CN211182180U - Power semiconductor device and housing thereof - Google Patents
Power semiconductor device and housing thereof Download PDFInfo
- Publication number
- CN211182180U CN211182180U CN202020116592.4U CN202020116592U CN211182180U CN 211182180 U CN211182180 U CN 211182180U CN 202020116592 U CN202020116592 U CN 202020116592U CN 211182180 U CN211182180 U CN 211182180U
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- nut
- mounting groove
- semiconductor device
- power semiconductor
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Abstract
An embodiment of the utility model provides a power semiconductor device and shell thereof, the shell includes the shell main part and from the sunken formation in shell main part one side and be used for corresponding the mounting groove that holds binding post and the nut with the butt joint of external electrode, the relative both sides wall of mounting groove is settled the position punishment to the nut respectively and is become to the inside convex card strip of mounting groove, and relative distance between two card strips is less than distance between the relative both sides wall of nut and can follow relative both sides elasticity and support to press and be located the relative both sides wall of the nut in the mounting groove. The embodiment of the utility model provides a through set up the card strip on the mounting groove inner wall of power semiconductor device shell connecting portion, can carry out good fixed with the nut in the mounting groove with the installation to simple structure can be applicable to the power semiconductor device shell of multiple specification.
Description
Technical Field
The embodiment of the utility model provides a relate to semiconductor device technical field, especially relate to a power semiconductor device and shell thereof.
Background
The power semiconductor device is formed by assembling a power module in a corresponding shell, the existing shell can be mainly divided into two types, one type is a pre-installed nut type, the other type is a non-nut type, a nut of the pre-installed nut type is installed in the process of manufacturing the shell, installation is not needed in subsequent work, but the pre-installed nut cannot be disassembled and assembled, and the whole power semiconductor device shell is scrapped when the nut is lost or the nut jumps during the manufacturing process of the shell. The shell that does not contain the nut type is at the shell make after assemble the nut again, if discover that the nut damages only need dismantle the replacement nut can, the nut generally adopts glue or buckle structure to fix, when using glue to fix, the live time glue will lose efficacy for a long time and lead to the nut easily to drop, and when adopting buckle structure to fix, need correspond the shaping at the corresponding position of shell and go out the buckle structure, processing is more difficult, and some shell sizes are little, do not have enough positions to set up the buckle, make the nut can't obtain good fixed.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a technical problem who solves lies in, provides a power semiconductor device shell, fixation nut that can be simple, convenient.
The embodiment of the utility model provides a technical problem who further solves lies in, provides a power semiconductor device, fixation nut that can be simple, convenient.
In order to solve the technical problem, the embodiment of the utility model provides an adopt following technical scheme: the utility model provides a power semiconductor device shell, includes the shell main part and from the sunken formation in shell main part one side and be used for corresponding the mounting groove that holds binding post and the nut with the butt joint of external electrode, the relative both sides wall of mounting groove is corresponding to the convex card strip of nut settling position punishment difference shaping to the mounting groove inside, and relative distance between two card strips is less than the distance between the relative both sides wall of nut and can follow relative both sides wall elasticity and support to press and be located the relative both sides wall of the nut in the mounting groove.
Further, the clamping strip is made of plastic through injection molding.
Furthermore, the clamping strip extends from a notch of the mounting groove, in which the nut is placed, to the direction of the groove bottom wall opposite to the notch.
Furthermore, a guide inclined plane for guiding the nut to be placed is formed at one end, close to the notch, of the clamping strip.
Further, the mounting groove is in the side of shell main part is equipped with the terminal surface opening, certainly in the mounting groove the terminal surface opening forms in proper order to the inside direction of mounting groove and holds the first trench of the butt joint portion of binding post outer end and the second trench that holds the nut, just the bottom of second trench also forms the bottom trench that supplies the connecting portion of binding post to correspond to pass.
Further, one end, far away from the end face opening, of the mounting groove is further recessed towards the shell main body to form an operation groove facilitating nut taking and placing.
In order to solve the above technical problem, the embodiment of the utility model provides a still adopt following technical scheme: a power semiconductor device comprises a shell and a power module assembled inside the shell, wherein the shell is the power semiconductor device shell.
Adopt above-mentioned technical scheme, the embodiment of the utility model provides a following beneficial effect has at least: the embodiment of the utility model provides a through set up the card strip on the mounting groove inner wall of power semiconductor device shell connecting portion, can carry out good fixed with the nut in the mounting groove with the installation to simple structure can be applicable to the power semiconductor device shell of multiple specification.
Drawings
Fig. 1 is a schematic perspective view of an alternative embodiment of a power semiconductor device according to the present invention.
Fig. 2 is a schematic perspective view of an alternative embodiment of the power semiconductor device of the present invention with terminals removed.
Fig. 3 is a schematic cross-sectional view of an alternative embodiment of the power semiconductor device housing of the present invention along the screwing direction.
Fig. 4 is a schematic cross-sectional view perpendicular to the screwing direction of an alternative embodiment of the power semiconductor device housing of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It is to be understood that the following illustrative embodiments and description are only intended to illustrate the present invention, and are not intended as a limitation of the present invention, and that features of the embodiments and examples may be combined with each other without conflict.
As shown in fig. 1-4, an optional embodiment of the present invention provides a power semiconductor device housing, which includes a housing body 1 and a mounting groove 30 formed by recessing one side of the housing body 1 and used for correspondingly accommodating a terminal 34 and a nut 50, the mounting groove 30 has two opposite side walls corresponding to the mounting position of the nut 50, and the two opposite side walls are respectively formed with a clamping strip 32 protruding into the mounting groove 30, and the relative distance between the two clamping strips 32 is smaller than the distance between the two opposite side walls of the nut 50, so as to elastically press the two opposite side walls of the nut 50 positioned in the mounting groove 30 from the opposite sides.
The embodiment of the utility model provides a through set up card strip 32 on the mounting groove 30 inner wall of power semiconductor device shell connecting portion 3, can carry out good fixed with the nut 50 of installation in the mounting groove 30 to simple structure can be applicable to the power semiconductor device shell of multiple specification.
In another alternative embodiment of the present invention, the clip strip 32 is made of plastic by injection molding. This embodiment is through setting up card strip 32 to being made by plastics injection molding for card strip 32 can provide certain elasticity when fixation nut 50, but has the poor nut 50 of small size to provide the clamp force in a flexible way with the specification, and the difficult deformation that takes place of plastics material simultaneously, life is longer.
In another alternative embodiment of the present invention, as shown in fig. 1, the locking strip 32 extends from the notch 301 of the mounting groove 30, into which the nut 50 is inserted, to the direction of the groove bottom wall opposite to the notch 301. In the embodiment, the direction of the clamping strip 32 extends from the notch 301 to the bottom wall of the groove, so that the contact area between the clamping strip 32 and the nut 50 is increased as much as possible, and the direction of the clamping strip 32 is perpendicular to the screwing direction of the nut 50, so that the fixation is more stable.
In another alternative embodiment of the present invention, the end of the locking strip 32 near the slot 301 is further formed with a guiding inclined plane 321 for guiding the nut 50 to be inserted. The present embodiment makes it easier for the nut 50 to enter the mounting groove 30 by providing the guide slope 321 guiding the nut 50 near the notch 301, and improves the efficiency of placing the nut 50.
As shown in fig. 2 to 4, in another optional embodiment of the present invention, the mounting groove 30 is provided with an end opening 303 on a side surface of the housing main body, a first slot 305 for accommodating the abutting portion 341 of the outer end of the terminal 34 and a second slot 307 for accommodating the nut 50 are sequentially formed in the mounting groove 30 from the end opening 303 to an inner direction of the mounting groove 30, and a bottom slot 309 for the connecting portion 343 of the terminal 34 to correspondingly pass through is also formed at a bottom of the second slot 307.
In practical implementation, the terminal 34 is placed in the first slot 305 and the bottom slot 309 to form an L shape, and is abutted against the power module of the power semiconductor device through the connecting portion 343, so that the external electrode is connected and conducted with the power module, and the external electrode is screwed with the abutting portion 343 of the terminal 34 through the nut 50 in the second slot 307, so that the structure in the screwing direction is more stable, and the external electrode and the terminal 34 are prevented from being loosened due to unstable screwing.
In another optional embodiment of the present invention, the end of the mounting groove 30 away from the end surface opening 303 is further recessed toward the housing main body 1 to form an operation groove 36 for conveniently taking and placing the nut 50. The present embodiment makes the nut 50 more convenient when setting and taking by providing the operation slot 36, and prevents the nut 50 from being difficult to take out due to over-tightening of the fixation.
On the other hand, the utility model also provides a power semiconductor device, including the shell with assemble in the inside power module of shell, the shell is above arbitrary power semiconductor device shell. The present embodiment can simply and conveniently fix the nut 50 by using the power semiconductor device case described above.
The embodiments of the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the above-mentioned embodiments, which are only illustrative and not restrictive, and those skilled in the art can make many changes without departing from the spirit and the scope of the invention as claimed.
Claims (7)
1. The utility model provides a power semiconductor device shell, includes the shell main part and from the sunken formation in shell main part one side and be used for corresponding the mounting groove that holds binding post and the nut with the butt joint of external electrode, its characterized in that, the inside convex card strip of mounting groove is do not moulded to the relative both sides wall of mounting groove corresponding to nut arrangement position punishment, and the relative distance between two card strips is less than the distance between the relative both sides wall of nut and can follow relative both sides elasticity and support to press the relative both sides wall of the nut of location in the mounting groove.
2. The power semiconductor device package of claim 1, wherein said snap strip is injection molded from plastic.
3. The power semiconductor device package according to claim 1, wherein the clip strip extends from a notch of the mounting groove into which the nut is inserted toward a groove bottom wall opposite to the notch.
4. The power semiconductor device package of claim 3, wherein said clip strip further has a guiding bevel formed at an end thereof adjacent to said notch for guiding insertion of said nut.
5. The power semiconductor device case according to claim 1, wherein the mounting groove has an end opening on a side surface of the case main body, a first groove for accommodating the abutting portion of the outer end of the terminal and a second groove for accommodating the nut are formed in the mounting groove in sequence from the end opening toward an inside of the mounting groove, and a bottom groove for allowing the connecting portion of the terminal to pass therethrough is also formed at a bottom of the second groove.
6. The power semiconductor device casing according to claim 5, wherein an end of the mounting groove remote from the end face opening is further recessed toward the casing main body to form an operation groove for facilitating nut taking and placing.
7. A power semiconductor device comprising a housing and a power module assembled inside the housing, characterized in that the housing is a power semiconductor device housing according to any one of claims 1-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020116592.4U CN211182180U (en) | 2020-01-17 | 2020-01-17 | Power semiconductor device and housing thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020116592.4U CN211182180U (en) | 2020-01-17 | 2020-01-17 | Power semiconductor device and housing thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211182180U true CN211182180U (en) | 2020-08-04 |
Family
ID=71807111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020116592.4U Active CN211182180U (en) | 2020-01-17 | 2020-01-17 | Power semiconductor device and housing thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211182180U (en) |
-
2020
- 2020-01-17 CN CN202020116592.4U patent/CN211182180U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |