CN211178758U - Temperature sensor packaging structure - Google Patents
Temperature sensor packaging structure Download PDFInfo
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- CN211178758U CN211178758U CN201922121512.4U CN201922121512U CN211178758U CN 211178758 U CN211178758 U CN 211178758U CN 201922121512 U CN201922121512 U CN 201922121512U CN 211178758 U CN211178758 U CN 211178758U
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Abstract
The utility model discloses a temperature sensor packaging structure, include: the sensor comprises a metal base, wherein a sensor chip is fixed on the metal base; a housing in which the metal base and the sensor chip are mounted; the sensor is characterized in that an opening is formed in the shell, a cover is further arranged on the opening, the size and the shape of the cover are determined to be matched with the opening, and the cover can be opened or closed on the opening so as to be convenient for checking internal parts of the sensor. The utility model has the advantages that the shell is provided with the opening, the opening is provided with the cover matched with the opening, and the cover can open and close the opening, so that the internal parts of the sensor can be conveniently checked and easily replaced; in addition, a hollow pipe for accommodating an external lead is arranged below the shell, so that the defect that the lead is exposed and damaged for a long time is overcome; the utility model discloses simple structure, convenient operation tends towards the practicality more.
Description
Technical Field
The utility model relates to a temperature sensor field, concretely relates to temperature sensor packaging structure.
Background
The temperature sensor is an instrument which converts temperature into electric quantity by utilizing the rule that various physical properties of substances change along with the temperature. The temperature sensor is widely applied to modern industry and daily life due to high sensitivity and convenient use. Currently, commonly used temperature sensing devices include thermocouples, thermistors, analog integrated temperature sensors, and digital integrated temperature sensors. The thermosensitive chip is used as a core component of the temperature sensor and needs to adopt different packaging forms in different application environments.
At present, chinese utility model patent that publication number is CN204115885U discloses a temperature sensor packaging structure, including the temperature sensor body, at this internal endotheca of temperature sensor be equipped with the rubberizing ring and glue the ring down, the thermal shrinkage pipe is gone out in the temperature sensor body in-connection, the thermal shrinkage pipe passes through foot solder joint welding in the casing of temperature sensor body, and the distance d that foot solder joint is apart from the temperature sensor body edge is 0.2mm, is equipped with the tin plate in the both sides of thermal shrinkage pipe, and the one end fixed connection of tin plate is on the outer wall of thermal shrinkage pipe.
For another example, the chinese utility model with publication number CN202393510U discloses a high sensitivity temperature sensor package structure, including metal base and the sensor chip fixed on this metal base, will metal base and sensor chip pack into the shell metal base tip is packaged with the resin layer, and this resin layer is hemispherical structure, the resin layer supports on the wall of shell bottom.
The existing sensor packaging structure mainly packages and protects the thermosensitive chip, the packages are integrally sealed, and when internal parts are damaged or have problems, the internal parts are difficult to inspect or replace and sometimes directly discarded, so that resource waste is caused; in addition, when in measurement, a lead is required to be connected with the outside, and the lead is easily damaged when being in an external environment for a long time, so that the service life is short.
Based on the above, an improved temperature sensor package structure is desired, which can effectively solve the problems that the inspection of the internal parts of the sensor is difficult and the external wires are easily damaged.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the problem that will solve and the technical scheme that provides improve prior art to a temperature sensor packaging structure is provided, and this packaging structure can effectively solve current sensor inner part inspection difficulty, the easy impaired problem of outside wire, and the sensor packaging structure who discloses is simple, the inspection is convenient, the effectual outside wire that has protected makes its life extension.
The above technical purpose of the present invention can be achieved by the following technical solutions:
an embodiment of the utility model provides a temperature sensor packaging structure, include:
the sensor comprises a metal base, wherein a sensor chip is fixed on the metal base;
a housing in which the metal base and the sensor chip are mounted;
the sensor is characterized in that an opening is formed in the shell, a cover is further arranged on the opening, the size and the shape of the cover are determined to be matched with the opening, and the cover can be opened or closed on the opening so as to be convenient for checking internal parts of the sensor.
According to the utility model discloses an above-mentioned embodiment provides a temperature sensor packaging structure, wherein the shell is hollow structure, including upper surface, lower surface and side, the opening is established the upper surface of shell.
According to the utility model discloses an above-mentioned embodiment provides a temperature sensor packaging structure, wherein the inside of lid has the internal thread, the opening is outstanding outward to have the external screw thread, the lid with opening threaded connection.
According to the utility model discloses an above-mentioned embodiment provides a temperature sensor packaging structure, wherein the inside periphery of lid still is equipped with the one deck rubber gasket.
According to the utility model discloses an above-mentioned embodiment provides a temperature sensor packaging structure, wherein be connected with the wire on the sensor chip, the shell the lower surface still is equipped with hollow pipe, in order to hold the wire.
According to the utility model discloses an above-mentioned embodiment provides a temperature sensor packaging structure, wherein hollow pipe with the connection can be dismantled to the shell.
According to the utility model discloses an above-mentioned embodiment provides a temperature sensor packaging structure, wherein packaging structure still includes protection architecture, protection architecture sets up the side of shell determines protection architecture's shape and size, with the side matching of shell.
According to the utility model discloses an above-mentioned embodiment provides a temperature sensor packaging structure, wherein protection architecture includes the protective housing and sets up the heat-conducting layer inside the protective housing.
According to the utility model discloses an above-mentioned an embodiment provides a temperature sensor packaging structure, wherein the protective housing is iron-aluminum alloy, the heat-conducting layer is resin layer and/or silicone grease layer.
To sum up, the utility model discloses following beneficial effect has: the utility model discloses an improvement to current temperature sensor packaging structure, through being equipped with the opening on the shell, then be equipped with the lid that matches with it on the opening, the lid can open and close this opening to the inspection sensor internals and change easily; in addition, a hollow pipe for accommodating an external lead is arranged below the shell, so that the defect that the lead is exposed and damaged for a long time is overcome; finally, the outer side of the packaging structure is further provided with a protective layer, and the protective layer comprises an iron-aluminum alloy shell and a resin layer and/or a silicone grease layer which are used as heat conducting layers, so that the temperature sensor is effectively protected from being damaged, and the service life of the sensor is prolonged. The utility model discloses simple structure, convenient operation tends towards the practicality more.
Drawings
The disclosure of the present invention will become more readily understood with reference to the accompanying drawings. As is readily understood by those skilled in the art: these drawings are only intended to illustrate the technical solution of the present invention and are not intended to limit the scope of the present invention. In the figure:
fig. 1 is a schematic structural diagram of a package structure of a temperature sensor according to the present invention;
fig. 2 is a partially exploded view of the package structure shown in fig. 1.
Wherein the various designations in the drawings are: 1. a metal base; 2. a sensor chip; 3. a housing; 4. an opening; 5. a cover; 6. a tube; 7. a wire; 8. a protective shell; 9. a thermally conductive layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It is to be noted that the drawings are merely illustrative and not to be drawn to strict scale, and that some portions may be enlarged or reduced for convenience of description, and some default may be made for a known portion.
Fig. 1 is a schematic structural diagram of a package structure of a temperature sensor according to the present invention; fig. 2 is a partial exploded view of the package structure shown in fig. 1. As shown in fig. 1 and 2, an embodiment of the present invention provides a temperature sensor package structure, which includes a metal base 1, a sensor chip 2, and a housing 3. A sensor chip 2 is fixed to the metal base 1. The metal base 1 and the sensor chip 2 are mounted in a housing 3. The housing 3 is provided with an opening 4. A cover 5 is also provided over the opening 4, the cover 5 being sized and shaped to match the opening 4. The lid 5 can be opened or closed over the opening 4 to facilitate inspection of the sensor internals. Specifically, the housing 3 has a hollow structure including an upper surface, a lower surface, and a side surface, and the opening 4 is provided in the upper surface of the housing 3. Or may be disposed at the side of the housing 3, and the modifications thereof will be easily suggested to those skilled in the art based on the description of the specification and will not be described herein. The cap 5 has an internal thread inside, an external thread protruding from the opening 4, and the cap 5 is screwed to the opening 4. Preferably, the inner periphery of the cap 5 is further provided with a layer of sealing rubber ring (not shown) for increasing the sealing performance between the cap 5 and the opening 4 when the cap 5 is covered on the opening 4. The sensor chip 2 is connected to a lead wire 7. The lower surface of the housing 3 is also provided with a hollow tube 6, the tube 6 being adapted to receive a wire 7 to prevent damage to the wire 7. The tube 6 is removably connected to the housing 3, which facilitates replacement of the tube 6 and the lead 7.
In addition, the packaging structure further comprises a protection structure. The protective structure is provided on the side of the housing 3 and is shaped and dimensioned to match the side of the housing 3. The protective structure comprises a protective shell 8 and a heat conducting layer 9 arranged inside the protective shell. Preferably, the protective shell 8 is made of an iron-aluminum alloy, and the heat conductive layer 9 is a resin layer and/or a silicone grease layer. The protection structure effectively protects the sensor from being damaged due to vibration, and meanwhile corrosion is avoided to a certain extent.
To sum up, the present invention is an improvement of the existing temperature sensor package structure, wherein an opening is formed on the housing, and a cover matched with the opening is arranged on the opening, so that the cover can open and close the opening, thereby facilitating the inspection of the internal parts of the sensor and easy replacement; in addition, a hollow pipe for accommodating an external lead is arranged below the shell, so that the defect that the lead is exposed and damaged for a long time is overcome; finally, the outer side of the packaging structure is further provided with a protective layer, and the protective layer comprises an iron-aluminum alloy shell and a resin layer and/or a silicone grease layer which are used as heat conducting layers, so that the temperature sensor is effectively protected from being damaged, and the service life of the sensor is prolonged. The utility model discloses simple structure, convenient operation tends towards the practicality more.
The above-mentioned embodiments further explain the objects, technical solutions and advantages of the present invention in detail, it should be understood that the above only is a detailed description of the present invention, and is not a limitation of the present invention in any form, and all the technical matters of the present invention are within the scope of the technical solutions of the present invention to any simple modifications, equivalent changes and modifications made to the above embodiments.
Claims (9)
1. A temperature sensor packaging structure is characterized in that: the method comprises the following steps:
the sensor comprises a metal base, wherein a sensor chip is fixed on the metal base;
a housing in which the metal base and the sensor chip are mounted;
the sensor is characterized in that an opening is formed in the shell, a cover is further arranged on the opening, the size and the shape of the cover are determined to be matched with the opening, and the cover can be opened or closed on the opening so as to be convenient for checking internal parts of the sensor.
2. The temperature sensor package structure of claim 1, wherein: the shell comprises an upper surface, a lower surface and a side surface, and the opening is formed in the upper surface of the shell.
3. The temperature sensor package structure of claim 2, wherein: the inner part of the cover is provided with internal threads, external threads protrude out of the opening, and the cover is in threaded connection with the opening.
4. The temperature sensor package structure of claim 3, wherein: and a layer of sealing rubber ring is arranged on the inner periphery of the cover.
5. The temperature sensor package structure of claim 2, wherein: the sensor chip is connected with a wire, and the lower surface of the shell is also provided with a hollow tube for accommodating the wire.
6. The temperature sensor package structure of claim 5, wherein: the hollow tube is detachably connected with the housing.
7. The temperature sensor package structure of claim 2, wherein: the package structure further includes a protective structure disposed at a side of the housing, the protective structure being shaped and sized to mate with the side of the housing.
8. The temperature sensor package structure of claim 7, wherein: the protection structure comprises a protection shell and a heat conduction layer arranged inside the protection shell.
9. The temperature sensor package structure of claim 8, wherein: the protective housing is iron-aluminum alloy, and the heat-conducting layer is resin layer and/or silicone grease layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922121512.4U CN211178758U (en) | 2019-12-02 | 2019-12-02 | Temperature sensor packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922121512.4U CN211178758U (en) | 2019-12-02 | 2019-12-02 | Temperature sensor packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211178758U true CN211178758U (en) | 2020-08-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922121512.4U Active CN211178758U (en) | 2019-12-02 | 2019-12-02 | Temperature sensor packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211178758U (en) |
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2019
- 2019-12-02 CN CN201922121512.4U patent/CN211178758U/en active Active
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