CN211177510U

CN211177510U - Semiconductor refrigeration physics heat sink

Info

Publication number: CN211177510U
Application number: CN201922388216.0U
Authority: CN
Inventors: 黄丽
Original assignee: Yuncheng University
Current assignee: Yuncheng University
Priority date: 2019-12-27
Filing date: 2019-12-27
Publication date: 2020-08-04
Anticipated expiration: 2029-12-27

Abstract

The utility model discloses a semiconductor refrigeration physics heat sink, including the cabinet body and semiconductor refrigeration module, the mid-mounting of the cabinet body has vertical baffle, semiconductor refrigeration module installs between the inner wall of the baffle and the cabinet body, semiconductor refrigeration module's both sides are equipped with heat pipe and cold pipe respectively, the back lateral wall fixed mounting of the cabinet body has first fin group, the square turn round joint is installed to the rear side of the cabinet body, axial fan is installed to the rear end of square turn round joint, there are first cabinet door and second cabinet door in the place ahead both sides of the cabinet body through the hinge mounting respectively, the water-cooling box of rectangle is installed to the right flank wall of the cabinet body, fixed mounting has second fin group in the water-cooling box, the heat pipe runs through second fin group and rather than fixed mounting. The heating end is positioned in the water cooling tank, and heats flowing water, so that the utilization rate of energy is improved, and the heat generated by the heating end cannot cause the temperature rise of the surrounding environment, thereby improving the refrigerating efficiency.

Description

Semiconductor refrigeration physics heat sink

Technical Field

The utility model relates to a refrigeration plant technical field specifically is a semiconductor refrigeration physics heat sink.

Background

The semiconductor refrigerator is a device for producing cold by using the thermo-electric effect of a semiconductor, and is also called as a thermoelectric refrigerator. When two different metals are connected by a conductor to conduct direct current, the temperature at one junction is reduced and the temperature at the other junction is increased. The semiconductor refrigerator has the characteristics of no noise, no vibration, no need of refrigerant, small volume, light weight and the like, and has the advantages of reliable work, simple and convenient operation, easy cold quantity adjustment and the like. The existing semiconductor refrigeration cooling device respectively uses two fans to respectively blow a refrigeration end and a heating end, and the hot air discharged by the heat dissipation of the heating end is directly discharged to the outside, so that the ambient temperature is increased, and the refrigeration effect is influenced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor refrigeration physics heat sink to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a semiconductor refrigeration physics heat sink, includes the cabinet body and semiconductor refrigeration module, the mid-mounting of the cabinet body has vertical baffle, semiconductor refrigeration module installs between the inner wall of the baffle and the cabinet body, semiconductor refrigeration module's both sides are equipped with heat pipe and cold pipe respectively, the back lateral wall fixed mounting of the cabinet body has first fin group, the rear side of the cabinet body is installed the square and is changeed round joint, axial fan is installed to the rear end that the square changes round joint, there are first cabinet door and second cabinet door in the place ahead both sides of the cabinet body through the hinge mounting respectively, the water-cooling tank of rectangle is installed to the right flank wall of the cabinet body, fixed mounting has second fin group in the water-cooling tank, the heat pipe runs through second fin group and rather than fixed mounting.

Preferably, the cold pipe penetrates through the first fin group and is fixedly connected with the first fin group, and a square hole communicated with the square-to-round joint is formed in the rear side of the cabinet body.

Preferably, an exhaust connecting pipe is installed in front of the first cabinet door, and the rear end of the exhaust connecting pipe is communicated with the left cavity of the partition plate.

Preferably, the heat pipe penetrates through the side walls of the cabinet body and the water cooling tank and is fixedly connected with the cabinet body and the water cooling tank.

Preferably, the upper side and the lower side of the water cooling tank are both fixedly provided with penetrating joint pipes, and the joint pipes are provided with annular flanges.

Compared with the prior art, the beneficial effects of the utility model are that: after the semiconductor refrigeration module is started, the temperature of the cold pipe is gradually reduced, the temperature of the heat pipe is gradually increased, the axial flow fan is used for blowing air to the cabinet body, the air flow is cooled through the cold pipe and the first fin group, cold air is discharged from the exhaust connecting pipe, water is heated by the heat pipe and the second fin group when circulating from the water cooling box, the discharged air can be utilized, the utilization rate of energy is improved, the heat generated by the heating end cannot cause the temperature rise of the surrounding environment, and therefore the refrigeration efficiency is improved.

Drawings

Fig. 1 is a schematic view of the internal structure of the present invention;

fig. 2 is a schematic top view of the present invention;

fig. 3 is a schematic view of the structure of the present invention.

In the figure: 1. a cabinet body; 2. a partition plate; 3. a semiconductor refrigeration module; 4. cooling the pipe; 5. a heat pipe; 6. a first fin group; 7. a second fin group; 8. a water cooling tank; 9. a square-to-round joint; 10. an axial flow fan; 11. An exhaust adapter; 12. a first cabinet door; 13. a second cabinet door; 14. and (4) a joint pipe.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a semiconductor refrigeration physical cooling device comprises a cabinet body 1 and a semiconductor refrigeration module 3, wherein a vertical partition plate 2 is arranged in the middle of the cabinet body 1, the semiconductor refrigeration module 3 is arranged between the partition plate 2 and the inner wall of the cabinet body 1, a heat pipe 5 and a cold pipe 4 are respectively arranged on two sides of the semiconductor refrigeration module 3, a first fin group 6 is fixedly arranged on the rear side wall of the cabinet body 1, the cold pipe 4 penetrates through the first fin group 6 and is fixedly connected with the first fin group 6, a square hole communicated with a square-to-round joint 9 is arranged on the rear side of the cabinet body 1, external air is blown into the cabinet body 1 through the square-to-round joint 9,

the rear side of the cabinet body 1 is provided with a square-to-round joint 9, the rear end of the square-to-round joint 9 is provided with an axial flow fan 10, the two sides in front of the cabinet body 1 are respectively provided with a first cabinet door 12 and a second cabinet door 13 through hinges, the front of the first cabinet door 12 is provided with an exhaust connecting pipe 11, the rear end of the exhaust connecting pipe 11 is communicated with the left cavity of the partition plate 2, cold air is discharged from the exhaust connecting pipe 11 during use, and the cold air is discharged from the exhaust connecting pipe 11 to equipment or a space area needing cooling.

The right side wall of the cabinet body 1 is provided with a rectangular water cooling tank 8, a second fin group 7 is fixedly arranged in the water cooling tank 8, the heat pipe 5 penetrates through the second fin group 7 and is fixedly arranged with the second fin group, the heat pipe 5 penetrates through the side walls of the cabinet body 1 and the water cooling tank 8 and is fixedly connected with the side walls, the upper side and the lower side of the water cooling tank 8 are fixedly provided with penetrating joint pipes 14, and annular flanges are arranged on the joint pipes 14. The water-cooling tank 8 is connected to the water line via a connecting piece 14, and the hot water produced can be used.

The working principle is as follows: when the water cooling box is used, the water cooling box 8 is connected into the flow pipeline through the upper joint pipe 14 and the lower joint pipe 14, after the semiconductor refrigeration module 3 is started, the temperature of the cold pipe 4 is gradually reduced, the temperature of the heat pipe 5 is gradually increased, the axial flow fan 10 is used for blowing air into the cabinet body 1, the air flow is cooled through the cold pipe 4 and the first fin group 6, cold air is discharged from the exhaust connecting pipe 11, water is heated by the heat pipe 5 and the second fin group 7 when circulating from the water cooling box 8, and the discharged water can be utilized.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a semiconductor refrigeration physics heat sink, includes cabinet body (1) and semiconductor refrigeration module (3), its characterized in that: a vertical clapboard (2) is arranged in the middle of the cabinet body (1), the semiconductor refrigeration module (3) is arranged between the clapboard (2) and the inner wall of the cabinet body (1), a heat pipe (5) and a cold pipe (4) are respectively arranged on two sides of the semiconductor refrigeration module (3), a first fin group (6) is fixedly arranged on the rear side wall of the cabinet body (1), a square-to-round joint (9) is arranged on the rear side of the cabinet body (1), an axial flow fan (10) is arranged at the rear end of the square-to-round joint (9), a first cabinet door (12) and a second cabinet door (13) are respectively arranged on the two sides of the front part of the cabinet body (1) through hinges, a rectangular water cooling tank (8) is arranged on the right side wall of the cabinet body (1), a second fin group (7) is fixedly arranged in the water cooling tank (8), the heat pipe (5) penetrates through the second fin group (7) and is fixedly installed with the second fin group.

2. The semiconductor refrigeration physical cooling device according to claim 1, wherein: the cold pipe (4) penetrates through the first fin group (6) and is fixedly connected with the first fin group, and a square hole communicated with the square-to-round joint (9) is formed in the rear side of the cabinet body (1).

3. The semiconductor refrigeration physical cooling device according to claim 1, wherein: an exhaust connecting pipe (11) is installed in front of the first cabinet door (12), and the rear end of the exhaust connecting pipe (11) is communicated with a left cavity of the partition plate (2).

4. The semiconductor refrigeration physical cooling device according to claim 1, wherein: the heat pipe (5) penetrates through the side walls of the cabinet body (1) and the water cooling tank (8) and is fixedly connected with the side walls.

5. The semiconductor refrigeration physical cooling device according to claim 1, wherein: the upper side and the lower side of the water cooling tank (8) are fixedly provided with penetrating joint pipes (14), and annular flanges are arranged on the joint pipes (14).