CN211152230U - High temperature resistance graphite alkene hot plate - Google Patents

Abstract

The utility model discloses a high temperature resistance graphite alkene hot plate, including microcrystalline glass board, flake graphite alkene sintering layer and conductive part. Through being provided with the flake graphite alkene sintering layer in one side of microcrystalline glass board, be provided with two sets of electrically conductive parts that do not contact each other on flake graphite alkene sintering layer surface, because the flake graphite alkene sintering layer through after the sintering has stable physical structure, the structure is very stable, thereby it is inseparabler with the combination of microcrystalline glass board, be difficult for exploding under the high temperature to split, and do not use glue to bond, glue melting's problem can not appear under the high temperature, it can reach 550 degrees to 600 degrees to prove the graphite alkene hot plate temperature of generating heat that produces through this method after the experiment, compare with prior art, the temperature of generating heat of graphite alkene hot plate has been increased substantially.

Description

High temperature resistance graphite alkene hot plate

Technical Field

The utility model relates to a hot plate field, especially a high temperature resistant graphite alkene hot plate.

Background

The heating plate is a heating mode commonly used for heating articles at present, graphene is a heating carrier emerging at present, and the sheet-shaped graphene plate can generate high temperature by electrifying the sheet-shaped graphene plate, but because the cost of the complete sheet-shaped graphene is high, the existing graphene heating plate is manufactured by mixing sheet-shaped graphene powder with specific glue, then coating the mixture on a microcrystalline glass plate and then hardening the mixture. But this kind of graphite alkene hot plate has a serious problem, and graphite alkene hot plate heating temperature can only heat to 230 and charge 300 degrees, surpasss this temperature after, the operating condition of graphite alkene hot plate just very unstable, and molten state can appear in glue, and graphite alkene hot plate is fried very easily.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, an object of the utility model is to provide a can bear higher temperature's graphite alkene hot plate.

The utility model discloses a technical scheme that the solution problem adopted is: a high temperature resistant graphene heating plate, comprising:

a microcrystalline glass plate;

the sheet graphene sintered layer is arranged on one side of the microcrystalline glass plate;

and the two groups of conductive parts are not in contact with each other and are positioned on the surface of the flake graphene sintering layer.

As a further improvement of the above technical solution, a reticular process groove is provided on a surface of one side of the microcrystalline glass plate corresponding to the sheet-like graphene sintered layer.

As a further improvement of the above technical scheme, the conductive portions are conductive silver pastes, and the two groups of conductive silver pastes are symmetrically arranged along two sides of the sheet graphene sintering plate.

As a further improvement of the above technical scheme, the area of the sheet-shaped graphene sintered layer is smaller than that of the glass-ceramic plate, the sheet-shaped graphene sintered layer is located in the middle of the glass-ceramic plate, and the conductive silver paste covers the edge of the sheet-shaped graphene sintered layer and the surface of the glass-ceramic plate simultaneously.

As a further improvement of the above technical solution, the sheet-like graphene sintered layer is sintered on a glass ceramic plate.

As a further improvement of the above technical solution, a tubular graphene heat conduction layer is disposed on the other side surface of the microcrystalline glass plate.

As a further improvement of the above technical solution, the side of the microcrystalline glass plate corresponding to the tubular graphene heat conduction layer is provided with frosted lines.

As a further improvement of the above technical solution, the tubular graphene heat conduction layer is sintered on the microcrystalline glass plate.

As a further improvement of the above technical solution, the thickness of the tubular graphene heat conduction layer is 30-50 micrometers.

As a further improvement of the above technical solution, the sheet graphene sintered layer and the conductive coating are covered with an insulating layer on the outer side.

The utility model has the advantages that: through being provided with the flake graphite alkene sintering layer in one side of microcrystalline glass board, be provided with two sets of electrically conductive parts that do not contact each other on flake graphite alkene sintering layer surface, because the flake graphite alkene sintering layer through after the sintering has stable physical structure, the structure is very stable, thereby it is inseparabler with the combination of microcrystalline glass board, be difficult for exploding under the high temperature to split, and do not use glue to bond, glue melting's problem can not appear under the high temperature, it can reach 550 degrees to 600 degrees to prove the graphite alkene hot plate temperature of generating heat that produces through this method after the experiment, compare with prior art, the temperature of generating heat of graphite alkene hot plate has been increased substantially.

Drawings

The invention will be further explained with reference to the drawings and the detailed description.

Fig. 1 is a schematic front structural view of a preferred embodiment of the present invention;

FIG. 2 is a schematic view of a sectional view taken along the line A-A in FIG. 1;

FIG. 3 is a schematic view of the back structure of the preferred embodiment of the present invention;

FIG. 4 is a schematic structural view of the preferred embodiment of the present invention after the insulating layer is removed;

fig. 5 is a schematic structural view of a microcrystalline glass plate according to a preferred embodiment of the present invention.

Detailed Description

This section will describe in detail the embodiments of the present invention, preferred embodiments of the present invention are shown in the attached drawings, which are used to supplement the description of the text part of the specification with figures, so that one can intuitively and vividly understand each technical feature and the whole technical solution of the present invention, but they cannot be understood as the limitation of the protection scope of the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.

Referring to fig. 1 to 5, a high temperature resistant graphene heating plate includes:

a crystallized glass plate 10;

the sheet graphene sintered layer 20 is arranged on one side of the microcrystalline glass plate 10;

and the two groups of conductive parts are arranged on the surface of the flake graphene sintering layer 20 and are not in contact with each other.

Through the integrative flake graphite alkene sintering layer 20 that is provided with through flake graphite alkene mixture sintering formation in one side of microcrystalline glass board 10, be provided with two sets of not mutual contact's conductive part on flake graphite alkene sintering layer 20 surface, because fix flake graphite alkene sintering layer 20 in microcrystalline glass board 10 one side after the sintering has stable physical structure, the structure is more stable, and it is inseparabler with microcrystalline glass board 10's combination, be difficult for exploding under the high temperature, and do not use glue to bond, glue melting's problem can not appear under the high temperature, prove through experimental back that the graphite alkene hot plate heat generation temperature of producing through this method can reach 550 degrees to 600 degrees, compare with prior art, the temperature of generating heat of graphite alkene hot plate has been improved greatly.

In order to bond the graphene sheet sintered layer 20 and the glass ceramic plate 10 more tightly, the graphene sheet sintered layer 20 is preferably sintered on the glass ceramic plate 10.

Further, in order to make the current running more regular when the sheet-shaped graphene sintered layer 20 is electrified and heated, thereby reducing the energy loss, it is preferable that the surface of one side of the microcrystalline glass plate 10 corresponding to the sheet-shaped graphene sintered layer 20 is provided with a mesh-shaped process groove 11. Through the mesh-shaped process groove 11, when the sintering of the sheet-shaped graphene sintering layer 20 is completed, mesh-shaped passages are formed on the sheet-shaped graphene sintering layer, and the mesh-shaped passages are different from the thickness of the surrounding graphene sintering layer to a certain extent, so that most of current can flow along the mesh-shaped passages, the current flow is more standard, and the endless loss of electric energy is reduced.

Further improvement is carried out, preferably, the conductive part is conductive silver paste 40, and the two groups of conductive silver paste 40 are symmetrically arranged along two sides of the sheet graphene sintering plate. The conductive part can also be a copper wire integrally sintered on the flake graphene sintered plate.

Further improvement is carried out, preferably, the area of the sheet-shaped graphene sintered layer 20 is smaller than that of the microcrystalline glass plate 10, the sheet-shaped graphene sintered layer 20 is located in the middle of the microcrystalline glass plate 10, and at this time, preferably, the conductive silver paste 40 simultaneously covers the edge of the sheet-shaped graphene sintered layer 20 and the surface of the microcrystalline glass plate 10.

Further, in order to increase the heat conduction efficiency, it is preferable that a tubular graphene heat conduction layer 30 is provided on the other surface of the microcrystalline glass plate 10. Although the thermodynamic effect of the tubular graphene is poor, the tubular graphene has ultrahigh heat conduction efficiency, can quickly transfer heat generated by the sheet graphene sintering layer 20 on the other side of the microcrystalline glass plate 10 to the bottom of a cooker, and has higher heat efficiency and higher conduction compared with the mode of directly using the microcrystalline glass plate 10 for heat conduction.

In order to bond the tubular graphene heat conduction layer 30 and the microcrystalline glass plate 10 more tightly, the tubular graphene heat conduction layer 30 is sintered on the microcrystalline glass plate 10.

Further improvement is made in order to increase the adhesion of the tubular graphene heat conduction layer 30 on the glass-ceramic plate 10 which is not sintered. The side of the microcrystalline glass plate 10 corresponding to the tubular graphene heat conduction layer 30 is preferably provided with frosted lines.

Further, preferably, the thickness of the tubular graphene heat conduction layer 30 is 30-50 micrometers.

Further improvement is made, and it is preferable that the sheet-shaped graphene sintered layer 20 and the conductive coating layer are covered with an insulating layer 50 outside in view of safety performance. The insulating layer 50 is covered so that a user cannot directly touch the graphene sheet sintered layer 20 and the conductive coating layer, thereby increasing the safety factor. Of course, the insulating layer 50 does not have to be covered outside the conductive coating and the graphene sheet sintered layer 20, and the graphene sheet sintered layer 20 and the conductive coating may be configured to prevent a user from touching the graphene sheet sintered layer 20 and the conductive coating, for example, a housing of the present graphene heating plate is installed to prevent a user from touching the graphene sheet.

The above is only the preferred embodiment of the present invention, not limiting the patent scope of the present invention, all of which are under the concept of the present invention, the equivalent structure transformation made by the contents of the specification and the drawings is utilized, or the direct or indirect application is included in other related technical fields in the patent protection scope of the present invention.

Claims (10)

1. A high temperature resistant graphite alkene hot plate which characterized in that includes:

a crystallized glass plate (10);

the sheet-shaped graphene sintered layer (20), wherein the sheet-shaped graphene sintered layer (20) is arranged on one side of the microcrystalline glass plate (10);

and the two groups of conductive parts are not in contact with each other and are positioned on the surface of the flake graphene sintering layer (20).

2. The high temperature resistant graphene heating plate of claim 1, comprising:

and a reticular process groove (11) is formed in the surface of one side of the microcrystalline glass plate (10) corresponding to the sheet graphene sintering layer (20).

3. The high temperature resistant graphene heating plate of claim 1, comprising:

the conductive part is conductive silver paste (40), and two groups of conductive silver paste (40) are symmetrically arranged along two sides of the sheet graphene sintering plate.

4. The high temperature resistant graphene heating plate of claim 3, comprising:

the area of the flaky graphene sintering layer (20) is smaller than that of the microcrystalline glass plate (10), the flaky graphene sintering layer (20) is located in the middle of the microcrystalline glass plate (10), and the conductive silver paste (40) covers the edge of the flaky graphene sintering layer (20) and the surface of the microcrystalline glass plate (10) at the same time.

5. The high temperature resistant graphene heating plate of claim 3, comprising:

the sheet graphene sintering layer (20) is sintered on the microcrystalline glass plate (10).

6. The high temperature resistant graphene heating plate of claim 1, comprising:

and a tubular graphene heat conduction layer (30) is arranged on the other side surface of the microcrystalline glass plate (10).

7. The high temperature resistant graphene heating plate of claim 6, comprising:

and the side surface of the microcrystalline glass plate (10) corresponding to the tubular graphene heat conduction layer (30) is provided with frosted lines.

8. The high temperature resistant graphene heating plate of claim 6, comprising:

the tubular graphene heat conduction layer (30) is sintered on the microcrystalline glass plate (10).

9. The high temperature resistant graphene heating plate of claim 6, comprising:

the thickness of the tubular graphene heat conduction layer (30) is 30-50 microns.

10. The high temperature resistant graphene heating plate of claim 1, comprising:

the sheet graphene sintering layer (20) and the conductive coating are covered with an insulating layer (50) on the outer side.

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