CN211135213U - Novel earphone die - Google Patents

Novel earphone die Download PDF

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Publication number
CN211135213U
CN211135213U CN201922303701.3U CN201922303701U CN211135213U CN 211135213 U CN211135213 U CN 211135213U CN 201922303701 U CN201922303701 U CN 201922303701U CN 211135213 U CN211135213 U CN 211135213U
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China
Prior art keywords
buffer
lower bolster
template
novel earphone
base
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Active
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CN201922303701.3U
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Chinese (zh)
Inventor
姚田新
王正锋
阮怀碧
王军平
胡之平
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Kunshan Youli Quasi Mold Technology Co ltd
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Kunshan Youli Quasi Mold Technology Co ltd
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Priority to CN201922303701.3U priority Critical patent/CN211135213U/en
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Publication of CN211135213U publication Critical patent/CN211135213U/en
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Abstract

The utility model discloses a novel earphone die, the on-line screen storage device comprises a base, the four corners upper end of base is the fixed guide pillar that is provided with all, the lower bolster is cup jointed in the slip on the shaft of guide pillar, the upper end of lower bolster is provided with the cope match-plate pattern and slides and cup joint on four guide pillars, the bottom of lower bolster is provided with a plurality of buffer seats, a plurality ofly seted up with buffer seat assorted standing groove on the base up end, the equal fixedly connected with buffer spring in bottom of a plurality of buffer seats, buffer spring's bottom fixed connection is in the bottom of standing groove, the die cut has been seted up on the upper end plate body of lower bolster, the punching press shaping groove has been seted up to the center department of die cut, the fixed punching press board that is provided with in bottom face center department of cope match-plate pattern, the bottom. The utility model discloses a novel earphone mould, this mould can guarantee that the earphone is shaping under stable temperature, can not produce because of high temperature and warp.

Description

Novel earphone die
Technical Field
The utility model relates to a mould field especially relates to a novel earphone mould.
Background
With the continuous development of electronic technology, the use of earphones is becoming more common, earphones are a pair of conversion units, in the actual use process, the earphones can receive electric signals sent by a media player or a receiver, and then the electric signals are converted into audible sound waves by using a loudspeaker close to ears, so that people can listen to music, broadcast and the like, and in the actual manufacturing process, earphones are generally manufactured by a die formed by punching.
The existing earphone stamping die is generally not provided with a cooling and heat dissipation device due to a small size, so that the earphone is slightly deformed again due to overhigh temperature during molding, the quality of the earphone is poor, and meanwhile, the earphone is made of plastic, and the plastic is crushed due to pressure during stamping.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a novel earphone mold.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a novel earphone die comprises a base, guide pillars are fixedly arranged at the upper ends of four corners of the base, a lower die plate is slidably sleeved on a body of each guide pillar, an upper die plate is arranged at the upper end of the lower die plate and slidably sleeved on the four guide pillars, a plurality of buffer seats are arranged at the bottom end of the lower die plate, a plurality of placing grooves matched with the buffer seats are formed in the upper end face of the base, buffer springs are fixedly connected at the bottom ends of the buffer seats, the bottom ends of the buffer springs are fixedly connected at the bottom ends of the placing grooves, a punching groove is formed in the upper die plate body of the lower die plate, a punching forming groove is formed in the center of the punching groove, a punching plate is fixedly arranged in the center of the bottom end face of the upper die plate, a punching forming block is fixedly connected at the bottom end of the punching plate, a plurality of cooling tubes are formed in the lower end of the punching forming groove, the other end of feed liquor pipe runs through a lateral wall of lower bolster, the other end through connection of many cooling tubes has the drain pipe, the drain pipe runs through another lateral wall of lower bolster.
As a further description of the above technical solution:
The base, the lower template and the upper template are all set to be square, and the areas of the upper end faces of the lower template and the upper template are the same.
As a further description of the above technical solution:
The buffer seat and the placing groove are provided with four.
As a further description of the above technical solution:
And the top ends of the four guide pillars are provided with stop blocks.
As a further description of the above technical solution:
The liquid inlet pipe is fixedly provided with a liquid inlet close to the outer end, and the outer wall of the liquid inlet is provided with an external thread.
As a further description of the above technical solution:
The size of the stamping plate is completely matched with that of the stamping groove.
The utility model discloses following beneficial effect has:
The utility model provides a novel earphone mould, the lower bolster inner of this mould is provided with many cooling tubes, and the cooling tube setting leads to the coolant liquid in to the cooling tube from the inlet when the punching press at the lower extreme in punching press shaping groove, and the heat that the coolant liquid produced when will punching press through many cooling tubes is siphoned away, then discharges in the drain pipe, makes the inner temperature of lower bolster remain stable, makes the earphone product can not lead to warping once more because of overheated.
The utility model provides a novel earphone mould, the bottom of the lower template of the mould is also provided with four buffer seats, the lower end of the buffer seat is provided with a buffer spring, when the upper template is pressed down under the action of stamping record, the buffer spring is compressed firstly under the stress of the lower template, then the lower template can contact the base, the stress of the lower template is eased by the design, thereby avoiding the condition that the earphone is crushed,
Drawings
Fig. 1 is a sectional view of a novel earphone mold provided by the present invention;
Fig. 2 is a top view of a novel earphone mold provided by the present invention;
Fig. 3 is the utility model provides a lower bolster cross-sectional view of novel earphone mould.
Illustration of the drawings:
1. A base; 2. a guide post; 3. a lower template; 4. mounting a template; 5. a placement groove; 6. a buffer seat; 7. a buffer spring; 8. notching; 9. stamping a forming groove; 10. stamping the plate; 11. stamping a forming block; 12. a stopper; 13. a liquid inlet pipe; 14. a radiating pipe; 15. a liquid outlet pipe; 16. and (4) a liquid inlet.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-3, the present invention provides an embodiment: a novel earphone die comprises a base 1, guide posts 2 are fixedly arranged at the upper ends of four corners of the base 1, a lower die plate 3 is slidably sleeved on a post body of each guide post 2, an upper die plate 4 is arranged at the upper end of the lower die plate 3 and slidably sleeved on the four guide posts 2, the arrangement of the four guide posts 2 can ensure that no deviation occurs when the lower die plate 3 and the upper die plate 4 are pressed together, the stability of punching is ensured, a plurality of buffer seats 6 are arranged at the bottom end of the lower die plate 3, a plurality of placing grooves 5 matched with the buffer seats 6 are formed in the upper end face of the base 1, buffer springs 7 are fixedly connected at the bottom ends of the buffer seats 6, the bottom ends of the buffer springs 7 are fixedly connected at the bottom ends of the placing grooves 5, the buffer springs 7 play a buffer role when the lower die plate 3 is subjected to the punching force of the upper die plate 4, the upper die plate 4 is prevented from directly impacting the lower die plate 3, the earphone, stamping forming groove 9 has been seted up to the center department of manger 8, stamping forming groove 9 can set up quantity according to concrete in service behavior, the fixed punching press board 10 that is provided with in bottom face center department of cope match-plate pattern 4, bottom fixedly connected with punching press shaping piece 11 of punching press board 10, punching press shaping piece 11 also can set up quantity according to concrete in service behavior, many cooling tubes 14 have been seted up to the lower extreme of punching press shaping groove 9 of lower bolster 3, the design of many cooling tubes 14 can be cooled down to the mould inside in stamping process, can not lead to warping once more because overheated when guaranteeing the earphone shaping, the one end through connection of many cooling tubes 14 has feed liquor pipe 13, the other end of feed liquor pipe 13 runs through a lateral wall of lower bolster 3, the other end through connection of many cooling tubes 14 has drain pipe 15, drain pipe 15 runs through another lateral wall of lower bolster 3.
Base 1 and lower bolster 3, cope match-plate pattern 4 all sets to square shape, and lower bolster 3, the up end area of cope match-plate pattern 4 is the same, cushion socket 6 and standing groove 5 all are provided with four, guarantee the stability of whole lower bolster 3, the top of four guide pillars 2 all is provided with dog 12, prevent that cope match-plate pattern 4 from droing, feed liquor pipe 13 leans on the outer end to be fixed to be provided with inlet 16, and be provided with the external screw thread on the 16 outer walls of inlet, inlet 16 is connected with the coolant liquid discharging equipment, the external screw thread can increase connection stability, the size of punching press board 10 agrees with completely with the size of dashing for groove 8.
The working principle is as follows: during the use, 4 tops of first cope match-plate pattern and the compression bar connection of punching machine, place the raw materials in the die-cut 8, then be connected the coolant liquid discharge pipe with inlet 16, next start the punching machine, the punching machine drives cope match-plate pattern 4 and pushes down, when cope match-plate pattern 4 pressed on lower bolster 3, lower bolster 3 atress can compress buffer spring 7 earlier, then lower bolster 3 just can contact base 1, buffer spring 7 makes the atress of lower bolster 3 become mitigately, the coolant liquid gets into in the feed liquor pipe 13 from inlet 16 simultaneously, then the heat that produces when punching press through many cooling tubes 14 is siphoned away, then discharge in following drain pipe 15, make the inner temperature of lower bolster 3 remain stable, make the earphone product can not lead to secondary deformation because of overheated.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.

Claims (6)

1. The utility model provides a novel earphone mould, includes base (1), its characterized in that: guide pillars (2) are fixedly arranged at the upper ends of four corners of the base (1), a lower template (3) is slidably sleeved on a column body of each guide pillar (2), an upper template (4) is arranged at the upper end of each lower template (3) and slidably sleeved on the four guide pillars (2), a plurality of buffer seats (6) are arranged at the bottom end of each lower template (3), a plurality of placing grooves (5) matched with the buffer seats (6) are formed in the upper end face of the base (1), buffer springs (7) are fixedly connected at the bottom ends of the buffer seats (6), the bottom ends of the buffer springs (7) are fixedly connected at the bottom ends of the placing grooves (5), a punching groove (8) is formed in the upper end plate body of the lower template (3), a punching forming groove (9) is formed in the center of the punching groove (8), and a punching plate (10) is fixedly arranged at the center of the bottom end face of the upper template (4), the bottom fixedly connected with press forming piece (11) of punching press board (10), many cooling tubes (14) have been seted up to the lower extreme of press forming groove (9) of lower bolster (3), the one end through connection of many cooling tubes (14) has feed liquor pipe (13), the other end of feed liquor pipe (13) runs through a lateral wall of lower bolster (3), the other end through connection of many cooling tubes (14) has drain pipe (15), another lateral wall of lower bolster (3) is run through in drain pipe (15).
2. The novel earphone mold according to claim 1, wherein: the base (1), the lower template (3) and the upper template (4) are all set to be square, and the areas of the upper end faces of the lower template (3) and the upper template (4) are the same.
3. The novel earphone mold according to claim 1, wherein: the buffer seat (6) and the placing groove (5) are provided with four.
4. The novel earphone mold according to claim 1, wherein: and the top ends of the four guide columns (2) are provided with stop blocks (12).
5. The novel earphone mold according to claim 1, wherein: the liquid inlet pipe (13) is fixedly provided with a liquid inlet (16) close to the outer end, and the outer wall of the liquid inlet (16) is provided with an external thread.
6. The novel earphone mold according to claim 1, wherein: the size of the stamping plate (10) is completely matched with that of the stamping groove (8).
CN201922303701.3U 2019-12-20 2019-12-20 Novel earphone die Active CN211135213U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201922303701.3U CN211135213U (en) 2019-12-20 2019-12-20 Novel earphone die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201922303701.3U CN211135213U (en) 2019-12-20 2019-12-20 Novel earphone die

Publications (1)

Publication Number Publication Date
CN211135213U true CN211135213U (en) 2020-07-31

Family

ID=71746837

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201922303701.3U Active CN211135213U (en) 2019-12-20 2019-12-20 Novel earphone die

Country Status (1)

Country Link
CN (1) CN211135213U (en)

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