CN211125386U - High-voltage-resistant ceramic capacitor chip and columnar capacitor - Google Patents

High-voltage-resistant ceramic capacitor chip and columnar capacitor Download PDF

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Publication number
CN211125386U
CN211125386U CN201922020277.1U CN201922020277U CN211125386U CN 211125386 U CN211125386 U CN 211125386U CN 201922020277 U CN201922020277 U CN 201922020277U CN 211125386 U CN211125386 U CN 211125386U
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electrode
ceramic body
capacitor chip
capacitor
ceramic capacitor
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CN201922020277.1U
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Chinese (zh)
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何鹏飞
易建超
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Hunan Meizhi Technology Co ltd
Dongguan Amazing Electronic Co ltd
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Hunan Meizhi Technology Co ltd
Dongguan Amazing Electronic Co ltd
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Abstract

The utility model relates to an electric capacity technical field especially relates to a high pressure resistant ceramic capacitor chip and column condenser. High pressure resistant ceramic capacitor chip includes the tubulose ceramic body, and the lateral surface middle part of ceramic body is equipped with annular shrinkage pool, and the both sides of shrinkage pool form insulating bulge loop respectively, the bottom surface of annular shrinkage pool covers has the outer electrode, the hole side of ceramic body covers there is the inner electrode, and the surface area of inner electrode is 1.0 times ~1.1 times of the surface area of outer electrode. The two ends of the ceramic body are provided with the insulating convex rings, so that the creepage distance can be increased, the voltage resistance of the capacitor can be improved, and the high voltage resistance of the columnar capacitor can be improved.

Description

High-voltage-resistant ceramic capacitor chip and columnar capacitor
Technical Field
The utility model relates to an electric capacity technical field especially relates to a high pressure resistant ceramic capacitor chip and column condenser.
Background
The cylindrical aluminum electrolytic capacitor of the MZR series is quite widely applied to electronic products, and is formed by wrapping anode foil, inner electrolytic paper, cathode foil, outer electrolytic paper and adhesive tape in an aluminum shell, two electrodes of the capacitor are connected through leads respectively connected with the anode foil and the cathode foil, the anode foil and the cathode foil are equal in height, only the inner electrolytic paper is arranged in the middle of the capacitor, the spacing distance between the anode foil and the cathode foil is limited, the voltage borne by the capacitor is limited, and when the voltage is higher, the anode foil and the cathode foil can be broken down through edges. Therefore, it is necessary to design a high voltage resistant capacitor chip and a pillar capacitor.
Disclosure of Invention
An object of the utility model is to solve prior art not enough, provide a high pressure resistant ceramic capacitor chip to and have this capacitor chip's column condenser.
The utility model provides a high pressure resistant ceramic capacitor chip, its includes the tubulose ceramic body, and the lateral surface middle part of ceramic body is equipped with annular shrinkage pool, and the both sides of shrinkage pool form insulating bulge loop respectively, the bottom surface of annular shrinkage pool covers has the outer electrode, the hole side of ceramic body covers has the inner electrode, and the surface area of inner electrode is 1.0 times ~1.1 times of the surface area of outer electrode.
Furthermore, a plurality of inner convex rings are arranged on the inner side surface of the ceramic body.
Furthermore, the internal electrode is positioned in the middle of an inner hole of the ceramic body, and insulators are connected to two sides of the inner hole of the ceramic body respectively.
A columnar capacitor comprises an aluminum shell and the high-voltage-resistant ceramic capacitor chip, wherein the aluminum shell is in a cylindrical shape with an opening at the upper end; high pressure resistant ceramic capacitor chip sets up in the aluminum hull, and high pressure resistant ceramic capacitor chip's outside parcel has the annular insulating layer of one deck, the internal electrode is connected with interior lead-out wire, and the outer electrode is connected with outer lead-out wire, the upper end of aluminum hull is provided with the rubber buffer, rubber buffer and aluminum hull interference fit, and the middle part of rubber buffer is equipped with two electrode holes and pegs graft respectively and have two electrode posts, and the one end of two electrode posts is passed the rubber buffer and is inserted in the casing and be connected with interior lead-out wire, outer lead-out wire respectively.
Furthermore, the insulating layer is externally sleeved with an insulating tape layer.
Furthermore, one end of the electrode column is provided with a threading hole, and the end part of the electrode column is provided with a winding groove.
Furthermore, an insulating sleeve is sleeved outside the aluminum shell.
The utility model has the advantages that: the two ends of the ceramic body are provided with the insulating convex rings, so that the creepage distance can be increased, the voltage resistance of the capacitor can be improved, and the high voltage resistance of the columnar capacitor can be improved.
Drawings
Fig. 1 is a schematic structural diagram of the high voltage resistant ceramic capacitor chip of the present invention.
Fig. 2 is a schematic cross-sectional view of fig. 1.
Fig. 3 is a second schematic structural diagram of the high voltage ceramic capacitor chip of the present invention.
Fig. 4 is a schematic cross-sectional view of fig. 3.
Fig. 5 is a schematic view of a third sectional structure of the high voltage ceramic capacitor chip of the present invention.
Fig. 6 is a schematic view of an exploded structure of the cylindrical capacitor of the present invention.
Description of reference numerals:
1-a ceramic body; 2-an outer electrode; 3-internal electrode; 4-an insulator; 5-electrode column; 6-rubber plug; 7-internal leading-out wire; 8-an insulating layer; 9-insulating tape layer; 10-aluminum shell; 11-a concave hole; 12-insulating convex ring; 13-inner convex ring; 20-insulating sleeve.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and the detailed description.
Example (b): see fig. 1-6.
See fig. 1, 2; the utility model provides a high pressure resistant ceramic capacitor chip, its includes pipy ceramic body 1, and the lateral surface middle part of ceramic body 1 is equipped with annular shrinkage pool 11, and insulating bulge loop 12 is formed respectively to the both sides of shrinkage pool 11, the bottom surface of annular shrinkage pool 11 covers has outer electrode 2, the hole side of ceramic body 1 covers there is inner electrode 3, and inner electrode 3's surface area is 1.0 times ~1.1 times of the surface area of outer electrode 2.
For cooperating with the present cylindrical capacitor of MZR series, this technical scheme has designed the tubulose electric capacity chip, this tubulose electric capacity chip simulation anode foil, interior electrolytic paper and the structure of negative pole foil are designed, ceramic body 1 thickness and insulating coefficient are all bigger than interior electrolytic paper in this technical scheme, therefore the voltage that its itself bore can be big than current MZR capacitor, and the creepage distance of electric capacity chip also can influence the scope that the electric capacity bore voltage, this technical scheme is through setting up annular shrinkage pool 11 and having the bulge loop in the middle part of the lateral surface of ceramic body 1 for the creepage distance between inner electrode 3 and outer electrode 2 obtains increasing, can further improve its withstand voltage. Secondly, the surface areas of the outer side and the inner side of the ceramic body 1 are different; in order to make the electric quantity of the inner electrode 3 and the outer electrode 2 consistent, the technical scheme sets the areas of the inner electrode 3 and the outer electrode 2 in a stable range.
See fig. 3, 4; furthermore, a plurality of inner convex rings 13 are arranged on the inner side surface of the ceramic body 1.
An inner collar 13 is arranged for increasing the area of the inner electrode 3; the capacity of the capacitor is improved; while also balancing the difference in electrical quantities with the outer electrode 2.
Referring to fig. 5, further, the internal electrode 3 is located in the middle of the inner hole of the ceramic body 1, and insulators 4 are respectively connected to two sides of the inner hole of the ceramic body 1.
To further increase the creepage distance, or to avoid the existence of creepage distances; in the technical scheme, insulators 4 are arranged on two sides of an inner hole of a ceramic body 1. The insulator 4 can be annular or round cake-shaped, and the insulator 4 is provided with a threading hole.
A columnar capacitor comprises an aluminum shell 10 and the high-voltage resistant ceramic capacitor chip, wherein the aluminum shell 10 is in a cylindrical shape with an opening at the upper end; high pressure resistant ceramic capacitor chip sets up in aluminum hull 10, and high pressure resistant ceramic capacitor chip's outside parcel has the annular insulating layer of one deck 8, internal electrode 3 is connected with interior lead-out wire 7, and outer electrode 2 is connected with outer lead-out wire, the upper end of aluminum hull 10 is provided with rubber buffer 6, rubber buffer 6 and 10 interference fit of aluminum hull, and the middle part of rubber buffer 6 is equipped with two electrode holes and pegs graft respectively and have two electrode posts 5, and the one end of two electrode posts 5 is passed rubber buffer 6 and is inserted in the casing and be connected with interior lead-out wire 7, outer lead-out wire respectively.
The cylindrical capacitor has basically the same appearance structure as the existing MZR series capacitor, but adopts a high-voltage resistant ceramic capacitor chip, so that the structure is more compact and high-voltage resistant. The insulating layer 8 may be made of a flexible insulating material such as electrolytic paper. Therefore, the ceramic body 1 is used as an inner core, and when the ceramic body is connected with the inner lead wire 7 and the outer lead wire, the connection can be stable in a soldering mode.
Further, an insulating tape layer 9 is sleeved outside the insulating layer 8.
The insulating tape layer 9 serves to bind the insulating layer 8 such that the insulating layer 8 is in close contact with the insulator 4.
Furthermore, one end of the electrode column 5 is provided with a threading hole, and the end part of the electrode column is provided with a winding groove.
For the convenience is connected internal lead, outer lead and electrode post 5, this technical scheme has set up through wires hole and wire winding groove at electrode post 5's tip.
Further, an insulating sleeve 20 is sleeved outside the aluminum shell 10.
The insulating sleeve 20 is arranged, so that the shell is prevented from being electrified and the inside is prevented from being influenced.
Having described the invention in detail, it will be apparent to those skilled in the art that modifications and equivalents may be made to the disclosed embodiments without departing from the spirit and scope of the disclosed embodiments.

Claims (7)

1. A high voltage resistant ceramic capacitor chip, which comprises a tubular ceramic body, is characterized in that: the lateral surface middle part of ceramic body is equipped with annular shrinkage pool, and the both sides of shrinkage pool form the insulating bulge loop respectively, the bottom surface of annular shrinkage pool covers has the outer electrode, the hole side of ceramic body covers has the inner electrode, and the surface area of inner electrode is 1.0 times ~1.1 times of the surface area of outer electrode.
2. The high voltage ceramic capacitor chip as claimed in claim 1, wherein: the inner side surface of the ceramic body is provided with a plurality of inner convex rings.
3. The high voltage ceramic capacitor chip as claimed in claim 1 or 2, wherein: the inner electrode is positioned in the middle of an inner hole of the ceramic body, and insulators are connected to two sides of the inner hole of the ceramic body respectively.
4. A cylindrical capacitor, characterized in that: the high-voltage resistant ceramic capacitor chip comprises an aluminum shell and the high-voltage resistant ceramic capacitor chip as claimed in any one of claims 1 to 3, wherein the aluminum shell is in a cylindrical shape with an open upper end; high pressure resistant ceramic capacitor chip sets up in the aluminum hull, and high pressure resistant ceramic capacitor chip's outside parcel has the annular insulating layer of one deck, the internal electrode is connected with interior lead-out wire, and the outer electrode is connected with outer lead-out wire, the upper end of aluminum hull is provided with the rubber buffer, rubber buffer and aluminum hull interference fit, and the middle part of rubber buffer is equipped with two electrode holes and pegs graft respectively and have two electrode posts, and the one end of two electrode posts is passed the rubber buffer and is inserted in the casing and be connected with interior lead-out wire, outer lead-out wire respectively.
5. The cylindrical capacitor as claimed in claim 4, wherein: the insulating layer is sleeved with an insulating tape layer.
6. The cylindrical capacitor as claimed in claim 4, wherein: one end of the electrode column is provided with a threading hole, and the end part of the electrode column is provided with a winding groove.
7. The cylindrical capacitor as claimed in claim 4, wherein: and an insulating sleeve is sleeved outside the aluminum shell.
CN201922020277.1U 2019-11-21 2019-11-21 High-voltage-resistant ceramic capacitor chip and columnar capacitor Active CN211125386U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201922020277.1U CN211125386U (en) 2019-11-21 2019-11-21 High-voltage-resistant ceramic capacitor chip and columnar capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201922020277.1U CN211125386U (en) 2019-11-21 2019-11-21 High-voltage-resistant ceramic capacitor chip and columnar capacitor

Publications (1)

Publication Number Publication Date
CN211125386U true CN211125386U (en) 2020-07-28

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201922020277.1U Active CN211125386U (en) 2019-11-21 2019-11-21 High-voltage-resistant ceramic capacitor chip and columnar capacitor

Country Status (1)

Country Link
CN (1) CN211125386U (en)

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