CN211125377U - Multilayer ceramic capacitor - Google Patents
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- CN211125377U CN211125377U CN201922140091.XU CN201922140091U CN211125377U CN 211125377 U CN211125377 U CN 211125377U CN 201922140091 U CN201922140091 U CN 201922140091U CN 211125377 U CN211125377 U CN 211125377U
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Abstract
The utility model discloses a multilayer ceramic capacitor, including effective electrode layer and reinforcement body, at least one department in the upper surface of effective electrode layer, the inside and effective electrode layer's of effective electrode layer lower surface is located to the reinforcement body, two terminal surfaces of effective electrode layer and reinforcement body all with the tip electrode contact, the reinforcement body is piled up by a plurality of reinforcement body units and forms, it includes high strength material layer and ceramic dielectric layer to strengthen the body unit, high strength material layer main part material's intensity is greater than ceramic dielectric layer main part material's intensity, multilayer ceramic capacitor sets up high strength material layer evenly distributed in M L CC's ceramic dielectric layer, under the prerequisite of the original electric property of assurance condenser, has improved M L CC's bending strength and bending strength greatly.
Description
Technical Field
The utility model relates to a condenser, concretely relates to high strength multilayer ceramic capacitor.
Background
The multilayer ceramic capacitor is mainly divided into two types, i type high-frequency ceramic capacitor and ii type high-dielectric ceramic capacitor. Among them, for the class ii high dielectric ceramic capacitor, because the ceramic dielectric material itself adopted is low in strength, it is easy to cause vibration in the using process, such as welding, plate splitting or stress or temperature fluctuation, resulting in its breakage.
In order to solve the problems, the stress is weakened by adopting flexible terminals or welding metal elastic sheets and other design means at the current stage, and the fracture problem caused in the using process of the product is improved. The design of the noble metal soft terminal is that a layer of flexible noble metal and conductive resin material is added at the end of the product, so that the flexible material at the end absorbs stress by slight plastic deformation when the product is subjected to external force or vibration, and the product is protected from breaking. This solution has the following drawbacks: 1) the noble metal resin slurry has high cost and is easy to have the problems of poor tin plating and the like; 2) the flexible terminal drying and co-firing technology is required to be fine, and the loss value of a product is generally increased; 3) the production of the product increases the operation flow and has certain influence on the production period and the cost of the product.
The design of welding the metal elastic sheet at the end of the product is similar to the principle of a flexible end, and the external stress is absorbed by setting the elastic deformation of the metal elastic sheet to protect the product. This solution has the following drawbacks: 1) the material and the manufacturing cost of the metal elastic sheet are increased, and the market competitiveness is reduced; 2) operability and production automation degree are not high, and mass production conditions are not met; 3) the production of the product increases the operation flow and has certain influence on the production period and the cost of the product.
Disclosure of Invention
An object of the utility model is to overcome the weak point that prior art exists and provide a high strength multilayer ceramic capacitor.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a multilayer ceramic capacitor includes an effective electrode layer and a reinforcement body provided at least one of an upper surface of the effective electrode layer, an inside of the effective electrode layer, and a lower surface of the effective electrode layer; the reinforcing body is formed by stacking a plurality of reinforcing body units; the reinforcing body unit comprises a high-strength material layer and a ceramic dielectric layer; the material of the high-strength material layer comprises a high-strength material, and the strength of the main body material of the high-strength material layer is greater than that of the main body material of the ceramic dielectric layer.
The utility model discloses a strength defect that multilayer ceramic capacitor material itself can obviously be improved to the reinforcer, guarantees under the prerequisite of the original electric property of condenser, has improved multilayer ceramic capacitor's bending strength and bending strength resistance greatly, can make multilayer ceramic capacitor's bending strength all is greater than or equal to 10kgf, and bending strength value all is greater than or equal to 7mm, the use field of the M L CC product of widening, multilayer ceramic capacitor can wide application in electron electrical products, as a conventional passive electronic components, multilayer ceramic capacitor is owing to have higher intensity, can be applied to electricity-saving lamp, on-vehicle electronic apparatus (like car navigation, vehicle event data recorder, vehicle audio etc.), wait to the higher field of product strength requirement.
Preferably, the reinforcement body is provided on an upper surface of the effective electrode layer and a lower surface of the effective electrode layer. The body intensity that the reinforcing body located multilayer ceramic capacitor's effective electrode layer's upper and lower surface can further improve the product, especially to the capacity great, the more condenser of electrode number of piles, its effect is more obvious (because the big condenser of electrode number of piles, the porcelain body fracture appears more easily, the not good problem of intensity).
Preferably, the reinforcement body is provided on an upper surface of the effective electrode layer, inside the effective electrode layer, and on a lower surface of the effective electrode layer. The reinforcing body is arranged in the effective electrode layer, so that a ceramic capacitor with more balanced stress can be formed, and the capacitor with smaller capacity and fewer electrode layers is easier to realize.
The reinforcement bodies are arranged on the upper surface and the lower surface of the effective electrode layer to play a role of a capacitor protection cover, the effective electrode layer comprises a ceramic dielectric layer and a metal electrode layer (such as Ni or Cu), the effective electrode layer is preferably prepared by uniformly coating an electrode material on the surface of the ceramic dielectric layer by adopting a screen printing process and realizing densification and combination through a later-stage co-firing process. The effective electrode layer comprises a plurality of effective electrode units which are stacked in a staggered mode, the effective electrode units are stacked to form two end faces, the reinforcing body comprises a plurality of stacked reinforcing body units, the plurality of stacked reinforcing body units are stacked to form two end faces, and the two end faces are respectively in contact with the end electrodes.
Preferably, the ratio of the thickness of the high-strength material layer to the thickness of the ceramic dielectric layer is: high-strength material layer: the ratio of the ceramic medium layer to the ceramic medium layer is 0.1-0.9: 1; preferably, the ratio of the thickness of the high-strength material layer to the thickness of the ceramic dielectric layer is: high-strength material layer: the ratio of the ceramic medium layer is 0.2-0.5: 1.
The shrinkage behaviors of the high-strength material layer and the ceramic dielectric layer are inconsistent due to the shrinkage rate difference in the sintering process. The thickness and the component proportion of the high-strength material layer and the ceramic dielectric layer can be controlled, a similar inner electrode distribution principle is adopted, the high-strength material layer is uniformly distributed between the ceramic dielectric layers in a thinner thickness, the shrinkage stress is effectively dispersed and balanced in the uniform distribution of the thin layer, the stress concentration in the sintering process is greatly reduced, the high-strength material layer is thinned and uniformly distributed to the reinforcing body, and the stress concentration in the sintering process is effectively reduced. The thickness ratio of the high-strength material layer to the ceramic dielectric layer is too small, namely the high-strength material layer accounts for too little, and the capacitor cannot meet the expected strength requirement; if the thickness ratio of the ceramic dielectric layer and the high-strength material layer is too high, the ratio of the high-strength material layer to the high-strength material layer is too high, and stress cracking is easily caused due to too large sintering shrinkage difference between the ceramic dielectric layer and the high-strength material layer.
Preferably, the thickness of the high-strength material layer is 1-5 μm, and the thickness of the ceramic dielectric layer is 4-14 μm. The size of the chip volume is increased if the thicknesses of the chip volume and the ceramic dielectric layer are too high, which is not beneficial to the miniaturization and the light weight of the chip volume and the application of the chip volume in electronic equipment; if the thickness of the two is too low, the strength effect is limited.
Preferably, the thickness of the reinforcement body is greater than or equal to 20% of the thickness of the multilayer ceramic capacitor, for example, the thickness of the reinforcement body is less than 20% of the thickness of the multilayer ceramic capacitor, and the strength of the reinforcement body is not improved well. The upper limit may not be limited in theory as long as the capacity requirement of the product is met. The number of reinforcing elements in the reinforcement is determined by the total thickness of the reinforcement and the thickness of the reinforcement itself.
Preferably, when the capacitor capacity is more than 100nF, the thickness of the high-strength material layer is 1-2.5 μm; and when the capacitor capacity is less than or equal to 100nF, the thickness of the high-strength material layer is 2.6-5.0 μm.
For medium and high capacitance products, namely, the capacitance is more than 100nF, the thickness of the high-strength material layer is 1-2.5 mu m, compared with the high-strength material layer formed on the film belt by secondary tape casting, the thickness of the high-strength material layer prepared by adopting a screen printing process can be thinner, and the appearance and thickness consistency can be controlled more accurately; in addition, the thinner the reinforcing body arranged in the effective electrode layer is, the smaller the stress generated by sintering is, and the method is more suitable for producing high-capacity products.
For low-capacitance products, namely, the capacitance is less than or equal to 100nF, the thickness of the high-strength material layer is 2.6-5.0 mu m, the low-capacitance products are formed by adopting a secondary tape casting process, the prepared high-strength material layer has a uniform structure by controlling the secondary tape casting process, and the strength, toughness, viscosity and the like of the film tape can meet the later lamination requirements.
Preferably, when the capacity of the capacitor is more than 100nF, the thickness of the ceramic dielectric layer is 4-7.5 μm; when the capacity of the capacitor is less than or equal to 100nF, the thickness of the ceramic dielectric layer in the reinforcing body is 8-14 mu m.
The material of the high-strength material layer comprises a high-strength material comprising at least one of zirconia, alumina, calcium zirconate, strontium zirconate, and strontium calcium zirconate titanate.
Zirconium oxide (ZrO)2) Alumina (Al)2O3) Calcium zirconate (CaZrO)3) Strontium zirconate (SrZrO)3) And its compound strontium calcium zirconate titanate (Ca)xSr1-xZryTi1-yO3) All are high-strength ceramicsThe material has three-point bending strength of over 300MPa and small thermal expansion coefficient, and the strength and the thermal expansion coefficient of the materials are shown in Table 1.
TABLE 1
The utility model adopts zirconium oxide (ZrO)2) Alumina (Al)2O3) Calcium zirconate (CaZrO)3) Strontium zirconate (SrZrO)3) And its compound strontium calcium zirconate titanate (Ca)xSr1-xZryTi1-yO3) At least one material with higher strength is used as a high-strength material layer in the reinforcing body and is uniformly distributed on the upper surface and the lower surface of the effective electrode layer or the upper surface and the lower surface of the effective electrode layer and the effective electrode layer of the multilayer ceramic capacitor, so that the flexural strength and the bending strength of the multilayer ceramic capacitor are effectively improved.
The high-strength material may be at least one of zirconia, calcium zirconate, and strontium zirconate. The three materials have high strength, high sintering shrinkage matching performance and excellent matching performance with a ceramic dielectric layer. The material strength of the zirconia is optimal, the expansion coefficient of the zirconia is very similar to that of the material of the ceramic dielectric layer, and the ceramic dielectric layer has excellent sintering matching performance. Preferably, the high-strength material layer further includes an auxiliary material including at least one of calcium oxide, magnesium oxide, silicon oxide, and yttrium oxide; the weight ratio of the high-strength material to the auxiliary material is as follows: high-strength material: the auxiliary material is (80-99.5): (0.5-20). The calcium oxide, the magnesium oxide, the silicon oxide and the yttrium oxide are used as auxiliary materials of the high-strength material layer, play a role of a sintering aid and promote the sintering of the main material. On the premise of not changing the electrical property of the multilayer ceramic capacitor, the content of the high-strength material and the auxiliary material can inhibit the sintering element from diffusing within the range of the mixture ratio to influence the electrical property, and the sintering shrinkage rate is adjusted. More preferably, the weight ratio of the high-strength material to the auxiliary material is: high-strength material: the auxiliary materials (87-98): 2-13. More preferably, the weight ratio of the high-strength material to the auxiliary material is: high-strength material: the auxiliary material is (90-95): 5-10).
More preferably, the high strength material is calcium zirconate and/or strontium zirconate. The calcium zirconate and the strontium zirconate have high strength, high sintering shrinkage matching property and more excellent matching property with the ceramic dielectric layer.
Preferably, the material of the ceramic dielectric layer and the material of the effective electrode layer comprise BaTiO3、BaTi1-xZrxO3And BaSrTiO3At least one of (1). The ceramic dielectric layer is made of a class II dielectric material with excellent dielectric property, and preferably, in the same capacitor, the main body material of the ceramic dielectric layer is the same as that of the effective electrode layer.
Preferably, the raw materials for preparing the high-strength material layer further comprise a binder, a dispersant and a solvent; the raw materials for preparing the ceramic dielectric layer also comprise an additive, a binder, a dispersant and a solvent. The kinds of additives, binders, dispersants and solvents may be selected from those commonly used in the art according to need.
Preferably, the preparation method of the reinforcing body comprises the following steps:
(a) uniformly mixing preparation raw materials of the ceramic dielectric layer, and then forming the ceramic dielectric layer by tape casting;
(b) uniformly mixing preparation raw materials of the high-strength material layer, and forming the high-strength material layer on the ceramic dielectric layer in the step (a) by adopting a secondary tape casting process or a screen printing process to obtain a reinforcing body unit;
(c) and (c) repeating the step (a) and the step (b), and stacking a plurality of reinforcement body units prepared in the step (b) to obtain the reinforcement body.
The preparation method of the multilayer ceramic capacitor comprises the following steps:
(1) uniformly mixing preparation raw materials of the ceramic dielectric layer, and then forming the ceramic dielectric layer by tape casting;
(2) uniformly mixing preparation raw materials of the high-strength material layer, and forming the high-strength material layer on the ceramic medium layer in the step (1) by adopting a secondary tape casting process or a screen printing process to obtain a reinforcement body unit;
(3) uniformly mixing preparation raw materials of the effective electrode layer, and then carrying out tape casting to obtain a ceramic film tape;
(4) performing screen printing on the ceramic membrane tape obtained in the step (3) by using Ni or Cu electronic paste as internal electrode paste to obtain the effective electrode unit;
(5) stacking the effective electrode units to form an effective electrode layer; stacking the reinforcing body units obtained in the step (2) on two opposite surfaces of the effective electrode layers, which are vertical to the stacking direction, so as to obtain stacked body units;
(6) stacking at least one stacked body unit to obtain a stacked body;
(7) and (4) sequentially carrying out pressing, cutting, glue discharging, sintering, chamfering, end copper sintering and surface treatment on the stacked body obtained in the step (6) to obtain the multilayer ceramic capacitor.
The utility model discloses a secondary curtain coating or screen printing's technology has realized the evenly distributed of high strength material layer on conventional dielectric layer, can effectively realize the dispersion of sintering stress and the prevention of fracture problem. The casting molding, the secondary casting process and the screen printing process are used for preparing the film layer with the corresponding thickness, the conventional process conditions in the field can be adopted, and the conventional process conditions in the field can be adopted for the process conditions of pressing, cutting, glue discharging, sintering, chamfering, end copper sintering, surface treatment and the like.
Preferably, the raw materials for preparing the ceramic dielectric layer in the step (1) are the same as the raw materials for preparing the effective electrode layer in the step (3).
Preferably, in the step (2), when the thickness of the high-strength material layer is 1-2.5 μm, the forming process of the high-strength material layer is a screen printing process; when the thickness of the high-strength material layer is 2.5-5.0 mu m, the forming process of the high-strength material layer is a secondary tape casting process.
For medium and high capacitance products, the thickness of the high-strength material layer is 1-2.5 microns, compared with the high-strength material layer formed on the film belt through secondary tape casting, the thickness of the high-strength material layer prepared by adopting a screen printing process can be thinner, and the appearance and thickness consistency can be controlled more accurately; in addition, the thinner the reinforcing body arranged in the effective electrode layer is, the smaller the stress generated by sintering is, and the method is more suitable for producing high-capacity products. By controlling the screen printing process, the prepared high-strength material layer has uniform structure and appearance, and the strength, toughness, viscosity and the like of the film belt can meet the later-stage lamination requirements; the screen printing process parameters comprise the selection of printing films, printing speed, drying temperature, printing thickness and the like.
For a low-capacitance product, the thickness of the low-capacitance product is 2.6-5.0 mu m, a secondary tape casting process is adopted for forming, the prepared high-strength material layer has a uniform structure by controlling the secondary tape casting process, and the strength, toughness, viscosity and the like of the film tape can meet the later-stage lamination requirements; the secondary casting process parameters comprise casting speed, drying temperature, casting thickness, film belt density and the like.
In the step (4), the qualified ceramic film belt subjected to medium casting is subjected to screen printing according to the film specified in the design parameters, and a qualified electrode pattern is printed by preferably adopting Ni electronic paste as the internal electrode paste;
preferably, in step (5), the effective electrode units are stacked in a staggered manner. The dislocation mode is stacked together to form effective electrical performance.
Preferably, in step (6), the number of the stacked units is 1 or 2. The number of the stacked body units can be 1 or more, and when the number of the stacked body units is 1, the reinforcing bodies are arranged on the upper surface and the lower surface of the effective electrode layer; when the number of the stacked bodies is 2, the reinforcing bodies are arranged on the upper surface, the lower surface and the inside of the effective electrode layer, when the number of the stacked body units is n, the reinforcing bodies are arranged on the upper surface, the lower surface and the inside of the effective electrode layer, and n-1 reinforcing bodies are arranged inside the effective electrode layer and can be arranged according to specific conditions. In general, a high strength effect can be achieved with 1 or 2 stacked units.
The beneficial effects of the utility model reside in that, the utility model provides a multilayer ceramic capacitor, multilayer ceramic capacitor adopts the high strength material layer in the high strength material conduct reinforcement body, and evenly distributed is in the upper and lower surface or upper and lower surface and the effective electrode layer of multilayer ceramic capacitor's effective electrode layer, can obviously improve the intensity defect of multilayer ceramic capacitor material itself, under the prerequisite of the original electric property of assurance condenser, has improved multilayer ceramic capacitor's bending strength and bending strength greatly, can make multilayer ceramic capacitor's bending strength all is more than or equal to 10kgf, and bending strength value all is more than or equal to 7mm, has widened the use field of M L CC product.
Drawings
FIG. 1 is a schematic view showing the structure of a multilayer ceramic capacitor described in example 1;
FIG. 2 is a schematic view showing the structure of a multilayer ceramic capacitor described in example 2;
wherein, 1, an effective electrode layer; 2. a reinforcement body; 3. and an end electrode.
Detailed Description
The embodiment of the utility model provides a performance data test method that relates to sees table 2.
TABLE 2
The flexural strength test method comprises the following steps: and testing the breaking strength by using a tension tester under the test condition that the product is fixed on a grinding tool of a test bench and applying 1mm/s pressure on the product by using the tension tester until the product is broken.
The bending strength test method comprises the following steps: and testing the bending strength of the PVB by using a tension tester under the test condition that the product is welded on a special PVB plate, and reversely applying a pressure of 1mm/s to the PVB plate by using the tension tester until the capacity change rate of the product is more than 10%.
For better illustrating the objects, technical solutions and advantages of the present invention, the present invention will be further described with reference to the following embodiments.
Example 1
A schematic structural diagram of a multilayer ceramic capacitor according to the present embodiment is shown in fig. 1, the multilayer ceramic capacitor includes an effective electrode layer 1 and a reinforcement body 2, the reinforcement body 2 is disposed on the upper surface and the lower surface of the effective electrode layer 1, and the reinforcement body 2 is formed by stacking a plurality of reinforcement body units; the effective electrode layer 1 is formed by stacking a plurality of effective electrode units in a staggered manner, the effective electrode units and the reinforcement body units are stacked to form two end faces, and the two end faces are respectively contacted with the end electrodes 3.
The reinforcing body unit comprises a high-strength material layer and a ceramic dielectric layer; the thickness of the high-strength material layer is 1-5 μm, the thickness of the ceramic dielectric layer is 4-14 μm, and the thickness ratio of the high-strength material layer to the ceramic dielectric layer is as follows: high-strength material layer: the ratio of the ceramic medium layer is 0.1-0.9: 1.
The material of the high-strength material layer comprises a high-strength material and an auxiliary material, and the high-strength material comprises at least one of zirconium oxide, aluminum oxide, calcium zirconate, strontium zirconate and strontium calcium zirconate titanate; the auxiliary material comprises at least one of calcium oxide, magnesium oxide, silicon oxide and yttrium oxide, and the weight ratio of the high-strength material to the auxiliary material is as follows: high-strength material: (ii) 80 to 99.5 and (0.5 to 20) as an auxiliary material; the weight ratio of the high-strength material to the auxiliary material is more preferably: high-strength material: (87-98) and (2-13) as auxiliary materials; the weight ratio of the high-strength material to the auxiliary material is most preferably: high-strength material: the auxiliary material is (90-95): 5-10). The material of the ceramic dielectric layer and the material of the effective electrode layer comprise BaTiO3、BaTi1-xZrxO3And BaSrTiO3At least one of (1).
The method for manufacturing the multilayer ceramic capacitor according to example 1 comprises the steps of:
(1) uniformly mixing preparation raw materials of the ceramic dielectric layer, and then forming the ceramic dielectric layer by tape casting;
(2) uniformly mixing preparation raw materials of the high-strength material layer, and forming the high-strength material layer on the ceramic medium layer in the step (1) by adopting a secondary tape casting process or a screen printing process to obtain a reinforcement body unit;
(3) uniformly mixing preparation raw materials of the effective electrode layer, and then carrying out tape casting to obtain a ceramic film tape;
(4) performing screen printing on the ceramic film belt obtained in the step (3) according to a film specified in design parameters by using Ni electronic paste as internal electrode paste, and printing a qualified electrode pattern by using Ni electronic paste as internal electrode paste to obtain an effective electrode unit;
(5) stacking the reinforcing body units prepared in the step (2) according to the product specification to form a bottom reinforcing body, then stacking the effective electrode units prepared in the step (4) to form an effective electrode layer, and then stacking the reinforcing body units prepared in the step (2) to form a top reinforcing body to obtain a stacked body;
(6) and (5) sequentially carrying out pressing, cutting, glue discharging, sintering, chamfering, end copper sintering and surface treatment on the stacked body obtained in the step (5) to obtain the multilayer ceramic capacitor.
Example 2
A schematic structural diagram of the multilayer ceramic capacitor of the present embodiment is shown in fig. 2, the multilayer ceramic capacitor includes an effective electrode layer 1 and a reinforcement body 2, the reinforcement body 2 is disposed on the upper surface and the lower surface of the effective electrode layer 1 and inside the effective electrode layer 1, and the reinforcement body 2 is formed by stacking a plurality of reinforcement body units; the effective electrode layer 1 is formed by stacking a plurality of effective electrode units in a staggered manner, the effective electrode units and the reinforcement body units are stacked to form two end faces, and the two end faces are respectively contacted with the end electrodes 3.
The reinforcing body unit comprises a high-strength material layer and a ceramic dielectric layer; the thickness of the high-strength material layer is 1-5 μm, the thickness of the ceramic dielectric layer is 4-14 μm, and the thickness ratio of the high-strength material layer to the ceramic dielectric layer is as follows: high-strength material layer: the ratio of the ceramic medium layer is 0.1-0.9: 1.
The material of the high-strength material layer comprises a high-strength material and an auxiliary material, and the high-strength material comprises at least one of zirconium oxide, aluminum oxide, calcium zirconate, strontium zirconate and strontium calcium zirconate titanate; the auxiliary material comprises at least one of calcium oxide, magnesium oxide, silicon oxide and yttrium oxide, and the weight ratio of the high-strength material to the auxiliary material is as follows: high-strength material: (ii) 80 to 99.5 and (0.5 to 20) as an auxiliary material; the high-strength material and the auxiliary materialMore preferably: high-strength material: (87-98) and (2-13) as auxiliary materials; the weight ratio of the high-strength material to the auxiliary material is most preferably: high-strength material: the auxiliary material is (90-95): 5-10). The material of the ceramic dielectric layer and the material of the effective electrode layer comprise BaTiO3、BaTi1-xZrxO3And BaSrTiO3At least one of (1).
The method for manufacturing the multilayer ceramic capacitor according to example 2 includes the steps of:
(1) uniformly mixing preparation raw materials of the ceramic dielectric layer, and then forming the ceramic dielectric layer by tape casting;
(2) uniformly mixing preparation raw materials of the high-strength material layer, and forming the high-strength material layer on the ceramic medium layer in the step (1) by adopting a secondary tape casting process or a screen printing process to obtain a reinforcement body unit;
(3) uniformly mixing preparation raw materials of the effective electrode layer, and then carrying out tape casting to obtain a ceramic film tape;
(4) performing screen printing on the ceramic film belt obtained in the step (3) according to a film specified in design parameters by using Ni electronic paste as internal electrode paste, and printing a qualified electrode pattern by using Ni electronic paste as internal electrode paste to obtain an effective electrode unit;
(5) stacking the reinforcement units prepared in the step (2) according to the product specification to form a bottom reinforcement, and then sequentially stacking the effective electrode units prepared in the step (4) to form an effective electrode layer, the reinforcement units prepared in the step (2), the effective electrode units prepared in the step (4) and the reinforcement units prepared in the step (2) to obtain a stacked body;
(6) and (5) sequentially carrying out pressing, cutting, glue discharging, sintering, chamfering, end copper sintering and surface treatment on the stacked body obtained in the step (5) to obtain the multilayer ceramic capacitor.
Example 3
In order to investigate the influence of the thicknesses of the high-strength material layer and the ceramic dielectric layer on the performance of the multilayer ceramic capacitor, test groups 1 to 8 and comparison groups 1 to 3 in a table 3 are arranged according to the thickness ratio of the high-strength material layer and the ceramic dielectric layer changed in the structure of the multilayer ceramic capacitor described in the embodiment 1 and the embodiment 2, test groups 9 to 16 and comparison groups 4 to 6 in the table 3 are arranged according to the thickness ratio of the high-strength material layer and the ceramic dielectric layer changed in the structure of the multilayer ceramic capacitor described in the embodiment 2, and the multilayer ceramic capacitor is prepared according to the sheet volume of 0805 specification, wherein the high-strength material layer comprises the following components in parts by weight: 83 parts of calcium zirconate, 2 parts of zirconia, 2 parts of alumina and 13 parts of auxiliary materials; the auxiliary material comprises 3 parts of magnesium oxide, 3 parts of calcium oxide and 5 parts of silicon oxide, and the ceramic dielectric layer and the effective electrode layer are barium titanium zirconate.
TABLE 3
The results of the test on the M L CC structure described in example 1 are shown in Table 4, and the results of the test on the M L CC structure described in example 1 are shown in Table 5.
TABLE 4
TABLE 5
As can be seen from the test results of Table 4, H1/H2When the range is 0.1-0.9, the breaking strength of the product is increased from 2.8 to 6.7-12.0 kgf; the bending strength is increased from 3.3mm to 5.9 mm-10.6 mm; the bending strength and the bending strength of the product adopting the reinforcing body are obviously improved.
When H is present1/H2When 1.0 is satisfied, the flexural strength and bending strength are both good, butThe poor welding resistance of the product is 5ppm, which shows that the sintering shrinkage is affected due to the too thick thickness of the high-strength layer, so that the effect of uniformly distributing the reinforcing material and further dispersing stress in the technical scheme is weakened; the sintering has larger residual stress, when the welding resistance is detected, the product is impacted by the thermal stress, and the thermal shock cracking is caused by the release of the sintering residual stress; and the temperature characteristic TCC of the product is beyond the standard and has obvious deterioration. If H is1/H2If the bending strength is less than 0.1, the bending strength cannot be improved well;
in addition, with the increase of the ratio of the thickness of the high-strength material layer, the loss of the capacitor is gradually increased, and the insulation resistance and the voltage resistance are also reduced, so that H is used for ensuring the multi-aspect performance of the product1/H2The ratio is preferably 0.2-0.5.
The reinforcement bodies of example 2 were disposed on the upper and lower surfaces of the effective electrode layers and inside the effective electrode layers, and the reinforcement bodies of example 1 were disposed only on the upper and lower surfaces of the effective electrode layers, as can be seen from a comparison of tables 4 and 5, H1/H2The capacitor in the embodiment 2 enables the high-strength material to be distributed in the product more uniformly, has higher strength, better matching performance and reduced risk of stress cracking, but the M L CC structure in the embodiment 2 simultaneously increases the volume ratio of the reinforcing component in the whole product, reduces the proportion of the effective part, is difficult to realize for higher-capacity products, and particularly for products with higher requirements on the number of layers of effective electrodes.
Example 4
In order to investigate the influence of the materials of the high-strength material layer and the ceramic dielectric layer on the performance of the multilayer ceramic capacitor, the high-strength materials and the auxiliary materials of the high-strength material layer and the ceramic dielectric layer and the mixture ratio thereof were changed according to the structure of the multilayer ceramic capacitor described in example 1, test groups 1 to 12 and control groups 1 to 2 in table 6 were set, and the multilayer ceramic capacitor was manufactured according to 0805 specification, wherein the thickness of the high-strength material layer was 2.5 μm and the thickness of the ceramic dielectric layer was 7.5 μm, and the total amount of the high-strength materials and the auxiliary materials in the high-strength material layer was 100 parts (the mixture ratio is shown in. The ceramic dielectric layer and the effective electrode layer are barium titanium zirconate.
TABLE 6
Note: "-" indicates no addition.
The test results are shown in Table 7.
TABLE 7
As can be seen from Table 7, if the auxiliary material is not added to the high-strength material layer (comparative group 1), the high-strength material layer cannot be sintered during sintering of the product, and because the sintering temperature of the pure zirconia material is high, the multilayer ceramic capacitor is sintered at about 1200-1300 ℃, and the high-strength material layer and the pure zirconia material are difficult to co-fire. Moreover, the size difference between the effective electrode layer and the high-strength protective layer after sintering causes great stress, and the stress is released during cooling to cause cracking of the product.
As can also be seen from table 7, the use of zirconia, calcium zirconate, and strontium zirconate as the host material for the high strength material layer is significantly superior in strength to alumina or strontium calcium zirconate titanate. When the ratio of M1/M2 is 78:22, the strength of the product is slightly reduced, which is probably caused by the reduction of the components of the high-strength zirconia material; the product had 1ppm solder crack resistance when M1/M2 was 95.5: 0.5; when M1/M2 is 78:22, the product has a remarkably deteriorated solder resistance (cracking of 10ppm or less). Therefore, the ratio of M1 to M2 is not easy to be too large; when the ratio of M1/M2 is 90-95: 5-10, the product strength and welding performance are good.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting the protection scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention.
Claims (7)
1. A multilayer ceramic capacitor comprising an effective electrode layer and a reinforcing body provided at least one of an upper surface of the effective electrode layer, an inside of the effective electrode layer and a lower surface of the effective electrode layer; both end surfaces of the effective electrode layer and the reinforcement body are in contact with the end electrode; the reinforcing body is formed by stacking a plurality of reinforcing body units; the reinforcing body unit comprises a high-strength material layer and a ceramic medium layer, and the strength of a main body material of the high-strength material layer is greater than that of the main body material of the ceramic medium layer.
2. The multilayer ceramic capacitor according to claim 1, wherein the ratio of the thickness of the high-strength material layer to the thickness of the ceramic dielectric layer is: high-strength material layer: the ratio of the ceramic medium layer is 0.1-0.9: 1.
3. The multilayer ceramic capacitor according to claim 2, wherein the ratio of the thickness of the high-strength material layer to the thickness of the ceramic dielectric layer is: high-strength material layer: the ratio of the ceramic medium layer is 0.2-0.5: 1.
4. The multilayer ceramic capacitor according to claim 1, wherein the thickness of the high-strength material layer is 1 to 5 μm, and the thickness of the ceramic dielectric layer is 4 to 14 μm.
5. The multilayer ceramic capacitor according to claim 1, wherein the reinforcement body has a thickness of 20% or more of the thickness of the multilayer ceramic capacitor.
6. The multilayer ceramic capacitor according to claim 1, wherein the thickness of the high-strength material layer is 1 to 2.5 μm when the capacitor has a capacity of more than 100 nF; and when the capacity of the capacitor is less than or equal to 100nF, the thickness of the high-strength material layer is 2.6-5.0 mu m.
7. The multilayer ceramic capacitor according to claim 1, wherein the ceramic dielectric layer has a thickness of 4 to 7.5 μm when the capacitor has a capacity of more than 100 nF; when the capacity of the capacitor is less than or equal to 100nF, the thickness of the ceramic dielectric layer in the reinforcing body is 8-14 mu m.
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| CN110867321A (en) * | 2019-12-02 | 2020-03-06 | 深圳三环电子有限公司 | Multilayer ceramic capacitor and preparation method thereof |
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