CN211125227U - Packaging machine for alloy resistor - Google Patents
Packaging machine for alloy resistor Download PDFInfo
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- CN211125227U CN211125227U CN201922260982.9U CN201922260982U CN211125227U CN 211125227 U CN211125227 U CN 211125227U CN 201922260982 U CN201922260982 U CN 201922260982U CN 211125227 U CN211125227 U CN 211125227U
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Abstract
The utility model discloses a packaging machine for alloy resistor, include: the material pressing die comprises a die holder, a rubber channel, a clamping groove, a fixing groove, a material sheet groove, a material pressing die and a thimble for jacking up a material sheet. In this way, the utility model is used for alloy resistor's packaging machine can come better, faster fixed tablet according to shape, the structure of tablet, moreover can high efficiency form the insulating layer on the tablet surface, improve work efficiency, reduction in production cost.
Description
Technical Field
The utility model relates to a numerical control encapsulation equipment field especially relates to a packaging machine for alloy resistor.
Background
Alloy resistance is a resistance using alloy as a current medium, and is often used for sampling current in a circuit. For feeding back the varying current in the circuit in order to further control or influence the variation of the current. The products mainly used are as follows: battery protection board, power source, frequency converter, lamps and lanterns, motor etc..
However, in the current alloy resistor processing process, the quality of different manufacturers is greatly different and uneven, and particularly in the packaging process, conditions such as glue overflow or uneven coating are often generated, and the packaging effect is poor, so people need a packaging mold which meets the requirements more.
Disclosure of Invention
The utility model discloses the main technical problem who solves provides a packaging machine for alloy resistor, has advantages such as reliable performance height, location accuracy, compact structure, encapsulation effect are good, convenient to use, has extensive market prospect in packaging die's application and popularization simultaneously.
In order to solve the technical problem, the utility model discloses a technical scheme be:
the packaging machine for the alloy resistor comprises a die holder, a rubber channel, a clamping groove, a fixing groove, a material sheet groove, a material pressing die and a thimble for jacking up a material sheet.
The die holder is provided with the tablet groove, the fixed groove is arranged between two adjacent tablet grooves, the clamping grooves are arranged on two sides of the tablet groove, the die holder is provided with a rubber channel, the tail end of the rubber channel extends to each tablet groove, and the ejector pin moves up and down in the rubber channel.
And positioning pins for fixing and balancing the material sheets are arranged on two sides of the material sheet groove, and the material pressing die is matched with the die holder.
In a preferred embodiment of the present invention, each of the material sheet grooves is provided with a glue channel corresponding to the material sheet.
In a preferred embodiment of the present invention, the glue channel includes a main channel and a plurality of branch channels, the main channel is disposed between two rows of the tablet grooves, the branch channels are connected to the main channel, and the branch channels are disposed in parallel on the tablet grooves.
In a preferred embodiment of the present invention, the positioning pin penetrates through the positioning hole on the material sheet, so that the material sheet is fixed in the material sheet groove.
In a preferred embodiment of the present invention, the positioning pins are vertically disposed on both sides of the tablet groove.
In a preferred embodiment of the present invention, the die holder is provided with a limiting device for limiting the descending of the ejector pin, so that when the die holder descends to a limiting position, the ejector pin protrudes from the die holder and jacks up the material sheet.
The utility model has the advantages that: can come better, faster fixed tablet according to shape, the structure of tablet, can high efficiency form the insulating layer on the tablet surface moreover, improve work efficiency, reduction in production cost.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive work, wherein:
fig. 1 is a schematic structural diagram of an encapsulation mold according to a preferred embodiment of the encapsulation mold for alloy resistors of the present invention;
fig. 2 is a schematic structural view of a material sheet groove in a preferred embodiment of the packaging mold for alloy resistors of the present invention;
fig. 3 is a schematic structural diagram of the material sheet in a preferred embodiment of the packaging mold for alloy resistors of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below, and it should be apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-3, an embodiment of the present invention includes:
the function of the packaging machine for the alloy resistor is to form an insulating layer of fixed area outside the metal material of the material sheet 8.
A packaging machine for alloy resistor, including die holder 1, glue way, draw-in groove 3, fixed slot 4, tablet groove 5, with die holder matched with press the material mould and be used for jack-up tablet thimble 6, be provided with two on the die holder the tablet groove, every row has 5 tablet grooves, is provided with between two adjacent tablet grooves in every row the fixed slot, the both sides in tablet groove are provided with the draw-in groove, the thimble is in up-and-down motion in the glue way.
And two ends of two sides of the material sheet groove are vertically provided with positioning needles 7 for fixing and balancing material sheets, and the positioning needles penetrate through positioning holes in the material sheets so that the material sheets are positioned and fixed in the material sheet groove.
Be provided with on the top surface of die holder and glue the way, the end that glues the way extends to on every tablet groove, every be provided with the gluey way that corresponds with the tablet on the tablet groove, glue and say including a sprue 21 and a plurality of runner 22, the sprue sets up in the centre of two tablet grooves, runner with the sprue is linked together, runner parallel arrangement in on the tablet groove is provided with 3 lines, glue like this when being derived on the sprue, can be faster flow each runner in, cover on the tablet, can make the more even of the cover of glue like this, improve product quality and work efficiency.
The pressing die and the material sheet groove are provided with grooves matched with alloy resistors on the material sheet, when the material sheet is placed in the material sheet groove and the upper die and the lower die are closed, the grooves can just catch the alloy resistors to play a role in fixing, and meanwhile, the pressing die can be further provided with fixing grooves, clamping grooves and through holes corresponding to positioning pins on the die holder in a matched mode, so that the pressing die and the die holder can be attached and fixed more tightly. After the encapsulation is finished, in order to enable the material sheet to be separated out better and faster, the material pressing die and the die holder can be provided with ejector pins capable of moving up and down.
The utility model discloses a packaging mold for alloy resistor's beneficial effect is: can come better, faster fixed tablet according to shape, the structure of tablet, can high efficiency form the insulating layer on the tablet surface moreover, improve work efficiency, reduction in production cost.
The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all of which utilize the equivalent structure or equivalent flow transformation made by the content of the specification of the present invention, or directly or indirectly applied to other related technical fields, all included in the same way in the patent protection scope of the present invention.
Claims (6)
1. The utility model provides an encapsulation machine for alloy resistor, includes die holder, glue way, draw-in groove, fixed slot, tablet groove, presses the material mould and is used for the thimble of jack-up tablet, its characterized in that, be provided with on the die holder the tablet groove is provided with between two adjacent tablet grooves the fixed slot, the both sides in tablet groove are provided with the draw-in groove, be provided with the glue way on the die holder, the end of glue way extends to on every tablet groove, the thimble is in up-and-down motion in the glue way, the both sides in tablet groove are provided with the pilot pin that is used for fixed balance tablet, press the material mould with the die holder cooperatees.
2. The packaging machine for the alloy resistor as claimed in claim 1, wherein each material sheet groove is provided with an adhesive channel corresponding to a material sheet.
3. A packaging machine for alloy resistors as claimed in claim 2, wherein the glue channel includes a main channel and a plurality of branch channels, the main channel is disposed between two rows of the tab slots, the branch channels are communicated with the main channel, and the branch channels are disposed in parallel on the tab slots.
4. The packaging machine for the alloy resistor as claimed in claim 1, wherein the positioning pin passes through a positioning hole on the material sheet so that the material sheet is fixed in the material sheet groove.
5. The packaging machine for the alloy resistor as claimed in claim 1, wherein the positioning pins are vertically arranged on two sides of the material sheet groove.
6. A packaging machine for alloy resistors as claimed in any one of claims 1 to 5, wherein said die holder is provided with a limiting device for limiting the descent of said ejector pins, so that when the die holder descends to a limiting position, said ejector pins protrude from said die holder and jack up the material sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922260982.9U CN211125227U (en) | 2019-12-17 | 2019-12-17 | Packaging machine for alloy resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922260982.9U CN211125227U (en) | 2019-12-17 | 2019-12-17 | Packaging machine for alloy resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211125227U true CN211125227U (en) | 2020-07-28 |
Family
ID=71707891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922260982.9U Active CN211125227U (en) | 2019-12-17 | 2019-12-17 | Packaging machine for alloy resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211125227U (en) |
-
2019
- 2019-12-17 CN CN201922260982.9U patent/CN211125227U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 213299 no.218, Shuibei Road, Jintan District, Changzhou City, Jiangsu Province Patentee after: Jiangsu juyongchang Electronic Technology Co.,Ltd. Address before: 215000 No. 183, Yisheng Road, Wujiang Economic and Technological Development Zone, Suzhou, Jiangsu Patentee before: Suzhou juyongchang Electronic Technology Co.,Ltd. |