CN211123503U - An optical component, emission unit, sensing module and electronic equipment - Google Patents

Abstract

The utility model provides an optical assembly, it includes first modulation component and second modulation component, first modulation component and second modulation component interconnect, second modulation component is used for rearranging the light field of the light that sees through according to predetermineeing the rule, first modulation component includes first electrode, second electrode and sets up the modulation layer between first electrode and second electrode, first electrode and second electrode are used for right the electric field is applyed to the modulation layer, the modulation layer can be along with the electric field intensity change of electric field is converted at least between transparent state and scattering state, first modulation component is used for carrying out remodulation to the light that sees through second modulation component.

Description

An optical component, emission unit, sensing module and electronic equipment

technical field

The utility model belongs to the field of optical technology, in particular to an optical component, a transmitting unit, a sensing module and an electronic device.

Background technique

The existing three-dimensional (Three Dimensional, 3D) sensing module usually uses a laser with relatively concentrated emission energy as the light source to project the sensing light pattern, so once the optical element disposed on the light-emitting side of the light source to form the structured detection light is damaged If so, the high-energy laser will directly irradiate the user's eyes and cause damage.

Utility model content

The technical problem to be solved by the present invention is to provide an optical component, a transmitting unit, a sensing module and an electronic device to solve the above technical problems.

Embodiments of the present invention provide an optical component, which includes a first modulation element and a second modulation element, the first modulation element and the second modulation element are connected to each other, and the second modulation element is used to transmit the transmitted light. The light field of the light is rearranged according to a preset rule, the first modulation element includes a first electrode, a second electrode and a modulation layer arranged between the first electrode and the second electrode, the first electrode and the second electrode are arranged between the first electrode and the second electrode. The second electrode is used for applying an electric field to the modulation layer, the modulation layer can switch at least between a transparent state and a scattering state with the change of the electric field strength of the electric field, and the first modulation element is used for the transmission through the second electrode. The light of the two modulating elements is modulated again.

In some embodiments, the second modulation element and the first modulation element are directly and fixedly connected or indirectly connected.

In some embodiments, the second modulation element is attached to the first modulation element.

In certain embodiments, the modulation layer is selected from any one of a formal polymer dispersed liquid crystal layer, a trans polymer dispersed liquid crystal layer, a polymer network liquid crystal layer and a bistable cholesteric liquid crystal layer.

In some embodiments, when the modulation layer of the first modulation element is in a transparent state, the haze of the light passing through the first modulation element is less than or equal to 10%.

In some embodiments, when the modulation layer of the first modulation element is in a scattering state, the haze of the light passing through the first modulation element is greater than or equal to 70%.

In certain embodiments, the second modulating element is a diffractive optical element.

An embodiment of the present invention further provides a transmitting unit, which includes a detection processor and the optical assembly described in any one of the above embodiments. The detection processor is respectively connected with the first electrode and the second electrode, and the detection processor is used for detecting the electrical characteristic value of the first modulation element through the first electrode and the second electrode and according to the measured value of the first modulation element. The electrical characteristic value is used to judge whether the optical component is damaged.

In some embodiments, the electrical characteristic value of the first modulation element includes a resistance value and/or a capacitance value.

In some embodiments, the detection processor is a comparison circuit, configured to compare the measured electrical characteristic value of the first modulation element with a preset standard value, and determine whether the first modulation element is not based on the comparison result. intact.

In some embodiments, the preset standard value is the capacitance value measured when the first modulation element is in good condition, if the difference between the detected capacitance value of the first modulation element and the preset standard value exceeds the preset value is within the error range, the detection processor determines that the optical component is damaged.

In some embodiments, a light source is further included, the light source is used for emitting detection light, the light source is connected with a detection processor, and the detection processor turns off the light source when it is determined that the first modulation element is damaged.

In some embodiments, it also includes a base, the base is provided with multi-layer stepped accommodating grooves, the accommodating groove includes a bottom surface, and the bottom surface includes a communication part located in the middle part and surrounds the periphery of the communication part The supporting part of the upper layer is located in the upper layer, and the lower layer is opened in the area where the bottom connecting part is located. The modulation element is fixedly connected to the support part on the bottom surface of one of the accommodating grooves.

In some embodiments, the second modulation element is directly connected to the first modulation element, and the second modulation element is not directly connected to the base.

In some embodiments, the second modulation element and the first modulation element are respectively fixedly connected to the support parts on the bottom surfaces of the two accommodating grooves in different layers, and there is no connection between the second modulation element and the first modulation element. direct connection.

In some embodiments, it further includes a light source, the second modulation element is arranged opposite to the light source, the first modulation element is arranged on the side of the second modulation element facing away from the light source, and the original light emitted by the light source In order to be able to project speckle light with a preset spot pattern, the original light is projected through the second modulation element and the first modulation element in turn. When the emission unit needs to project the structured light, the modulation of the first modulation element The layer is converted into a transparent state, and the original light is modulated into structured light by the second modulation element and then projected through the modulation layer in the transparent state. When the emitting unit needs to project flood light, the modulation of the first modulation element The layer is converted into a scattering state, and the light is modulated into structured light by the second modulation element, and then scattered as flood light for projection when passing through the modulation layer in the scattering state; or, a light source is also included, the first modulation element and the The light sources are arranged opposite to each other, the second modulation element is arranged on the side of the first modulation element facing away from the light source, the original light emitted by the light source is speckle light capable of projecting a preset spot pattern, and the original light is sequentially When projected by the first modulation element and the second modulation element, when the emitting unit needs to project structured light rays, the modulation layer of the first modulation element is converted into a transparent state, and the original light passes through the modulation layer in the transparent state Then, the second modulation element modulates the structured light for projection. When the emitting unit needs to project flood light, the modulation layer of the first modulation element is converted into a scattering state, and the original light passes through the modulation layer in the scattering state. The flood light is scattered as flood light, and the flood light is still projected as flood light after being modulated by the second modulation element.

An embodiment of the present invention further provides a sensing module, which includes a receiving unit and the transmitting unit as described in any one of the above embodiments. The receiving unit is used for acquiring an image of the sensing light pattern projected by the transmitting unit on the target object for sensing.

In some embodiments, when the transmitting unit projects flood light to the target object, the receiving unit is configured to acquire a flood light pattern of the target object, and the flood light pattern is used to identify whether the target object is a preset object type.

In some embodiments, when the transmitting unit projects structured light rays to the target object, the receiving unit is configured to acquire a structured light pattern projected on the target object, and the structured light pattern is used to sense the three-dimensionality of the target object information.

Embodiments of the present invention also provide an electronic device, which includes the sensing module described in any one of the above embodiments. The electronic device performs corresponding functions according to the three-dimensional information of the target object sensed by the sensing module.

The transmitting unit, the sensing module, and the electronic device provided by the embodiments of the present invention utilize the existing structure of the first modulation element with the modulation layer sandwiched between the first electrode and the second electrode to detect the electrical characteristics of the first modulation element By comparing the measured electrical characteristic value of the first modulating element with the standard electrical characteristic value when the first modulating element is in good condition, it can be easily detected whether the first modulating element is damaged, thereby preventing the light emitted by the light source Injuries that may be caused by direct exposure to the user's eyes from the damaged area.

Additional aspects and advantages of embodiments of the present invention will be set forth, in part, in the following description, and in part will be apparent from the following description, or learned by practice of embodiments of the invention.

Description of drawings

FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present invention.

FIG. 2 is a schematic diagram of functional modules of the transmitting unit shown in FIG. 1 .

FIG. 3 is a schematic diagram of the projection light path of the emitting unit in FIG. 1 .

FIG. 4 is a schematic diagram of an optical path when the first modulation element in FIG. 3 is in a diffuse and transparent state.

FIG. 5 is a schematic diagram of an optical path when the first modulation element in FIG. 3 is in a transparent state.

FIG. 6 is a schematic diagram of the connection of the first modulation element, the conversion controller and the detection processor in FIG. 2 .

FIG. 7 is a schematic structural diagram of the transmitting unit in FIG. 1 .

FIG. 8 is a schematic structural diagram of a transmitting unit provided by a modified embodiment of the present invention.

FIG. 9 is a schematic structural diagram of a transmitting unit provided by another modified embodiment of the present invention.

Detailed ways

Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary, only used to explain the present invention, and should not be construed as a limitation of the present invention. In the description of the present invention, it should be understood that the terms "first" and "second" are only used for description, and should not be interpreted as indicating or implying relative importance or indicating the number or number of technical features indicated. Order. Thus, the technical features defined with "first" and "second" may explicitly or implicitly include one or more of the technical features. In the description of the present invention, "plurality" means two or more, unless otherwise expressly and specifically defined.

In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection or a Detachable connection, or integrated connection; it can be a mechanical connection, an electrical connection or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, and it can be internal communication between two elements or between two elements. interaction relationship. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

The following disclosure provides many different embodiments or examples for implementing different structures of the invention. In order to simplify the disclosure of the present invention, only specific example components and settings are described below. Of course, they are only examples and are not intended to limit the invention. Furthermore, the present disclosure may reuse reference numerals and/or reference letters in various instances, such reuse is for simplicity and clarity of presentation of the present disclosure and does not in itself indicate the various embodiments and/or devices discussed. specific relationship between them. In addition, the various specific processes and materials provided in the following description of the present invention are only examples for realizing the technical solutions of the present invention, but those of ordinary skill in the art should realize that the technical solutions of the present invention can also be implemented through the following Other processes and/or other materials described.

Further, the described features and structures may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to enable a thorough understanding of the embodiments of the present invention. However, those skilled in the art will appreciate that the technical solutions of the present invention may be practiced without one or more of the specific details, or with other structures, components, and the like. In other instances, well-known structures or operations have not been shown or described in detail to avoid obscuring the essentials of the present invention.

As shown in FIG. 1, an embodiment of the present invention provides an electronic device 1, such as a mobile phone, a notebook computer, a tablet computer, a touch interactive screen, a door, a vehicle, a robot, an automatic numerical control machine tool, and the like. The electronic device 1 includes a sensing module 2 for sensing a target object. The electronic device 1 can perform corresponding functions according to the sensing result of the sensing module 2 . The corresponding functions include, but are not limited to, performing operations such as unlocking, paying, and starting a preset application program after recognizing the identity of the target object, or avoiding obstacles according to the sensing results, or using deep learning technology after recognizing the facial expression of the target object. Determine any one or a combination of the target object's mood and health. In this embodiment, the sensing module 2 is a three-dimensional face recognition module capable of sensing the three-dimensional information on the surface of the target object and identifying the identity of the target object accordingly.

The sensing module 2 includes a transmitting unit 20 and a receiving unit 22 . The emitting unit 20 is used for emitting sensing light to a target object, so as to project a preset sensing light pattern on the target object. The receiving unit 22 is used for receiving the sensing light reflected by the target object or emitted by the target object to perform related sensing. It can be understood that after the sensing light emitted by the emitting unit 20 is projected onto the target object, a part of the sensing light will be directly reflected by the target object and return, and the other part of the sensing light will enter the interior of the target object and pass through a diffuse period of time. The reflection propagates and then exits the surface of the external object and returns. The sensing light can be used to sense biometrics of the target object. For example, the receiving unit 22 receives the reflected light from the sensing light to acquire the image of the sensing light pattern projected on the target object, and the image of the sensing light pattern can be used to sense three-dimensional information on the surface of the target object . Alternatively, the receiving unit 22 receives the sensing light emitted after entering the target object and can be used to sense the fingerprint information of the target object or other biometric values of the target object, such as heart rate, pulse, and the like.

The sensing light emitted by the emitting unit 20 includes flood light and structured light. The flood light is light with uniform light intensity and highly diffused in all directions. The flood light is projected onto the target object to form a flood image of the target object. The floodlight image is a two-dimensional plane image, and the feature points of the target object can be obtained by analyzing the floodlight image. The acquired feature points of the floodlight image can be used to determine whether the target object is a preset object type of interest, such as a human face.

The structured light rays are structured light rays, and the light field intensity thereof has a preset spatial distribution. For example: light and dark striped light or irregularly arranged point-like light spots. The structured light rays project a preset sensing light pattern on the target object. The preset sensing light pattern can be used to sense three-dimensional information of the target object. The three-dimensional information includes, but is not limited to, depth information of the surface of the target object, position information of the target object in space, size information of the target object, and the like. The sensed three-dimensional information of the target object may be used to identify the identity of the target object or to construct a three-dimensional model of the target object. In this embodiment, the structured light rays are speckle structured light rays.

The flood light and the structured light can be emitted by the same emitting unit 20 . The emission unit 20 emits the flood light and the structured light in different time periods respectively. In this embodiment, the sensing light is infrared or near-infrared light, and the wavelength range is from 750 nanometers (Nanometer, nm) to 2000 nm.

As shown in FIG. 2 , the receiving unit 22 includes but is not limited to a lens 220 , an image sensor 222 and an image analysis processor 223 . The lens 220 focuses the returned sensing light on the image sensor 222 to acquire an image of the sensing light pattern projected on the target object. The image analysis processor 223 analyzes the acquired image of the sensing light pattern to sense three-dimensional information of the target object.

It can be understood that, in other modified embodiments, the optical elements in the lens 220 can also be integrated in the image sensor 222 so that the lens 220 is omitted, for example, above the photosensitive pixels of the image sensor 222 Set up the mini lens group for in-focus imaging. The image analysis processor 223 may be arranged in the sensing module 2 or at other positions of the electronic device 1, which is not limited in the present invention.

Please refer to FIG. 2 and FIG. 3 together, the emission unit 20 includes a light source 200 and an optical component 201 . The light source 200 is used for emitting original light. The light source 200 includes a semiconductor substrate 120 and a plurality of light emitters 122 formed on the semiconductor substrate 120 . The light emitting body 122 can be any one of a vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser, VCSEL), a light emitting diode (Light Emitting Diode, LED), and a laser diode (Laser Diode, LD), and combinations thereof. The light-emitting bodies 122 are distributed on the semiconductor substrate 120 according to a preset arrangement pattern. The sensing light emitted by the light source 200 has a spatial light field distribution corresponding to the arrangement pattern of the light-emitting bodies 122 .

The optical component 201 is used to modulate the original light emitted by the light source 200 into structured light or flood light to project the target object. The optical assembly 201 includes a second modulation element 202 and a first modulation element 204 . The second modulation element 202 and the first modulation element 204 are disposed on the outgoing light path of the light source 200 . The second modulation element 202 is used to rearrange the light field of the original light according to a preset rule. The arrangement includes, but is not limited to, copying the spatial distribution of the incident original light multiple times, and rearranging the spatial distribution of the multiple copies of the original light according to a preset angle range. The second modulation element 202 is, for example, but not limited to, diffractive optical elements (Diffractive Optical Elements, DOE). In this embodiment, the original light emitted by the light source 200 is a speckle light capable of projecting a preset light spot pattern. The original light can be modulated into structured light after passing through the second modulation element 202 . The structured light rays are speckle structured light rays.

As shown in FIG. 4 , the first modulation element 204 includes a first electrode 2040 , a second electrode 2042 and a modulation layer 2044 . The first electrode 2040 and the second electrode 2042 are disposed opposite to each other. The modulation layer 2044 is disposed between the first electrode 2040 and the second electrode 2042 . The modulation layer 2044 is used to modulate the light transmitted therethrough. The first electrode 2040 and the second electrode 2042 can be used to apply an electric field to the modulation layer 2044. The haze of the modulation layer 2044 for the transmitted light can be adjusted with the intensity of the electric field, so that the modulation layer 2044 in the electric field can at least switch between a transparent state and a scattering state.

The modulation layer 2044 can be a formal polymer dispersed liquid crystal layer (Polymer Dispersion Liquid Crystal, PDLC), a trans-PDLC layer, a polymer network liquid crystal layer (Polymer Network Liquid Crystal, PNLC) or a bistable cholesteric liquid crystal layer. It can be understood that, in other modified embodiments, the modulation layer 2044 may also be other types of liquid crystal layers.

In this embodiment, the modulation layer 2044 is a formal PDLC layer, including a polymer matrix 2045 and liquid crystal molecules 2046 distributed in the inner gap of the polymer matrix 2045 . The liquid crystal molecules 2046 are in a disordered orientation state in the polymer matrix 2045 when no electric field is applied, and have a significant scattering effect on the light passing therethrough, so that the modulation layer 2044 is non-transparent scattering state.

As shown in FIG. 5 , the liquid crystal molecules 2046 in the modulation layer 2044 can be uniformly arranged along the direction of the electric field under the action of the preset electric field, which hardly interferes with the transmitted light, so that the transmitted light can be Pass through the modulation layer 2044 without distortion. At this time, the modulation layer 2044 is in a transparent state.

Therefore, by controlling the electric field applied by the first electrode 2040 and the second electrode 2042 to the modulation layer 2044, the modulation layer 2044 in the electric field can at least switch between the transparent state and the scattering state.

In this embodiment, when the first modulating element 204 is in a transparent state, the haze of the transmitted light is relatively low, for example, the haze is less than or equal to 10%, and the light can be basically transmitted without distortion. through the first modulation element 204 . When the first modulation element 204 is in a scattering state, the transmitted light has a high haze, for example, the haze is greater than or equal to 70%, and the transmitted light is diffused into flood light with uniform illumination.

Optionally, the first modulation element 204 may also have one or more intermediate states between the transparent state and the scattering state. When the first modulation element 204 is in the intermediate state, the haze of the transmitted light ranges from 10% to 70%.

The second modulation element 202 and the first modulation element 204 are sequentially arranged along the projection light path, and the original light emitted by the light source 200 is modulated into the sensing light through the second modulation element 202 and the first modulation element 204 in turn and projected to the light source. on the target object. If the first modulation element 204 is in a transparent state, the original light can be projected onto the target object through the first modulation element 204 without distortion after being modulated into structured light by the second modulation element 202 . If the first modulation element 204 is in the scattering state, the sensing light is modulated into structured light by the second modulation element 202 and then scattered to form flood light when passing through the first modulation element 204 to be projected onto the target object .

As shown in FIG. 4 , the first modulation element 204 may further include an upper substrate 467 and a lower substrate 468 disposed opposite to each other. The upper substrate 467 and the lower substrate 468 are made of light-transmitting material. The material of the upper substrate 467 and/or the lower substrate 468 may be, but not limited to, glass, polycarbonate (PC), polymethyl methacrylate (PMMA) and polyethylene terephthalate (PET) A combination of any one or more of . It can be understood that the upper substrate 467 and the lower substrate 468 may be made of the same material, or may be made of different materials, which are not limited in the present invention.

The modulation layer 2044 is disposed between the upper substrate 467 and the lower substrate 468 to form a sandwich-like structure. Because the upper substrate 467 and the lower substrate 468 have a protective effect on the modulation layer 2044 disposed in the middle, the scratches on the modulation layer 2044 during use can be effectively reduced, so that the first modulation element 204 has a better performance. of durability.

The first electrode 2040 and the second electrode 2042 may be disposed on the upper substrate 467 or the lower substrate 468, respectively. For example, if the first electrode 2040 is disposed on the upper substrate 467 , the second electrode 2042 is correspondingly disposed on the lower substrate 468 . If the first electrode 2040 is disposed on the lower substrate 468 , the second electrode 2042 is correspondingly disposed on the upper substrate 467 .

It can be understood that, as shown in FIG. 2 and FIG. 6 , the transmitting unit 20 may further include a switching controller 205 . The conversion controller 205 is connected to the first electrode 2040 and the second electrode 2042 respectively, and is used to adjust the electric field intensity applied to the modulation layer 2044, so that the modulation layer 2044 can be at least in a transparent state and a scattering state convert between. For example, when the emitting unit 20 needs to project structured light rays, the conversion controller 205 applies an electric field with a preset electric field strength to the modulation layer 2044 through the first electrode 2040 and the second electrode 2042, so as to convert the modulation layer 2044 is converted into a transparent state, and the structured light formed by the sensing light modulated by the second modulation element 202 can be projected onto the target object through the first modulation element 204 without distortion. When the emitting unit 20 needs to project flood light, the conversion controller 205 controls the first electrode 2040 and the second electrode 2042 not to apply an electric field to the modulation layer 2044, so as to convert the modulation layer 2044 into In the transparent state, the structured light rays formed by the sensing light modulated by the second modulation element 202 are scattered into flood light rays and projected onto the target object when passing through the first modulation element 204 .

It can be understood that, in other modified embodiments, the transmitting unit 20 may also include other optical elements, including but not limited to collimating elements, beam expanding elements, focusing lenses, and the like. The optical element is used to adjust the sensing light so that the optical properties of its propagation, such as the diffusion angle, etc., meet preset requirements.

Compared with the prior art, the emitting unit 20, the sensing module 2 and the electronic device 1 provided by the present invention realize structured light by arranging the first modulation element 204 capable of switching the transparent state and the non-transparent state on the projection light path. The multiplexing of the projection light path and the flood light projection light path saves components, reduces the cost of the module, and at the same time simplifies the structure of the module, which is beneficial to the miniaturization of the module.

As shown in FIG. 2 and FIG. 6 , the transmitting unit 20 further includes a detection processor 206 . The detection processor 206 is respectively connected with the first electrode 2040 and the second electrode 2042 of the first modulation element 204 to form a detection loop. The detection processor 206 is configured to detect the electrical characteristics of the first modulation element 204 through the first electrode 2040 and the second electrode 2042, and determine the first modulation element according to the measured electrical characteristics of the first modulation element 204 204 is intact. The electrical properties of the first modulation element 204 include, but are not limited to, resistance and capacitance. Because the first modulation element 204 is a stable structure as a whole, under the condition that the first modulation element 204 is kept intact, the electrical characteristics of the first modulation element 204 should remain unchanged, and the detection processor 206 The measured value of the electrical characteristic of the first modulation element 204 should be substantially the same stable value. If the first modulation element 204 is damaged, for example, the upper substrate 467 or the lower substrate 468 is broken, it will affect the conductivity of the first electrode 2040 or the second electrode 2042 disposed thereon. The obtained electrical characteristics of the first modulation element 204 will change significantly.

Taking the detection of the capacitance of the first modulation element 204 as an example, the first electrode 2040 or the second electrode 2042 will be damaged at the cracked position, resulting in a reduction in the area of the electrode that can conduct electricity effectively. The capacitance of a modulation element 204 also decreases accordingly. Therefore, if the capacitance value of the first modulation element 204 actually measured by the detection processor 206 is smaller than the capacitance value measured when the first modulation element 204 is in a good state, it means that the first modulation element 204 is present damaged. It can be understood that, in other damage situations, the actually measured capacitance value may be larger than the capacitance value measured when the first modulation element 204 is in an intact state.

Therefore, the electrical characteristic value measured when the first modulation element 204 is in good condition is a preset standard value, and at the same time, a reasonable error range that is greater than or less than the standard value is preset. If the detection process is used in actual use If the difference between the electrical characteristic value of the first modulation element 204 measured by the device 206 and the standard value exceeds a preset error range, the first modulation element 204 is considered to be in a damaged state. If the electrical characteristic value of the first modulation element 204 measured by the detection processor 206 is equal to the standard value or the difference from the standard value is within a preset error range, it is considered that the first modulation element 204 is in actual use. The modulation element 204 is in good condition. In this embodiment, the error range may be 20% less than the standard value to 20% greater than the standard value.

The standard value of the electrical characteristics of the first modulation element 204 may be calibrated before the first modulation element 204 is shipped from the factory. During the use of the electronic device 1 , the detection processor 206 detects the electrical characteristics of the first modulation element 204 through the first electrode 2040 and the second electrode 2042 . The detection by the detection processor 206 may be performed before each activation of the light source 200 or after completion of projection, or may be performed during the operation of the emission unit 20 . Because the detection processor 206 forms an independent detection loop with the first electrode 2040 , the second electrode 2042 and the modulation layer 2044 . When performing detection, the detection processor 206 may apply a detection voltage to the modulation layer 2044 through the first electrode 2040 and the second electrode 2042 for detection, and the applied detection voltage may be different from that used by the conversion controller 205 for conversion modulation Voltage applied to layer 2044 state. It can be understood that, the detection processor 206 may not apply the detection voltage but use the voltage applied by the conversion controller 205 when the modulation layer 2044 is maintained in a transparent state to perform detection.

In this embodiment, the detection processor 206 may include a comparison circuit. The comparison circuit is used to compare the measured electrical characteristic value of the first modulation element 204 with a preset standard value, and output a representation when the difference between the measured electrical characteristic value and the standard value exceeds a preset error range. The judgment signal that the first modulation element 204 is in a damaged state.

It can be understood that, in other modified embodiments, the detection processor 206 can also implement the above comparison and judgment functions by executing a code program.

In this embodiment, the first modulation element 204 is disposed on the side of the second modulation element 202 facing away from the light source 200 . That is, the first modulation element 204 is located at the outermost position of the entire transmitting unit 20 . When subjected to external impact, the first modulation element 204 should be the most easily damaged component. Therefore, the detection processor 206 can also be connected to the light source 200 to turn off the light source 200 when it is detected that the first modulation element 204 is in a damaged state, so as to prevent the light emitted by the light source 200 from passing through the damaged second modulation element 200. The modulating element 202 and/or the first modulating element 204 may directly hit the user's eyes and cause injury.

As shown in FIG. 7 , the transmitting unit 20 may further include a base 207 . The base 207 is provided with multi-layer stepped accommodating grooves 208 . Among the two adjacent accommodating grooves 208, the accommodating groove 208 in the lower layer has a smaller diameter than the accommodating groove 208 in the upper layer. The accommodating groove 208 on the lower layer is opened on a part of the bottom surface 2080 of the accommodating groove 208 on the upper layer. The bottom surface 2080 includes a support portion 2084 and a communication portion 2085. The communicating portion 2085 is located in the middle portion of the bottom surface 2080 , and the supporting portion 2084 is located at the periphery of the communicating portion 2085 and is disposed around the communicating portion 2085 . The accommodating groove 208 located on the upper layer defines an accommodating groove 208 located on the lower layer downward in the area where the communicating portion 2085 of the bottom surface 2080 is located. Therefore, the communicating portion 2085 of the bottom surface 2080 is dug out to form the opening of the lower accommodating groove 208 .

For example, in this embodiment, the base 207 includes a first accommodating groove 2081 , a second accommodating groove 2082 and a third accommodating groove 2083 opened in sequence from top to bottom. The second modulation element 202 is disposed in the second accommodating groove 2082 . The first modulation element 204 is disposed in the first accommodating groove 2081 . The light source 200 is disposed in the third accommodating groove 2083 . The second modulation element 202 is fixedly connected to the support portion 2084 of the bottom surface 2080 of the second accommodating groove 2082 . The first modulation element 204 is fixedly connected to the support portion 2084 of the bottom surface 2080 of the first accommodating groove 2081 . The first modulation element 204 is closer to the outside of the transmitting unit 20 than the second modulation element 202 . Because the second modulating element 202 and the first modulating element 204 are respectively disposed in the second accommodating groove 2082 and the first accommodating groove 2081 of different layers, the difference between the second modulating element 202 and the first modulating element 204 is not directly connected.

It can be understood that, as shown in FIG. 8 , in other alternative embodiments, the second modulation element 202 and the first modulation element 204 are directly and fixedly connected. For example, the second modulation element 202 includes a light incident surface 2020 and a light exit surface 2022 that are disposed opposite to each other. The second modulation element 202 is attached to the first modulation element 204 through the light emitting surface 2022 . The first modulation element 204 is disposed in the first accommodating groove 2081 and is fixedly connected with the supporting portion 2084 of the bottom surface 2080 of the first accommodating groove 2081 . The second modulating element 202 is accommodated in the second accommodating groove 2082, however, the second modulating element 202 is only directly connected with the bottom of the first modulating element 204 for fixing, and not with the The base 207 is directly connected. Therefore, the second modulation element 202 and the first modulation element 204 as a whole structure are only fixedly connected to a part of the bottom surface 2080 of the first accommodating groove 2081 through the first modulation element 204 . The external force impact generated during use will directly act on the first modulation element 204 first, so that the first modulation element 204 is more likely to be damaged first than the second modulation element 202 .

It can be understood that, as shown in FIG. 9 , the first modulation element 204 may also be disposed on the light incident side of the second modulation element 202 . That is, the second modulation element 202 is located above the first modulation element 204 , and the second modulation element 202 is attached to the first modulation element 204 through the light incident surface 2020 .

The second modulation element 202 and the first modulation element 204 are accommodated in the first accommodating groove 2081 of the base 207 as an integral structure. The first modulation element 204 is fixedly connected to the support portion 2084 of the bottom surface 2080 of the first accommodating groove 2081. The second modulating element 202 is not directly connected with the base 207 but only relies on the fixed connection with the first modulating element 204 to achieve support and positioning. Because the second modulating element 202 and the first modulating element 204 as a whole are only connected with the first accommodating groove 2081 on the base 207 through the second modulating element 202, the impact of external force during use will first directly Acting on the part where the first modulation element 204 is connected to the first accommodating groove 2081 , the first modulation element 204 is most easily damaged first. Therefore, by detecting whether the first modulation element 204 is in good condition, and turning off the light source 200 when it is detected that the first modulation element 204 is in a damaged state, the light emitted by the light source 200 can be prevented from passing through the damaged second modulation element The element 202 and/or the first modulating element 204 may then directly shoot into the user's eyes and cause injury.

Compared with the prior art, the embodiment of the present invention utilizes the structure in which the modulation layer 2044 is sandwiched between the first electrode 2040 and the second electrode 2042 in the first modulation element 204 to detect the electrical characteristic value of the first modulation element 204 , by comparing the measured electrical characteristic value of the first modulating element 204 with the standard value when the first modulating element 204 is intact, it can be easily detected whether the first modulating element 204 is damaged, thereby preventing the light emitted by the light source 200 The damage may be caused by directly irradiating the user's eyes through the damaged part of the first modulation element 204 .

In the description of this specification, reference to the terms "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples", etc. A particular feature, structure, material, or characteristic described in this embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention shall be included in the present invention. within the scope of protection of the utility model.

Claims (20)

1. An optical assembly, comprising: the light field of the transmitted light is rearranged according to a preset rule, the first modulation element comprises a first electrode, a second electrode and a modulation layer arranged between the first electrode and the second electrode, the first electrode and the second electrode are used for applying an electric field to the modulation layer, the modulation layer can be switched at least between a transparent state and a scattering state along with the change of the electric field intensity of the electric field, and the first modulation element is used for modulating the light transmitted through the second modulation element again.

2. The optical assembly of claim 1, wherein the second modulating element is directly or indirectly connected to the first modulating element.

3. The optical assembly of claim 2, wherein the second modulating element is attached to the first modulating element.

4. The optical assembly of claim 1, wherein the modulation layer is selected from any one of a formal polymer dispersed liquid crystal layer, a trans polymer dispersed liquid crystal layer, a polymer network liquid crystal layer, and a bistable cholesteric liquid crystal layer.

5. The optical assembly of claim 1, wherein the modulation layer of the first modulation element has a haze of less than or equal to 10% for light transmitted through the first modulation element when in a transparent state.

6. The optical assembly of claim 1, wherein the modulation layer of the first modulation element has a haze of greater than or equal to 70% for light transmitted through the first modulation element when in a scattering state.

7. The optical assembly of claim 1 wherein the second modulating element is a diffractive optical element.

8. A transmitter unit comprising an optical assembly according to any one of claims 1 to 7 and a detection processor, the detection processor being connected to the first electrode and the second electrode, respectively, the detection processor being configured to detect an electrical characteristic value of the first modulator element via the first electrode and the second electrode and to determine whether the optical assembly is broken based on the detected electrical characteristic value of the first modulator element.

9. The transmit unit of claim 8, wherein: the electrical property values of the first modulating element comprise resistance values and/or capacitance values.

10. The transmit unit of claim 8, wherein: the detection processor is a comparison circuit and is used for comparing the measured electrical property value of the first modulation element with a preset standard value and judging whether the first modulation element is damaged or not according to the comparison result.

11. The transmit unit of claim 10, wherein: the preset standard value is a capacitance value measured when the first modulation element is intact, and if the difference value between the capacitance value of the first modulation element and the preset standard value exceeds a preset error range, the detection processor judges that the optical component is damaged.

12. The transmit unit of any one of claims 8-11, wherein: the light source is used for emitting detection light and is connected with the detection processor, and the detection processor closes the light source when judging that the first modulation element is damaged.

13. The emitter unit according to any one of claims 8 to 11, further comprising a base, wherein the base is provided with a plurality of layers of step-shaped receiving grooves, the receiving grooves comprise bottom surfaces, the bottom surfaces comprise a communicating portion located in the middle portion and a supporting portion surrounding the communicating portion, the receiving groove located in the upper layer is provided with a receiving groove located in the lower layer downward in the region of the communicating portion located in the bottom surface, the communicating portion of the receiving groove located in the upper layer is hollowed out to form an opening of the receiving groove located in the lower layer, and the first modulation element is fixedly connected to the supporting portion on the bottom surface of the receiving groove located in one of the layers.

14. The transmit unit of claim 13, wherein the second modulation element is directly connected to the first modulation element, the second modulation element not being directly connected to the base.

15. The transmitter unit of claim 13, wherein the second modulation element and the first modulation element are respectively fixedly connected to the supporting portions on the bottom surfaces of the two receiving slots of different layers, and the second modulation element is not directly connected to the first modulation element.

16. The emission unit as claimed in claim 8, further comprising a light source for emitting original light, the second modulation element being disposed opposite to the light source, the first modulation element being disposed on a side of the second modulation element opposite to the light source, the original light emitted from the light source being speckle light capable of projecting a predetermined speckle pattern, the original light being projected sequentially through the second modulation element and the first modulation element, when the emission unit is required to project the structured light, the modulation layer of the first modulation element being converted into a transparent state, the original light being modulated into the structured light by the second modulation element and then projected through the modulation layer in the transparent state, when the emission unit is required to project the flood light, the modulation layer of the first modulation element being converted into a scattering state, the original light being modulated into the structured light by the second modulation element and then being scattered into the flood light when passing through the modulation layer in the scattering state To project, or

The light source is used for emitting original light, the first modulation element is arranged opposite to the light source, the second modulation element is arranged on one side of the first modulation element, which is opposite to the light source, the original light emitted by the light source is the speckle light capable of projecting a preset light spot pattern, the original light rays are projected through the first modulation element and the second modulation element in sequence, when the emission unit needs to project the structured light rays, the modulation layer piece of the first modulation element is converted into a transparent state, the original light passes through the modulation layer in the transparent state and is modulated into structured light by the second modulation element for projection, when the emission unit needs to project floodlight, the modulation layer of the first modulation element is converted into a scattering state, the original light is scattered into floodlight when passing through the modulation layer, and the floodlight is still floodlight after being modulated by the second modulation element and then projected.

17. A sensing module comprising a receiving unit and an emitting unit as claimed in any one of claims 1 to 16, wherein the receiving unit is configured to acquire an image of the sensing light pattern projected on the target object by the emitting unit for sensing.

18. The sensing module of claim 17, wherein the receiving unit is configured to obtain a flood pattern of the target object when the transmitting unit projects flood light towards the target object, and the flood pattern is configured to identify whether the target object is of a preset object type.

19. The sensing module of claim 17, wherein the receiving unit is configured to acquire a structured light pattern projected on the target object when the emitting unit projects the structured light rays on the target object, and the structured light pattern is configured to sense three-dimensional information of the target object.

20. An electronic device, comprising the sensing module according to any one of claims 17 to 19, wherein the electronic device executes a corresponding function according to the three-dimensional information of the target object sensed by the sensing module.

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