CN211119652U - Temperature control device - Google Patents
Temperature control device Download PDFInfo
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- CN211119652U CN211119652U CN201922307055.8U CN201922307055U CN211119652U CN 211119652 U CN211119652 U CN 211119652U CN 201922307055 U CN201922307055 U CN 201922307055U CN 211119652 U CN211119652 U CN 211119652U
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- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 48
- 238000006243 chemical reaction Methods 0.000 claims abstract description 15
- 239000003990 capacitor Substances 0.000 claims description 23
- 230000000087 stabilizing effect Effects 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 abstract description 21
- 230000000694 effects Effects 0.000 abstract description 4
- 238000005265 energy consumption Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 13
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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- 230000004048 modification Effects 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
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Abstract
The utility model discloses a temperature control device, which comprises an MCU main control module, a liquid crystal touch screen, a WIFI module, a relay control circuit, a power circuit, an AC-DC conversion circuit, a temperature analog-digital processing circuit, a power-off storage module and a power-off interface module, wherein the MCU main control module comprises a main chip U4, and the model of the main chip U4 is STM 32; the liquid crystal touch screen comprises a liquid crystal driving integrated circuit, a liquid crystal display module and a capacitance key integrated circuit. The temperature control device can accurately control the temperature of the floor heating in a room to achieve the comfort degree required by people; the heating time can be set. The floor heating temperature is controllable, so that the energy consumption can be effectively controlled, and the energy-saving effect is achieved; remote control can be carried out through a mobile phone APP; the whole operation is simple, the human-computer interface is good, and the power consumption is small.
Description
Technical Field
The utility model relates to a accuse temperature technical field specifically is a temperature control device.
Background
The floor heating of present majority adopts fixed power to heat according to certain area, and heating temperature can not be controlled, and power consumption is big, and the comfort level is not good, and heating time can not be controlled. When the floor heating is laid, the output power of the floor heating needs to be estimated, which is very troublesome, and based on the estimation, the temperature control device is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a temperature control device has easy operation, and human-computer interface is good, and the advantage that the consumption is little has solved prior art heating temperature and can not be controlled, and power consumption is big, and the comfort level is not good, problem that heating time can not be controlled.
In order to achieve the above object, the utility model provides a following technical scheme: a temperature control device comprises an MCU (microprogrammed control Unit) main control module, a liquid crystal touch screen, a WIFI (wireless fidelity) module, a relay control circuit, a power supply circuit, an AC-DC conversion circuit, a temperature analog-digital processing circuit, a power-off storage module and a power-off interface module, wherein the MCU main control module comprises a main chip U4, and the main chip U4 is STM32 in model number; the liquid crystal touch screen comprises a liquid crystal driving integrated circuit, a liquid crystal display module and a capacitor key integrated circuit, wherein the liquid crystal driving integrated circuit adopts a chip U2, the model of the chip U2 is H1621B, the liquid crystal display module adopts a chip U1, the capacitor key integrated circuit adopts a chip U3, and the model of the chip U3 is BS 816A; the WIFI module adopts a chip U7, the relay control circuit adopts a switch K3 and a pin header P3, the power supply circuit adopts a chip U9, the alternating current-direct current conversion circuit adopts a chip U10, the temperature analog-digital processing circuit adopts an operational amplifier U8A and an operational amplifier U8B, the power-off storage module adopts a chip U5, and the power-off interface module adopts a pin header P1; the liquid crystal touch screen, the WIFI module, the relay control circuit, the temperature analog-digital processing circuit, the power-off storage module and the power-off interface module are all connected with the MCU main control module, the alternating current-direct current conversion circuit is connected with the relay control circuit, and the output end of the power supply circuit is connected to the input end connected to the MCU main control module, the liquid crystal touch screen, the WIFI module and the power-off storage module.
Preferably, the liquid crystal driving integrated circuit is connected with a liquid crystal display module, the liquid crystal display module is connected with a capacitor key integrated circuit, pins 1 to 4 of a chip U2 are correspondingly connected to pins 14 to 15 of a chip U4, pins 37 to 48 of a chip U2 are correspondingly connected to pins 16 to 5 of a chip U1, and pins 29 to 36 of a chip U2 are correspondingly connected to pins 24 to 17 of a chip U1; pins 1-4 of the chip U1 are correspondingly connected to pins 13-16 of the chip U2, a pin 37 of the chip U1 is connected to a collector of a triode Q1, an emitter of the triode Q1 is grounded, and a base of the triode Q1 is connected with a resistor R10 in series and then is connected to a pin 18 of the chip U4; the pin 26 and the pin 27 of the chip U2 are connected and then connected to the pin 1 of the chip U3, the pin 28 and the pin 29 of the chip U2 are connected and then connected to the pin 2 of the chip U3, the pin 30 and the pin 31 of the chip U2 are connected and then connected to the pin 3 of the chip U3, the pin 32 and the pin 33 of the chip U2 are connected and then connected to the pin 4 of the chip U3, the pin 34 and the pin 35 of the chip U2 are connected and then connected to the pin 5 of the chip U3, the pin 12 of the chip U3 is connected to the pin 29 of the chip U4, the pin 13 of the chip U3 is connected to the pin 32 of the chip U4, the pin 14 of the chip U3 is connected to the pin 33 of the chip 686U 8, the pin 15 of the chip U3 is connected to the pin 38 of the chip U4, and the pin 16 of the chip.
Preferably, pin 1 of the chip U7 used by the WIFI module is connected to pin 22 of the chip U4, pin 5 of the chip U7 is connected to pin 21 of the chip U4, pin 18 of the chip U7 is connected in series with resistor DR1 and then connected to pin 2 of the chip U4, pin 21 of the chip U7 is connected to pin 30 of the chip U4, and pin 22 of the chip U7 is connected to pin 31 of the chip U4.
Preferably, pin 1 of a switch K3 adopted by the relay control circuit is connected to a collector of a transistor DQ1, an emitter of a transistor DQ1 is connected to the VCC L terminal for input, a base of a transistor DQ1 is connected in series with a resistor R43 and then connected to a pin 19 of a chip U4, pin 6 of the switch K3 is connected to pin 2 of a pin bank P3, and pin 5 of a switch K3 is connected to pin 1 of the pin bank P3.
Preferably, pin 1 of the chip U10 used in the ac-dc conversion circuit is connected in series with fuse F1 and then connected to pin 1 of pin P3, pin 2 of chip U10 is connected to pin 2 of pin P3, pin 3 of chip U10 is connected to the input terminal of zener diode W3 and connected to the input terminals of capacitor C29 and capacitor C30, and the output terminals of capacitor C29, capacitor C30 and zener diode W3 are connected to pin 4 of chip U10 and then connected to VCC L terminal for output.
Preferably, the pin 2 of the operational amplifier U8A adopted by the temperature analog-to-digital processing circuit is connected to the output end of the zener diode W1, the input end of the zener diode W1 is grounded, the pin 3 of the operational amplifier U8A is connected to the output end of the resistor R33, the input end of the resistor R33 is connected to the output end of the resistor R30, and is connected to the input ends of the resistor R46 and the capacitor C15, the output ends of the resistor R46 and the capacitor C15 are grounded, and the input end of the resistor R30 is connected to the VREF2.5V terminal; pin 2 of the operational amplifier U8B is connected to the output terminal of the zener diode W2, the input terminal of the zener diode W2 is grounded, pin 3 of the operational amplifier U8B is connected to the output terminal of the resistor R39, the input terminal of the resistor R39 is connected to the output terminal of the resistor R37, and the input terminal of the resistor R37 is connected to the VREF2.5V terminal.
Preferably, pin 6 of the chip U1 used by the power-down memory module is connected to pin 42 of the chip U4, and pin 5 of the chip U1 is connected to pin 43 of the chip U4.
Preferably, pin 4 and pin 7 of pin header P1 adopted by the power down interface module are connected to pin 5 of operational amplifier U8B, and pin 5 and pin 6 of pin header P1 are connected to 19 of chip U4.
Preferably, pin 3 of a chip U9 adopted by the power circuit is connected to the output end of an inductor L, the input end of an inductor L1 is connected to VCC power supply electronic input, pin 2 of a chip U9 is connected to VDD3.3V power terminal output, pin 1, pin 9, pin 24, pin 36 and pin 48 of the chip U4 are connected and then connected to VDD3.3V power terminal input power, pin 8 and pin 9 of the chip U VDD3.3V are connected and then connected to VDD3.3V power terminal input power, pin 36 of the chip U VDD3.3V is connected to VDD3.3V power terminal input power, pin 16 of the chip U VDD3.3V is sequentially connected in series with a light emitting diode VDD3.3V ED VDD3.3V and a resistor R VDD3.3V and then connected to VDD3.3V power terminal input power, pin 14 of the chip U VDD3.3V is sequentially connected in series with a light emitting diode VDD3.3V ED VDD3.3V and a resistor R VDD3.3V and then connected to VDD3.3V input power, pin 13 of the chip U VDD3.3V is sequentially connected to a light emitting diode VDD3.3V ED VDD3.3V and a resistor R VDD3.3V and then connected to VDD3.3V power terminal, and pin 6 of the chip U VDD3.3V is connected to VDD3.3V and then connected to VDD3.3V input power terminal of the chip VDD3.3V.
Compared with the prior art, the beneficial effects of the utility model are as follows:
the temperature control device can accurately control the temperature of the floor heating in a room to achieve the comfort degree required by people; the heating time can be set. The floor heating temperature is controllable, so that the energy consumption can be effectively controlled, and the energy-saving effect is achieved; remote control can be carried out through a mobile phone APP; the whole operation is simple, the human-computer interface is good, and the power consumption is small.
Drawings
FIG. 1 is an overall schematic block diagram of the present invention;
FIG. 2 is a circuit diagram of the MCU master control module of the present invention;
FIG. 3 is a schematic diagram of the liquid crystal touch panel of the present invention;
fig. 4 is a diagram of a liquid crystal driving ic of the present invention;
FIG. 5 is a circuit diagram of a liquid crystal display module according to the present invention;
fig. 6 is an integrated circuit diagram of the capacitor key of the present invention;
fig. 7 is a working circuit diagram of the WIFI module of the present invention;
fig. 8 is a circuit diagram of the relay control of the present invention;
fig. 9 is a power supply circuit diagram of the present invention;
fig. 10 is an ac/dc conversion circuit diagram of the present invention;
fig. 11 is a temperature analog-to-digital processing circuit diagram of the present invention;
FIG. 12 is a circuit diagram of a power-off memory module of the present invention;
fig. 13 is a circuit diagram of the power down interface module of the present invention.
In the figure: 1. the MCU master control module; 2. a liquid crystal touch screen; 21. a liquid crystal driving integrated circuit; 22. a liquid crystal display module; 23. a capacitive key integrated circuit; 3. a WIFI module; 4. a relay control circuit; 5. a power supply circuit; 6. an AC-DC conversion circuit; 7. a temperature analog-to-digital processing circuit; 8. a power-off storage module; 9. and a power-down interface module.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-13, a temperature control device comprises an MCU main control module 1, a liquid crystal touch screen 2, a WIFI module 3, a relay control circuit 4, a power circuit 5, an ac-dc conversion circuit 6, a temperature analog-digital processing circuit 7, a power-off storage module 8 and a power-off interface module 9, wherein the MCU main control module 1 comprises a main chip U4, and the main chip U4 is STM 32; the liquid crystal touch screen 2 comprises a liquid crystal driving integrated circuit 21, a liquid crystal display module 22 and a capacitance key integrated circuit 23, wherein the liquid crystal driving integrated circuit 21 adopts a chip U2, the model of the chip U2 is H1621B, the liquid crystal display module 22 adopts a chip U1, the capacitance key integrated circuit 23 adopts a chip U3, and the model of the chip U3 is BS 816A; the WIFI module 3 adopts a chip U7, the relay control circuit 4 adopts a switch K3 and a pin header P3, the power supply circuit 5 adopts a chip U9, the alternating current-direct current conversion circuit 6 adopts a chip U10, the temperature analog-digital processing circuit 7 adopts an operational amplifier U8A and an operational amplifier U8B, the power-off storage module 8 adopts a chip U5, and the power-off interface module 9 adopts a pin header P1; liquid crystal touch screen 2, WIFI module 3, relay control circuit 4, temperature analog-digital processing circuit 7, outage storage module 8 and power down interface module 9 all link to each other with MCU host system 1, and alternating current-direct current conversion circuit 6 links to each other with relay control circuit 4, and power supply circuit 5's output connects to the input that is connected to MCU host system 1, liquid crystal touch screen 2, WIFI module 3 and outage storage module 8.
Wherein: the liquid crystal driving integrated circuit 21 is connected with the liquid crystal display module 22, the liquid crystal display module 22 is connected with the capacitance key integrated circuit 23, pins 1-4 of a chip U2 are correspondingly connected to pins 14-15 of a chip U4, pins 37-48 of a chip U2 are correspondingly connected to pins 16-5 of a chip U1, and pins 29-36 of a chip U2 are correspondingly connected to pins 24-17 of a chip U1; pins 1-4 of a chip U1 are correspondingly connected to pins 13-16 of a chip U2, a pin 37 of a chip U1 is connected to a collector of a triode Q1, an emitter of the triode Q1 is grounded, and a base of the triode Q1 is connected in series with a resistor R10 and then is connected to a pin 18 of the chip U4; pin 26 and pin 27 of chip U2 are connected to pin 1 of chip U3, pin 28 and pin 29 of chip U2 are connected to pin 2 of chip U3, pin 30 and pin 31 of chip U2 are connected to pin 3 of chip U3, pin 32 and pin 33 of chip U2 are connected to pin 4 of chip U3, pin 34 and pin 35 of chip U2 are connected to pin 5 of chip U3, pin 12 of chip U3 is connected to pin 29 of chip U4, pin 13 of chip U3 is connected to pin 32 of chip U4, pin 14 of chip U3 is connected to pin 33 of chip U4, pin 15 of chip U3 is connected to pin 38 of chip U4, and pin 16 of chip U3 is connected to pin 12 of chip U4.
Wherein: pin 1 of a chip U7 adopted by the WIFI module 3 is connected to pin 22 of a chip U4, pin 5 of a chip U7 is connected to pin 21 of a chip U4, pin 18 of a chip U7 is connected in series with a resistor DR1 and then connected to pin 2 of a chip U4, pin 21 of a chip U7 is connected to pin 30 of a chip U4, and pin 22 of a chip U7 is connected to pin 31 of a chip U4.
Wherein: the pin 2 of an operational amplifier U8A adopted by the temperature analog-digital processing circuit 7 is connected to the output end of a voltage stabilizing diode W1, the input end of the voltage stabilizing diode W1 is grounded, the pin 3 of the operational amplifier U8A is connected to the output end of a resistor R33, the input end of a resistor R33 is connected to the output end of a resistor R30 and to the input ends of a resistor R46 and a capacitor C15, the output ends of a resistor R46 and the capacitor C15 are grounded, and the input end of a resistor R30 is connected to the VREF2.5V terminal; pin 2 of operational amplifier U8B is connected to the output of zener diode W2, the input of zener diode W2 is connected to ground, pin 3 of operational amplifier U8B is connected to the output of resistor R39, the input of resistor R39 is connected to the output of resistor R37, and the input of resistor R37 is connected to the VREF2.5V terminal.
Wherein: pin 6 of the chip U1 used by the power-down memory module 8 is connected to pin 42 of the chip U4, and pin 5 of the chip U1 is connected to pin 43 of the chip U4.
Wherein: pin 4 and pin 7 of pin bank P1 employed by power down interface module 9 are connected to pin 5 of operational amplifier U8B, and pin 5 and pin 6 of pin bank P1 are connected to 19 of chip U4.
A pin 3 of a chip U9 adopted by a power circuit 5 is connected to an output end of an inductor L, an input end of an inductor L1 is connected to VCC power supply electronic input, a pin 2 of a chip U9 is connected to VDD3.3V power terminal output, a pin 1, a pin 9, a pin 24, a pin 36 and a pin 48 of a chip U4 are connected and then connected to VDD3.3V power terminal input power, a pin 8 and a pin 9 of the chip U VDD3.3V are connected and then connected to VDD3.3V power terminal input power, a pin 36 of the chip U VDD3.3V is connected to VDD3.3V power terminal input power, a pin 16 of the chip U VDD3.3V is sequentially connected in series with a light emitting diode VDD3.3V ED VDD3.3V and a resistor R VDD3.3V and then connected to VDD3.3V power terminal input power, a pin 14 of the chip U VDD3.3V is sequentially connected in series with the light emitting diode VDD3.3V ED VDD3.3V and the resistor R VDD3.3V and then connected to the VDD3.3V input power terminal, a pin 13 of the chip U VDD3.3V is sequentially connected in series with the light emitting diode VDD3.3V ED VDD3.3V and the resistor R VDD3.3V and then connected to the VDD3.3V input power terminal VDD3.3V, and the pin 6 of the chip U VDD3.3V is.
In the temperature control device, firstly, a chip U4 of an MCU main control module 1 detects real-time temperature in a room through a temperature analog-digital processing circuit 7 and transmits a temperature signal to a chip U4, the chip U4 processes the obtained signal and transmits the processed signal to a liquid crystal driving integrated circuit 21, the liquid crystal driving integrated circuit 21 drives a liquid crystal display module 22 to work, and the obtained signal is displayed on the liquid crystal display module 22; the room temperature and the floor heating working time can be set on the liquid crystal display module 22 in real time by operating the capacitor key integrated circuit 23; the chip U4 of the MCU master control module 1 compares the obtained real-time temperature signal with a set temperature, if the temperature difference is greater than 3 ℃, an IO port control switch K3 of the chip U4 is closed, so that floor heating is started, the temperature reaches the set temperature, the chip U4 controls a switch K3 to be disconnected, the floor heating is closed, the floor heating is in working time, and the chip U4 controls an IO pin to close the floor heating; temperature parameter and the WIFI password that set up at every turn can be saved in outage storage module 8 in real time, and data do not lose during the shutdown, and chip U4 and cloud end server are connected to WIFI module 3, and the cell-phone can control each item operation through APP remote control chip U1 at any time, connects cloud end server through WIFI, and cell-phone APP also can be through network connection cloud end server, through the mediation effect and the communication of chip U1 of cloud end server and control.
In summary, the following steps: the temperature control device can accurately control the temperature of the floor heating in a room to achieve the comfort degree required by people; the heating time can be set. The floor heating temperature is controllable, so that the energy consumption can be effectively controlled, and the energy-saving effect is achieved; remote control can be carried out through a mobile phone APP; the whole operation is simple, the human-computer interface is good, and the power consumption is small.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. The utility model provides a temperature control device, includes MCU host system (1), liquid crystal touch screen (2), WIFI module (3), relay control circuit (4), power supply circuit (5), alternating current-direct current conversion circuit (6), temperature analog-digital processing circuit (7), outage storage module (8) and falls electric interface module (9), its characterized in that: the MCU master control module (1) comprises a main chip U4, and the model of the main chip U4 is STM 32; the liquid crystal touch screen (2) comprises a liquid crystal driving integrated circuit (21), a liquid crystal display module (22) and a capacitance key integrated circuit (23), wherein the liquid crystal driving integrated circuit (21) adopts a chip U2, the model of the chip U2 is H1621B, the liquid crystal display module (22) adopts a chip U1, the capacitance key integrated circuit (23) adopts a chip U3, and the model of the chip U3 is BS 816A; the WIFI module (3) adopts a chip U7, the relay control circuit (4) adopts a switch K3 and a pin header P3, the power supply circuit (5) adopts a chip U9, the alternating current-direct current conversion circuit (6) adopts a chip U10, the temperature analog-digital processing circuit (7) adopts an operational amplifier U8A and an operational amplifier U8B, the power-off storage module (8) adopts a chip U5, and the power-off interface module (9) adopts a pin header P1; liquid crystal touch screen (2), WIFI module (3), relay control circuit (4), temperature analog-digital processing circuit (7), outage storage module (8) and power down interface module (9) all link to each other with MCU host system (1), alternating current-direct current conversion circuit (6) link to each other with relay control circuit (4), the input that is connected to MCU host system (1), liquid crystal touch screen (2), WIFI module (3) and outage storage module (8) is received to the output of power supply circuit (5).
2. A temperature control apparatus according to claim 1, wherein: the liquid crystal driving integrated circuit (21) is connected with a liquid crystal display module (22), the liquid crystal display module (22) is connected with a capacitance key integrated circuit (23), pins 1 to 4 of a chip U2 are correspondingly connected to pins 14 to 15 of a chip U4, pins 37 to 48 of a chip U2 are correspondingly connected to pins 16 to 5 of a chip U1, and pins 29 to 36 of a chip U2 are correspondingly connected to pins 24 to 17 of a chip U1; pins 1-4 of the chip U1 are correspondingly connected to pins 13-16 of the chip U2, a pin 37 of the chip U1 is connected to a collector of a triode Q1, an emitter of the triode Q1 is grounded, and a base of the triode Q1 is connected with a resistor R10 in series and then is connected to a pin 18 of the chip U4; the pin 26 and the pin 27 of the chip U2 are connected and then connected to the pin 1 of the chip U3, the pin 28 and the pin 29 of the chip U2 are connected and then connected to the pin 2 of the chip U3, the pin 30 and the pin 31 of the chip U2 are connected and then connected to the pin 3 of the chip U3, the pin 32 and the pin 33 of the chip U2 are connected and then connected to the pin 4 of the chip U3, the pin 34 and the pin 35 of the chip U2 are connected and then connected to the pin 5 of the chip U3, the pin 12 of the chip U3 is connected to the pin 29 of the chip U4, the pin 13 of the chip U3 is connected to the pin 32 of the chip U4, the pin 14 of the chip U3 is connected to the pin 33 of the chip 686U 8, the pin 15 of the chip U3 is connected to the pin 38 of the chip U4, and the pin 16 of the chip.
3. A temperature control apparatus according to claim 1, wherein: pin 1 of a chip U7 adopted by the WIFI module (3) is connected to pin 22 of a chip U4, pin 5 of a chip U7 is connected to pin 21 of a chip U4, pin 18 of a chip U7 is connected in series with a resistor DR1 and then connected to pin 2 of a chip U4, pin 21 of a chip U7 is connected to pin 30 of a chip U4, and pin 22 of a chip U7 is connected to pin 31 of a chip U4.
4. The temperature control device according to claim 1, wherein pin 1 of switch K3 adopted by the relay control circuit (4) is connected to the collector of a transistor DQ1, the emitter of the transistor DQ1 is connected to the input of a VCC L terminal, the base of the transistor DQ1 is connected in series with a resistor R43 and then connected to pin 19 of a chip U4, pin 6 of switch K3 is connected to pin 2 of pin P3, and pin 5 of switch K3 is connected to pin 1 of pin P3.
5. The temperature control device according to claim 1, wherein pin 1 of chip U10 used by the AC/DC conversion circuit (6) is connected in series with fuse F1 and then connected to pin 1 of pin P3, pin 2 of chip U10 is connected to pin 2 of pin P3, pin 3 of chip U10 is connected to the input terminal of zener diode W3 and to the input terminals of capacitor C29 and capacitor C30, and the output terminals of capacitor C29, capacitor C30 and zener diode W3 are connected to pin 4 of chip U10 and then connected to the output terminal VCC L.
6. A temperature control apparatus according to claim 1, wherein: the pin 2 of an operational amplifier U8A adopted by the temperature analog-digital processing circuit (7) is connected to the output end of a voltage stabilizing diode W1, the input end of a voltage stabilizing diode W1 is grounded, a pin 3 of the operational amplifier U8A is connected to the output end of a resistor R33, the input end of a resistor R33 is connected to the output end of a resistor R30 and is connected to the input ends of a resistor R46 and a capacitor C15, the output ends of a resistor R46 and the capacitor C15 are grounded, and the input end of a resistor R30 is connected to the VREF2.5V terminal; pin 2 of the operational amplifier U8B is connected to the output terminal of the zener diode W2, the input terminal of the zener diode W2 is grounded, pin 3 of the operational amplifier U8B is connected to the output terminal of the resistor R39, the input terminal of the resistor R39 is connected to the output terminal of the resistor R37, and the input terminal of the resistor R37 is connected to the VREF2.5V terminal.
7. A temperature control apparatus according to claim 1, wherein: pin 6 of the chip U1 adopted by the power-down memory module (8) is connected to pin 42 of the chip U4, and pin 5 of the chip U1 is connected to pin 43 of the chip U4.
8. A temperature control apparatus according to claim 1, wherein: pin 4 and pin 7 of pin header P1 adopted by the power down interface module (9) are connected to pin 5 of operational amplifier U8B, and pin 5 and pin 6 of pin header P1 are connected to pin 19 of chip U4.
9. The temperature control device according to claim 1, wherein a pin 3 of a chip U9 adopted by the power circuit (5) is connected to an output end of an inductor L, an input end of an inductor L is connected to a VCC power supply electronic input, a pin 2 of a chip U9 is connected to an output end of an VDD3.3V power terminal, a pin 1, a pin 9, a pin 24 and a pin 36 of the chip U4 are connected to a VDD3.3V power terminal input power after being connected with a pin 48, a pin 8 and a pin 9 of the chip U VDD3.3V are connected to a VDD3.3V power terminal input power after being connected with each other, a pin 36 of the chip U VDD3.3V is connected to the VDD3.3V power terminal input power after being connected with the pin 36 of the chip U VDD3.3V, a pin 16 of the chip U VDD3.3V is sequentially connected to the light emitting diode VDD3.3V ED VDD3.3V and a resistor R VDD3.3V in series and then connected to the VDD3.3V power terminal input power supply, a pin 14 of the chip U VDD3.3V is sequentially connected to the light emitting diode VDD3.3V ED VDD3.3V and the resistor R VDD3.3V in series and then connected to the VDD3.3V power terminal VDD3.3V of the chip U VDD3.3V and the pin 13 of the chip U VDD3.3V is connected to the power terminal VDD3.3V and the power terminal VDD3.3V is connected to the.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922307055.8U CN211119652U (en) | 2019-12-19 | 2019-12-19 | Temperature control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922307055.8U CN211119652U (en) | 2019-12-19 | 2019-12-19 | Temperature control device |
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| Publication Number | Publication Date |
|---|---|
| CN211119652U true CN211119652U (en) | 2020-07-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922307055.8U Expired - Fee Related CN211119652U (en) | 2019-12-19 | 2019-12-19 | Temperature control device |
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| CN (1) | CN211119652U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110836416A (en) * | 2019-12-19 | 2020-02-25 | 湖北杰思瑞电子科技有限公司 | Temperature control device |
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2019
- 2019-12-19 CN CN201922307055.8U patent/CN211119652U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110836416A (en) * | 2019-12-19 | 2020-02-25 | 湖北杰思瑞电子科技有限公司 | Temperature control device |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200728 |