CN211114619U - Anti-static copper strip porcelain floor structure - Google Patents

Abstract

The utility model discloses an anti-static copper strips porcelain matter floor structure relates to the ceramic tile field, mainly includes as follows: the anti-static ground system comprises a leveling layer, a ground base layer, a bonding layer, a surface layer and an anti-static ground system from bottom to top; the anti-static grounding system comprises a metal grounding net, a grounding electrode and a current-limiting resistor, wherein the metal grounding net is connected with the grounding electrode through a lead, and the current-limiting resistor is connected in series on the lead, so that the ceramic tiles can be effectively placed to gather static electricity.

Description

Anti-static copper strip porcelain floor structure

Technical Field

The utility model relates to an anti-static copper strips porcelain matter floor structure mainly relates to the ceramic tile field.

Background

The electrostatic phenomenon is very common in the production, processing and use processes of industries such as information industry, electronic industry, textile industry and the like. Because ceramics and other building materials in general have high electrical resistivity and are difficult to remove once electrostatically charged, the build up of such charges can be a significant hazard. Therefore, in the rapid development of science and technology, effective antistatic materials are urgently needed to eliminate the harm caused by static electricity.

SUMMERY OF THE UTILITY MODEL

The not enough to above prior art, the utility model provides an prevent static copper strips porcelain matter floor structure can effectually place the ceramic tile and gather static.

In order to achieve the above purpose, the technical scheme of the utility model is that: the anti-static ground system comprises a leveling layer, a ground base layer, a bonding layer, a surface layer and an anti-static ground system from bottom to top; the anti-static grounding system comprises a metal grounding net, a grounding electrode and a current-limiting resistor, wherein the metal grounding net is connected with the grounding electrode through a lead, and the current-limiting resistor is connected on the lead in series.

The technical principle and the beneficial effects of the utility model are as follows: static charge that produces on with the ceramic tile through ground connection copper tape layer transmits the ground, makes the electric potential of ceramic tile be close to earth potential to obtain reliable antistatic performance, can effectually place the ceramic tile and gather static, set up current-limiting resistor simultaneously and can avoid static to form too big potential difference, it is safer.

Furthermore, the leveling layer is leveled by using the dry and hard cement paste, so that the moisture is less, the shrinkage of the relative mortar is small, and the time requirement of people above the ground is short.

Furthermore, the thickness of the base layer is 25-30 mm, so that better bearing capacity is obtained.

Furthermore, the composite conductive powder is doped in the bonding layer, the weight ratio of the cement to the composite conductive powder is 1:0.003, and the conductivity of the slurry layer is improved.

Furthermore, the metal grounding net is paved on the combining layer, so that more extensive and comprehensive charge transmission to the ceramic tile is facilitated, and static electricity is better eliminated.

Furthermore, the metal grounding grid comprises a plurality of copper strips which are longitudinally and transversely distributed, and the copper strips are mutually welded into a net-shaped structure, so that a net-shaped conductive net belt with a larger coverage area can be rapidly manufactured, and charges can be rapidly transferred to the ground.

Furthermore, the ceramic tile electric power generation device further comprises a stainless steel band which is longitudinally arranged, the stainless steel band is respectively in electric contact with the copper bands which are transversely distributed, the end part of the stainless steel band is connected with the grounding electrode, and the end part of the stainless steel band is connected with the grounding electrode, so that the electric charges of the ceramic tile are more effectively transferred to the ground.

Furthermore, the surface layer comprises a plurality of paved anti-static ceramic tiles, and the anti-static ceramic floor is formed by adding high-temperature resistant conductive inorganic materials for permeation in production on the basis of a common ceramic tile manufacturing process, carrying out physical modification and firing at high temperature, so that the floor is not influenced by the environment in use, has permanent and stable anti-static performance on the whole body, has the body resistance and the surface resistance of less than 5 × 10^8 omega, and has the advantages of wear resistance, corrosion resistance, acid and alkali resistance, aging resistance, oil stain resistance, high temperature resistance, flame retardance, permeation prevention and the like.

Furthermore, at least one longitudinal copper strip and one transverse copper strip are correspondingly contacted with any one ceramic tile, so that the charge of each ceramic tile can be effectively transferred to the ground.

Furthermore, joint mixture is filled between the tiles of the tile layer, so that the stability between the tiles is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments will be briefly described below, it is obvious that the drawings in the following description are only two of the embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an embodiment of the present invention;

fig. 2 shows a ground metal strip arrangement and a ground structure according to an embodiment of the present invention.

The device comprises a transverse copper strip 1, a longitudinal copper strip 2, a stainless steel strip 3, a guide 4, a current limiting resistor 5, a grounding electrode 6, a bonding layer 7, a metal grounding grid 8, a ground base layer 9, a surface layer 10, a leveling layer 11 and a jointing agent 12.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it is to be understood that the described embodiments are merely preferred embodiments of the present invention, rather than all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Examples

The anti-static copper strip porcelain floor structure provided by the embodiment of the utility model comprises a leveling layer 11, a ground base layer 9, a bonding layer 7, a surface layer 10 and an anti-static grounding system from bottom to top; the anti-static grounding system comprises a metal grounding grid 8, a grounding electrode 6 and a current-limiting resistor 5, wherein the metal grounding grid 8 is connected with the grounding electrode 6 through a lead, and the current-limiting resistor 5 is connected on the lead in series.

The surface layer 10 comprises a plurality of paved anti-static ceramic tiles, and the leveling layer 11 is leveled by using dry and hard cement paste. The thickness of the base layer is 25-30 mm. The bonding layer is doped with composite conductive powder, and the weight ratio of the cement to the composite conductive powder is 1: 0.003.

And the metal grounding grid 8 is paved on the bonding layer 7. The metal grounding grid 8 comprises a plurality of copper strips which are longitudinally and transversely distributed, and the copper strips are mutually welded to form a net-shaped structure. The stainless steel strip grounding device is characterized by further comprising a stainless steel strip 3 which is longitudinally arranged, wherein the stainless steel strip 3 is respectively in electrical contact with copper strips which are transversely distributed, and the end part of the stainless steel strip 3 is connected with a grounding electrode 6. At least one longitudinal copper strip 2 and one transverse copper strip 1 are correspondingly contacted with any one ceramic tile.

And joint mixture 12 is filled between the tiles of the tile layer.

The construction method is similar to the construction method of the common floor tile, namely, the ceramic tiles are directly laid on the ground in a dry mode, and the difference is that the anti-static ceramic tiles are adopted. As shown in fig. 2. A latticed copper strip conducting layer is paved on the lower bonding layer 7 of the anti-static tile, and a reasonable grounding system is arranged, so that the ground potential of the tile is close to the earth potential, and the reliable anti-static performance is obtained. The construction process of the anti-static ceramic floor dry-paving system sequentially comprises the steps of firstly leveling the structural ground, then paving and pasting a cement mortar binding layer 7 doped with the composite conductive powder, paving and pasting a conductive copper strip on the binding layer 7, mutually welding the longitudinal and transverse conductive copper strips into a grid shape, paving and pasting the anti-static ceramic floor on the conductive copper strip, jointing, finally installing a copper strip end grounding system and testing the whole conductive system, and thus the construction of the whole anti-static ceramic floor is completed.

The anti-static ceramic floor paving system project comprises the construction of a leveling layer 11, a base layer, a binding layer 7, a surface layer 10 and an anti-static grounding system, and the system test and acceptance.

1 leveling layer 11

1) The distance between plastering cakes is 1.5m from the lower part of the horizontal line of the well-bounced surface course 10 to the elevation of the upper skin of the leveling course 11 (the thickness of the brick and the thickness of the bonding layer are subtracted from the surface course 10), the upper level of the plastering cakes is the elevation of the leveling course 11 of the cement mortar, and then the plastering of the marking rib is started from one side of the room. The plastering cake and the mark rib should use dry and hard mortar, and the thickness is not less than 2 cm.

2) On the cleaned structure layer, the ground base layer 9 is uniformly sprinkled with water once by using a sprinkling can.

3) The leveling layer 11 is leveled by cement mortar (the mixing ratio is 1: 3-1: 4), and is trowelled and compacted by a wood trowel.

4) The surface of the leveling layer 11 is compact, and the defects of sand, honeycomb, cracks and the like cannot be caused.

5) And when the mortar compressive strength of the leveling layer 11 reaches 1.2MPa, starting to start to drive the control line of the brick. The width of a gap paved by the plate is determined in advance according to the design requirement and the specification and the size of the brick plate, and when the design is not specified, the width of the abutted seam is not more than 3 mm. In the room, the size of the rows is divided from the longitudinal direction and the transverse direction, when the size is less than the multiple of the whole brick, the non-whole bricks are arranged at the position close to the wall, the longitudinal direction (vertical door opening) is divided in the room, and the non-whole bricks are symmetrically arranged at the two wall sides. And (4) bouncing longitudinal and transverse control lines (one control line per every 4 bricks) on the ground according to the determined number of bricks and seam width.

2 base layer

1) The leveling layer 11 is sprayed with water to be wet, plain cement paste (the water-cement ratio is 0.4-0.5) is uniformly coated, the coating area is not too large, and the quantity of the spread plain cement paste is not too large.

2) The base mortar is preferably prepared by mixing the following raw materials in a volume ratio of 1:3, the dry and hard cement mortar is uniformly spread and pasted, and the thickness of the dry and hard cement mortar is 25-30 mm.

3) The base mortar is paved while being attached, the mortar is stirred and used while being stirred, the paving and attaching are completed when the materials are cleaned, and hard blocks in different days are not allowed to be paved into the base.

3 bonding layer 7

1) The mortar of the bonding layer 7 is preferably cement mortar, and the thickness is preferably 8-12 mm.

2) Mixing materials of the bonding layer 7: the mortar is preferably dry and hard cement mortar with the volume ratio of 1:3, and the dry and hard cement mortar can be used along with stirring and before initial setting, so that the bonding quality is prevented from being influenced.

3) Composite conductive powder (resistance reducing agent) is added into the cement mortar bonding layer 7 according to the proportion, and the weight ratio of the cement to the composite conductive powder is 1: 0.003.

4) And (3) paving and pasting 0.05mm by 25mm of conductive copper strips on the cement mortar bonding layer 7, wherein the longitudinal spacing is 600mm, the transverse spacing is 3000 mm-5000 mm, and the paving and pasting of the conductive copper strips are carried out along with the paving and pasting of the anti-static ceramic tiles.

5) And after the conductive copper strips are paved and attached, detecting the conductive copper strips by using a universal meter, enabling the conductive copper strips to form paths completely, and making a concealed project acceptance record.

6) And (3) paving a conductive copper strip on the cement mortar bonding layer 7, and setting a grounding terminal every 500m2, wherein the copper grounding strip required by a grounding system is 40mm × 4mm, and the length is not less than 1000 mm.

4 face layer 10

1) Before paving and pasting, the anti-static porcelain floor blocks are pre-arranged. The specification size, appearance quality, color and the like of the anti-static porcelain floor block are pre-selected. The allowable deviation of the block size of the antistatic porcelain floor should meet the following specification:

2) before paving, the floor tiles are put into a half bucket to be soaked in water for wetting, and after being dried in the air, the floor tiles can be used when no open water exists on the surface.

3) When the anti-static porcelain floor block is paved on the cement mortar combined layer 7, the surface of the copper strip is cleaned, and particularly, the joint of the transverse copper strip and the longitudinal copper strip 2 is kept clean and is fully contacted. In addition, gaps are required to be arranged between the plates according to design requirements. The plate should be tightly attached to the wall without mortar joint filling.

4) When paving, the ridges of the brick are slightly higher than the horizontal height lines, after alignment, straightening and squaring, the upper surface of the brick is padded with a wood block, the brick is compacted by a rubber hammer, and the surface flatness and the seam width are adjusted.

5) When paving, the facing bricks are paved from inside to outside in sequence, so that the facing brick mortar is full, tightly connected and solid. When the floor tiles are paved, the floor tiles are preferably paved one time at a time, and when large-area construction is carried out, the floor tiles are paved in a sectional and subsection mode.

6) In order to find the position and elevation, 2-3 rows of bricks are paved longitudinally from the doorway, the horizontal and vertical elevation lines are pulled by using the bricks as the elevation bars, people cannot step on the surface of the just paved bricks, and each brick should follow the line.

7) After laying 2-3 rows, pulling at any time to check the straightness of the seam cells, if exceeding the specification, immediately finishing, straightening the seam, and compacting by using a rubber hammer. This should be done before the bonding layer 7 sets.

8) The surface layer 10 is paved and adhered for joint wiping and pointing within 24 hours, and the joint wiping and pointing adopts cement or other high-quality joint pointing materials with the same variety, the same strength grade and the same color, and is well maintained and protected. If no seam is left or the seam is small, the seam is required to be flat and straight, conductive epoxy resin glue is poured into the seam on the paved and finished brick surface layer 10 by using a slurry pot, then dry cement is sprayed on the seam, and then cotton yarn groups are used for rubbing and kneading to fill the seam. In the process of pointing in a clean workshop, conducting epoxy resin glue is adopted for pointing treatment.

9) And covering and wetting the surface after the bricks are paved for 24 hours, wherein the curing time is not less than 7 d. When the compressive strength of the cement mortar combined layer 7 reaches the design requirement, the cement mortar combined layer can be normally used.

10) The skirting board brick is made of floor material, and its vertical seam is aligned with the floor seam, and when it is spread on the wall, a brick is inlaid at the internal corner of two ends of every wall surface, and the thickness and height of the wall are in accordance with the design requirements. Then, the upper edge of the brick is taken as a standard hanging line, brick paving is started, bonding mortar (cement mortar with the mixing ratio of 1: 2) is smeared on the back face of the brick upwards, the mortar is preferably fully adhered to the whole brick and is timely adhered to the wall, the root line of the upper edge of the brick is immediately compacted, the extruded mortar is scraped, and the surface layer 10 is cleaned (before adhesion, the brick blocks are soaked in water and dried, and the wall surface is sprayed with water and moistened).

11) After the anti-static porcelain floor is paved, the surface should be covered with fabric and kept wet, and the curing time should not be less than 7 d. After the compressive strength of the cement mortar of the bonding layer 7 meets the requirement, the surface can be cleaned by clear water or 5 to 10 percent oxalic acid or neutral detergent solution to ensure that the surface is clean.

12) The indoor operating temperature is not lower than +5 ℃. When the outdoor operation is carried out, the operation can be carried out only after the test in a laboratory is qualified, and the antifreezing agent is added according to the change of the air temperature.

Grounding system installation

1) And after the floor surface is dried, grounding connection is carried out according to requirements.

2) The grounding system of the anti-static porcelain floor comprises an under-floor copper strip or aluminum strip grounding net, an indoor grounding terminal, an outdoor grounding wire, an outdoor connecting device, a current-limiting resistor 5, an outdoor grounding electrode 6 and the like.

3) The outdoor grounding part of the electrostatic grounding system is preferably made to be independently grounded and can be connected to a grounding bus for sites without conditions. The number of the grounding electrodes depends on the geological conditions of the soil, and the outdoor grounding resistance is not more than 30 omega.

4) When the static grounding and the lightning protection grounding, the direct current working grounding, the alternating current working grounding and the safety protection grounding share one grounding, the system grounding resistance is less than 1 omega, and lightning protection sensitive resistors are arranged on the static and other grounding branches besides the lightning protection grounding branch to ensure the safety.

5) The electrostatic ground and the protective ground, the working ground may share a set of ground poles. The electrostatic earth may be connected to the earth electrode via a current limiting resistor and a connecting wire. A current limiting resistor 5 with a current limiting resistance of 1M omega is used as a current limiting protection device.

6) The grounding conductive net and the protective grounding resistor of the anti-static ceramic floor adopt grounding terminals as connecting devices.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (8)

1. The anti-static copper strip porcelain floor structure is characterized by comprising a leveling layer (11), a ground base layer (9), a bonding layer (7), a surface layer (10) and an anti-static grounding system from bottom to top; the anti-static grounding system comprises a metal grounding grid (8), a grounding electrode (6) and a current-limiting resistor (5), wherein the metal grounding grid (8) is connected with the grounding electrode (6) through a wire, and the current-limiting resistor (5) is connected in series on the wire.

2. The antistatic copper tape porcelain floor structure of claim 1, wherein: the leveling layer (11) is leveled by adopting dry and hard cement paste.

3. The antistatic copper tape porcelain floor structure of claim 1, wherein: the thickness of the base layer is 25-30 mm.

4. The antistatic copper tape porcelain floor structure of claim 1, wherein: and the metal grounding grid (8) is paved on the bonding layer (7).

5. The antistatic copper tape porcelain floor structure of claim 1, wherein: the metal grounding grid (8) comprises a plurality of copper strips which are longitudinally and transversely distributed, and the copper strips are mutually welded to form a net structure.

6. The antistatic copper tape porcelain floor structure of claim 1, wherein: the stainless steel strip grounding device is characterized by further comprising a stainless steel strip (3) which is longitudinally arranged, wherein the stainless steel strip (3) is respectively in electrical contact with the copper strips which are transversely distributed, and the end part of the stainless steel strip (3) is connected with the grounding electrode (6).

7. The antistatic copper tape porcelain floor structure of claim 1, wherein: the surface layer (10) comprises a plurality of paved anti-static ceramic tiles.

8. The antistatic copper tape porcelain floor structure of claim 1, wherein: any tile is at least correspondingly contacted with a longitudinal copper strip (2) and a transverse copper strip (1).

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