CN211109760U

CN211109760U - Wafer mounting tool for silicon wafer

Info

Publication number: CN211109760U
Application number: CN201921644044.2U
Authority: CN
Inventors: 邹文龙; 冯强; 丁雷
Original assignee: Suzhou Jingying Pv Tech Co ltd
Current assignee: Suzhou Jingying Pv Tech Co ltd
Priority date: 2019-09-29
Filing date: 2019-09-29
Publication date: 2020-07-28
Anticipated expiration: 2029-09-29

Abstract

The utility model provides a silicon chip is with dress piece frock, comprising a base and a base plate, the bottom plate is slope form through a gasket and establishes on the base, be equipped with a plurality of top-down's water overflow groove on the bottom plate, water overflows the water overflow hole that is equipped with the intercommunication between the groove, the bottom plate both sides be equipped with the curb plate on the base respectively, the base with one of bottom plate connection is served and is separately equipped with two back plates, be equipped with crashproof rubber band on the back plate, the back plate respectively with be close be equipped with the connecting plate between the top of curb plate, the back plate with curb plate mutually perpendicular just leaves the clearance setting. The utility model discloses the edge is impaired when reducing the silicon chip mounting, and the operation of being convenient for.

Description

Wafer mounting tool for silicon wafer

Technical Field

The utility model belongs to the technical field of the silicon chip washs, concretely relates to mounting frock for silicon chip.

Background

With the popularization of the diamond wire slicing technology, the productivity of the silicon wafer is improved by 2-3 times, the pressure for cleaning the rear end is increased day by day, and the edge of the diamond wire silicon wafer is easy to damage in the cleaning process to cause abnormal silicon falling, so that the requirement on the operability of a chip mounting tool is improved.

The existing tool structure staff take out a pile of silicon wafers from the turnover box, push the silicon wafers from the front side of the tool, and rub the left side and the right side of the silicon wafers with the side plates to cause silicon to fall.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a mounting frock for silicon chip, the edge is impaired when reducing the silicon chip mounting, and the operation of being convenient for.

The utility model provides a following technical scheme:

the utility model provides a silicon chip is with dress piece frock, includes base and bottom plate, the bottom plate is slope form through a gasket and establishes on the base, be equipped with a plurality of top-down's water overflow groove on the bottom plate, water overflows and is equipped with the water overflow hole of intercommunication between the groove, the bottom plate both sides be equipped with the curb plate on the base respectively, the base with one of bottom plate connection is served and is divided and be equipped with two back plates, be equipped with crashproof rubber band on the back plate, the back plate respectively with be close be equipped with the connecting plate between the top of curb plate, the back plate with curb plate mutually perpendicular just leaves the clearance setting.

Preferably, the base is provided with a through hole, and the through hole corresponds to the water overflow hole.

Preferably, the base is provided with a plurality of mounting holes, the gasket is provided with a plurality of base connecting holes and a plurality of bottom plate connecting holes, the bottom plate is provided with bottom plate mounting holes, the gasket passes through the mounting holes, the base connecting holes, the bottom plate connecting holes and the bottom plate mounting holes respectively and fixedly connected with the base and the bottom plate, and the mounting connection is realized by bolts or screws.

Preferably, a base contact surface is arranged below the bottom plate, the base contact surface is connected and installed on the base, and the surface of the bottom plate opposite to the base contact surface is arranged on the base in a slope shape.

Preferably, the inclination angle between the bottom plate and the base ranges from 10 degrees to 15 degrees.

Preferably, the side plate is provided with a handle, and the handle is a square hole or a round waist-shaped hole.

Preferably, the connecting plate is L type connecting plate, be equipped with a plurality of connection screw on the L type connecting plate, the connecting plate passes through connection screw respectively with the curb plate with back plate erection joint, the erection joint adopts threaded connection.

Preferably, an induction screw is arranged on one side of the base, which is opposite to the rear plate.

Preferably, the bottom plate, the side plates and the rear plate are all made of PVC.

The utility model has the advantages that: the whole structure of the tool is stable, and the operation of workers is simple; the design of the side plate and the rear plate of the tool can effectively reduce the friction between the side plate and the silicon wafer during the wafer loading process, and reduce the abnormal damage and edge damage of the silicon wafer during the wafer loading process; the back plate is provided with a gap, so that silicon chip fragments can be conveniently taken from the back side plate; the overflow design of the bottom plate can facilitate the loading and unloading of wet silicon wafers.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the back structure of the present invention;

FIG. 3 is a schematic view of the gasket structure of the present invention;

FIG. 4 is a schematic view of the bottom plate structure of the present invention;

FIG. 5 is a schematic view of the side mounting structure of the present invention;

FIG. 6 is a schematic view of the mounting structure of the present invention;

labeled as: 1. a base; 11. a through hole; 2. a gasket; 21. a base connection hole; 22. a bottom plate connection hole; 23. installing a bolt; 3. a base plate; 31. water overflows the trough; 32. a water overflow hole; 33. a bottom plate mounting hole; 4. a side plate; 41. a handle; 5. a back plate; 6. anti-collision rubber band; 7. a connecting plate; 71. a connecting screw hole; 8. an induction screw; 9. and (3) a silicon wafer.

Detailed Description

As shown in fig. 1 and 2, a silicon wafer mounting tool, the whole tool is made of a PVC plate, and comprises a base 1 and a bottom plate 3, the bottom plate 3 is arranged on the base 1 in a slope shape through a gasket 2, side plates 4 are respectively arranged on the base 1 on two sides of the bottom plate 3, a handle 41 is arranged on each side plate 4, each handle 41 is a square hole or a circular waist-shaped hole, the lifting and the carrying are convenient, two rear plates 5 are separately arranged on one end of the base 1 connected with the bottom plate 3, each rear plate 5 is provided with an anti-collision rubber rib 6, a reserved through hole of the anti-collision rubber rib 6 is arranged on each rear plate 5, the anti-collision rubber rib 6 is mainly made of rubber, the anti-collision rubber rib prevents silicon wafers from colliding with the rear plates 5 when the wafers are mounted, so that silicon falls, connecting plates 7 are respectively arranged between the rear plates 5 and the top ends of the side plates 4 close to the rear plates, the connecting plates 7 are L-type connecting plates, a plurality of connecting screws 71 are arranged on the L-type connecting plates, the connecting plates 7 are respectively connected with the side plates 4 and the rear plates 4 through connecting screws 71, threaded holes are also arranged on the left side plates 4 and the right side plates 5, the rear plates are connected with the rear plates, a screw hole, a base plate 5, the base plate is also arranged on two.

As shown in fig. 1-5, a plurality of mounting holes are formed in the base 1, a plurality of base connecting holes 21 and bottom plate connecting holes 22 are formed in the gasket 2, bottom plate mounting holes 33 are formed in the bottom plate 3, the gasket 2 is respectively connected with the base 1 and the bottom plate 3 through the mounting holes, the base connecting holes 21, the bottom plate connecting holes 22 and the bottom plate mounting holes 33, and the mounting connection is achieved through bolts or screws. The bottom plate 3 is provided with a base contact surface, the base contact surface is connected and installed on the base 1, and the surface of the bottom plate 3 opposite to the base contact surface is arranged on the base 1 in a slope shape. The bottom plate 3 is connected with the base 1 through the gasket 2 through a cylindrical head screw, the gasket 2 is T-shaped, an angle of 10-15 degrees is formed between the bottom plate 3 and the base 1, and the silicon wafer is prevented from obliquely sliding out in the carrying process. Furthermore, a plurality of water overflow grooves 31 are arranged on the bottom plate 3 from top to bottom, communicated water overflow holes 32 are arranged between the water overflow grooves 31, through holes 11 are arranged on the base 1, the through holes 11 correspond to the water overflow holes 32, and when a wet silicon wafer is loaded, water can flow out through the water overflow holes 32 and the through holes 11 so as to facilitate the operation of the subsequent silicon wafer.

As shown in fig. 1-6, when the wafer mounting tool for the silicon wafer is used, the silicon wafer 9 is placed from top to bottom, the left side plate 4, the right side plate 4 and the rear plate 5 are separately arranged, materials are convenient to process, the chamfering position of the silicon wafer 9 is reserved, and the wafer is prevented from being collided with the side plate 4 at the corner; the interval is reserved in the middle of the rear plate 5, the broken silicon wafers 9 are convenient to take, the silicon wafers 9 can be rotated from top to bottom, friction between the silicon wafers 9 and the side plates when the silicon wafers 9 are pushed in is reduced, and therefore damage to the silicon wafers during loading is reduced.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The wafer mounting tool for the silicon wafer is characterized by comprising a base and a bottom plate, wherein the bottom plate is arranged on the base in a slope shape through a gasket, a plurality of water overflow grooves from top to bottom are formed in the bottom plate, communicated water overflow holes are formed between the water overflow grooves, side plates are arranged on the base on two sides of the bottom plate respectively, two rear plates are separately arranged on one end, connected with the bottom plate, of the base, anti-collision rubber bands are arranged on the rear plates, connecting plates are arranged between the rear plates and the top ends, close to the rear plates, of the side plates respectively, and the rear plates are perpendicular to the side plates and are arranged with gaps.

2. The wafer mounting tool for the silicon wafer as claimed in claim 1, wherein the base is provided with a through hole corresponding to the water overflow hole.

3. The die bonding tool for the silicon wafer according to claim 1, wherein a plurality of mounting holes are formed in the base, a plurality of base connecting holes and bottom plate connecting holes are formed in the gasket, bottom plate mounting holes are formed in the bottom plate, the gasket is respectively in mounting connection with the base and the bottom plate through the mounting holes, the base connecting holes, the bottom plate connecting holes and the bottom plate mounting holes, and the mounting connection is achieved through bolts or screws.

4. The wafer mounting tool for the silicon wafer as claimed in claim 1, wherein a base contact surface is arranged below the bottom plate, the base contact surface is connected and mounted on the base, and the surface of the bottom plate opposite to the base contact surface is arranged on the base in a slope shape.

5. The die bonding tool for silicon wafers as claimed in claim 1, wherein the inclination angle between the base plate and the base is in the range of 10 ° to 15 °.

6. The wafer loading tool for the silicon wafer as claimed in claim 1, wherein a handle is arranged on the side plate, and the handle is a square hole or a circular waist-shaped hole.

7. The wafer mounting tool for silicon wafers as claimed in claim 1, wherein the connecting plate is an L type connecting plate, a plurality of connecting screw holes are formed in the L type connecting plate, the connecting plate is respectively connected with the side plate and the rear plate through the connecting screw holes in an installing manner, and the installing connection is realized through a threaded connection.

8. The die-bonding tool for silicon wafers as claimed in claim 1, wherein an induction screw is provided on a side of the base opposite to the rear plate.

9. The wafer loading tool for the silicon wafer as claimed in claim 1, wherein the bottom plate, the side plates and the rear plate are made of PVC.