CN211102018U

CN211102018U - Wave soldering device

Info

Publication number: CN211102018U
Application number: CN201922309995.0U
Authority: CN
Inventors: 陈宗兵
Original assignee: Sanxinwei Electronic Technology Jiangsu Co ltd
Current assignee: Sanxinwei Electronic Technology Jiangsu Co ltd
Priority date: 2019-12-20
Filing date: 2019-12-20
Publication date: 2020-07-28
Anticipated expiration: 2029-12-20

Abstract

The utility model provides a wave soldering device, which comprises a wave soldering machine, a fan is arranged on the shell of the wave soldering machine, a cooling device is connected at the air inlet of the fan, the wave soldering machine comprises a box body, a cooling cavity and a filter cavity which are communicated are arranged in the box body, a plurality of cooling pipelines are arranged in the cooling cavity, a multilayer filter screen is arranged in the filter cavity, an inlet connecting end is arranged at the box body end where the cooling cavity is located, an outlet connecting end is arranged at the box body end where the filter cavity is located, an outlet connecting end mounting pipeline is communicated with the air inlet of the fan, an inlet connecting end mounting pipeline is communicated with the inner cavity of the shell of the wave soldering machine, an air outlet of the fan is communicated with an adsorption device, the wave soldering device cools the gas pumped from the inner part of the shell of the wave soldering machine through the cooling pipeline, accelerates the crystallization speed of scaling powder, improve the quality of the exhaust gas and eliminate strange odor.

Description

Wave soldering device

Technical Field

The utility model relates to a wave-soldering technical field especially relates to wave-soldering equipment.

Background

Wave soldering refers to the process of jetting molten soft solder into solder wave with design requirements through an electric pump or an electromagnetic pump, or injecting nitrogen into a solder pool to form the solder wave, so that a printed board with components mounted in advance passes through the solder wave to realize the soft soldering of mechanical and electrical connection between the soldering end or pin of the components and the pad of the printed board.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present invention is to provide a wave soldering apparatus to solve the above problems.

The technical scheme of the utility model is that:

wave-soldering equipment, including the crest welder, establish the fan on the casing of crest welder, the air intake department of fan connects cooling device, including the box, establish cooling chamber and the filter chamber that is linked together in the box, establish many cooling tube in the cooling chamber, establish the multilayer filter screen in the filter chamber, the box end that the cooling chamber is located establishes the import link, the box end that the filter chamber is located establishes the exit linkage, exit linkage erection tube communicates with the air intake of fan, entrance linkage erection tube and this pipeline and crest welder casing intracavity communicate, the air outlet and the adsorption equipment intercommunication of fan.

This wave-soldering equipment cools off the gas of taking out from wave-soldering machine casing through cooling tube for scaling powder crystallization speed improves crystallization quantity, keeps somewhere the box in after filtering, changes on time and can improve factor of safety, and further adsorbs the gas of taking out through adsorption equipment, improves the gaseous quality of exhaust, eliminates strange smell.

The wave soldering equipment is only provided with the adsorption device at the initial stage of research and development, but the problem that crystallized soldering flux is easy to gather in the adsorption device and has high danger is easily caused, and the technical scheme of the application is formed after further research and development.

Furthermore, a box body is arranged in the filter cavity, porous plates are arranged at two ends of the box body, a plurality of layers of filter screens are arranged in the box body, the wall of the box body at the top of the filter cavity is provided with an opening, and an elastic clamping mechanism is arranged at the opening correspondingly.

Furthermore, the elastic clamping mechanism comprises a fixed plate, a pushing block, a guide post and a spring, the fixed plate is installed at the top of the box body, a hole is formed in the fixed plate, the spring is sleeved on the guide post, one end of the guide post penetrates through the fixed plate, and the other end of the guide post is fixed with the pushing block.

The split type structure is convenient for replacing the filter screen in the filtering device and timely removes the filtered scaling powder by matching the push block with the spring to clamp the fixed box body.

Furthermore, communicating pipes are arranged in the cooling cavity from top to bottom, the cooling pipeline is arranged between the upper communicating pipe and the lower communicating pipe, and water is supplied through the communicating pipes, so that the cooling device is more convenient.

Furthermore, a pipeline is arranged at the air inlet of the fan, two branch pipes are arranged at the end part of the pipeline, and the branch pipes are connected with the outlet connecting end of the box body.

Furthermore, the inlet connecting end mounting pipeline faces towards the inlet end and the outlet end of the wave-soldering machine respectively, and waste gas generated during wave-soldering is timely pumped out.

Further, adsorption equipment holds the shell intracavity and is filled with the active carbon granule including holding the shell, through the purified gas of active carbon granule adsorption.

Drawings

FIG. 1: the whole structure of the utility model in the embodiment 1;

FIG. 2: a fan installation structure diagram;

FIG. 3: part A enlarges the structure chart;

in the figure: 1. a wave crest welder; 2. a cooling device; 3. a fan; 4. an adsorption device; 21. a box body; 22. a communicating pipe; 23. a cooling duct; 24. an inlet; 25. an outlet; 26. an inlet connection end; 27. a box body; 28. a filter screen; 29. an outlet connection end; 30. a fixing plate; 31. a push block; 32. a guide post; 33. pipe distribution; 41. activated carbon particles.

Detailed Description

The following detailed description of the embodiments of the present invention is made with reference to the accompanying drawings, so that the technical solution of the present invention can be more easily understood and grasped.

Example 1

Referring to fig. 1, 2 and 3, the wave soldering device comprises a wave soldering machine, a top shell of the wave soldering machine is fixed with a fan, a pipeline is installed at an air inlet of the fan, two branch pipes are arranged at the end part of the pipeline and connected with a cooling device, an air outlet of the fan is connected with an adsorption device, and the adsorption device in the embodiment adopts a structure for accommodating activated carbon particles filled in a shell.

Specifically, the cooling device comprises a box body, wherein a cooling cavity and a filter cavity which are communicated are arranged in the box body, an inlet connecting end is arranged at the end of the box body where the cooling cavity is located, the inlet connecting end is connected with a pipeline, the other end of the pipeline is positioned above an inlet or an outlet of a crest welder, communicating pipes are arranged in the cooling cavity from top to bottom, the cooling pipeline is arranged between an upper communicating pipe and a lower communicating pipe, water is conveyed or discharged through the communicating pipes, an inlet is arranged on the lower communicating pipe in the embodiment, an outlet is arranged on the upper communicating pipe, and.

The outlet connecting end is arranged at the box body end where the filter cavity is located, the outlet connecting end is connected with the branch pipe, a box body is arranged in the filter cavity, porous plates are arranged at two ends of the box body, a multi-layer filter screen is arranged in the box body, the box body wall at the top of the filter cavity is open, an elastic clamping mechanism is arranged at the opening and opposite to the opening, the elastic clamping mechanism comprises a fixed plate, a push block, a guide column and a spring, the fixed plate is installed at the top of the box body, a hole is formed in the fixed plate, the spring is sleeved on the guide column, one end of the guide column penetrates through the fixed plate, the other end.

When the soldering flux is used, waste gas generated by the wave crest welder during preheating or welding is pumped into the cooling cavity through the fan, the soldering flux is filtered by the filter screen in the filter cavity after being crystallized, and then the waste gas is discharged after being adsorbed by active carbon particles.

Of course, the above is only a specific application example of the present invention, and the protection scope of the present invention is not limited at all. All the technical solutions formed by equivalent transformation or equivalent replacement fall within the protection scope of the present invention.

Claims

1. Wave-soldering equipment, including the wave-soldering machine, its characterized in that establishes the fan on the casing of wave-soldering machine, and cooling device is connected to the air intake department of fan, including the box, establishes cooling chamber and the filter chamber that is linked together in the box, establishes many cooling tube in the cooling chamber, establishes multilayer filter screen in the filter chamber, and the case end that the cooling chamber is located establishes the access connection end, and the access connection end is established to the box end that the filter chamber is located, and the access connection end erection pipe communicates with the air intake of fan, and access connection end erection pipe and this pipeline communicate with wave-soldering machine casing intracavity, and the air outlet and the adsorption equipment intercommunication of fan.

2. The wave soldering apparatus of claim 1, wherein a box is disposed in the filter chamber, perforated plates are disposed at two ends of the box, a plurality of layers of filter screens are disposed in the box, and an opening is disposed on a wall of the box at the top of the filter chamber and opposite to the opening, and an elastic clamping mechanism is disposed at the opening.

3. The wave soldering apparatus of claim 2, wherein the resilient holding mechanism includes a fixed plate, a pushing block, a guiding post and a spring, the fixed plate is mounted on the top of the housing, the fixed plate has an opening, the guiding post is sleeved with the spring, one end of the guiding post passes through the fixed plate, and the other end of the guiding post is fixed to the pushing block.

4. The wave soldering apparatus of claim 1, wherein the cooling chamber has upper and lower communicating tubes mounted therein, and the cooling conduit is mounted between the upper and lower communicating tubes.

5. The wave soldering apparatus of claim 1, wherein a duct is installed at the air inlet of the blower, and two branch pipes are installed at the end of the duct and connected to the outlet connection end of the case.

6. The wave soldering apparatus of claim 5, wherein the inlet connection end mounting conduits face an inlet end and an outlet end of the wave soldering machine, respectively.

7. The wave soldering apparatus of claim 1, wherein the adsorption device includes a containment shell, and the containment shell cavity is filled with activated carbon particles.