CN211090468U

CN211090468U - Novel 3D power module structure

Info

Publication number: CN211090468U
Application number: CN202020089722.XU
Authority: CN
Inventors: 周玮
Original assignee: Lianzhen Electronics Shenzhen Co ltd
Current assignee: Lianzhen Electronics Shenzhen Co ltd
Priority date: 2020-01-16
Filing date: 2020-01-16
Publication date: 2020-07-24
Anticipated expiration: 2030-01-16

Abstract

The utility model discloses a novel 3D power module structure, which comprises a circuit board, power IC is installed to the front side of circuit board, power IC's both sides are provided with electric capacity and resistance respectively, the inductance body is installed to the inboard of circuit board, the draw-in groove has all been seted up to the both sides of circuit board. The utility model discloses a heat dissipation section of thick bamboo drives montant and circuit board installation, this moment kelly and circuit board contact, the kelly moves to the outside, the removal of kelly drives the slide and removes, the removal of slide makes reset spring take place deformation, inside the draw-in groove is gone into to the kelly card afterwards, it rotates to drive the flabellum through the motor, the rotation of flabellum is outside the heat discharge of circuit board work production, the advantage that the radiating effect is good has been reached, it is not good to have solved current power module radiating effect when using, often power top installation inductance, so that the heat that produces as to power work can not timely discharge, consequently, the problem of being not convenient for people to use.

Description

Novel 3D power module structure

Technical Field

The utility model relates to a power module technical field specifically is a novel 3D power module structure.

Background

The power module is a power supply device which can be directly attached to a printed circuit board, and is characterized in that the power module can provide power for an application specific integrated circuit, a digital signal processor, a microprocessor, a memory, a field programmable gate array and other digital or analog loads, while the existing power module has poor heat dissipation effect in use, and often an inductor is arranged above a power supply, so that heat generated by the power supply cannot be timely discharged, and the power module is inconvenient for people to use.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides a novel 3D power module structure possesses the good advantage of radiating effect, and it is not good to have solved current power module radiating effect when using, often power top installation inductance to as for the heat that power work produced can not timely discharge, the problem of consequently not being convenient for people to use.

(II) technical scheme

For the purpose that realizes above-mentioned radiating effect is good, the utility model provides a following technical scheme: the utility model provides a novel 3D power module structure, includes the circuit board, power IC is installed to the front side of circuit board, power IC's both sides are provided with electric capacity and resistance respectively, the inductance body is installed to the inboard of circuit board, the draw-in groove has all been seted up to the both sides of circuit board, a heat dissipation section of thick bamboo is installed in the outside of circuit board, the top fixedly connected with motor of a heat dissipation section of thick bamboo inner wall, the output fixedly connected with flabellum of motor, the inboard equal fixedly connected with montant in both sides of a heat dissipation section of thick bamboo, the inner chamber of montant is seted up flutedly, one side fixedly connected with reset spring of recess inner wall, reset spring's inboard fixedly connected with slide, the inboard fixedly connected with kelly of slide, the inboard of kel.

Preferably, the bottom of the inner cavity of the heat dissipation cylinder is transversely provided with a filter screen, and the aperture of the filter screen is ten-to twenty-mesh.

Preferably, the inductor body is located between the two circuit boards, the terminal at the top of the inductor body is connected with the circuit board above the inductor body, and the terminal at the bottom of the inductor body is connected with the circuit board below the inductor body.

Preferably, the capacitor, the power supply IC and the resistor can be placed on the front surface and the back surface of the circuit board or embedded in the circuit board.

Preferably, the top and the bottom of the sliding plate are in sliding connection with the inner wall of the groove, and the elastic coefficient of the return spring is 1N/M.

(III) advantageous effects

Compared with the prior art, the utility model provides a novel 3D power module structure possesses following beneficial effect:

1. the utility model discloses a heat dissipation section of thick bamboo drives montant and circuit board installation, this moment kelly and circuit board contact, the kelly moves to the outside, the removal of kelly drives the slide and removes, the removal of slide makes reset spring take place deformation, inside the draw-in groove is gone into to the kelly card afterwards, it rotates to drive the flabellum through the motor, the rotation of flabellum is outside the heat discharge of circuit board work production, the advantage that the radiating effect is good has been reached, it is not good to have solved current power module radiating effect when using, often power top installation inductance, so that the heat that produces as to power work can not timely discharge, consequently, the problem of being not convenient for people to use.

2. The utility model discloses a filter screen plays filterable effect to external impurity, prevents inside debris can get into a heat dissipation section of thick bamboo to the radiating effect has been guaranteed.

3. The utility model discloses a draw-in groove makes inside the card that the kelly can be smooth goes into the circuit board to can install the position of a heat dissipation section of thick bamboo.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a cross-sectional view of the heat dissipating barrel structure of the present invention;

fig. 3 is a partial sectional view of the structure of the vertical rod of the present invention;

fig. 4 is a partially enlarged schematic view of a portion a of fig. 1.

In the figure: 1. a circuit board; 2. a heat-dissipating cylinder; 3. a resistance; 4. an inductor body; 5. a vertical rod; 6. a capacitor; 7. a power supply IC; 8. a fan blade; 9. a motor; 10. a filter screen; 11. a return spring; 12. a groove; 13. a slide plate; 14. a clamping rod; 15. a clamping groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to be referred must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The utility model discloses a circuit board 1, heat dissipation section of thick bamboo 2, resistance 3, inductance body 4, montant 5, electric capacity 6, power IC 7, flabellum 8, motor 9, filter screen 10, reset spring 11, recess 12,

slide

13, 14 draw-in grooves of kelly 15 parts are the parts that general standard or technical personnel in the field know, and its structure and principle all are that this technical personnel all can learn through the technical manual or learn through conventional experimental method.

Referring to fig. 1-4, a novel 3D power module structure includes a circuit board 1, a power IC 7 is installed on the front side of the circuit board 1, capacitors 6 and resistors 3 are respectively installed on both sides of the power IC 7, the capacitors 6, the power IC 7 and the resistors 3 can be placed on the front side and the back side of the circuit board 1 or embedded in the circuit board 1, an inductor body 4 is installed on the inner side of the circuit board 1, the inductor body 4 is located between the two circuit boards 1, terminals on the top of the inductor body 4 are connected to the circuit board 1 above, terminals on the bottom of the inductor body 4 are connected to the circuit board 1 below, slots 15 are respectively installed on both sides of the circuit board 1, a heat dissipation cylinder 2 is installed on the outer side of the circuit board 1, a filter screen 10 is transversely installed on the bottom of the inner cavity of the heat dissipation cylinder 2, the aperture of the filter screen 10 is ten, prevent that debris can get into inside heat dissipation section of thick bamboo 2, thereby the radiating effect has been guaranteed, the top fixedly connected with motor 9 of 2 inner walls of heat dissipation section of thick bamboo, motor 9's output fixedly connected with flabellum 8, the equal fixedly connected with montant 5 in 2 inboard both sides of heat dissipation section of thick bamboo, recess 12 is seted up to the inner chamber of montant 5, one side fixedly connected with reset spring 11 of recess 12 inner wall, reset spring 11's inboard fixedly connected with slide 13, slide 13's top and bottom all are sliding connection with recess 12's inner wall, reset spring 11's elastic coefficient is 1 NM, slide 13's inboard fixedly connected with kelly 14, the inboard of kelly 14 runs through montant 5 and extends to the inner chamber of draw-in groove 15, through draw-in groove 15, inside card that makes kelly 14 can be smooth goes into circuit board 1, thereby can install heat.

When using, at first drive montant 5 and the installation of circuit board 1 through heat dissipation section of thick bamboo 2, card pole 14 and the contact of circuit board 1 this moment, card pole 14 moves to the outside, the removal of card pole 14 drives slide 13 and removes, slide 13's removal makes reset spring 11 take place deformation, after card pole 14 is same level with draw-in groove 15, restore to deform at reset spring 11 and promote card pole 14 and move to the inside side down, card pole 14 card is gone into inside draw-in groove 15 this moment, can install heat dissipation section of thick bamboo 2, drive flabellum 8 through motor 9 afterwards and rotate, the heat that the rotation of flabellum 8 produced the work of circuit board 1 is discharged the outside.

While embodiments of the present invention have been shown and described, it will be apparent to those skilled in the art that various modifications and changes can be made in the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. The utility model provides a novel 3D power module structure, includes circuit board (1), its characterized in that: the inductor comprises a circuit board (1), a power IC (7) and resistors (3), wherein the power IC (7) is installed on the front side of the circuit board (1), capacitors (6) and the resistors (3) are respectively arranged on two sides of the power IC (7), an inductor body (4) is installed on the inner side of the circuit board (1), clamping grooves (15) are respectively formed in two sides of the circuit board (1), a heat dissipation cylinder (2) is installed on the outer side of the circuit board (1), a motor (9) is fixedly connected to the top of the inner wall of the heat dissipation cylinder (2), fan blades (8) are fixedly connected to the output end of the motor (9), vertical rods (5) are fixedly connected to two sides of the inner side of the heat dissipation cylinder (2), grooves (12) are formed in the inner cavity of the vertical rods (5), reset springs (11) are fixedly connected to one side of the inner wall of the grooves (12), sliding plates, the inner side of the clamping rod (14) penetrates through the vertical rod (5) and extends to the inner cavity of the clamping groove (15).

2. The novel 3D power module structure of claim 1, wherein: the bottom of the inner cavity of the heat dissipation cylinder (2) is transversely provided with a filter screen (10), and the aperture of the filter screen (10) is ten-mesh to twenty-mesh.

3. The novel 3D power module structure of claim 1, wherein: the inductor body (4) is located between the two circuit boards (1), the terminal at the top of the inductor body (4) is connected with the circuit board (1) above, and the terminal at the bottom of the inductor body (4) is connected with the circuit board (1) below.

4. The novel 3D power module structure of claim 1, wherein: the capacitor (6), the power IC (7) and the resistor (3) can be placed on the front surface and the back surface of the circuit board (1) or embedded in the circuit board (1).

5. The novel 3D power module structure of claim 1, wherein: the top and the bottom of the sliding plate (13) are in sliding connection with the inner wall of the groove (12), and the elastic coefficient of the return spring (11) is 1N/M.