CN211089748U

CN211089748U - Thermal infrared image acquisition equipment

Info

Publication number: CN211089748U
Application number: CN202020136983.2U
Authority: CN
Inventors: 蒋伟鑫; 王潇; 邸文华
Original assignee: Beijing Dushi Technology Co ltd
Current assignee: Beijing Dushi Technology Co ltd
Priority date: 2020-01-21
Filing date: 2020-01-21
Publication date: 2020-07-24
Anticipated expiration: 2030-01-21

Abstract

The application discloses thermal infrared image acquisition equipment. Wherein the thermal infrared image acquisition device (10) comprises: a thermal infrared image acquisition camera (200) for acquiring thermal infrared images; a panel (100) disposed in front of the thermal infrared image capturing camera (200), wherein the panel (100) is made of a light-impermeable material; and a support frame (300) connecting the thermal infrared image acquisition camera (200) and the panel (100), wherein an optical filter (110) is arranged at a position of the panel (100) corresponding to the lens (210) of the thermal infrared image acquisition camera (200) and used for filtering other light except infrared light.

Description

Thermal infrared image acquisition equipment

Technical Field

The application relates to the field of image acquisition, in particular to thermal infrared image acquisition equipment.

Background

The thermal infrared imaging device can realize monitoring by acquiring thermal infrared radiation for imaging in an environment with insufficient visible light, such as at night, and the like, so that the thermal infrared imaging device is widely applied to the monitoring field. However, the existing thermal infrared image acquisition equipment has the following disadvantages:

(1) the infrared lens is not easy to clean, and particularly the lens is difficult to clean, and the infrared lens can be degraded when meeting water, so that the infrared lens is easy to damage;

(2) the device is easy to damage and high in maintenance cost; and

(3) poor concealment, large size, and easy to be damaged by man.

Aiming at the technical problems of difficult cleaning, easy damage and poor concealment of the existing thermal infrared image acquisition equipment, an effective solution is not provided at present.

SUMMERY OF THE UTILITY MODEL

The utility model provides a thermal infrared image acquisition equipment to solve difficult clean, fragile and the disguised poor technical problem that exists of the thermal infrared image acquisition equipment that exists among the prior art at least.

According to an aspect of the present application, there is provided a thermal infrared image acquisition apparatus comprising: the thermal infrared image acquisition camera is used for acquiring thermal infrared images; a panel disposed in front of the thermal infrared image capturing camera, wherein the panel is made of an opaque material; and the supporting frame is used for connecting the thermal infrared image acquisition camera with the panel, wherein an optical filter is arranged at the position of the panel corresponding to the lens of the thermal infrared image acquisition camera and is used for filtering other light rays except infrared light.

Optionally, the thermal infrared image capturing device further includes a connecting mechanism, and the connecting mechanism is configured to fix the optical filter on the panel.

Optionally, the attachment mechanism comprises a tab.

Optionally, one end of the support frame is connected with the panel, and the other end of the support frame is provided with a universal tripod head connected with the thermal infrared image acquisition camera.

Optionally, the thermal infrared image capturing device further comprises a cassette for accommodating the thermal infrared image capturing camera and the support frame, wherein the cassette is connected with the support frame and the panel and shields the thermal infrared image capturing camera from the panel.

Optionally, the thermal infrared image capturing camera includes an image capturing module and a lens disposed at a front end of the image capturing module.

Optionally, the image acquisition module comprises: a front housing configured to be connected with a lens; and a rear housing configured to be connected with the gimbal.

Optionally, the outer surface of the front and/or rear housing is provided with a heat sink structure.

Optionally, a thermal infrared image sensor circuit board for acquiring an image and a signal transmission circuit board connected with the thermal infrared image sensor circuit board are arranged in the image acquisition module.

Optionally, the outer surface of the rear housing is provided with an image signal transmission interface connected with the signal transmission circuit board.

In summary, embodiments of the present application provide a thermal infrared image capturing device. The thermal infrared image acquisition equipment comprises a panel arranged in front of a thermal infrared image acquisition camera and a support frame connecting the thermal infrared image acquisition camera and the panel. Thereby hot infrared image acquisition equipment can place in the wall to shelter from hot infrared image acquisition equipment through setting up the panel in hot infrared image acquisition camera the place ahead, make hot infrared image acquisition camera can obtain hiding. And because the panel can be dustproof and explosion-proof to can protect hot infrared image acquisition camera to avoid damaging, and make hot infrared image acquisition camera be difficult for receiving the pollution, thereby reduce and carry out clear operation to hot infrared image acquisition camera. Therefore, the technical problems that the existing thermal infrared image acquisition equipment is not easy to clean, easy to damage and poor in concealment are solved.

The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments thereof, taken in conjunction with the accompanying drawings.

Drawings

Some specific embodiments of the present application will be described in detail hereinafter by way of illustration and not limitation with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:

FIG. 1 is a side view of a thermal infrared image capture device according to an embodiment of the present application;

FIG. 2 is a front view of a thermal infrared image capture device according to an embodiment of the present application; and

fig. 3 is an external schematic view of a thermal infrared image capturing device according to an embodiment of the present application.

Detailed Description

It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.

It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances for describing embodiments of the invention herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

Fig. 1-3 are schematic perspective views of a thermal infrared image capturing device 10 according to an embodiment of the present application.

Referring to fig. 1 and 2, the present embodiment provides a thermal infrared image capturing apparatus 10. The thermal infrared image capturing apparatus 10 includes a thermal infrared image capturing camera 200, a panel 100, and a support 300.

The thermal infrared image capturing camera 200 is configured to capture thermal infrared images. The panel 100 is disposed in front of the thermal infrared image capturing camera 200, and wherein the panel 100 is made of an opaque material. The support 300 is used to connect the thermal infrared image capturing camera 200 with the panel 100.

And wherein, a filter 110 is disposed at a position of the panel 100 corresponding to the lens 210 of the thermal infrared image capturing camera 200, for filtering other light than infrared light.

As described in the background, the existing thermal infrared image capturing apparatus has the following disadvantages: (1) the infrared lens is not easy to clean, and particularly the lens is difficult to clean, and the infrared lens can be degraded when meeting water, so that the infrared lens is easy to damage; (2) the device is easy to damage and high in maintenance cost; and (3) poor concealment, large size, and susceptibility to human damage.

In view of the above problems in the prior art, the present embodiment proposes a thermal infrared image capturing device 10. The thermal infrared image capturing apparatus 10 includes a panel 100 disposed in front of a thermal infrared image capturing camera 200, and a support 300 connecting the thermal infrared image capturing camera 200 with the panel 100. So that the thermal infrared image capture device 10 can be placed 86 inside the cassette 400 and embedded in a wall by the 86 cassette 400. And the thermal infrared image capturing apparatus 10 is shielded by the panel 100 disposed in front of the thermal infrared image capturing camera 200 so that the thermal infrared image capturing camera 200 can be hidden. And since the panel 100 can be dustproof and explosion-proof, the thermal infrared image capturing camera 200 can be protected from being damaged, and the thermal infrared image capturing camera 200 is not easily contaminated, thereby reducing an operation of cleaning the thermal infrared image capturing camera 200.

Therefore, the technical problems that the existing thermal infrared image acquisition equipment is not easy to clean, easy to damage and poor in concealment are solved.

In addition, in order to avoid the thermal infrared image capturing camera 200 from being interfered by other stray light, the panel 100 is made of a light-proof material. And an optical filter 110 for filtering light other than infrared light is disposed at a position of the panel 100 corresponding to the lens 210 of the thermal infrared image capturing camera 200. The filter 110 is preferably made of germanium glass. The outer panel 100 may be, for example, integral with the support frame 300.

Optionally, referring to fig. 1 and 2, the thermal infrared image capturing device 10 further includes a connecting mechanism 120, and the connecting mechanism 120 is used to fix the optical filter 110 on the panel 100. And further, the connecting mechanism may be, for example, a pressing piece 121, but the connecting mechanism 120 may also adopt other connecting methods. Referring to fig. 1 and 2, in the present embodiment, the filter 110 is fixed to the panel 100 by screws, for example, through a pressing sheet 121 disposed on the panel 100. Therefore, in this way, the optical filter 110 can be conveniently detached and replaced, and the use by a user is facilitated.

Alternatively, as shown in fig. 1, one end of the support 300 is connected to the panel 100, and the other end of the support 300 is provided with a gimbal 310 connected to the thermal infrared image capturing camera 200. Specifically, referring to fig. 1 and 2, one end of the supporting frame 300 may be fixed to the panel 100 by screws, for example, and the other end is fixed to the thermal infrared image capturing camera 200 by a gimbal 310. So that the shooting angle of the thermal infrared image capturing camera 200 can be adjusted by the gimbal table 310. Still further, referring to fig. 2, the gimbal table 310 may be connected with the thermal infrared image capturing camera 200, for example, by a connecting base 320.

Optionally, referring to fig. 3, the thermal infrared image capturing device 10 further includes a cassette 400 for housing the thermal infrared image capturing camera 200 and the support stand 300, wherein the cassette 400 is connected with the support stand 300 and the panel 100 and shields the thermal infrared image capturing camera 200 from the panel 100. Specifically, cassette 400 may be, for example, a 86-type junction box housing (i.e., a general 86-type cassette). The thermal infrared image capturing camera 200 can be further protected from damage by the cassette 400, and interference of other veiling glare to the thermal infrared image capturing camera 200 can be prevented.

Alternatively, referring to fig. 1, the thermal infrared image capturing camera 200 includes an image capturing module 220 and a lens 210 disposed at a front end of the image capturing module 220. Thus, it is possible to image with the lens 210 and to collect a thermal infrared image with the image collection module 220.

Alternatively, as shown with reference to fig. 1, the image acquisition module 220 includes: a front case 221 configured to be connected with the lens 210; and a rear housing 222 configured to couple with the gimbal table 310. The image sensor circuit inside the image capture module 220 can be protected by the front case 221 and the rear case 222 for water and dust prevention.

Optionally, the outer surface of the front case 221 and/or the rear case 222 is provided with

heat sink structures

241 and 242 so that the image capture module 220 can dissipate heat in time.

Alternatively, although not shown in the drawings, a thermal infrared image sensor circuit board for collecting thermal infrared images and a signal transmission circuit board connected to the thermal infrared image sensor circuit board are provided in the image collection module 220. Therefore, the collection of images can be completed through the thermal infrared image sensor circuit board and the signal transmission circuit board, and signals can be transmitted to external equipment.

Optionally, the outer surface of the rear case 222 is provided with image signal transmission interfaces 231 and 232 connected to the signal transmission circuit board. So that the collected thermal infrared image can be transmitted through the

signal transmission cables

251 and 252 connected to the image signal transmission interfaces 231 and 232.

Unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the orientation words such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, and in the case of not making a contrary explanation, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be interpreted as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

The above description is only for the preferred embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present application should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A thermal infrared image acquisition device (10), characterized by comprising: a thermal infrared image acquisition camera (200) for acquiring thermal infrared images; a panel (100) disposed in front of the thermal infrared image capturing camera (200), wherein the panel (100) is made of a light-impermeable material; and a support (300) connecting the thermal infrared image capturing camera (200) with the panel (100), wherein,

and an optical filter (110) is arranged at the position of the panel (100) corresponding to the lens (210) of the thermal infrared image acquisition camera (200) and is used for filtering other light rays except infrared light.

2. The thermal infrared image capturing device (10) according to claim 1, characterized in that it further comprises a connecting mechanism (120), and said connecting mechanism (120) is used to fix said optical filter (110) on said panel (100).

3. Thermal infrared image acquisition device (10) according to claim 2, characterized in that said connection means (120) comprise a pressure pad (121).

4. Thermal infrared image acquisition device (10) according to claim 1, characterized in that one end of said support (300) is connected with said panel (100) and the other end of said support (300) is provided with a gimbal table (310) connected with said thermal infrared image acquisition camera (200).

5. The thermal infrared image capturing device (10) according to claim 1, further comprising a cassette (400) for accommodating the thermal infrared image capturing camera (200) and the support frame (300), wherein the cassette (400) is connected with the support frame (300) and the panel (100) and shields the thermal infrared image capturing camera (200) from the panel (100).

6. The thermal infrared image capturing device (10) according to claim 4, characterized in that the thermal infrared image capturing camera (200) comprises an image capturing module (220) and the lens (210) arranged at a front end of the image capturing module (220).

7. The thermal infrared image capturing device (10) according to claim 6, characterized in that said image capturing module (220) comprises:

a front housing (221) configured for connection with the lens (210); and

a rear housing (222) configured to connect with the gimbal table (310).

8. Thermal infrared image acquisition device (10) according to claim 7, characterized in that the outer surface of said front shell (221) and/or said rear shell (222) is provided with a heat sink structure (241, 242).

9. The thermal infrared image capturing device (10) according to claim 7, characterized in that a thermal infrared image sensor circuit board for capturing images and a signal transmission circuit board connected with the thermal infrared image sensor circuit board are disposed in the image capturing module (220).

10. The thermal infrared image capturing device (10) according to claim 9, characterized in that an outer surface of the rear housing (222) is provided with an image signal transmission interface (231, 232) connected with a signal transmission circuit board.