CN211088220U

CN211088220U - Etching device for integrated circuit device

Info

Publication number: CN211088220U
Application number: CN201922434986.4U
Authority: CN
Inventors: 陈国军
Original assignee: Shanghai Xingxin Integrated Circuit Co ltd
Current assignee: Shanghai Xingxin Integrated Circuit Co ltd
Priority date: 2019-12-30
Filing date: 2019-12-30
Publication date: 2020-07-24
Anticipated expiration: 2029-12-30

Abstract

The utility model discloses an integrated circuit device carving device, which comprises a base plate, a lower mold core, guide pillars, an upper connecting plate, an upper mold plate and a carving device, wherein the lower mold core is fixedly connected to the top surface of the base plate through a connecting frame, a plurality of guide pillars are connected to the top surface of the base plate, the upper connecting plate penetrates through the guide pillars and is in sliding connection with the guide pillars, the bottom surface of the upper connecting plate is connected with the upper mold plate, and a plurality of spring seats are connected between the upper mold plate and the upper connecting plate; the upper template is provided with a plurality of connecting through holes penetrating through the upper template, and the etching device is detachably connected with the connecting through holes of the upper template; the workpiece is connected in the lower die core, and the upper die plate descends to drive the carving device to carve and remove the workpiece; the utility model discloses a carve and remove device can install it in the position that needs, during the use, carves through pushing down the upper junction plate drive and removes the device decline, can accomplish carving of device on the integrated circuit and remove, but has improved the security accuracy of carving removing, has guaranteed to carve the effect of removing.

Description

Etching device for integrated circuit device

Technical Field

The utility model relates to an integrated circuit manufacturing technical field, concretely relates to integrated circuit device is carved except that device.

Background

In the manufacturing process of the integrated circuit packaging industry, defective products exist, and a single device needs to be etched before the whole frame is formed. At present, the common practice is to manually remove the device to be removed on the frame by a knife. The devices are manually etched, the etching effect cannot be guaranteed, and the risk of etching other devices is also existed.

As shown in fig. 1, an integrated circuit includes a plurality of devices, and if one of the devices is a defective device, it needs to be etched, and how to effectively etch the defective device without damaging other devices is a problem to be considered.

Disclosure of Invention

An object of the utility model is to provide an integrated circuit device is carved except that the device to the device on the integrated circuit is carved except that the problem of difficulty among the solution prior art.

In order to achieve the purpose, the utility model is realized by adopting the following technical scheme:

the integrated circuit device etching device comprises a base plate, a lower die core, guide pillars, an upper connecting plate, an upper die plate and an etching device, wherein the lower die core is fixedly connected to the top surface of the base plate through a connecting frame, the guide pillars are connected to the top surface of the base plate, the upper connecting plate penetrates through the guide pillars and is in sliding connection with the guide pillars, the bottom surface of the upper connecting plate is connected with the upper die plate, and a plurality of spring seats are connected between the upper die plate and the upper connecting plate;

the upper template is provided with a plurality of connecting through holes penetrating through the upper template, and the etching device is detachably connected with the connecting through holes of the upper template; the workpiece is connected in the lower die core, and the upper die plate descends to drive the carving device to carve and remove the workpiece.

Further, the lower mold core comprises a mold core main body, a positioning column and a through groove, a mold core cavity is arranged on the top surface of the mold core main body, the positioning column is connected in the mold core cavity, and the through groove penetrates through the mold core main body and is communicated with the mold core cavity; the workpiece is fixed in the die cavity through the positioning column.

Furthermore, the bottom surface of the upper connecting plate is also connected with a limit stop, and the length of the limit stop is smaller than that of the spring seat in a natural state.

Furthermore, the top end of the guide post is connected with a limiting seat through a bolt.

Further, the carving device comprises a screw and a cutter head, the cutter head is connected to one end of the screw, and the screw is connected with the connecting through hole through a nut.

Furthermore, the base plate is further connected with a vertical plate, the vertical plate is connected with a cylinder seat, the cylinder seat is connected with a cylinder, and an output shaft of the cylinder is connected with the top surface of the upper connecting plate.

Furthermore, the two sides of the upper connecting plate are connected with sliding blocks, the vertical plate is further connected with a connecting seat, a sliding rail is fixed on the connecting seat, and the sliding blocks are in sliding connection with the sliding rail.

Further, the arrangement direction of the slide rail is the same as that of the guide post.

Further, the top surface of the upper connecting plate is connected with a handle.

According to the above technical scheme, the embodiment of the utility model has following effect at least:

1. the engraving device designed by the utility model can be installed at a required position, and when in use, the upper connecting plate is pressed down to drive the engraving device to descend, so that engraving of devices on the integrated circuit can be completed, the engraving safety and accuracy are improved, and the engraving effect is ensured;

2. the device is provided with the sliding block and the sliding rail, when the upper connecting plate moves up and down, the sliding block slides in the sliding rail, and the stability of the up-and-down movement of the upper connecting plate is ensured by combining the arrangement of the guide posts, and the precision of the cutting device of the carving device is ensured.

Drawings

FIG. 1 is a diagram of an integrated circuit of the prior art;

FIG. 2 is a schematic view of an engraving device according to an embodiment of the present invention;

FIG. 3 is a schematic view of the overall structure of an embodiment of the present invention;

FIG. 4 is a schematic view of FIG. 3 in a different state;

FIG. 5 is a schematic view of a lower mold insert according to an embodiment of the present invention;

fig. 6 is a schematic view of the connection between the engraving device and the upper mold plate according to the embodiment of the present invention.

Wherein: 1. a base plate; 2. a lower die core; 3. a connecting frame; 4. a guide post; 5. a guide sleeve; 6. an upper connecting plate; 7. a spring seat; 8. a limit stop block; 9. mounting a template; 10. an engraving device; 11. a limiting seat; 12. a connecting seat; 13. a slide rail; 14. a slider; 15. a vertical plate; 16. a cylinder block; 17. a cylinder; 21. a mold core main body; 22. a mold cavity; 23. a positioning column; 24. a through groove; 91. a connecting through hole; 101. a screw; 102. a cutter head.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

It should be noted that, in the description of the present invention, the terms "front", "rear", "left", "right", "upper", "lower", "inner", "outer", etc. indicate the directions or positional relationships based on the directions or positional relationships shown in the drawings, and are only for convenience of description of the present invention but do not require the present invention to be constructed and operated in a specific direction, and thus, should not be construed as limiting the present invention. As used in the description of the present invention, the terms "front," "back," "left," "right," "up," "down" and "in" refer to directions in the drawings, and the terms "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component.

As shown in fig. 2 to 6, the etching device for integrated circuit devices includes a base plate 1, a lower mold core 2, guide pillars 4, an upper connecting plate 6, an upper mold plate 9 and an etching device 10, wherein the lower mold core 2 is fixedly connected to the top surface of the base plate 1 through a connecting frame 3, the four guide pillars 4 are connected to the top surface of the base plate 1, and the upper connecting plate 6 penetrates through the guide pillars 4 and is slidably connected to the guide pillars 4. Specifically, the connecting part of the upper connecting plate 6 and the guide post 4 is connected with a guide sleeve 5, and the guide sleeve 5 is connected with the guide post 4 in a sliding manner. The bottom surface of the upper connecting plate 6 is connected with an upper template 9, and four spring seats 7 are connected between the upper template 9 and the upper connecting plate 6; the upper template 9 is provided with a plurality of connecting through holes 91 penetrating through the upper template 9, and the etching device 10 is detachably connected with the connecting through holes 91 of the upper template 9; the workpiece is connected in the lower die core 2, and the upper die plate 9 descends to drive the carving device 10 to carve and remove the workpiece.

In the device, the upper template 9 is connected with the spring seat 7 through a bolt, and the spring seat 7 is connected with the upper connecting plate 6 through a bolt, so that the device is convenient to disassemble. The number of the connection through holes 91 provided on the upper board 9 depends on the integrated circuit. Have eight devices on the integrated circuit among the background art, the utility model discloses an it then corresponds on the cope match-plate pattern 9 and sets up eight connect the via hole 91. The connecting through hole 91 is used to fix the etching apparatus 10. Specifically, as shown in fig. 6, the engraving device 10 includes a screw 101 and a cutter 102, and the cutter 102 is integrally formed at the bottom end of the screw 101. The shape of the cutting tip 102 is configured according to the devices on the integrated circuit, and different integrated circuits may be exchanged for different cutting tips 102, i.e., for different scribe devices 10. When in use, the screw 101 penetrates through the connecting through hole 91, and the engraving device 10 is fixed by connecting nuts to the screw 101 on the upper and lower sides of the upper template 9. The engraving device 10 is fixed in the desired position.

The utility model discloses a carve and remove device 10 can install it in the position that needs, during the use, carve and remove device 10 through pushing down 6 drives of upper junction plate and descend, can accomplish carving of device on the integrated circuit and remove, but improved the security accuracy of carving removing, guaranteed the effect of carving removing.

Further, the lower mold core 2 comprises a mold core main body 21, a positioning column 23 and a through groove 24, a mold core cavity 22 is arranged on the top surface of the mold core main body 21, the positioning column 23 is connected in the mold core cavity 22, and the through groove 24 penetrates through the mold core main body 21 and is communicated with the mold core cavity 22; holes at two ends of the integrated circuit are arranged in the positioning column 23, so that the integrated circuit is fixed in the die cavity 22. The devices on the integrated circuit are located above the through grooves 24, and when the defective devices are cut off, the devices will fall to the lower part of the lower mold core 2 through the through grooves 24. A collecting box can be arranged below the lower die core 2 so as to collect defective devices.

In this embodiment, a limit stop 8 is further connected to the bottom surface of the upper connecting plate 6, and the length of the limit stop 8 is smaller than the length of the spring seat 7 in a natural state. When the etching device 10 and the integrated circuit are in contact, the upper die plate 9 moves upward, the upper die plate 9 presses the spring seat 7, and the spring seat 7 contracts. The setting of limit stop 8 can restrict the furthest of spring holder 7 shrink, has guaranteed spring holder 7's life on the one hand, and on the other hand guarantees the effectual excision to the device. The top end of the guide post 4 is connected with a limiting seat 11 through a bolt. The limiting seat 11 prevents the upper connecting plate 6 from falling off from the guide post 4.

In this embodiment, still be connected with riser 15 on the bed plate 1, riser 15 passes through the bolt fastening at the rear of bed plate 1 top surface, and it guarantees its stability through the welding otic placode. The vertical plate 15 is connected with a cylinder seat 16, the cylinder seat 16 is perpendicular to the vertical plate 15, the top surface of the cylinder seat 16 is connected with a cylinder 17, and an output shaft of the cylinder 17 penetrates through the cylinder seat 16 and is connected with the top surface of the upper connecting plate 6. During the use, start cylinder 17, the extension of cylinder output end drives and carves except that device 10 and amputate the device, and the cylinder output end shortens to drive and carves except that device 10 return.

Further, in order to ensure the stability of the up-and-down motion of the upper connecting plate 6, the device is further provided with a guide rail 13, the two sides of the upper connecting plate 6 are connected with sliding blocks 14, the two sides in front of the vertical plate 15 are also connected with a connecting seat 12, a sliding rail 13 is fixed on the connecting seat 12, and the sliding rail 13 and the guide post 4 are arranged in the plumb direction and are perpendicular to the base plate 1. The sliding block 14 is connected with the sliding rail 13 in a sliding way. The slide block 14 is connected with the slide rail 13 in a sliding manner, so that the stability of the up-and-down movement of the upper connecting plate 6 is ensured, and the precision of the cutting device 10 is ensured.

The utility model discloses still can be through manual operation, do not connect the cylinder 17 on the upper junction plate 6 promptly, the handle is connected to the top surface of upper junction plate 6. The defective components can be cut off through manual operation.

It will be appreciated by those skilled in the art that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The embodiments disclosed above are therefore to be considered in all respects as illustrative and not restrictive. All changes which come within the scope of the invention or which are equivalent to the scope of the invention are embraced by the invention.

Claims

1. The integrated circuit device carving device is characterized by comprising a base plate (1), a lower die core (2), guide pillars (4), an upper connecting plate (6), an upper die plate (9) and a carving device (10), wherein the lower die core (2) is fixedly connected to the top surface of the base plate (1) through a connecting frame (3), the guide pillars (4) are connected to the top surface of the base plate (1), the upper connecting plate (6) penetrates through the guide pillars (4) and is in sliding connection with the guide pillars (4), the bottom surface of the upper connecting plate (6) is connected with the upper die plate (9), and a plurality of spring seats (7) are connected between the upper die plate (9) and the upper connecting plate (6);

a plurality of connecting through holes (91) penetrating through the upper template (9) are formed in the upper template (9), and the etching device (10) is detachably connected with the connecting through holes (91) of the upper template (9); the workpiece is connected in the lower die core (2), and the upper die plate (9) descends to drive the carving device (10) to carve and remove the workpiece.

2. The device according to claim 1, wherein the lower mold (2) comprises a mold main body (21), a positioning post (23) and a through groove (24), the top surface of the mold main body (21) is provided with a mold cavity (22), the positioning post (23) is connected in the mold cavity (22), and the through groove (24) penetrates through the mold main body (21) and is communicated with the mold cavity (22); the workpiece is fixed in the die core cavity (22) through a positioning column (23).

3. The integrated circuit device etching device according to claim 1, wherein a limit stop (8) is further connected to a bottom surface of the upper connecting plate (6), and a length of the limit stop (8) is smaller than a length of the spring seat (7) in a natural state.

4. The IC device etching apparatus according to claim 1, wherein the top end of the guide pillar (4) is bolted with a limiting seat (11).

5. The integrated circuit device scribing apparatus according to claim 1, wherein the scribing apparatus (10) comprises a screw (101) and a cutter head (102), the cutter head (102) is connected to one end of the screw (101), and the screw (101) is connected to the connecting through hole (91) through a nut.

6. The integrated circuit device etching device according to claim 1, wherein a vertical plate (15) is further connected to the base plate (1), a cylinder seat (16) is connected to the vertical plate (15), a cylinder (17) is connected to the cylinder seat (16), and an output shaft of the cylinder (17) is connected to the top surface of the upper connecting plate (6).

7. The etching apparatus for integrated circuit device according to claim 6, wherein the upper connecting plate (6) is connected to a sliding block (14) at both sides thereof, the vertical plate (15) is further connected to a connecting seat (12), the connecting seat (12) is fixed with a sliding rail (13), and the sliding block (14) is slidably connected to the sliding rail (13).

8. The IC device etching apparatus according to claim 7, wherein the slide rails (13) and the guide pillars (4) are arranged in the same direction.

9. The integrated circuit device etching apparatus according to claim 1, wherein a handle is attached to a top surface of the upper connection plate (6).