CN211086860U

CN211086860U - High-flatness back plate

Info

Publication number: CN211086860U
Application number: CN201922107693.5U
Authority: CN
Inventors: 白雷; 朱恩全; 刘军伟; 方仁
Original assignee: Taiyang Optoelectronics Technology Huizhou Co ltd
Current assignee: Taiyang Optoelectronics Technology Huizhou Co ltd; Taiyang Optoelectronics Huizhou Co Ltd
Priority date: 2019-11-29
Filing date: 2019-11-29
Publication date: 2020-07-24
Anticipated expiration: 2029-11-29

Abstract

The utility model relates to a backplate field discloses a high roughness backplate, include: the backboard comprises a backboard main body, a frame-shaped protruding structure and a stamping convex hull structure, wherein the frame-shaped protruding structure comprises a plurality of frame-shaped protruding parts which are mutually connected and formed by stamping the board wall of the backboard main body upwards, a second accommodating cavity is respectively arranged at the central position of each frame-shaped protruding part, and the second accommodating cavities are used for accommodating a circuit board; the protruding package of punching press structure includes the first punching press protruding package that the diapire that holds the chamber by the second formed to the punching press, and first punching press protruding package is provided with interconnect's lower punching press groove and upper punching press groove, and first punching press hole has been seted up to the cell wall in upper punching press groove, and first spiro union hole and joint mouth have been seted up to the cell wall in lower punching press groove, and first spiro union hole and joint mouth are located the both sides in first punching press hole respectively, and the joint mouth includes interconnect's import and bayonet socket. The high-flatness back plate can prevent other parts of the backlight module from being scratched by the protrusion of a hard bolt head.

Description

High-flatness back plate

Technical Field

The utility model relates to a backplate field especially relates to a high roughness backplate.

Background

With the progress of technology, liquid crystal display devices (such as liquid crystal televisions, liquid crystal displays, etc.) are increasingly used in production and daily life. As is well known, the core of a liquid crystal display device is a backlight module, which generally comprises a front frame, a polarizer, a filter, liquid crystal molecules, a TFT glass plate, a diffuser, a plastic frame, a backlight source, a back plate, and a circuit board.

The common back plate and the circuit board are connected with each other only by one bolt, and the connection mode of the common back plate and the circuit board is not firm enough. And the flatness of ordinary backplate is lower, and when backplate and circuit board passed through bolted connection, the bolt was higher than the height of backplate, and hard bolt head protrusion can fish tail other parts of backlight unit, such as backlight. In practical use, the side edge of the back plate can touch surrounding objects more, so that the side edge of the back plate is easy to curl, crack and the like.

SUMMERY OF THE UTILITY MODEL

The utility model aims at overcoming the weak point among the prior art, providing a high roughness backplate, having higher roughness, can avoid hard bolt head protrusion can fish tail backlight unit's other parts, can prevent that the side of backplate from taking place phenomenons such as curling, breaking easily.

The purpose of the utility model is realized through the following technical scheme:

a high flatness backplane comprising:

the side edge of the back plate main body is bent to form a bending plate, the back plate main body and the bending plate jointly enclose a first accommodating cavity, and the side edge of the bending plate is bent to form a bending plate attached to the bending plate;

the frame-shaped protruding structure comprises a plurality of frame-shaped protruding parts which are formed by upward stamping of the plate wall of the backboard main body and are connected with each other, a second accommodating cavity is formed in the center of each frame-shaped protruding part, and the second accommodating cavities are used for accommodating circuit boards; and

punching press convex closure structure, punching press convex closure structure include by the second holds the first punching press convex closure that the diapire of chamber upwards punching press formed, first punching press convex closure is provided with interconnect's lower stamping groove and upper stamping groove, first punching press hole has been seted up to the cell wall of upper stamping groove, first spiro union hole and joint mouth have been seted up to the cell wall in lower stamping groove, first spiro union hole reaches the joint mouth is located respectively the both sides in first punching press hole, the joint mouth includes interconnect's import and bayonet socket.

In one embodiment, the stamping convex hull structure further comprises a second stamping convex hull formed by stamping the bottom wall of the second accommodating cavity upwards, the second stamping convex hull is provided with a second stamping groove, and a second stamping hole is formed in the groove wall of the second stamping groove.

In one embodiment, the stamped convex hull structure further comprises a third stamped convex hull stamped and formed upward from the bottom wall of the second receiving cavity.

In one embodiment, the high-flatness back plate further includes a reinforcing structure, the reinforcing structure includes a frame-shaped reinforcing structure and a sheet-shaped reinforcing rib, the frame-shaped reinforcing structure includes a plurality of frame-shaped reinforcing ribs, each frame-shaped reinforcing rib is respectively accommodated in an inner wall of each frame-shaped protrusion portion, and the sheet-shaped reinforcing rib is accommodated in an inner wall of the second accommodating cavity.

In one embodiment, the bottom wall of the second accommodating cavity is provided with an outlet hole.

In one of them embodiment, high roughness backplate still includes pin post cover group, pin post cover group is including a plurality of pin post cover, and is a plurality of pin post cover interval set up in on the frame form bellying.

In one embodiment, the high-flatness back plate further comprises a side protruding structure, the side protruding structure comprises a plurality of lower protruding plates formed by bending the side edge of the back plate main body downwards, the side edge of each lower protruding plate extends outwards to form a side protruding part, and the side edge of each lower protruding plate is provided with a second screw hole.

In one embodiment, the back plate main body is provided with a connecting port, and the connecting port is arranged on one side of the lower convex plate.

In one embodiment, the back plate main body is an integrated structure, and the back plate main body is provided with a plurality of mounting holes.

In one embodiment, the backsheet body comprises a brass layer, a steel layer, a PET layer, and a TPU layer, the steel layer being hot pressed on one side of the brass layer, the PET layer being hot pressed on a side of the steel layer remote from the brass layer, and the TPU layer being hot pressed on a side of the PET layer remote from the steel layer.

Compared with the prior art, the utility model discloses at least, following advantage has:

the utility model discloses a turn-ups design makes when not increasing backplate actual thickness, can increase the thickness of backplate side, can improve the intensity and the rigidity of backplate side, can prevent that the side of backplate from taking place phenomenons such as curling, breaking easily. Moreover, the circuit board is provided with the joint lug, gets into narrower bayonet socket with the joint lug by the import of broad, can install the circuit board in the backplate main part, then passes through first punching press hole with a bolt to and pass through first spiro union hole with another bolt, fix the circuit board locking in the backplate main part, with the fastness that improves circuit board and backplate main part and be connected. One bolt head is held in last indent, and joint lug and another bolt head are held in lower indent so that two bolt heads all are less than the height of backplate main part, are favorable to the roughness of high roughness backplate to and can avoid hard bolt head protrusion can fish tail backlight unit's other parts, like the backlight etc..

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a front structural view of a high-flatness back plate according to an embodiment of the present invention.

Fig. 2 is a reverse structure view of the high-flatness back plate according to an embodiment of the present invention.

Fig. 3 is a partial structure view of a high-flatness back plate according to an embodiment of the present invention.

Fig. 4 is an enlarged view of a portion of a dotted circle a in fig. 2.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

A high flatness backplane comprising: the side edge of the back plate main body is bent to form a bending plate, the back plate main body and the bending plate jointly enclose a first accommodating cavity, and the side edge of the bending plate is bent to form a bending plate attached to the bending plate; the frame-shaped protruding structure comprises a plurality of frame-shaped protruding parts which are formed by upward stamping of the plate wall of the backboard main body and are connected with each other, a second accommodating cavity is formed in the center of each frame-shaped protruding part, and the second accommodating cavities are used for accommodating circuit boards; and the punching convex hull structure comprises a first punching convex hull formed by upward punching of the bottom wall of the second accommodating cavity, the first punching convex hull is provided with a lower punching groove and an upper punching groove which are connected with each other, a first punching hole is formed in the groove wall of the upper punching groove, a first screwing hole and a joint port are formed in the groove wall of the lower punching groove, the first screwing hole and the joint port are respectively located on two sides of the first punching hole, and the joint port comprises an inlet and a bayonet which are connected with each other.

In order to better explain the high-flatness back plate, the concept of the high-flatness back plate is better understood. In one embodiment, referring to fig. 1, fig. 2, fig. 3 and fig. 4, a high-flatness backplate 10 includes a backplate main body 110, a frame-shaped protrusion structure 120 and a stamping protrusion structure 130. The side edge of the back plate main body 110 is bent to form a bent plate 111, the back plate main body 110 and the bent plate 111 together enclose a first accommodating cavity 113, and the first accommodating cavity 113 is used for accommodating other components of the backlight module, so that the flatness of the main plate 110 can be maintained. The side of the bending plate 111 is folded to form a folding plate 112 attached to the bending plate 111. The frame-shaped protrusion structure 120 includes a plurality of frame-shaped protrusions 121 formed by stamping the plate wall of the backplate main body 110 upward, a second receiving cavity 1211 is disposed at a central position of each frame-shaped protrusion 121, and the second receiving cavity 1211 is used for receiving a circuit board. The stamping convex hull structure 130 includes a first stamping convex hull 131 formed by stamping the bottom wall of the second accommodating cavity 1211 upwards, the first stamping convex hull 131 is provided with a lower stamping groove 1311 and an upper stamping groove 1312 which are connected with each other, a first stamping hole 1312a is formed in the groove wall of the upper stamping groove 1312, a first screw hole 1311a and a clip interface 1311b are formed in the groove wall of the lower stamping groove 1311, the first screw hole 1311a and the clip interface 1311b are respectively located on two sides of the first stamping hole 1312a, and the clip interface 1311b includes an inlet and a bayonet which are connected with each other.

It should be noted that the utility model discloses a side of backplate main part 110 is buckled and is formed bending plate 111, and bending plate 111's side is turned over a turnover plate 112 that forms and bending plate 111 laminating, and this kind of turn-ups design makes when not increasing backplate actual thickness, can increase the thickness of backplate side, can improve the intensity and the rigidity of backplate side, can prevent that the side of backplate from taking place phenomenons such as curling, breaking easily. Moreover, the circuit board is provided with a clamping convex block, the clamping convex block enters a narrow bayonet from a wider inlet, the clamping convex block is clamped with the bayonet, the circuit board can be installed on the back plate main body 110, and then one bolt passes through the first stamping hole 1312a and the other bolt passes through the first screwing hole 1311a to lock and fix the circuit board on the back plate main body 110, so that the firmness of connection of the circuit board and the back plate main body 110 is improved. One bolt head is accommodated in the lower stamping groove 1311, and the clamping protrusion and the other bolt head are accommodated in the upper stamping groove 1312, so that the two bolt heads are both lower than the height of the back plate main body 110, which is beneficial to the flatness of the high-flatness back plate 10, and can prevent the hard bolt head from protruding to scratch other components of the backlight module, such as a backlight source.

In order to improve the connection firmness between the circuit board and the back plate main body 110, in an embodiment, referring to fig. 2 and fig. 4, the stamping convex hull structure 130 further includes a second stamping convex hull 132 formed by stamping the bottom wall of the second accommodating cavity 1211 upwards, the second stamping convex hull 132 is provided with a second stamping groove 1321, and a groove wall of the second stamping groove 1321 is provided with a second stamping hole 1321 a. It should be noted that, in this way, the shorter bolt is used to pass through the second punched hole 1321a to lock and fix the circuit board on the back plate main body 110, so as to improve the firmness of the connection between the circuit board and the back plate main body 110. The shorter bolt head is accommodated in the second punched groove 1321, so that the shorter bolt head is lower than the height of the back plate main body 110, which is beneficial to the flatness of the high-flatness back plate 10, and can prevent the hard bolt head from protruding to scratch other components of the backlight module, such as a backlight source and the like.

In one embodiment, referring to fig. 2 and 4, the stamping convex hull structure 130 further includes a third stamping convex hull 133 stamped from the bottom wall of the second receiving cavity 1211 upward. It should be noted that the third pressing convex hull 133 plays a role of supplementary support for the concave portion of the circuit board, so that the stability of the circuit board when being connected with the back plate main body 110121 is better.

In an embodiment, referring to fig. 1, the high-flatness back plate 10 further includes a reinforcing structure 140, the reinforcing structure 140 includes a frame-shaped reinforcing structure 141 and a sheet-shaped reinforcing rib 142, the frame-shaped reinforcing structure 141 includes a plurality of frame-shaped reinforcing ribs 1411, each frame-shaped reinforcing rib 1411 is respectively received in an inner wall of each frame-shaped protrusion 121, and the sheet-shaped reinforcing rib 142 is received in an inner wall of the second receiving cavity 1211. It should be noted that, by the frame-shaped reinforcing structure 141 and the sheet-shaped reinforcing ribs 142, the strength and rigidity of the frame-shaped protruding portion 121 can be improved, so that the frame-shaped protruding portion is not easily deformed by a force applied thereto, and the circuit board accommodated therein can be better protected.

In order to facilitate the circuit connection between the circuit board and other components, referring to fig. 1, in one embodiment, a wire outlet 1211a is formed on a bottom wall of the second accommodating cavity 1211. Thus, the circuit connection between the circuit board and other components can be facilitated through the wire outlet 1211 a.

In order to improve the heat dissipation effect of the backlight module, in an embodiment, the high-flatness back plate 10 further includes a pin column sleeve set, the pin column sleeve set includes a plurality of pin column sleeves, and the pin column sleeves are arranged on the frame-shaped protrusion 121 at intervals. It should be noted that, the radiator is provided with a plurality of pins, through the plug-in connection between pin and the pin post cover, can make the radiator firmly connect at backplate main part 110, dispels the heat fast to the circuit board, so can improve backlight unit's radiating effect, supports the radiator through the backplate main part 110 of high strength simultaneously, has solved the radiator and long-time, direct mount can lead to the circuit board to warp to scrap problem.

In order to further improve the connection firmness of the backplate main body 110 and the display housing, in an embodiment, referring to fig. 2 and fig. 3, the high-flatness backplate 10 further includes a side protrusion structure 160, the side protrusion structure 160 includes a plurality of lower protruding plates 161 formed by bending the side edge of the backplate main body 110 downward, the side edge of each lower protruding plate 161 extends outward to form a side protrusion 1611, and the side edge of each lower protruding plate 161 is provided with a second screw hole 1612. The back plate main body 110 is provided with a connection port 115, and the connection port 115 is disposed at one side of the lower protruding plate 161. It should be noted that, the display housing is provided with the connection groove and the connection protrusion, the connection protrusion passes through the connection port 115, the connection groove passes through the side protruding portion 1611, and then the bolt passes through the second screwing hole 1612, so as to lock and fix the back plate main body 110 on the display housing, which can further improve the firmness of the connection between the back plate main body 110 and the display housing.

In one embodiment, referring to fig. 2, the backplate main body 110 is an integrated structure, and the backplate main body 110 is provided with a plurality of mounting holes 114. The backplane body 110 can thus be securely mounted to the display enclosure by T-head screws through the mounting holes 114.

In one embodiment, the back-plate body 121 includes a brass layer, a steel layer, a PET layer, and a TPU layer, the steel layer is hot-pressed on a side of the brass layer, the PET layer is hot-pressed on a side of the steel layer away from the brass layer, and the TPU layer is hot-pressed on a side of the PET layer away from the steel layer. So dispel the heat through the brass layer to the circuit board, increase hardness and rigidity through the iron and steel layer, carry out electrical insulation and play the cushioning effect when the atress through PET layer and TPU layer.

the utility model discloses a side of backplate main part 110 is buckled and is formed bending plate 111, bending plate 111 the side turn over a book form with bending plate 112 of 111 laminating of bending plate, this kind of turn-ups design make when not increasing the actual thickness of backplate, can increase the thickness of backplate side, can improve the intensity and the rigidity of backplate side, can prevent that the side of backplate from taking place phenomenons such as curling, breaking easily. Moreover, the circuit board is provided with a clamping protrusion, the clamping protrusion enters the narrow bayonet from the wider inlet, the circuit board can be mounted on the back plate main body 110, and then the circuit board is locked and fixed on the back plate main body 110 by passing one bolt through the first punched hole 1312a and passing the other bolt through the first screwing hole 1312a, so as to improve the firmness of the connection between the circuit board and the back plate main body 110. One bolt head is accommodated in the upper punching groove 1312, and the clamping convex block and the other bolt head are accommodated in the upper punching groove 1312, so that the two bolt heads are both lower than the height of the back plate main body 110, which is beneficial to the flatness of the high-flatness back plate 10, and can prevent the hard bolt head from protruding to scratch other components of the backlight module, such as a backlight source and the like.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A high flatness backplate, comprising:

2. The high-flatness back plate according to claim 1, wherein the stamping convex hull structure further comprises a second stamping convex hull stamped and formed by upward stamping of the bottom wall of the second accommodating cavity, the second stamping convex hull is provided with a second stamping groove, and a groove wall of the second stamping groove is provided with a second stamping hole.

3. The high flatness back plate of claim 2, wherein said stamped convex hull structure further includes a third stamped convex hull stamped upward from the bottom wall of said second receiving cavity.

4. The high-flatness back plate according to claim 1, further comprising a reinforcing structure, wherein the reinforcing structure comprises a frame-shaped reinforcing structure and a sheet-shaped reinforcing rib, the frame-shaped reinforcing structure comprises a plurality of frame-shaped reinforcing ribs, each frame-shaped reinforcing rib is respectively received in an inner wall of each frame-shaped protrusion portion, and the sheet-shaped reinforcing rib is received in an inner wall of the second receiving cavity.

5. The high-flatness back plate of claim 4, wherein the bottom wall of the second accommodating cavity is provided with an outlet hole.

6. The high flatness back plate of claim 1, further comprising a set of pin posts, the set of pin posts including a plurality of pin post sets, the plurality of pin post sets being disposed on the frame-shaped protrusion at intervals.

7. The high-flatness back plate of claim 1, further comprising a side protruding structure, wherein the side protruding structure includes a plurality of lower protruding plates formed by bending the side edge of the back plate main body downward, the side edge of each lower protruding plate extends outward to form a side protruding portion, and the side edge of each lower protruding plate is provided with a second screw hole.

8. The high flatness back plate of claim 7, wherein the back plate body defines a connection opening, and the connection opening is disposed on one side of the lower protruding plate.

9. The high-flatness back plate of claim 1, wherein the back plate body is a one-piece structure, and the back plate body is provided with a plurality of mounting holes.

10. The high flatness backsheet of claim 1, wherein the backsheet body includes a brass layer, a steel layer, a PET layer, and a TPU layer, the steel layer being hot-pressed on a side of the brass layer, the PET layer being hot-pressed on a side of the steel layer remote from the brass layer, the TPU layer being hot-pressed on a side of the PET layer remote from the steel layer.