CN211062689U - Automatic lead frame detection equipment for semiconductor - Google Patents
Automatic lead frame detection equipment for semiconductor Download PDFInfo
- Publication number
- CN211062689U CN211062689U CN201922223144.4U CN201922223144U CN211062689U CN 211062689 U CN211062689 U CN 211062689U CN 201922223144 U CN201922223144 U CN 201922223144U CN 211062689 U CN211062689 U CN 211062689U
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- China
- Prior art keywords
- fixed mounting
- lead frame
- pipe
- dust removal
- detection equipment
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- 238000001514 detection method Methods 0.000 title claims abstract description 26
- 239000004065 semiconductor Substances 0.000 title claims abstract description 14
- 239000000428 dust Substances 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 12
- 230000007246 mechanism Effects 0.000 claims abstract description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 14
- 229910052799 carbon Inorganic materials 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 238000000746 purification Methods 0.000 claims description 6
- 230000000740 bleeding effect Effects 0.000 claims description 4
- 238000007689 inspection Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 abstract description 2
- 238000004140 cleaning Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- IYRDVAUFQZOLSB-UHFFFAOYSA-N copper iron Chemical compound [Fe].[Cu] IYRDVAUFQZOLSB-UHFFFAOYSA-N 0.000 description 3
- 239000012634 fragment Substances 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GXDVEXJTVGRLNW-UHFFFAOYSA-N [Cr].[Cu] Chemical compound [Cr].[Cu] GXDVEXJTVGRLNW-UHFFFAOYSA-N 0.000 description 1
- ZUPBPXNOBDEWQT-UHFFFAOYSA-N [Si].[Ni].[Cu] Chemical compound [Si].[Ni].[Cu] ZUPBPXNOBDEWQT-UHFFFAOYSA-N 0.000 description 1
- VRUVRQYVUDCDMT-UHFFFAOYSA-N [Sn].[Ni].[Cu] Chemical compound [Sn].[Ni].[Cu] VRUVRQYVUDCDMT-UHFFFAOYSA-N 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910002056 binary alloy Inorganic materials 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Sampling And Sample Adjustment (AREA)
Abstract
The utility model discloses a lead frame automatic detection equipment for semiconductor, including AOI detection equipment, feeding inlet and receipts material export, feeding inlet fixed mounting is in AOI detection equipment one end, receives material export fixed mounting in AOI detection equipment other end, AOI detection equipment one end is located the feeding inlet top and is fixed and installs clean mechanism, clean mechanism includes dust removal frame and purifying box, purifying box fixed mounting is close to axle center in dust removal frame top, dust removal frame top one side fixed mounting has the air compressor machine; the utility model discloses a clean mechanism of installation, nozzle spun air current can blow up the piece and the dirt that the lead frame surface is difficult to clear away, adsorbs by two sets of suction hoods at last again to can effectively clear away remaining piece and the dirt in lead frame surface, can guarantee the accurate nature that the lead frame detected.
Description
Technical Field
The utility model relates to a lead frame detects technical field, specifically is a lead frame automated inspection equipment for semiconductor.
Background
The lead frame is used as a chip carrier of an integrated circuit, the lead frame realizes the electrical connection between the leading-out end of an internal circuit of the chip and an external lead by means of bonding materials (gold wires, aluminum wires and copper wires) to form a key structural member of an electrical circuit, the lead frame plays a role of a bridge connected with an external lead, the lead frame is required to be used in most semiconductor integrated blocks and is an important basic material in the electronic information industry, the copper alloy used for the lead frame is roughly divided into a copper-iron system, a copper-nickel-silicon system, a copper-chromium system, a copper-nickel-tin system (JK-2 alloy) and the like, ternary, quaternary and other multi-element copper alloys can obtain better performance and lower cost than the traditional binary alloys, the grade of the copper-iron alloy is the most, the copper-iron alloy has better mechanical strength, stress relaxation resistance and low creep deformation, and is a good lead frame material, generally, in the production process of the lead frame, lead frame detection equipment is needed to perform optical detection on the lead frame.
However, most of lead frame detection equipment in the market have single function, and are inconvenient to use, and the traditional lead frame detection equipment needs to detect the produced lead frame when in use, but because the surface of the lead frame just produced has partial residual scraps and dirt, if the detection is directly carried out, the detection accuracy can be influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a lead frame automated inspection equipment for semiconductor to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an automatic check out test set of lead frame for semiconductor, includes AOI check out test set, feeding entry and receives the material export, feeding entry fixed mounting is in AOI check out test set one end, receive material export fixed mounting in the AOI check out test set other end, AOI check out test set one end is located feeding entry top fixed mounting and has clean mechanism, clean mechanism is including dust removal frame and purifying box, purifying box fixed mounting is close to axle center department in dust removal frame top, dust removal frame top one side fixed mounting has the air compressor machine, the inside support fixed mounting that passes through of dust removal frame has the backup pad, the backup pad bottom is close to axle center department and has jet-propelled pipe through pole setting fixed mounting, jet-propelled pipe bottom fixed mounting has the nozzle, and the nozzle is equipped with the multiunit, connecting rod fixed mounting has the suction hood.
Preferably, the inside top fixed mounting of purifying box has the fan, the inside bottom fixed mounting of purifying box has filter screen and active carbon filter screen, and the active carbon filter screen is located the filter screen upper end, wherein two sets of dust hood top fixedly connected with branch pipe of bleeding, pipe connection between branch pipe one end of bleeding and the purifying box is passed through the three-way pipe.
Preferably, the air outlet end of the air compressor is fixedly connected with an air inlet pipe, and one end, far away from the air outlet end of the air compressor, of the air inlet pipe is fixedly connected to the inside of the air injection pipe.
Preferably, the top end of the purification box is fixedly connected with an exhaust pipe.
Preferably, the air outlet end of the fan faces one side of the exhaust pipe.
Preferably, the nozzles are evenly distributed at the bottom end of the gas lance, and the spacing between each nozzle is equal.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses a clean mechanism of installation, when in-service use, fan work can produce suction, make preceding a set of suction hood can adsorb the easy absorbent piece in lead frame surface and dirt, and some pieces and dirt of card on the lead frame then continue to stay on the lead frame, when the lead frame continues to removing in the AOI check out test set, air compressor machine work can be gaseous through the intake pipe pour into in the jet-propelled pipe, then spout by the nozzle again, nozzle spun air current can blow the piece and the dirt that the lead frame surface is difficult to clear away, adsorb by two sets of suction hoods at last again, thereby can effectively clear away remaining piece in lead frame surface and dirt, can guarantee the accurate nature that the lead frame detected.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the cleaning mechanism of the present invention;
fig. 3 is the internal structure schematic diagram of the purification box of the present invention.
In the figure: 1-AOI detection equipment; 2-a feed inlet; 3-a material receiving outlet; 4-a cleaning mechanism; 5-a dust removal frame; 6-a purifying box; 7, an air compressor; 8-a support plate; 9-a scaffold; 10-an air exhaust branch pipe; 11-a three-way pipe; 12-an air inlet pipe; 13-a connecting rod; 14-a nozzle; 15-a gas ejector tube; 16-a dust hood; 17-a filter screen; 18-activated carbon screen; 19-a fan; 20-an exhaust pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a lead frame automatic detection equipment for semiconductor comprises an AOI detection equipment 1, a feeding inlet 2 and a material receiving outlet 3, wherein the feeding inlet 2 is fixedly arranged at one end of the AOI detection equipment 1, the material receiving outlet 3 is fixedly arranged at the other end of the AOI detection equipment 1, one end of the AOI detection equipment 1 is fixedly arranged above the feeding inlet 2 and is provided with a cleaning mechanism 4, the cleaning mechanism 4 comprises a dust removal frame 5 and a purification box 6, the purification box 6 is fixedly arranged at the top end of the dust removal frame 5 close to the axle center, one side of the top end of the dust removal frame 5 is fixedly provided with an air compressor 7, the dust removal frame 5 is internally and fixedly provided with a support plate 8 through a bracket 9, the bottom end of the support plate 8 is close to the axle center and is fixedly provided with an air injection pipe 15 through an upright rod, the bottom end of the air injection pipe 15 is fixedly provided with a nozzle 14, the, during the use, 19 work of fan can produce suction, make preceding a set of suction hood 16 can adsorb the easy adsorbed piece in lead frame surface and dirt, and some piece and the dirt of card on the lead frame then continue to stay on the lead frame, when the lead frame continues to remove to AOI check out test set 1, air compressor machine 7 work can be gaseous through intake pipe 12 pour into in the jet-propelled pipe 15 into, then spout by nozzle 14 again, the piece and the dirt that the lead frame surface is difficult to clear away can be blown to nozzle 14 spun air current, adsorb by two sets of suction hoods 16 again at last, thereby can effectively clear away remaining piece and dirt in lead frame surface, can guarantee the accurate nature that the lead frame detected.
Since the front group of dust hoods 16 can absorb the easily absorbed chips and dirt, the chips and dirt on the lead frame can be reduced, and the splashing of the chips and dirt caused by the airflow sprayed from the nozzles 14 can be avoided.
Wherein, 6 inside top fixed mounting of purifying box has fan 19, 6 inside bottom fixed mounting of purifying box has filter screen 17 and active carbon filter screen 18, and active carbon filter screen 18 is located filter screen 17 upper end, and is wherein two sets of 16 top fixedly connected with air exhaust branch pipe 10 of suction hood, pipe connection between three-way pipe 11 and the purifying box 6 is passed through to air exhaust branch pipe 10 one end, and the adsorbed air of being sucked by suction hood 16 can concentrate through air exhaust branch pipe 10 and enter into purifying box 6 in, then passes filter screen 17 and active carbon filter screen 18, discharges from exhaust pipe 20 at last again, and filter screen 17 and active carbon filter screen 18 can intercept piece and the filth in the air, ensure exhaust gas's cleanliness factor, also can collect piece and filth simultaneously, the people's of being convenient for clearance.
Wherein, air compressor machine 7 fixed connection that gives vent to anger has intake pipe 12, intake pipe 12 is kept away from the one end fixed connection that air compressor machine 7 gave vent to anger the end inside jet 15, and 14 blowout can be followed to the air current that air compressor machine 7 produced, then can realize the surface cleaning to the lead frame.
Wherein, the top end of the purifying box 6 is fixedly connected with an exhaust pipe 20.
The air outlet end of the fan 19 faces the exhaust duct 20.
The nozzles 14 are uniformly distributed at the bottom end of the gas injection pipe 15, and the distance between every two nozzles 14 is equal, so that the uniformity of the sprayed gas flow is ensured.
The working principle is as follows: when the device is used, a servo system sends the lead frame into the AOI detection device 1 from the feeding inlet 2 step by step through the attraction force, meanwhile, the fan 19 works to generate the suction force, so that the front group of dust hoods 16 can adsorb the fragments and the dirt which are easy to adsorb on the surface of the lead frame, and some of the fragments and the dirt which are clamped on the lead frame continue to stay on the lead frame, when the lead frame continues to move towards the AOI detection device 1, the air compressor 7 works to inject the air into the air injection pipe 15 through the air inlet pipe 12, then the air is sprayed out through the nozzle 14, the air flow sprayed out from the nozzle 14 can blow up the fragments and the dirt which are difficult to clean on the surface of the lead frame, and finally the two groups of dust hoods 16 adsorb, the air adsorbed by the dust hoods 16 can enter the purification box 6 through the air suction branch pipe 10, then passes through the filter screen 17 and the activated carbon filter screen 18, the filter screen 17 and the activated carbon filter screen 18 can intercept debris and dirt in the air, and ensure the cleanliness of the exhaust gas.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a lead frame automated inspection equipment for semiconductor, includes AOI check out test set (1), feeding entry (2) and receipts material export (3), feeding entry (2) fixed mounting is in AOI check out test set (1) one end, receive material export (3) fixed mounting in AOI check out test set (1) other end, its characterized in that: AOI check out test set (1) one end is located feeding entry (2) top fixed mounting and has clean mechanism (4), clean mechanism (4) are including dust removal frame (5) and purifying box (6), purifying box (6) fixed mounting is close to axle center department in dust removal frame (5) top, dust removal frame (5) top one side fixed mounting has air compressor machine (7), dust removal frame (5) are inside to have backup pad (8) through support (9) fixed mounting, backup pad (8) bottom is close to axle center department and has jet-propelled pipe (15) through pole setting fixed mounting, jet-propelled pipe (15) bottom fixed mounting has nozzle (14), and nozzle (14) are equipped with the multiunit, backup pad (8) bottom both sides have suction hood (16) through connecting rod (13) fixed mounting.
2. The automatic lead frame detection device for semiconductors according to claim 1, characterized in that: the inside top fixed mounting of purifying box (6) has fan (19), the inside bottom fixed mounting of purifying box (6) has filter screen (17) and active carbon filter screen (18), and active carbon filter screen (18) are located filter screen (17) upper end, and wherein two sets of suction hood (16) top fixedly connected with branch pipe (10) of bleeding, pipe connection between branch pipe (10) one end of bleeding is through three-way pipe (11) and purifying box (6).
3. The automatic lead frame detection device for semiconductors according to claim 1, characterized in that: air compressor machine (7) the end fixedly connected with intake pipe (12) of giving vent to anger, air compressor machine (7) are kept away from in intake pipe (12) one end fixed connection in jet-propelled pipe (15) the end of giving vent to anger.
4. The automatic lead frame detection device for semiconductors according to claim 1, characterized in that: the top end of the purification box (6) is fixedly connected with an exhaust pipe (20).
5. The automatic lead frame detection device for semiconductors according to claim 2, characterized in that: the air outlet end of the fan (19) faces one side of the exhaust pipe (20).
6. The automatic lead frame detection device for semiconductors according to claim 1, characterized in that: the nozzles (14) are uniformly distributed at the bottom end of the gas injection pipe (15), and the distance between every two nozzles (14) is equal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922223144.4U CN211062689U (en) | 2019-12-12 | 2019-12-12 | Automatic lead frame detection equipment for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922223144.4U CN211062689U (en) | 2019-12-12 | 2019-12-12 | Automatic lead frame detection equipment for semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211062689U true CN211062689U (en) | 2020-07-21 |
Family
ID=71596287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922223144.4U Active CN211062689U (en) | 2019-12-12 | 2019-12-12 | Automatic lead frame detection equipment for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211062689U (en) |
-
2019
- 2019-12-12 CN CN201922223144.4U patent/CN211062689U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240116 Address after: Room 208, Building 2, New City Science and Technology Industrial Park, No. 2 Xinke Road, Xincheng District, Xi'an City, Shaanxi Province, 710004 Patentee after: Xi'an Zhenghua Teaching Instrument Manufacturing Co.,Ltd. Address before: No.76, Fenghuang East Road, Hailing District, Taizhou City, Jiangsu Province 225300 Patentee before: Taizhou Yuxin Microelectronics Co.,Ltd. |
|
| TR01 | Transfer of patent right |