CN211047738U

CN211047738U - Radiator for electronic communication equipment

Info

Publication number: CN211047738U
Application number: CN201922474068.4U
Authority: CN
Inventors: 宋海声; 赵嘉晨
Original assignee: Northwest Normal University
Current assignee: Northwest Normal University
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2020-07-17
Anticipated expiration: 2029-12-31

Abstract

The utility model relates to a radiator for electronic communication equipment, which comprises a shell, wherein a ventilation pipe is arranged in the inner cavity of the shell, semiconductor refrigeration sheets are symmetrically arranged on the ventilation pipe, a heat dissipation pipe is arranged at the outer side of each semiconductor refrigeration sheet, the other end of the heat dissipation pipe penetrates through the shell, a first metal sheet is arranged between the semiconductor refrigeration sheets, a second metal sheet is connected between the first metal sheets, a fan is arranged at the left end of the ventilation pipe, a dust cover is arranged at the outer side of the fan, a brush is arranged at the outer side of the dust cover, a motor is connected to one side of the brush through a rotating shaft, a stop ring is arranged at the outer side of the motor, the motor is fixedly connected with the stop ring through a connecting frame, a drying frame is arranged at the right side of the second metal sheet, the, avoid local overheating to cause equipment damage.

Description

Radiator for electronic communication equipment

Technical Field

The utility model relates to a radiator for electronic communication equipment belongs to radiator technical field.

Background

Electronic communication equipment is easy to generate larger heat during working and easy to influence the service performance of the whole communication equipment, so that a part of radiators for electronic communication equipment are also available in the market, the electronic communication equipment can be better radiated, and the service performance of the equipment is ensured; the existing requirements are not met, and a heat radiator for electronic communication equipment is provided for the requirements.

SUMMERY OF THE UTILITY MODEL

The technical problem to be solved by the utility model is to overcome the existing defects, provide a radiator for electronic communication equipment, through setting up the semiconductor refrigeration piece, can cool down the air, improve the heat dissipation effect, the security is higher compared with modes such as water-cooling simultaneously, the operation is easier, through setting up the sheetmetal one and the sheetmetal two, the area of contact with the air can be increased, thereby improve the refrigeration effect of the semiconductor refrigeration piece, then cooperate with the fan to blow out cold wind to the equipment, improve the cooling effect, through setting up the drying rack, can dry the air, avoid the moisture in the air to cause the influence to the equipment operation more, simultaneously also reduce the resistance to the air as much as possible, avoid influencing the efficiency of air circulation, through setting up the wind-guiding dish, can play the effect of sweeping wind, sweep the wind to different directions, thereby increase the heat dissipation area, the heat dissipation is more even, the local overheating of the equipment is avoided, and the problems in the background technology can be effectively solved.

In order to solve the technical problem, the utility model provides a following technical scheme:

a radiator for electronic communication equipment comprises a shell, wherein a ventilation pipe is installed in the inner cavity of the shell, semiconductor refrigeration sheets are symmetrically installed on the ventilation pipe, a heat dissipation pipe is arranged on the outer side of each semiconductor refrigeration sheet, the other end of each semiconductor refrigeration sheet penetrates through the shell, a first metal sheet is installed between the semiconductor refrigeration sheets, a second metal sheet is connected between the first metal sheets, a fan is installed at the left end of the ventilation pipe, a dust cover is arranged on the outer side of the fan, a hairbrush is arranged on the outer side of the dust cover, a motor is connected to one side of the hairbrush through a rotating shaft, a blocking ring is arranged on the outer side of the motor, the motor is fixedly connected with the blocking ring through a connecting frame, a drying frame is installed on the right side of the second metal sheet, a, and an air guide disc is arranged in the air guide pipe, and air guide blades are arranged in the air guide disc.

Furthermore, the semiconductor refrigeration piece is embedded on two sides of the ventilation pipe, and the ventilation pipe is connected with the radiating pipe in a sealing mode.

Furthermore, the first metal sheet is attached to the semiconductor refrigeration sheet, and the first metal sheet and the second metal sheet are both made of metal copper materials.

Further, a dustproof net is arranged on the dustproof cover, the hairbrush is of a C-shaped structure, and bristles of the hairbrush are attached to the dustproof cover.

Further, the inner wall of the ventilation opening is of an intercepting net structure, the drying frame is of an annular structure, and the axis of the drying frame coincides with the axis of the ventilation pipe.

Further, a dust removal port is formed in the bottom of the shell, and the dust removal port is arranged between the blocking ring and the fan.

The utility model discloses beneficial effect:

1. the semiconductor refrigerating sheet is arranged, so that the air can be cooled, the heat dissipation effect is improved, and the safety is higher and the operation is easier compared with a water cooling mode and the like;

2. the first metal sheet and the second metal sheet are arranged, so that the contact area with air can be increased, the refrigerating effect of the semiconductor refrigerating sheet is improved, and the cooling effect is improved by matching with a fan to blow cold air out of equipment;

3. the drying rack is arranged, so that the air can be dried, the influence of more moisture in the air on the operation of equipment is avoided, the resistance to the air is reduced as much as possible, and the influence on the air circulation efficiency is avoided;

4. through setting up the aviation baffle, can play the effect of sweeping wind, sweep wind to different directions to increase heat radiating area, the heat dissipation is more even, avoids the local overheat of equipment.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.

Fig. 1 is a cross-sectional view of a heat sink for an electronic communication device.

Fig. 2 is a structural view of a heat sink metal sheet for an electronic communication device.

Fig. 3 is a structural diagram of a drying rack of a heat sink for electronic communication equipment.

Reference numbers in the figures: 1. a housing; 2. a vent pipe; 3. a semiconductor refrigeration sheet; 4. a radiating pipe; 5. a first metal sheet; 6. a second metal sheet; 7. a fan; 8. a dust cover; 9. a brush; 10. a motor; 11. a blocking ring; 12. a drying rack; 13. a vent; 14. a desiccant; 15. an air guide pipe; 16. a wind guide plate; 17. a wind guide blade; 18. a dust removal port.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

The first embodiment is as follows:

as shown in fig. 1-3, a radiator for electronic communication equipment comprises a housing 1, wherein a ventilation pipe 2 is installed in an inner cavity of the housing 1, semiconductor refrigeration sheets 3 are symmetrically installed on the ventilation pipe 2, the air can be cooled, the heat dissipation effect is improved, meanwhile, the safety is higher compared with that of water cooling and the like, the operation is easier, a heat dissipation pipe 4 is arranged outside each semiconductor refrigeration sheet 3, the other end of each heat dissipation pipe 4 penetrates through the housing 1, metal sheets one 5 are installed between the semiconductor refrigeration sheets 3, metal sheets two 6 are connected between the metal sheets one 5, the contact area with the air can be increased, the refrigeration effect of each semiconductor refrigeration sheet 3 is improved, the semiconductor refrigeration sheets are matched with a fan 7 to blow out cold air to the equipment, the cooling effect is improved, a fan 7 is installed at the left end of the ventilation pipe 2, and a dust cover 8, a brush 9 is arranged outside the dust cover 8, one side of the brush 9 is connected with a motor 10 through a rotating shaft, a stop ring 11 is arranged outside the motor 10, the motor 10 is fixedly connected with the barrier ring 11 through a connecting frame, the drying frame 12 is arranged on the right side of the second metal sheet 6, air can be dried, the influence of more moisture in the air on the operation of equipment is avoided, meanwhile, the resistance to the air is reduced as much as possible, and the influence on the air circulation efficiency is avoided, the vent 13 is arranged in the drying rack 12, the drying agent 14 is filled in the inner cavity of the drying rack 12, the air guide pipe 15 is arranged at the right side of the ventilating pipe 2, the wind guide plate 16 is arranged in the wind guide pipe 15, can play a role of sweeping wind, can sweep the wind to different directions, therefore, the heat dissipation area is increased, the heat dissipation is more uniform, the local overheating of equipment is avoided, and the air guide blades 17 are installed in the air guide disc 16.

More specifically, semiconductor refrigeration piece 3 inlays in 2 both sides of ventilation pipe, just

ventilation pipe

2 and 4 sealing connection of cooling tube, 5 and the laminating of semiconductor refrigeration piece of sheetmetal, 5 and two 6 metallic copper material of sheetmetal, be provided with the dust screen on the dust cover 8, brush 9 is C font structure, just brush 9's brush hair and the laminating of

dust cover

8, 13 inner walls of vent are the interception net structure, dry frame 12 is the loop configuration, just the axis of dry frame 12 coincides with the axis of

ventilation pipe

2, 1 bottom of casing is provided with dust removal mouth 18, just dust removal mouth 18 sets up the position between barrier ring 11 and fan 7.

Example two:

as shown in fig. 3, the drying rack 12 has openings at the top and bottom, and sealing plugs are disposed in the openings.

The utility model discloses the theory of operation: when dispelling the heat, open semiconductor refrigeration piece 3, motor 10 and fan 7, the air admission ventilation pipe 2 removes dust through dust cover 8, then cools down with two 6 of sheetmetal through sheetmetal one 5, and the dry back of rethread drying rack 12 gets into guide duct 15, and rethread air guide disc 16 cools down equipment, and motor 10 rotates and drives the brush 9 rotation and clear up dust cover 8, and the dust falls into dust removal mouth 18.

The above is the preferred embodiment of the present invention, and the technical personnel in the field of the present invention can also change and modify the above embodiment, therefore, the present invention is not limited to the above specific embodiment, and any obvious improvement, replacement or modification made by the technical personnel in the field on the basis of the present invention all belong to the protection scope of the present invention.

Claims

1. A radiator for electronic communication equipment, includes casing (1), its characterized in that: the ventilation pipe (2) is installed to the casing (1) inner chamber, semiconductor refrigeration piece (3) is installed to the symmetry on ventilation pipe (2), semiconductor refrigeration piece (3) outside is provided with cooling tube (4), just cooling tube (4) other end runs through casing (1), install sheetmetal (5) between semiconductor refrigeration piece (3), be connected with sheetmetal two (6) between sheetmetal (5), fan (7) is installed to ventilation pipe (2) left end, the fan (7) outside is provided with dust cover (8), the dust cover (8) outside is provided with brush (9), brush (9) one side is connected with motor (10) through the pivot, the motor (10) outside is provided with barrier ring (11), just motor (10) is through link and barrier ring (11) fixed connection, drying rack (12) are installed on sheetmetal two (6) right side, the drying rack is characterized in that a ventilation opening (13) is formed in the drying rack (12), a drying agent (14) is filled in the inner cavity of the drying rack (12), an air guide pipe (15) is arranged on the right side of the ventilation pipe (2), an air guide disc (16) is installed in the air guide pipe (15), and an air guide blade (17) is installed in the air guide disc (16).

2. A heat sink for electronic communication equipment according to claim 1, wherein: the semiconductor refrigeration piece (3) is embedded on two sides of the ventilation pipe (2), and the ventilation pipe (2) is connected with the radiating pipe (4) in a sealing mode.

3. A heat sink for electronic communication equipment according to claim 1, wherein: the first metal sheet (5) is attached to the semiconductor refrigerating sheet (3), and the first metal sheet (5) and the second metal sheet (6) are made of metal copper materials.

4. A heat sink for electronic communication equipment according to claim 1, wherein: the dustproof cover (8) is provided with a dustproof net, the hairbrush (9) is of a C-shaped structure, and bristles of the hairbrush (9) are attached to the dustproof cover (8).

5. A heat sink for electronic communication equipment according to claim 1, wherein: the inner wall of the ventilation opening (13) is of an intercepting net structure, the drying rack (12) is of an annular structure, and the axis of the drying rack (12) coincides with the axis of the ventilation pipe (2).

6. A heat sink for electronic communication equipment according to claim 1, wherein: the bottom of the shell (1) is provided with a dust removal port (18), and the dust removal port (18) is arranged between the stop ring (11) and the fan (7).