CN211047515U

CN211047515U - Electronic device

Info

Publication number: CN211047515U
Application number: CN201921657681.3U
Authority: CN
Inventors: 李俊鑫
Original assignee: Guangzhou Shiyuan Electronics Thecnology Co Ltd; Guangzhou Shirui Electronics Co Ltd
Current assignee: Guangzhou Shiyuan Electronics Thecnology Co Ltd; Guangzhou Shirui Electronics Co Ltd
Priority date: 2019-09-30
Filing date: 2019-09-30
Publication date: 2020-07-17
Anticipated expiration: 2029-09-30

Abstract

The utility model provides an electronic equipment, including the module backplate, the apron, data interface and with data interface connection's circuit board, wherein, data interface sets up on the apron, the circuit board sets up on the module backplate, the apron lid is established on the circuit board and is connected with module backplate buckle, only need to fix the apron buckle on the module backplate during installation, and the also convenient to detach of mode of buckle, need not to carry out twisting of screw and move etc. the assembly and dismantle conveniently, the improvement that is showing the assembly efficiency of apron, use the fixed back of thread tightening mode with apron and module backplate to fix in having solved current electronic equipment, be not convenient for assemble and lead to the lower problem of assembly efficiency.

Description

Electronic device

Technical Field

The utility model relates to the field of electronic technology, especially, relate to an electronic equipment.

Background

With the continuous development of science and technology and the continuous improvement of the living standard of people, electronic equipment including liquid crystal televisions has been popularized comprehensively. People have higher requirements on the display effect of the electronic equipment, the modeling of the electronic equipment is more pursuing to be light, thin and attractive, and for the liquid crystal television, the backlight module can be divided into a direct type and a side type according to different light emitting modes.

At present, the existing side-in lcd tv, the circuit board and the routing of components such as USB located on the appearance surface of the module backplane are often shielded by a cover plate, so as to improve the aesthetic property and the safety, wherein the fixing mode between the module backplane and the cover plate is usually a thread fixing mode, specifically, as shown in fig. 1, the circuit board is located on the module backplane 10, the cover plate 20 is provided with a containing space for containing the circuit board, the cover plate 20 is covered on the module backplane 10, and the circuit board is located in the containing space, through holes 201 are provided on two ends of the cover plate 10, coaxial threaded holes are provided on the module backplane, after the screw passes through the through hole 201 on the cover plate, the screw is screwed and matched with the threaded holes on the module backplane, thereby fixing the cover plate 20 and the module backplane 10, and shielding of the circuit board and the routing is realized.

However, the cover plate and the module backboard are fixed in a thread fixing mode, so that the problem of inconvenient assembly and disassembly is caused.

SUMMERY OF THE UTILITY MODEL

The utility model provides an electronic equipment to use the thread tightening mode to fix apron and module backplate in solving current electronic equipment, the assembly of being not convenient for leads to the lower problem of assembly efficiency.

The utility model provides an electronic device, which comprises a module backboard, a cover plate, a data interface and a circuit board connected with the data interface;

the data interface is arranged on the cover plate, the circuit board is arranged on the module backboard, and the cover plate is covered on the circuit board and is connected with the module backboard in a buckling mode.

In a preferred embodiment of the present invention, the module back plate is recessed inward to form an inner concave portion, and the cover plate is at least partially received in the inner concave portion.

In a specific embodiment of the present invention, the side wall of the inner concave portion is formed with a clamping groove, and the side wall of the cover plate is formed with an elastic buckle connected with the clamping groove.

The utility model discloses an among the specific embodiment, the module backplate is including the first aluminium sheet layer, plastic layer and the second aluminium sheet layer that are connected, the plastic layer is located first aluminium sheet layer with between the second aluminium sheet layer, first aluminium sheet layer is close to the apron, interior concave part is located on the first aluminium sheet layer and extend to the plastic layer, the draw-in groove is located in the plastic layer.

In a specific embodiment of the present invention, the side wall of the cover plate is provided with a first slit and a second slit at an interval, and the portion between the first slit and the second slit forms the elastic buckle.

In a specific embodiment of the present invention, the elastic buckle includes a main body portion located between the first slit and the second slit and a hook protruding outward from the main body portion, and the hook is used for being connected to the slot.

In a specific embodiment of the present invention, the cover plate is provided with at least two opposite side walls, and the two opposite side walls are respectively provided with one elastic buckle.

In a particular embodiment of the invention, the size of the side wall of the cover plate matches the size of the side wall of the inner recess.

In a preferred embodiment of the present invention, the cross section of the inner concave portion is annular, and the circuit board is located around the inner concave portion on the module backboard.

In a specific embodiment of the present invention, the cover plate is a plastic cover plate; and/or the data interface comprises a USB interface.

The utility model provides a pair of electronic equipment, through including module backplate, apron, data interface and with data interface connection's circuit board. The data interface is arranged on the cover plate, the circuit board is arranged on the module backboard, the cover plate is covered on the circuit board, and the circuit board and the wiring between the circuit board and the data interface are located in the cover plate and are shielded by the cover plate. Make apron and module backplate buckle simultaneously and be connected, only need during the installation with the apron buckle on the module backplate, the mode of buckle is convenient for detach also moreover, need not to carry out twisting of screw and moves etc. the assembly and dismantle conveniently, the improvement that is showing the assembly efficiency of apron, and then improve electronic equipment's assembly efficiency. The problem of use the thread tightening mode fixed with apron and module backplate among the current electronic equipment, be not convenient for assemble and lead to the assembly efficiency lower is solved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor.

Fig. 1 is a schematic view illustrating an assembly between a module back plate and a cover plate in a conventional electronic device;

fig. 2 is an assembly schematic view of a module back plate and a cover plate in an electronic device according to an embodiment of the present invention;

fig. 3 is a schematic diagram illustrating a split of a back plate and a cover plate of a module in an electronic device according to an embodiment of the present invention;

fig. 4 is an assembled cross-sectional view of a module back plate and a cover plate in an electronic device according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of a module backplane in an electronic device according to an embodiment of the present invention;

fig. 6 is a schematic cross-sectional view of a module backplane in an electronic device according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram of a cover plate in an electronic device according to an embodiment of the present invention;

fig. 8 is a side view of a cover plate in an electronic device according to an embodiment of the present invention.

Description of reference numerals:

10-a module backplane;

201-a through hole;

11-a concave inner portion;

111-card slot;

112-a first aluminum plate layer;

113-a second aluminum plate layer;

114-a plastic layer;

20-cover plate;

21-elastic buckle;

211-a body portion;

212-a hook;

22-a first slit;

23-a second slit;

30-circuit board.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As mentioned in the background art, fig. 1 is an assembly diagram between a module backplane and a cover board in an existing electronic device, specifically, as shown in fig. 1, a circuit board is disposed on the back of the module backplane 10 of a backlight module, the cover board 20 has an accommodation space with an open end, the open end of the cover board 20 faces the module backplane 10, so that the circuit board 30 is located in the accommodation space, the cover board 20 has a data interface electrically connected to the circuit board through a trace, the cover board 20 is fixed to the module backplane 10, that is, the circuit board and the trace between the circuit board and the data interface are shielded in the cover board 20. Generally, the fixing mode between the cover plate 20 and the module back plate 10 is a screw thread fixing mode, specifically, as shown in fig. 1, through holes 201 may be provided on both ends of the cover plate 20, threaded holes coaxial with the through holes are provided on the module back plate 10, and screws pass through the through holes 201 on the cover plate 20 and are in threaded fit with the threaded holes on the module back plate 10, so that the fixing of the cover plate 20 and the module back plate 10 is realized, and the screws can be seen on the back surface, i.e., the appearance surface, of the module back plate. However, the screw fixing method requires operations such as screwing the screw during the disassembling or assembling process, which is inconvenient and time-consuming, and has a low assembling efficiency.

Based on this, the embodiment of the utility model provides an electronic equipment is provided, this electronic equipment can be the LCD TV, also can be man-machine interaction intelligence flat board etc. wherein, use this electronic equipment as the LCD TV as an example, concrete example is as follows:

fig. 2 is an assembly schematic view of a module back plate and a cover plate in an electronic device according to this embodiment, fig. 3 is a disassembly schematic view of the module back plate and the cover plate in the electronic device according to this embodiment, and fig. 4 is an assembly cross-sectional view of the module back plate and the cover plate in the electronic device according to this embodiment. As shown in fig. 2 to 4, the electronic apparatus includes a module back plate 10, a cover plate 20, a data interface (not shown), and a circuit board 30 connected to the data interface. The data interface is electrically connected to the circuit board 30 through a wire, and the module back plate 10 is a back plate of the backlight module and mainly plays a role in supporting a backlight structure.

In this embodiment, the data interface is disposed on the cover plate 20, the circuit board 30 is disposed on the module backplane 10, and the cover plate 20 covers the circuit board 30 and is connected to the module backplane 10 by a snap fit. Specifically, as shown in fig. 2 to 4, the circuit board 30 is fixed on the back of the module backplane 10, and the module backplane 10 may have a wire feeding hole for electrically connecting the circuit board 30 with a main circuit board of an electronic device, in this embodiment, the cover plate 20 has an accommodating space capable of accommodating the circuit board 30, one end of the accommodating space is open, one end of the cover plate 20 having the opening faces the module backplane 10 and covers the circuit board 30, so that the circuit board 30 is located in the accommodating space, the cover plate 20 and the module backplane 10 are fixed by being fastened, and the circuit board 30 and the wire feeding between the circuit board 30 and the data interface are covered by the cover plate 20. And because the buckle is fixed between apron 20 and the module backplate 10, only need directly can realize the assembly with apron 20 buckle on module backplate 10 during the installation, the mode of buckle also convenient to detach moreover need not to carry out twisting of screw and moves etc. the assembly and dismantle conveniently, the improvement that is showing apron 20 assembly efficiency, and then improved electronic equipment's assembly efficiency and use experience.

It should be understood that, in this embodiment, there may be a plurality of fastening connection manners between the module back plate 10 and the cover plate 20, in an embodiment, a fastening groove may be disposed on the back surface of the module back plate 10, and a fastening hook capable of fastening with the fastening groove is disposed on the side wall of the cover plate 20; alternatively, the side wall of the cover plate 20 may have a locking groove, and the back surface of the module backplane 10 may have a locking hook or the like that can be engaged with the locking groove. Or, in another embodiment, a through hole is provided on the side wall of the cover plate 20, and an elastic clip or the like is provided on the module back plate 10 to pass through the through hole and be clipped in the through hole.

In this embodiment, the data interface and the circuit board 30 may be a data interface and a circuit board in an existing electronic device, and specific shapes, structures and connection manners can be found in the prior art, which is not described in detail in this embodiment.

Further, in the present embodiment, the module back plate 10 is recessed inward to form an inner recess 11, and the cover plate 20 is at least partially accommodated in the inner recess 11. Fig. 5 is a schematic structural diagram of a module backplane in an electronic device according to this embodiment, as shown in fig. 5, an inner recess 11 is formed on a back surface of the module backplane 10, the inner recess 11 is formed by recessing the back surface of the module backplane 10, a shape of the inner recess 11 may correspond to a shape of a sidewall of the cover plate 20, so that at least a portion of the cover plate 20 may be accommodated in the inner recess 11, and when the cover plate 20 is assembled, as shown in fig. 3 and 4, an open end of the cover plate 20 is accommodated in the inner recess 11 and covers the circuit board 30, so that the circuit board 30 is located in an accommodating space of the cover plate 20. Wherein, the effect of location can be played to interior concave part 11, and when assembling apron 20 and module backplate 10, the setting of interior concave part 11 can be convenient for user or relevant staff with the quick installation of apron 20 in place, helps improving the installation effectiveness.

In this embodiment, a clamping groove 111 is formed on a side wall of the inner recess 11, and an elastic buckle 21 clamped with the clamping groove 111 is formed on a side wall of the cover plate 20. Fig. 6 is a schematic cross-sectional view of a module back plate in an electronic device according to this embodiment, and fig. 7 is a schematic structural view of a cover plate in an electronic device according to this embodiment. As shown in fig. 4, 6 and 7, a clamping groove 111 is formed on a side wall of the inner recess 11 of the module back plate 10, an elastic buckle 21 is provided on a side wall of the cover plate 20, the elastic buckle 21 can be in clamping fit with the clamping groove 111, and when the cover plate 20 is located in the inner recess 11, the elastic buckle 21 on the side wall of the cover plate 20 can be in clamping fit with the clamping groove 111 on the side wall of the inner recess 11, so that the cover plate 20 and the module back plate 10 can be in clamping connection.

In addition, because the draw-in groove 111 is located the lateral wall of interior recess 11, and interior recess 11 is inwards sunken by module backplate 10 and forms, recess 11 including the joint of elasticity buckle 21 and draw-in groove 111 takes place promptly, also take place in module backplate 10, as shown in fig. 2, after with apron 20 and module backplate 10 joint in order to realize apron 20 fixed on module backplate 10, just can not see the joint position of elasticity buckle 21 and draw-in groove 111 from module backplate 10 outward appearance, compare with current thread tightening mode, it is concrete, can see the screw on module backplate 10 outward appearance as shown in fig. 1, make the outward appearance of module backplate 10 more clean and tidy, help improving the aesthetic property of module backplate 10, and then improve the aesthetic property of electronic equipment complete machine.

In this embodiment, it should be noted that the clamping groove 111 may be a groove dug in a side wall of the inner concave portion 11, the clamping groove 111 may be located on a bottom surface of the inner concave portion 11, or the clamping groove 111 may also be located on a side wall of the inner concave portion 11, wherein when the clamping groove 111 is located on the side wall of the inner concave portion 11, the clamping groove 111 may be located on a side wall of any one of two side walls of the inner concave portion 11, which are opposite to each other, that is, the clamping groove 111 may be located on a side wall of the two side walls of the inner concave portion 11, which is closer to an outer side of the module backplane 10, or the clamping groove 111 may also be located on a side wall of the two side walls.

It should be noted that, in the present embodiment, the elastic buckle 21 means that the buckle has a certain elastic movement margin, so as to facilitate the elastic buckle 21 to be clamped in the clamping groove 111 on the side wall of the inner concave portion 11, and also facilitate the elastic buckle 21 to be separated from the clamping groove 111. Specifically, in the present embodiment, as shown in fig. 3 and 4, for example, the clamping groove 111 is disposed on the side wall of the inner concave portion 11 close to the outer side of the module back plate 10, the elastic buckle 21 is disposed on the outer side wall of the cover plate 20, the elastic buckle 21 has a certain movement margin in the horizontal direction, when the cover plate 20 is assembled with the module back plate 10, the cover plate 20 is pressed, the open end of the cover plate 20 is accommodated in the inner concave portion 11, and the elastic buckle 21 on the side wall of the cover plate 20 is clamped with the clamping groove 111 on the side wall of the inner concave portion 11, so that the cover plate 20 is fixed with the module back plate 10. When the circuit board 30 needs to be repaired or replaced, the elastic clip 21 is pressed towards the inner direction of the cover plate 20, and the elastic clip 21 is separated from the clamping groove 111, so that the cover plate 20 is disconnected from the module back plate 10, and the cover plate 20 is conveniently taken down.

Present electronic equipment, its module backplate 10 are mostly the metal sheet, form sunken interior recess 11 in on the metal sheet to set up the recess in order to form draw-in groove 111 on the lateral wall of this interior recess 11, its technology is comparatively complicated, and the processing degree of difficulty is great. Therefore, in this embodiment, the module backplane 10 includes a first aluminum plate layer 112, a plastic layer 114, and a second aluminum plate layer 113 connected to each other, that is, the module backplane 10 is an aluminum-plastic plate, and includes the first aluminum plate layer 112, the second aluminum plate layer 113, and the plastic layer 114, as shown in fig. 4 and fig. 6, the plastic layer 114 is located between the first aluminum plate layer 112 and the second aluminum plate layer 113, the first aluminum plate layer 112 is located on one side of the plastic layer 114 close to the cover plate 20, the inner concave portion 11 is located on the first aluminum plate layer 112 and extends to the plastic layer 114, and the clamping groove 111 is located in the plastic layer 114, specifically, the clamping groove 111 may be a groove formed in the plastic layer 114. Make module backplate 10 be the plastic-aluminum board to make draw-in groove 111 be the recess of seting up in plastic layer 114, compare for module backplate 10 with current use metal sheet, dig on the plastic board and establish the recess comparatively simple and convenient, that is to say can be easier including form draw-in groove 111 on the lateral wall of concave part 11, be convenient for realize and help reducing module backplate 10's processing cost.

Wherein, it should be understood that, the slot 111 is located in the plastic layer 114, the slot 111 may be a groove obtained by hollowing out the plastic layer 114 in the vertical direction between the first aluminum plate layer 112 and the second aluminum plate layer 113, or may also be a groove obtained by hollowing out a part of the plastic layer 114, that is, the slot 111 may include a first surface and a second surface which are oppositely disposed and a third surface which connects the first surface and the second surface, wherein the third surface may be perpendicular to the first surface and the second surface, and the third surface is the plastic layer 114, and the first surface and the second surface may be the plastic layer 114, or the first surface and the second surface may also be the first aluminum plate layer 112 and the second aluminum plate layer 113, or the first surface may be the plastic layer 114, and the second surface is the first aluminum plate layer 112 or the second aluminum plate layer 113.

Further, in the present embodiment, the side wall of the cover plate 20 is provided with a first slit 22 and a second slit 23 at intervals, and the portion between the first slit 22 and the second slit 23 forms the elastic catch 21. Fig. 8 is a side view of a cover plate in an electronic device provided in this embodiment. As shown in fig. 7 and 8, the side wall of the cover plate 20 has a first slit 22 and a second slit 23, the first slit 22 and the second slit 23 are arranged at intervals, and an elastic catch 21 is formed between the first slit 22 and the second slit 23, that is, the elastic catch 21 and the side wall of the cover plate 20 have the first slit 22 and the second slit 23, so that the elastic catch 21 can have a moving margin in a horizontal direction under a certain force, thereby facilitating the engagement and disengagement between the elastic catch 21 and the card slot 111.

Wherein, it should be noted that, this elastic buckle 21 can be located on the lateral wall of module backplate 10, or elastic buckle 21 also can be located on the inside wall of module backplate 10, and is corresponding, and draw-in groove 111 can be located on the lateral wall that is close to the module backplate 10 outside on interior recess 11, also can be located on the lateral wall that keeps away from the module backplate 10 outside on interior recess 11, can realize the joint of elastic buckle 21 and draw-in groove 111 can.

In the present embodiment, the elastic buckle 21 includes a main body 211 located between the first slit 22 and the second slit 23, and a hook 212 protruding outward from the main body 211, and the hook 212 is used for being engaged with the slot 111. Specifically, as shown in fig. 4, 7 and 8, the elastic buckle 21 includes a main body 211 and a hook 212 formed to protrude outward from an outer wall of the main body 211. Wherein, make the trip 212 for following the trip 212 of the outside protrusion formation of main part 211, the trip 212 is the outside arch that forms of main part 211 outer wall promptly, and is corresponding, on the draw-in groove 111 is located the lateral wall that is close to the outside on the recess 11 in the module backplate 10, as shown in fig. 4, when apron 20 and module backplate 10 joint, the main part 211 of inwards pressing elasticity buckle 21 can make the trip 212 and the draw-in groove 111 separation of elasticity buckle 21, can be convenient for take off apron 20, be convenient for realize the dismantlement to apron 20.

As shown in fig. 7 and 8, the hook 212 may include a first end, a second end and a transition end connecting the first end and the second end, the first end is close to the opening of the open cavity, the width of the first end is smaller than that of the second end, the transition end is an inclined surface, so that the cover plate is assembled on the module backboard, and when the hook is engaged with the slot, the hook is conveniently clamped in the slot due to the smaller width of the first end and the inclined transition surface.

When the cover plate 20 is assembled to the module back plate 10, as shown in fig. 3 and 4, the cover plate 20 is pressed to accommodate the open end of the cover plate 20 in the inner concave portion 11, and the hooks 212 of the elastic buckles 21 on the side wall of the cover plate 20 are engaged with the engaging grooves 111 on the side wall of the inner concave portion 11, so that the cover plate 20 and the module back plate 10 are fixed. When the circuit board 30 needs to be repaired and replaced, the elastic buckle 21 is pressed inwards, and the hook 212 of the elastic buckle 21 is separated from the clamping groove 111, so that the cover plate 20 is disconnected from the module backboard 10, and the cover plate 20 can be detached.

In this embodiment, as shown in fig. 7 and 8, at least two opposite side walls of the cover plate 20 are respectively provided with one elastic buckle 21, that is, at least two elastic buckles 21 are provided on the cover plate 20, and the two elastic buckles 21 are provided on the two opposite side walls of the cover plate 20, so that the stability of the fixed clamping between the cover plate 20 and the module back plate 10 is ensured.

Wherein, in this embodiment, the size of the lateral wall of apron 20 and the size phase-match of the lateral wall of interior recess 11, interior recess 11 can play spacing fixed effect to apron 20 and module backplate 10 carry out the buckle fixed, also help improving the steadiness of being connected between apron 20 and the module backplate 10 simultaneously.

It should be understood that the specific shape and size of the concave portion 11 can be selected and set according to the specific shape and size of the cover plate 20, wherein, in this embodiment, the cross section of the concave portion 11 is annular, the circuit board 30 is located on the module back plate 10 surrounded by the concave portion 11, when the open end of the cover plate 20 is received in the concave portion 11, the circuit board 30 located on the module back plate 10 surrounded by the concave portion 11 is located in the receiving space of the cover plate 20, so as to shield the circuit board 30 and the routing thereof by the cover plate 20.

The cover plate 20 is a plastic cover plate, which has a low cost and is easy to machine and form, and is helpful to improve the lightness, thinness and beauty of the electronic device.

The data interface on the cover plate 20 may include a USB interface, and USB (universal Serial bus) is a universal Serial bus, and can implement connection and communication between the television and external devices, such as a USB disk, a video camera, and a projector.

The electronic device provided by the embodiment comprises a module back plate 10, a cover plate 20, a data interface and a circuit board 30 connected with the data interface. The data interface is disposed on the cover plate 20, the circuit board 30 is disposed on the module backplane 10, the cover plate 20 covers the circuit board 30, and the circuit board 30 and the traces between the circuit board 30 and the data interface are located in the cover plate 20 and are shielded by the cover plate 20. Make apron 20 and module backplate 10 buckle simultaneously and be connected, only need during the installation with apron 20 buckle on module backplate 10, the mode of buckle is convenient for detach also moreover, need not to carry out twisting of screw and moves etc. the assembly and dismantle conveniently, the improvement that is showing apron 20 assembly efficiency, and then improve electronic equipment's assembly efficiency. The problem of use the thread tightening mode among the current electronic equipment with apron and module backplate fixed back, be not convenient for assemble and lead to the assembly efficiency lower is solved.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "comprises" and "comprising," and any variations thereof, as used herein, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

Unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integral to one another; either directly or indirectly through intervening media, may be used in either the internal or the external relationship of the two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.

Claims

1. An electronic device is characterized by comprising a module backboard, a cover plate, a data interface and a circuit board connected with the data interface;

2. The electronic device of claim 1, wherein the module back plate is recessed to form an interior recess, and the cover plate is at least partially received within the interior recess.

3. The electronic device of claim 2, wherein a slot is formed on a side wall of the inner recess, and an elastic clip is formed on a side wall of the cover plate and is engaged with the slot.

4. The electronic device of claim 3, wherein the module backplane comprises a first aluminum plate layer, a plastic layer, and a second aluminum plate layer connected, the plastic layer is located between the first aluminum plate layer and the second aluminum plate layer, the first aluminum plate layer is adjacent to the cover plate, the inner recess is located on the first aluminum plate layer and extends to the plastic layer, and the slot is located in the plastic layer.

5. The electronic device of claim 4, wherein the side wall of the cover plate is provided with a first slit and a second slit at intervals, and a part between the first slit and the second slit forms the elastic buckle.

6. The electronic device of claim 5, wherein the elastic buckle comprises a main body part located between the first slit and the second slit and a hook protruding outwards from the main body part, and the hook is used for being clamped with the clamping groove.

7. The electronic device of claim 6, wherein at least two opposite sidewalls of the cover plate are respectively provided with one of the elastic fasteners.

8. The electronic device of claim 7, wherein a size of a sidewall of the cover plate matches a size of a sidewall of the recess.

9. The electronic device of claim 8, wherein the recess is annular in cross-section, and the circuit board is located on the module backplane around which the recess surrounds.

10. The electronic device of any of claims 1-9, wherein the cover is a plastic cover; and/or the data interface comprises a USB interface.