CN211047033U - Camera assembly and electronic equipment - Google Patents

Abstract

The embodiment of the application provides a camera subassembly and electronic equipment, camera subassembly setting is on electronic equipment, and wherein, the camera subassembly includes camera lens module, sensitization chip and adjustment mechanism, the camera lens module sets up in the light channel that advances of sensitization chip, the sensitization chip sets up adjustment mechanism is last, the camera lens module is used for gathering light and projects the light of gathering on the sensitization chip, adjustment mechanism drives through deformation the sensitization chip removes with the adjustment the sensitization chip with distance between the camera lens module, and then the realization is focused. The camera module can reduce the occupied space of the camera assembly on the electronic equipment.

Description

Camera assembly and electronic equipment

Technical Field

The present application relates to the field of electronic technologies, and in particular, to a camera assembly and an electronic device.

Background

The camera module is generally applied to an electronic device (such as a smart phone, a tablet computer, etc.) to realize a shooting function. In the related art, the auto-focusing function of the camera module is usually realized through the auto-focusing drive, but the size of the camera assembly is large due to the arrangement of the auto-focusing drive, the camera assembly occupies the space of the electronic device, and the development of the electronic device in a light and thin manner is not facilitated.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a camera assembly and electronic equipment, and the occupied space of the camera assembly on the electronic equipment can be reduced.

The embodiment of the application provides a camera component, including camera lens module, sensitization chip and adjustment mechanism, the camera lens module sets up in sensitization chip advance the light passageway, the sensitization chip sets up adjustment mechanism is last, the camera lens module is used for gathering light and projects the light of gathering on the sensitization chip, adjustment mechanism drives through deformation sensitization chip removes with the adjustment the sensitization chip with distance between the camera lens module, and then the realization is focused.

The embodiment of the application further provides an electronic device, which comprises a shell and a camera assembly, wherein the camera assembly is arranged on the shell, and the camera assembly is as above.

This application embodiment sets up the sensitization chip on adjustment mechanism, and adjustment mechanism drives the sensitization chip through deformation and removes the distance between with adjustment sensitization chip and the camera lens module, and then realizes focusing, need not to add the auto focus drive arrangement, can reduce the overall size of camera subassembly, reduces the occupation space of camera subassembly to electronic equipment.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 2 is a schematic diagram of a first structure of a camera assembly in the electronic device shown in fig. 1.

Fig. 3 is an exploded view of the camera assembly of fig. 2.

Fig. 4 is a schematic diagram of the control mechanism of the camera assembly of fig. 3.

Fig. 5 is a schematic structural diagram of a control mechanism, a photosensitive chip and an adjusting mechanism in the camera assembly shown in fig. 3.

Fig. 6 is a schematic structural view of a base, an adjustment mechanism, and a photosensitive member in the camera assembly shown in fig. 3.

FIG. 7 is a cross-sectional view of the camera assembly of FIG. 2 taken along the line P1-P1.

Fig. 8 is a first structural schematic diagram of a mount in the camera assembly of fig. 3.

Fig. 9 is a second construction of a frame of the camera assembly of fig. 3.

Fig. 10 is a second structural diagram of the camera assembly in the electronic device shown in fig. 1.

Fig. 11 is an exploded view of the camera assembly of fig. 10.

Fig. 12 is a schematic structural view of a control mechanism of the camera assembly shown in fig. 10.

FIG. 13 is a cross-sectional view of the camera assembly of FIG. 8 taken along line P2-P2.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure. The electronic device 20 may be a computing device such as a laptop computer, a computer monitor containing an embedded computer, a tablet computer, a cellular telephone, a media player, or other handheld or portable electronic devices, smaller devices (such as a wristwatch device, a hanging device, a headset or earpiece device, a device embedded in eyeglasses, or other device worn on the head of a user, or other wearable or miniature devices), a television, a computer display not containing an embedded computer, a gaming device, a navigation device, an embedded system (such as a system in which an electronic device with a display is installed in a kiosk or automobile), a device that implements the functionality of two or more of these devices, or other electronic devices. In the exemplary configuration of fig. 1, the electronic device 20 is a portable device, such as a cellular telephone, media player, tablet, or other portable computing device. Other configurations may be used for the electronic device 20, if desired, and the example of FIG. 1 is merely exemplary.

The electronic device 20 may include a camera assembly such as the camera assembly 200, and the camera assembly 200 may be used to capture pictures, capture videos, and the like to implement the capture functionality of the electronic device 20.

As shown in fig. 2, fig. 2 is a schematic structural diagram of a camera assembly in the electronic device shown in fig. 1, and fig. 3 is a schematic structural diagram of an exploded view of the camera assembly shown in fig. 2. The camera assembly 200 may include a lens module such as a lens module 210 and a photo sensor chip 220, and the lens module 210 is disposed in a light inlet channel of the photo sensor chip 220. For example, the lens module 210 may include a lens mount and a plurality of lenses, the plurality of lenses are coaxially disposed in the lens mount, the plurality of lenses may transmit light entering the electronic device 20 and project collected light to a photosensitive chip, such as the photosensitive chip 220, and the photosensitive chip 220 may image based on the light, so as to implement a picture taking function of the camera assembly 200.

The camera head assembly 200 further includes an adjustment mechanism such as adjustment mechanism 230, and the adjustment mechanism 230 may be regular in shape, for example, the adjustment mechanism 230 may be a rectangular parallelepiped structure, and the adjustment mechanism 230 may also be irregular in shape. The adjusting mechanism 230 can be deformed, for example, the adjusting mechanism 230 is made of a conductive material, and the conductive material can generate heat when being powered on, so that the adjusting mechanism 230 is heated to expand and deform; alternatively, the adjustment mechanism 230 may be made of a soft material (such as rubber) that deforms under a force.

The photosensitive chip 220 may be disposed on the adjusting mechanism 230, for example, the photosensitive chip 220 may be fixed on the surface of the adjusting mechanism 230 by adhesion, or may be fixed by screw connection, soldering, or the like. The adjusting mechanism 230 can drive the photosensitive chip 220 to move in the deformation process, and adjust the distance between the lens module 210 and the photosensitive chip 220, so as to realize the focusing process of the camera assembly 200, so that the imaging of the photosensitive chip 220 is clear, and the picture shooting effect of the camera assembly 200 is improved.

For example, the adjustment mechanism 230 may have a rectangular parallelepiped structure and be made of a conductive material. For example, the adjusting mechanism 20 has a first surface, a second surface, a first side surface, a second side surface, a third side surface and a fourth side surface, the first surface and the second surface are oppositely disposed, and the first side surface, the second side surface, the third side surface and the fourth side surface are sequentially connected and simultaneously connected with the first surface and the second surface. Wherein the initial thickness of the adjustment mechanism 230 is M. When the camera assembly 200 starts a shooting function, the electronic device 20 may determine a target distance between the photosensitive chip 220 and the lens module 210 according to an imaging effect of the photosensitive chip 220, and control a current value passing through the adjusting mechanism 230 according to the target distance, and the adjusting mechanism 230 is heated to expand under a power-on condition, so that the thickness of the adjusting mechanism 230 is changed from the initial thickness M to the target thickness M + N. The distance between the lens module 210 and the photosensitive chip 220 is adjusted to the target distance, and the focusing of the camera assembly 200 is further achieved.

It can be understood that, since the photosensitive chip 220 is disposed on the adjusting mechanism 230, the photosensitive chip 220 is driven to move in the deformation process of the adjusting mechanism 230, so that the distance between the photosensitive chip 220 and the lens module 210 can be adjusted, and the focusing of the camera assembly 200 can be further achieved.

This application embodiment drives sensitization chip 220 through adjustment mechanism 230's deformation and removes for distance between sensitization chip 220 and the camera lens module 210 is adjustable, for the camera subassembly of correlation technique, can need not to install the drive and drive the lens group and remove and realize focusing, the structure of camera subassembly has been simplified, and the inner space of camera subassembly can also be saved, and then reduce the overall size of camera subassembly, be favorable to electronic equipment 20's frivolousization development.

It should be noted that the focusing process of the camera head assembly 200 is not limited to this, for example, the electronic device 20 may directly control the current value change through the adjusting mechanism 230, so that the adjusting mechanism 230 deforms until the image formed by the photosensitive chip 220 is clear.

In some embodiments, the adjustment mechanism 230 can be a Micro-Electro-mechanical system (MEMS) mechanism, which can also be referred to as a MEMS sensor. The micro electro mechanical system is a high-tech device with the size of several millimeters or even smaller, the internal structure of the micro electro mechanical system is generally in the micrometer or even nanometer level, and the micro electro mechanical system is an independent intelligent system. The mems mechanism can deform under power-on condition to change its thickness, thereby adjusting the distance between the photo sensor chip 220 and the lens module 210.

For example, the photosensitive chip 220 may be disposed on a surface of a mems, the mems is electrically connected to a control mechanism such as the control mechanism 250 through the conductive wire 240, and the control mechanism 250 may control the magnitude of the current flowing through the mems through the conductive wire 240, so as to control the thickness of the mems to be uniformly changed until the image of the photosensitive chip 220 is clear. The conductive wire may be made of copper, gold, or other conductive metal, among others. According to the embodiment of the application, the focusing of the camera assembly is realized by using the micro-electromechanical system mechanism with the thickness capable of being uniformly changed, and the structure of the camera assembly 200 is simplified.

In some embodiments, the adjusting mechanism 230 may be made of a rubber material, and the control mechanism 250 may include a force applying component, where the force applying component may apply a force to the adjusting mechanism 230, and the adjusting mechanism 230 is deformed by the force applied by the force applying component and drives the photosensitive chip 220 to move, so as to adjust a distance between the photosensitive chip 220 and the lens module 210, thereby achieving focusing.

As shown in fig. 4, fig. 4 is a schematic structural diagram of a control mechanism in the camera assembly shown in fig. 3, and fig. 5 is a schematic structural diagram of a control mechanism, a photosensitive chip and an adjusting mechanism in the camera assembly shown in fig. 3. The control mechanism 250 includes a circuit board 251, and the circuit board 251 may have a regular shape, such as a rectangular parallelepiped structure or a rounded rectangular structure, or the circuit board 251 may have an irregular shape. The circuit board 251 may include a plurality of regions, and the plurality of regions may be the same in size and may be different in size. The circuit board 251 is provided with a first through hole such as the first through hole 2511, and at least a portion of the photosensitive chip 220 and/or at least a portion of the adjustment mechanism 230 may be located within the first through hole 2511. For example, the entirety of the photo sensor chip 220 is located in the first through hole 2511, or a portion of the photo sensor chip 220 is located in the first through hole 2511; all of the adjustment mechanism 230 is located within the first through-hole 2511, or a portion of the adjustment mechanism 230 is located within the first through-hole 2511.

The size of the first through hole 2511 is larger than that of the adjusting mechanism 230, so that the adjusting mechanism 230 is not interfered by the hole wall of the first through hole 2511 in the deformation process and can be freely deformed. It is understood that the periphery of the first through hole 2511 has a gap with the adjusting mechanism, and the gap can separate the circuit board 251 and the adjusting mechanism 230, so as to provide enough space for the adjusting mechanism 230 to deform.

In the shooting process of the electronic device 20 using the camera assembly 200, the lens module 210 collects light rays emitted into the electronic device 20, and projects the collected light rays into the photosensitive chip 220 for imaging. When the image collected by the camera assembly 200 is unclear, the electronic device 20 may control the adjusting mechanism 230 to deform, and the adjusting mechanism 230 may drive the photosensitive chip 220 to move in the first through hole 2511 through deformation until the image collected by the camera assembly 200 is clear. The adjusting mechanism 230 can move in a direction away from the photosensitive chip 220 or in a direction close to the photosensitive chip 220.

With continued reference to fig. 5, the circuit board 251 may be provided with a first pad, the adjusting mechanism 230 may be provided with a second pad, the first pad and the second pad are spaced apart, one end of the conductive wire 240 is connected to the first pad, and the other end of the conductive wire 240 is connected to the second pad. For example, the circuit board 251 may be provided with a first pad a and a first pad b, the adjustment mechanism 230 may be provided with a second pad a and a second pad b, and the first pad a, the first pad b, the second pad a, and the second pad b may be connected by two conductive wires (e.g., the conductive wire a and the conductive wire b). One end of the conductive wire a is connected with the first pad a, and the other end of the conductive wire a is connected with the second pad a; one end of the conductive line b is connected to the first pad b, and the other end of the conductive line b is connected to the second pad b. When energized, current is transmitted from the circuit board 251 to the adjustment mechanism 230 via the conductive line a, and is transmitted back to the circuit board 251 via the conductive line b, and the adjustment mechanism 230 can be deformed when energized.

In some embodiments, the size of the adjustment mechanism 230 may be larger than the size of the photosensitive chip 220. For example, the adjustment mechanism 230 may include a first region and a second region, the second region being located at an edge of the first region, the photosensitive chip 220 being located in the first region, and the second pad being located in the first region. At this time, the conductive wire 240 can be connected from the first pad of the circuit board 251 to the second pad through the first through hole 2511, and the conductive wire 240 is not interfered by the photo sensor chip 220 during the movement.

The electronic device 20 can control the amount of deformation of the mems mechanism by controlling the amount of current flowing through the mems mechanism. For example, the electronic device 20 may control the current input to the mems mechanism to increase, so that the thickness of the mems mechanism increases, and at this time, the photo sensor chip 220 moves toward the lens module 210, so as to decrease the distance between the photo sensor chip 220 and the lens module 210; the electronic device 20 can also control the current input to the mems mechanism to decrease, so that the thickness of the mems mechanism is smaller, and at this time, the photo sensor chip 220 moves in a direction away from the lens module 210, so that the distance between the photo sensor chip 220 and the lens module 210 is increased.

Wherein the length of the conductive line 240 is greater than the distance between the first pad and the second pad, so that the conductive line 240 can satisfy the amount of deformation of the adjustment mechanism 230. It will be appreciated that the conductive wires 240 are reserved with a suitable amount of redundancy so that the adjustment mechanism 230 is not constrained by the conductive wires 240 during deformation. For example, the length of the conductive wire 240 may be set according to the maximum amount of deformation of the adjustment mechanism 230, such as may be slightly greater than the maximum amount of deformation of the adjustment mechanism 230.

The circuit board 251 may be a multi-layer circuit board, which may be formed by laminating a plurality of sub-circuit boards. For example, the circuit board 251 may include a first layer, a second layer, and a third layer that are stacked. The first layer may be a rigid circuit board, the second layer may be a flexible circuit board, the third layer may be a rigid circuit board, and the size of the third layer may be the same as that of the first layer. The third layer is larger in size than the second layer such that a portion of the third layer is exposed to the outside. For example, the third layer may include a first portion and a second portion, the second portion being disposed at a periphery of the first portion, the second portion being disposed between the first layer and the third layer, and the first portion may be exposed to the outside. It should be noted that the size of the second layer may be the same as that of the third layer, and the size of the second layer may also be smaller than that of the third layer, as long as a part of the third layer is exposed. The first, second, and third layers of the circuit board 251 may be a single-layer circuit board or a multi-layer circuit board.

The circuit board 251 may further be provided with a connector, the connector is disposed on the first portion of the second layer, and the connector may be used for electrically connecting with a main board of the electronic device 20, so that the camera assembly 200 is electrically connected with the main board, and further the camera assembly 200 is controlled to implement a shooting function.

As shown in fig. 3 and 5, the control mechanism 250 further includes a reinforcing plate 252, and the reinforcing plate 252 may be made of a metal material, such as stainless steel material for the reinforcing plate 252. The reinforcing plate 252 is disposed on the circuit board 251 to support the circuit board 251, and to reinforce the strength of the circuit board 251. The reinforcing plate 252 is provided with a second through hole such as a second through hole 2521, the second through hole 2521 communicates with the first through hole 2511, and the size of the second through hole 2521 may be the same as that of the first through hole 2511, although the size of the second through hole 2521 may be different from that of the first through hole 2511. The fixed connection between the reinforcing plate 252 and the circuit board 251 may be achieved by glue, where glue is coated on one surface of the reinforcing plate 252, and the surface of the reinforcing plate 252 coated with glue is adhered to the surface of the circuit board 251. It should be noted that the fixing connection manner of the reinforcing plate 252 and the circuit board 251 is not limited to this, and for example, the fixing connection of the reinforcing plate 252 and the circuit board 251 may also be realized by rivet riveting, or the fixing connection of the reinforcing plate 252 and the circuit board 251 may also be realized by screw connection.

As shown in fig. 6 and 7, fig. 6 is a schematic structural diagram of a base, an adjusting mechanism and a photosensitive member in the camera head assembly shown in fig. 3, and fig. 7 is a schematic structural diagram of a cross section of the camera head assembly shown in fig. 2 along a direction P1-P1. The camera assembly 200 may further include a base, such as base 260, and the base 260 may be used to carry the photosensitive chip 220, the adjustment mechanism 230, the control mechanism 250, and the like. The base 260 may be made of a rigid material such as iron, aluminum, etc. capable of bearing load. The base 260 may be regular in shape, such as the base 260 may be a rectangular parallelepiped structure, or the base 260 may be irregular in shape. For example, the base 260 may include a bottom wall 261 and side walls disposed around the periphery of the bottom wall 261 to form a receiving groove 262. The base 260 may include a plurality of sidewalls, such as the base 260 may include a first sidewall 263, a second sidewall 264, a third sidewall 265 and a fourth sidewall 266, the first sidewall 263 and the second sidewall 264 are oppositely disposed, the third sidewall 265 and the fourth sidewall 266 are disposed between the first sidewall 263 and the second sidewall 264, two adjacent sidewalls may be connected by one connecting wall, the number of the connecting walls may be the same as the number of the sidewalls, such as the number of the connecting walls may also be four. It should be noted that the number of the connecting walls is not limited thereto, and for example, the number of the connecting walls may be five or six. The embodiment of the present application is described taking a connecting wall as an example. The first side wall 263 and the third side wall 265 are connected by a connecting wall such as a connecting wall 267, and the connecting wall 267 may have an arc structure or a right-angle structure.

It should be noted that the number of the side walls of the base 260 is not limited thereto, such as the base 260 may only include one side wall, such as when the base 260 has a cylindrical structure, the side wall of the base 260 is an integrally formed arc-shaped wall.

The adjustment mechanism 230 may be disposed in the receiving groove 262, for example, the adjustment mechanism 230 may be disposed on the bottom wall 261 of the base 260 by gluing. Of course, the adjustment mechanism 230 may be secured to the bottom wall 261 by other means, such as screwing, welding, etc. The control mechanism 250 can also be attached to the sidewall of the base 260 by glue. Of course, the control mechanism 250 may be secured to the sidewall by other means, such as screwing, welding, etc. For example, the other surface of the reinforcing plate 252 may be adhered to the sidewall of the base 260 by glue. For example, four sidewalls of the base and the stiffener 252 may be fixed closed by dispensing. Of course, the stiffening plate 252 may be fixed to the sidewall by other means, such as screwing, welding, etc.

Referring to fig. 3, 8 and 9, fig. 8 is a first structural schematic diagram of a bracket in the camera head assembly shown in fig. 3, and fig. 9 is a second structural schematic diagram of the bracket in the camera head assembly shown in fig. 3. The camera assembly 200 may further include a holder such as the holder 270, and the holder 270 is disposed between the lens module 210 and the circuit board 251 for supporting the lens module 210. The support 270 may be regular in shape, for example, the support 270 may be a rectangular parallelepiped structure, a rounded rectangular structure, or the like.

The holder 270 is provided with a first groove 271, the first groove 271 is disposed at a side close to the circuit board 251, and the first groove 271 is communicated with the first through hole 2511, so as to provide a space for the movement of the photosensitive chip 220 and the deformation of the adjusting mechanism 230. The notch size of the first recess 271 is larger than the size of the first through hole 2511 so that a portion of the circuit board 251 is located within the first recess 271. The first groove 271 may provide a receiving space for devices disposed on the circuit board 251. It is understood that the circuit board 251 may include a fixing region and a device disposing region, the support 270 is fixed to the fixing region of the circuit board 251, the device disposing region is located in the first recess 271, and the device disposing region may be used for disposing devices such as capacitors, resistors, and control chips. This structural design may make the space of the camera assembly 200 more compact, further reducing the size of the camera assembly 200.

The holder 270 is further provided with a second groove 272, and the direction of the notch of the second groove 272 is opposite to the direction of the notch of the first groove 271. It is understood that the notch of the first groove 271 faces the lens module 210 and the notch of the second groove 272 faces the circuit board 251, or it is understood that the holder 270 has two opposite sides, one of which is used for connecting with the lens module 210 and the other of which is used for connecting with the circuit board 251, the first groove 271 is disposed on one of the sides, and the second groove 272 is disposed on the other side. The second recess 272 may be used to accommodate a filter such as the filter 280. The second groove 272 includes a groove bottom and a plurality of groove walls that surround the periphery of the groove bottom. For example, the second groove 272 may include a first groove wall, a second groove wall, a third groove wall, and a fourth groove wall, the first groove wall and the third groove wall are disposed opposite to each other, the second groove wall and the fourth groove wall are disposed opposite to each other, the first groove wall is connected between the second groove wall and the fourth groove wall, the second groove wall is connected between the first groove wall and the third groove wall, the third groove wall is connected between the second groove wall and the fourth groove wall, and the fourth groove wall is connected between the first groove wall and the third groove wall.

In some embodiments, the two slot walls are connected by an arcuate connecting wall. In the embodiment of the present application, the first slot wall and the second slot wall are taken as an example, and the first slot wall and the second slot wall may be connected by an arc-shaped connecting wall. The arc-shaped connection wall may protect the corners of the optical filter 280 when the optical filter such as the optical filter 280 is mounted, compared to the right-angle connection wall, so that the optical filter 280 is not damaged when mounted.

The holder 270 is further provided with an opening such as the opening 273, and the opening 273 penetrates the holder 270 in the thickness direction of the holder 270 such that the first groove 271 and the second groove 272 communicate through the opening 273. The filter 280 covers the opening 273, and the filter 280 can filter the light collected by the lens module 210 and project the filtered light to the photo sensor chip 220 through the opening 273. It can be understood that the opening 273 is communicated with the first through hole 2511, when the light collected by the lens module 210 passes through the optical filter 280, the optical filter 280 filters the collected light to filter some unwanted light, the light after the filtering processing can pass through the second through hole 2521 and the first through hole 2511 to the photosensitive chip 220, and the photosensitive chip 220 can perform imaging based on the light after the filtering processing.

In some embodiments, the base 260 may not be provided, and alternatively, the control mechanism 250 is provided with a receiving slot. As shown in fig. 10 to 13, fig. 10 is a second schematic structural diagram of the camera assembly in the electronic device shown in fig. 1, fig. 11 is a schematic structural diagram of an exploded view of the camera assembly shown in fig. 10, fig. 12 is a schematic structural diagram of a control mechanism of the camera assembly shown in fig. 10, and fig. 13 is a schematic structural diagram of a cross-section of the camera assembly shown in fig. 8 along P2-P2. The control mechanism 250 is provided with a receiving groove 253, and the adjusting mechanism 230 can be directly disposed in the receiving groove 253. The reinforcing plate 252 is not provided with the second through hole 2521, but is a complete plate structure, the reinforcing plate 252 is disposed on one side of the circuit board 251 and covers the first through hole 2511 to block the first through hole 2511, so that the hole wall of the first through hole 2511 and the reinforcing plate 252 together enclose the receiving groove 253. The embodiment of the application can save the base 260 on the basis of the above embodiments, so that the structure of the camera assembly 200 is more simplified, the size of the camera assembly 200 can be further reduced, and the occupied space of the camera assembly 200 on the electronic device 20 is saved.

As shown in FIG. 1, the electronic device 20 may further include a Display component such as a Display component 400. the Display component 400 may be mounted on a housing of the electronic device, the Display component 400 being used to form a Display surface of the electronic device 20 for displaying images, text, etc. the Display component 400 may be a liquid crystal Display (L iquid Display, L CD) or an Organic light-Emitting Diode Display (O L ED).

The electronic device 20 may further include a light-transmissive region 600, and the light-transmissive region 600 may be used to inject light signals external to the electronic device 20 into the electronic device 20. The transparent region 600 may be a through hole, or a window formed by covering a transparent substrate on the through hole, for example, a transparent glass plate or a transparent plastic plate may be covered on the through hole, or a transparent structure, such as transparent glass. The optical signal can penetrate into the electronic device 20 through the light-transmitting area 600 to form an incident optical signal. The shape of the light-transmitting region 600 may be regular, such as circular, rectangular, or irregular.

The light-transmitting region 600 may be disposed on the display assembly 400 such that an optical signal at one side of the display assembly 400 may be incident into the electronic device 20 through the light-transmitting region 600, and the camera assembly 200 at the inside of the electronic device 20 may receive the incident optical signal and capture an image at one side of the display assembly 400. It is understood that when the light-transmissive region 600 is disposed on the display assembly 400, the camera assembly 400 corresponds to a front camera of the electronic device 20.

It should be noted that when the light-transmitting region 600 is disposed on the display module 400, the light-transmitting region 600 may be located in the non-display region, such as the light-transmitting region 600 formed by disposing the light-transmitting region in the non-display region of the display module 400. A light transmission area 600 can be used for a plurality of cameras to take pictures, and the size of the light transmission area 600 can be set to be corresponding to the size of a lens of one camera.

As shown in fig. 1, electronic device 20 may further include a housing such as housing 800, with camera assembly 200 and display assembly 400 each disposed on housing 800. The housing 800 may be a regular shape such as a rectangular parallelepiped structure, a rounded rectangular structure, or the housing 800 may be an irregular shape. The housing 800 may be formed from plastic, glass, ceramic, fiber composite, metal (e.g., stainless steel, aluminum, etc.), other suitable materials, or a combination of any two or more of these materials. The first shell 800 may be formed using a one-piece configuration in which some or all of the first shell 800 is machined or molded as a single structure, or may be formed using multiple structures (e.g., an inner frame structure, one or more structures that form the sides of an outer shell, etc.).

The housing 800 may include a back cover that may be used to form the exterior profile of the electronic device 20. The rear cover may be integrally formed. In the forming process of the rear cover, structures such as a microphone hole, a loudspeaker hole, a receiver hole, an earphone hole, a USB interface hole, a rear camera hole, a fingerprint identification module mounting hole and the like can be formed on the rear cover. The rear cover may be interconnected with the display assembly 400 and cover the outside of other devices (e.g., battery, circuit board) on the case 800 to shield the other devices.

In some embodiments, the light-transmitting area 600 may also be disposed on the back cover, and the camera assembly 200 may be a rear camera of the electronic device 20, through which a user may take a rear shot. For example, a light hole may be formed in the rear cover, and the light hole may serve as the light-transmitting area 600, or a light-transmitting lens may be disposed on the light hole.

The camera assembly and the electronic device provided by the embodiment of the application are described in detail above. The principles and implementations of the present application are described herein using specific examples, which are presented only to aid in understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (11)

1. The utility model provides a camera component, its characterized in that, includes camera lens module, sensitization chip and adjustment mechanism, the camera lens module sets up in the light channel of advancing of sensitization chip, the sensitization chip sets up adjustment mechanism is last, the camera lens module is used for gathering light and projects the light of gathering on the sensitization chip, adjustment mechanism drives through deformation the sensitization chip removes in order to adjust the sensitization chip with distance between the camera lens module, and then the realization is focused.

2. The camera assembly of claim 1, wherein the adjustment mechanism comprises a mems mechanism that adjusts the distance between the photo-sensing die and the lens module by changing the thickness.

3. The camera assembly of claim 2, further comprising a base provided with a receiving slot, the adjustment mechanism being disposed within the receiving slot.

4. The camera assembly according to claim 3, further comprising a circuit board, wherein the circuit board is disposed on the base and electrically connected to the adjusting mechanism, the circuit board is provided with a first through hole, and the adjusting mechanism is deformed to drive the photosensitive chip to move in the first through hole.

5. The camera assembly of claim 4, wherein the circuit board is provided with a first pad, the adjustment mechanism is provided with a second pad, the first pad and the second pad are spaced apart, and the first pad and the second pad are electrically connected by a conductive wire.

6. The camera assembly of claim 5, wherein the length of the conductive wire is greater than the distance between the first and second pads to meet the amount of deformation of the adjustment mechanism.

7. The camera assembly of any one of claims 4 to 6, further comprising a stiffener plate, the stiffener plate being disposed on the circuit board, and the stiffener plate being provided with a second through hole, the second through hole being in communication with the first through hole, the stiffener plate being configured to increase the strength of the circuit board.

8. The camera assembly of claim 7, further comprising a bracket disposed between the circuit board and the lens module, the bracket configured to support the lens module.

9. The camera assembly according to claim 8, wherein the holder has an opening, the opening is connected to the first through hole, the holder further has a filter, the filter covers the opening, and the filter can filter the light collected by the lens module.

10. An electronic device comprising a housing and a camera assembly disposed on the housing, the camera assembly being as claimed in any one of claims 1 to 9.

11. The electronic device according to claim 10, further comprising a display component disposed on the housing, wherein the display component is provided with a light-transmitting area for external light to penetrate into the lens module.

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