CN211044076U - Electronic device - Google Patents
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- CN211044076U CN211044076U CN201922380353.XU CN201922380353U CN211044076U CN 211044076 U CN211044076 U CN 211044076U CN 201922380353 U CN201922380353 U CN 201922380353U CN 211044076 U CN211044076 U CN 211044076U
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Abstract
The embodiment of the utility model discloses electronic equipment, electronic equipment includes: the pressure sensing module and the control mainboard; the pressure sensing module includes: the temperature detection device comprises a pressure sensing module, a temperature detection module, a first adhesive layer and a temperature adjusting module; the temperature detection module and the temperature adjusting module are respectively connected with the control mainboard; the first adhesive layer is arranged between the pressure sensing module and the shell of the electronic equipment; the temperature adjusting module is arranged close to the first glue layer. The temperature detection module is used for detecting the current temperature of the pressure sensing module and sending the temperature to the control mainboard, the control mainboard sends an adjusting signal to the temperature adjusting module according to the preset temperature and the current temperature of the pressure sensing module, the temperature adjusting module is used for adjusting the temperature near the first glue layer, the influence of the external temperature on the deformation of the first glue layer is reduced, and therefore the detection accuracy of the pressure sensing module is guaranteed.
Description
Technical Field
The utility model relates to an electronic equipment technical field especially relates to an electronic equipment.
Background
Currently, with the pursuit of the user for the simplification of the appearance of the electronic device, the pressure sensing technology gradually appears in the electronic device, and has a tendency to gradually develop to replace the physical key.
The main working principle of pressure induction is as follows: the pressure-sensitive material is fixed on the deformation area surface, the pressure is converted into an electric signal through deformation and processed, and when the electric signal is larger than a certain threshold value, the induction function is triggered. The pressure sensing device mainly comprises a pressure sensor, wherein the pressure sensor is contacted with the deformation surface through glue, the force of the deformation surface acting on the pressure sensing material is influenced due to the expansion and contraction effect of the glue, the same force is converted into different values of electric signals at different temperatures, for example, the glue shrinks when the temperature is low, the stress is concentrated when the external force acts on the glue surface, and the shape is enlarged; when the temperature is higher, the glue expands, and when external force acts on the glue, the stress is dispersed, the deformation is small, and the pressure induction is sensitive or insensitive.
SUMMERY OF THE UTILITY MODEL
The utility model provides an electronic equipment aims at solving the technical problem of temperature to the influence of forced induction device.
The utility model discloses an electronic equipment, electronic equipment includes: the pressure sensing module and the control mainboard; the pressure sensing module includes: the temperature detection device comprises a pressure sensing module, a temperature detection module, a first adhesive layer and a temperature adjusting module;
the temperature detection module and the temperature adjusting module are respectively connected with the control mainboard;
the first adhesive layer is arranged between the pressure sensing module and the shell of the electronic equipment;
the temperature adjusting module is arranged close to the first glue layer.
Optionally, the housing has a pressing area, and the pressure sensing module is disposed opposite to the pressing area.
Optionally, the electronic device further comprises a rear cover; the temperature adjusting module is arranged on one side, facing the pressure sensing module, of the rear cover.
Optionally, the temperature adjustment module is disposed between the first glue layer and the housing.
Optionally, the electronic device further includes a second adhesive layer, one side of the temperature adjustment module is connected to the first adhesive layer, and the other side of the temperature adjustment module is connected to the housing through the second adhesive layer.
Optionally, the pressure sensing module is electrically connected to the control motherboard through a connection line.
Optionally, the electronic device further includes a display screen, and the temperature adjustment module is disposed on a side of the display screen facing the pressure sensing module.
Optionally, the temperature regulating module comprises a peltier chip.
Optionally, the thickness of the peltier chip is greater than or equal to 2mm and less than or equal to 7 mm.
Optionally, the temperature regulation module comprises a cooling device and a heating device.
The embodiment of the utility model provides a temperature detection module set up in the forced induction module, and with the control mainboard is connected for detect forced induction module current temperature, and will the temperature sends for the control mainboard, the control mainboard with temperature regulation module is connected, is used for sending the regulation signal to temperature regulation module according to presetting the temperature and this forced induction module current temperature, utilizes temperature regulation module to adjust near the temperature of first glue film, has reduced the influence of ambient temperature to first glue film deformation volume, thereby has guaranteed the detection accuracy of forced induction module.
Drawings
Fig. 1 shows a schematic structural diagram of an electronic device in an embodiment of the present invention;
fig. 2 is a schematic diagram illustrating a specific structure of an electronic device according to an embodiment of the present invention;
fig. 3 is a schematic diagram showing a specific structure of another electronic device in an embodiment of the present invention;
fig. 4 is a schematic diagram showing a specific structure of another electronic device in an embodiment of the present invention;
fig. 5 shows a schematic structural diagram of a peltier chip in an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, of the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The utility model discloses an electronic equipment, electronic equipment includes: the pressure sensing module and the control mainboard; the pressure sensing module includes: the temperature detection device comprises a pressure sensing module, a temperature detection module, a first adhesive layer and a temperature adjusting module; the temperature detection module and the temperature adjusting module are respectively connected with the control mainboard; the first adhesive layer is arranged between the pressure sensing module and the shell of the electronic equipment; the temperature adjusting module is arranged close to the first glue layer.
In the embodiment of the present invention, the electronic device includes a mobile phone, a tablet computer, a navigator, a hearing aid, or a wearable device.
Referring to fig. 1, a schematic diagram of an electronic device in an embodiment of the present invention is shown, where the electronic device includes a pressure sensing module 10 and a control motherboard 20, and the control motherboard 20 is connected to the pressure sensing module 10; the pressure sensing module comprises a pressure sensing module, a temperature detection module, a first adhesive layer and a temperature adjusting module; the first adhesive layer is close to the shell of the electronic equipment, and the pressure sensing module is arranged on one side, far away from the shell of the electronic equipment, of the first adhesive layer.
As a specific example, the pressure sensing module includes a pressure sensor, and the pressure sensor senses the pressure acting on the housing of the electronic device, converts the pressure into an electrical signal, and transmits the electrical signal to other functional devices for processing, so as to trigger the pressure sensing function. It can be understood that the pressure sensing module may also be other pressure sensing devices, and is not limited to a pressure sensor, and therefore, the embodiment of the present invention is not limited specifically.
Specifically, the pressure sensing module is connected with the control mainboard through the temperature detection module and the temperature regulation module respectively, because the temperature detection module is arranged in the pressure sensing module, the temperature detection module can obtain the temperature in the pressure sensing module at any time, because the temperature detection module is connected with the control mainboard, the temperature detection module further transmits the obtained temperature in the pressure sensing module to the control mainboard, the control mainboard stores the proper temperature range of the pressure sensing module in advance, when the temperature in the pressure sensing module received by the control mainboard is not in the proper temperature range, the control mainboard sends a temperature regulation signal to the temperature regulation module, and the temperature regulation module regulates the temperature in the pressure sensing module according to the temperature regulation signal.
As a specific example, when the temperature in the pressure sensing module received by the control motherboard is less than the suitable temperature range, the control motherboard sends a temperature-increasing signal to the temperature adjustment module, and the temperature adjustment module adjusts the temperature in the pressure sensing module according to the temperature-increasing signal, so that the temperature of the pressure sensing module is within the suitable temperature range.
As a specific example, when the temperature in the pressure sensing module received by the control motherboard is greater than the suitable temperature range, the control motherboard sends a temperature reduction signal to the temperature adjustment module, and the temperature adjustment module adjusts the temperature in the pressure sensing module according to the temperature reduction signal, so that the temperature of the pressure sensing module is within the suitable temperature range.
It can be understood that, the suitable temperature range may be a temperature range in which the first adhesive layer is not deformed, and may be specifically determined according to the property of the first adhesive layer, and the embodiment of the present invention does not specifically limit this.
It can be understood that this temperature detection module can be resistance temperature detector, also can be applicable to in this forced induction module and can carry out the device that the temperature detected, the embodiment of the utility model provides a do not do specific restriction to this.
Optionally, the housing has a pressing area, and the pressure sensing module is disposed opposite to the pressing area.
In the embodiment of the utility model provides an in, press the region for user's the region of pressing the action effect, pressure sensing module is used for acquireing user's the signal of pressing.
In the embodiment of the present invention, the housing of the electronic device may include a frame of the electronic device. The electronic equipment can be provided with a pressing area on the frame of the electronic equipment according to actual requirements.
As a specific example, when the electronic device is a mobile phone and the pressure sensing module is used for a volume control key of the mobile phone, the pressure sensing module is disposed opposite to the pressing area on the frame of the mobile phone according to the previous usage habit of the user.
As another specific example, when the electronic device is a child watch, and when the pressure sensing module is used for a power on/off sensing key of the child watch, the pressure sensing module is disposed opposite to a pressing area on a frame of the child watch according to a previous usage habit of a user.
Optionally, the electronic device further comprises a rear cover; the temperature adjusting module is arranged on one side, facing the pressure sensing module, of the rear cover.
In the embodiment of the present invention, referring to fig. 2, a schematic diagram of a partial structure of an electronic device is shown, wherein the temperature detection module 204 is disposed on one side of the pressure sensing module 201, and of course, the temperature detection module 204 can also be disposed in other areas of the pressure sensing module, and fig. 2 only shows a specific embodiment. In the pressure sensing module, the pressure sensing module 201 is adhered to the housing 30 of the electronic device through the first adhesive layer 202, for the electronic device manufacturer, considering the internal layout of the pressure sensing module, a plurality of modules are already arranged in the transverse direction, and the temperature adjusting module 203 can be arranged on one side of the rear cover 40 close to the pressure sensing module. Above setting, can adjust the transverse dimension of forced induction module, make the overall dimension of forced induction module can satisfy this electronic equipment's dimensional requirement.
Specifically, the pressure sensing module may further include a circuit board, the temperature detection module is disposed on the circuit board and connected to the control motherboard 20 through the circuit board, and the temperature adjustment module may also be connected to the control motherboard 20 through the circuit board. Specifically, referring to fig. 2, the circuit board may be connected to the control motherboard 20 through a flexible circuit board 50. It is understood that the circuit board may be connected to the control motherboard 50 in other manners, which is not limited by the embodiment of the present invention.
Optionally, the temperature adjustment module is disposed between the first glue layer and the housing.
In the embodiment of the present invention, referring to fig. 3, a schematic diagram of a partial structure of an electronic device is shown, wherein the temperature detection module 204 is disposed on one side of the pressure sensing module 201, and of course, the temperature detection module 204 can also be disposed in other areas of the pressure sensing module, and fig. 3 only shows a specific embodiment. In the forced induction module, be provided with temperature regulation module 203 between first glue film 202 and electronic equipment's casing 30, when this temperature regulation module's thickness is thinner, can not cause great influence to this forced induction module's inside transverse dimension, set up this temperature regulation module 203 near casing 30, specifically can be: the first adhesive layer 202 is away from one side of the pressure sensing module 201. Because this temperature regulation module is close to this first glue film 202 setting, the temperature near the first glue film 202 of regulation that can be faster, the performance of this forced induction module of assurance that can be better.
Specifically, the pressure sensing module may further include a circuit board, and the temperature detection module is disposed on the circuit board and connected to the control motherboard through the circuit board, and optionally, the temperature detection module may be a temperature detection resistor. The temperature adjustment module may also be connected to the control motherboard 20 via the circuit board. The temperature adjusting module may be connected to the control main board 20 through a wire or a flexible circuit board. Specifically, referring to fig. 3, the circuit board may be connected to the control motherboard 20 through a flexible circuit board 50. It is understood that the circuit board may be connected to the control motherboard 20 in other manners, which is not limited by the embodiment of the present invention.
Optionally, the electronic device further includes a second adhesive layer, one side of the temperature adjustment module is connected to the first adhesive layer, and the other side of the temperature adjustment module is connected to the housing through the second adhesive layer.
The embodiment of the utility model provides an in, in order to improve the stability and the reliability of this forced induction module. The pressure sensing module needs to be reliably fixed on the electronic equipment, and because the temperature adjusting module is arranged close to the first adhesive layer and the first adhesive layer is arranged close to the frame of the electronic equipment, one side of the temperature adjusting module can be connected with the first adhesive layer, and the other side of the temperature adjusting module is connected with the shell through the second adhesive layer to improve the reliability of the pressure sensing module.
Optionally, the pressure sensing module is electrically connected to the control motherboard through a connection line.
The embodiment of the utility model provides an in, this pressure sensing module passes through the connecting wire and is connected with the control mainboard electricity for the pressure signal transmission who will acquire gives the control mainboard, and the control mainboard handles the back to pressure signal, and output control signal carries out corresponding action with other devices of control electronic equipment.
Optionally, the electronic device further includes a display screen, and the temperature adjustment module is disposed on a side of the display screen facing the pressure sensing module.
In the embodiment of the present invention, the display screen can be embedded in the casing of the electronic device as a part of the casing. In the case where the electronic device meets user requirements or meets design requirements, a pressing area may be set on the display screen of the electronic device. As an example, when the electronic device is a mobile terminal with a game function or a mobile terminal capable of installing a game client, in order to simulate a real game environment, the pressure sensing module may be disposed on a display screen of the electronic device, and the electronic device may feedback scene information, such as vibration, simulating a game to a user by sensing a touch force of the user.
In the embodiment of the utility model, electronic equipment still includes the third glue film, one side of temperature regulation module with first glue film is connected, and the opposite side passes through the third glue film with the display screen is connected.
In the embodiment of the utility model, refer to fig. 4, this electronic equipment includes display screen 60, in order to improve the performance of this forced induction module, need be close to this electronic equipment's display screen 60 setting with the forced induction module, a concrete structure does, set up temperature regulation module 203 between first glue film 202 and display screen 60, the opposite side and the pressure sensing module 201 of first glue film 202 bond mutually, in order to guarantee the steadiness of this forced induction module, can bond one side that temperature regulation module 203 is close to the display screen through the third glue film and display screen. It can be understood that the relation between each inside module of this forced induction module can be adjusted under the prerequisite of guaranteeing the functionality, the utility model discloses the implementation does not do specific injecing to this.
Optionally, the temperature regulating module comprises a peltier chip (also known as a peltier chip).
In the embodiment of the present invention, the peltier chip is a heating and cooling chip made by using peltier effect, and referring to fig. 5, the peltier chip has a first end 501, a second end 502, a conductor 503 and a semiconductor 504. Alternatively, the conductor 503 may be copper and the semiconductor may be an N-type or P-type semiconductor. The peltier effect is that when a current passes through a loop formed by different conductors, heat absorption and heat release phenomena occur at the first end 501 and the second end 502 respectively along with the difference of current directions except for the generation of irreversible joule.
As a specific example, the peltier chip is connected to a control board through a conductor, and a CPU (central processing unit) is disposed on the control board, and controls the direction of current flowing inside the peltier chip, thereby controlling cooling and heating of the first end or the second end of the peltier chip. For example, if the temperature near the first adhesive layer 202 is cold, the temperature detection module transmits a varying electrical signal to the CPU, and then the CPU inputs a current and a current magnitude corresponding to the current direction to the peltier chip, so that the first end of the peltier chip cools and the second end heats, and the second end of the peltier chip can increase the temperature near the first adhesive layer 202. If the first gel layer 202 is hotter then the input of current in the opposite direction causes the first end of the peltier chip to heat up and the second end to cool down so that the second end of the peltier chip can lower the temperature near the first gel layer 202. The temperature inside the pressure sensing module is stable through the adjustment, so that the performance of the pressure sensing module is ensured.
Optionally, the thickness of the peltier chip is greater than or equal to 2mm and less than or equal to 7 mm.
The embodiment of the utility model provides an in, give the concrete thickness of peltier piece, can be according to the concrete thickness of this peltier piece, according to the structure needs of forced induction module, with the peltier piece setting in the fit for within range of this forced induction module, concrete position the embodiment of the utility model provides a do not specifically prescribe a limit to.
Optionally, the temperature regulation module comprises a cooling device and a heating device.
The embodiment of the utility model provides an in, this temperature regulation module sets up in the forced induction module, and is close to the setting of first glue film for adjust the temperature near this first glue film, so this temperature regulation module can include refrigeration device and heating device, and this refrigeration device is used for when the temperature near this first glue film is higher, cools down near this first glue film region. The heating device is used for heating the area near the first adhesive layer when the temperature near the first adhesive layer is lower. A particular such heating device may comprise an electrical resistance.
As a specific example, the cooling device includes a first peltier chip, the heating device includes a second peltier chip, the first peltier chip and the second peltier chip are both connected to the control main board, and the control main board provides current to the first peltier chip and the second peltier chip in the same direction, so as to implement cooling or heating. The first end of this first peltier piece is the refrigeration end, and is close to first glue film setting, and when the temperature near this first glue film was higher, accessible control mainboard provided the electric current to first peltier piece, and under the effect of this electric current, the first end of first peltier piece began to refrigerate to adjust the temperature near first glue film. The second end of this second peltier piece is the refrigeration end, and is close to first glue film setting, and when the temperature near this first glue film was lower, accessible control mainboard provided the electric current to first peltier piece, and under the effect of this electric current, the second end of second peltier piece began to heat to adjust the temperature near first glue film.
It can be understood that the embodiment of the present invention does not specifically limit the cooling device or the heating device, as long as the cooling or heating device has the size capable of adapting to the pressure sensing module.
The embodiment of the utility model provides a temperature detection module set up in the forced induction module, and with the control mainboard is connected for detect forced induction module current temperature, and will the temperature sends for the control mainboard, the control mainboard with temperature regulation module is connected, is used for sending the regulation signal to temperature regulation module according to presetting the temperature and this forced induction module current temperature, utilizes temperature regulation module to adjust near the temperature of first glue film, has reduced the influence of ambient temperature to first glue film deformation volume, thereby has guaranteed the detection accuracy of forced induction module. It will be appreciated that the development of materials technology has led to the development of pressure sensitive materials that are not temperature sensitive, thereby eliminating the use of temperature compensating materials.
While preferred embodiments of the present invention have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the invention.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.
While the embodiments of the present invention have been described with reference to the accompanying drawings, the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many modifications may be made by one skilled in the art without departing from the spirit and scope of the present invention as defined in the appended claims.
Claims (10)
1. An electronic device, characterized in that the electronic device comprises: the pressure sensing module and the control mainboard; the pressure sensing module includes: the temperature detection device comprises a pressure sensing module, a temperature detection module, a first adhesive layer and a temperature adjusting module;
the temperature detection module and the temperature adjusting module are respectively connected with the control mainboard;
the first adhesive layer is arranged between the pressure sensing module and the shell of the electronic equipment;
the temperature adjusting module is arranged close to the first glue layer.
2. The electronic device of claim 1, wherein the housing has a pressing area, and the pressure sensing module is disposed opposite the pressing area.
3. The electronic device of claim 1, further comprising a back cover; the temperature adjusting module is arranged on one side, facing the pressure sensing module, of the rear cover.
4. The electronic device of claim 1, wherein the temperature regulation module is disposed between the first glue layer and the housing.
5. The electronic device of claim 4, further comprising a second adhesive layer, wherein one side of the temperature adjustment module is connected to the first adhesive layer, and the other side of the temperature adjustment module is connected to the housing through the second adhesive layer.
6. The electronic device of claim 1, wherein the pressure sensing module is electrically connected to the control motherboard by a connecting wire.
7. The electronic device of claim 1, further comprising a display screen, wherein the temperature adjustment module is disposed on a side of the display screen facing the pressure sensing module.
8. The electronic device of claim 1, wherein the temperature regulation module comprises a peltier chip.
9. The electronic device of claim 8, wherein the thickness of the peltier chip is greater than or equal to 2mm and less than or equal to 7 mm.
10. The electronic device of any of claims 1-9, wherein the temperature regulation module comprises a cooling device and a heating device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922380353.XU CN211044076U (en) | 2019-12-25 | 2019-12-25 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922380353.XU CN211044076U (en) | 2019-12-25 | 2019-12-25 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211044076U true CN211044076U (en) | 2020-07-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922380353.XU Active CN211044076U (en) | 2019-12-25 | 2019-12-25 | Electronic device |
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| CN (1) | CN211044076U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112859955A (en) * | 2021-01-22 | 2021-05-28 | 维沃移动通信有限公司 | Temperature control device and temperature control method thereof |
-
2019
- 2019-12-25 CN CN201922380353.XU patent/CN211044076U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112859955A (en) * | 2021-01-22 | 2021-05-28 | 维沃移动通信有限公司 | Temperature control device and temperature control method thereof |
| CN112859955B (en) * | 2021-01-22 | 2022-08-26 | 维沃移动通信有限公司 | Temperature control device and temperature control method thereof |
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