CN211036172U

CN211036172U - Online electrolytic regeneration recovery system for alkaline cyanide-free copper plating solution

Info

Publication number: CN211036172U
Application number: CN201921878621.4U
Authority: CN
Inventors: 徐金来; 彭梓根; 赵国鹏; 胡耀红; 廖磊华
Original assignee: GUANGZHOU HONWAY TECHNOLOGY CORP
Current assignee: GUANGZHOU HONWAY TECHNOLOGY CORP
Priority date: 2019-11-04
Filing date: 2019-11-04
Publication date: 2020-07-17
Anticipated expiration: 2029-11-04

Abstract

The utility model relates to an electroplate liquid recovery plant field especially relates to online electrolysis regeneration recovery system of alkaline cyanide-free copper plating liquid, including the electrolysis trough, the electrolysis trough passes through pipeline and plating bath intercommunication, be equipped with cathode chamber and anode chamber in the electrolysis trough, the anode chamber sets up in the cathode chamber, the cathode chamber separates through cation exchange membrane with the anode chamber, be equipped with the cathode plate in the cathode chamber, be equipped with the anode plate in the anode chamber, the pipeline is equipped with liquid flow drive arrangement, this system has simple structure, it converts monovalent copper ion into monovalent copper ion to have realized that divalent copper ion converts to, and avoid adding the reductant and convert divalent copper ion into monovalent copper ion, thereby do not accumulate reductant result, make the plating bath effect keep, the cost is reduced.

Description

Online electrolytic regeneration recovery system for alkaline cyanide-free copper plating solution

Technical Field

The utility model relates to an electroplate liquid recovery plant field especially relates to online electrolytic regeneration recovery system of alkaline cyanide-free copper plating liquid.

Background

The cyanide-free alkaline copper plating solution has the characteristics of good dispersibility, low porosity and high electroplating efficiency, and monovalent copper ions are converted into divalent ions after the plating solution is used for a long time, so that the displacement capacity of the plating solution is poor, and the performance of the plating solution is reduced. In order to recycle the plating solution, a chemical reduction method is generally used, in which a reducing agent is added to the plating solution to reduce divalent copper ions into monovalent copper ions, and the method has the characteristic of high conversion efficiency, but the chemical reduction method has the disadvantages that: the reducing agent can generate reduction products after reducing the copper plating solution, and the reduction products not only increase the concentration of impurities in the plating solution and increase the baume degree of the plating solution, but also have adverse effects on the plating solution.

Disclosure of Invention

To the technical problem who exists among the prior art, the utility model aims at: the on-line electrolytic regeneration recovery system for the alkaline cyanide-free copper plating solution is provided, divalent copper ions can be converted into monovalent copper ions, the effect of the plating solution is kept, and the cost is reduced.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the on-line electrolytic regeneration recovery system for the alkaline cyanide-free copper plating solution comprises an electrolytic bath, wherein the electrolytic bath is communicated with an electroplating bath through a pipeline, a cathode chamber and an anode chamber are arranged in the electrolytic bath, the anode chamber is arranged in the cathode chamber, the cathode chamber is separated from the anode chamber through a cation exchange membrane, a cathode plate is arranged in the cathode chamber, an anode plate is arranged in the anode chamber, and a liquid flow driving device is arranged in the pipeline.

Furthermore, a plurality of anode chambers enclosed by cation exchange membranes are arranged in the electrolytic cell, cathode chambers are enclosed between the electrolytic cell and the anode chambers, and a cathode plate is arranged around each anode chamber.

Furthermore, the electrolytic cell is a cubic electrolytic cell, the anode chambers are uniformly distributed in the electrolytic cell, the anode chambers are cubic anode chambers, and the anode plates are arranged in the middle of the anode chambers.

Further, liquid flow drive arrangement is the filter, and the liquid outlet of electrolysis trough passes through first pipe connection in the inlet of filter, and the liquid outlet of filter passes through the second pipe connection in the inlet of electrolysis trough, and the liquid outlet of plating bath passes through the inlet of third pipe connection in the filter, and the liquid outlet of filter passes through the fourth pipe connection in the inlet of plating bath, is equipped with first solenoid valve on the first pipeline, is equipped with the second solenoid valve on the second pipeline, is equipped with the third solenoid valve on the third pipeline, is equipped with the fourth solenoid valve on the fourth pipeline.

Furthermore, two ends of the same circulating pipeline are respectively inserted into two positions of the cathode chamber, and the circulating pipeline is provided with a circulating pump.

Furthermore, an automatic control center is further arranged, an oxidation-reduction potentiometer and a cathode liquid level meter are arranged in the cathode chamber, an anode liquid level meter is arranged in the anode chamber, and the oxidation-reduction potentiometer, the cathode liquid level meter, the anode liquid level meter, the circulating pump, the filter, the first electromagnetic valve, the second electromagnetic valve, the third electromagnetic valve and the fourth electromagnetic valve are all in signal connection with the automatic control center.

Further, the negative plate is a DSA cathode net or a graphite cathode net.

Furthermore, the anode plate is made of pure copper.

In general, the utility model has the advantages as follows:

alkaline cyanide-free copper plating solution on-line electrolysis regeneration recovery system, including the electrolysis trough, the electrolysis trough passes through pipeline and plating bath intercommunication, be equipped with cathode chamber and anode chamber in the electrolysis trough, the anode chamber sets up in the cathode chamber, cathode chamber and anode chamber separate through cation exchange membrane, be equipped with the cathode plate in the cathode chamber, be equipped with the anode plate in the anode chamber, the pipeline is equipped with liquid flow drive arrangement, this system has simple structure, bivalent copper ion conversion becomes monovalent copper ion, and avoid adding the reductant and convert bivalent copper ion into monovalent copper ion, thereby do not accumulate reductant product, make the plating bath effect keep, and the cost is reduced simultaneously.

Drawings

FIG. 1 is a schematic view of the three-dimensional structure of the on-line electrolytic regeneration recovery system for alkaline cyanide-free copper plating solution of the present invention.

Wherein, fig. 1 includes:

1 is an automatic control center, 2 is a circulating pump, 3 is an electrolytic tank, 4 is a cathode chamber, 5 is a DSA cathode mesh, 6 is an anode chamber, 7 is an ion exchange membrane, 8 is an anode plate, 9 is a pipeline, 10 is an oxidation-reduction potentiometer, 11 is an electroplating tank, 12 is a filter, 13 is a fourth electromagnetic valve, 14 is a first electromagnetic valve, 15 is a second electromagnetic valve, and 16 is a third electromagnetic valve.

Detailed Description

The present invention will be described in further detail below.

As shown in figure 1, the on-line electrolytic regeneration recovery system for alkaline cyanide-free copper plating solution comprises an electrolytic bath 3, wherein the electrolytic bath 3 is communicated with an electroplating bath 11 through a pipeline 9, a cathode chamber 4 and an anode chamber 6 are arranged in the electrolytic bath 3, the anode chamber 6 is arranged in the cathode chamber 4, the cathode chamber 4 is separated from the anode chamber 6 through a cation exchange membrane 7, a cathode plate is arranged in the cathode chamber 4, an anode plate 8 is arranged in the anode chamber 6, and the cathode plate is a DSA cathode mesh 5 or a graphite cathode mesh. The anode plate 8 is an anode plate 8 of pure copper material. The pipeline 9 is provided with a liquid flow driving device, the system has simple structure, realizes the conversion of bivalent copper ions into monovalent copper ions, avoids adding a reducing agent and converts the bivalent copper ions into monovalent copper ions, thereby not accumulating the reducing agent product, keeping the plating solution effect and reducing the cost.

A plurality of anode chambers 6 enclosed by cation exchange membranes 7 are arranged in the electrolytic cell 3, cathode chambers 4 are enclosed between the electrolytic cell 3 and the anode chambers 6, and a cathode plate is arranged around each anode chamber 6. The electrolytic cell 3 is a cubic electrolytic cell 3, the anode chambers 6 are uniformly distributed in the electrolytic cell 3, the anode chambers 6 are cubic anode chambers 6, and the anodeThe plate 8 is disposed in the middle of the anode chamber 6. The specific structure is that a square frame is arranged, and an ion exchange membrane 7 which only allows specific ions to pass through is fixed on the outer surface of the frame. The ion exchange membrane 7 is a cation exchange membrane having selective permeability and capable of blocking OH^-And Cl^-The water migrates to the cathode area, so that the cathode electrolysis efficiency is improved. The four anode chambers 6 are identical in structure. As shown in fig. 1, the anode chamber 6 is square, and an anode plate 8 is arranged at the central axis of the anode chamber; the anode plate 8 is connected with the automatic control center 1 through a conductive copper bar. DSA cathode nets 5 are arranged in the cathode chamber 4, in the overlooking direction, the DSA cathode nets 5 are in a grid shape of two rows and two columns, and an anode chamber 6 is distributed in each grid. The DSA cathode mesh 5 is connected with the automatic control center 1 through a conductive copper bar.

The liquid flow driving device is a filter 12, a liquid outlet of the electrolytic bath 3 is connected with a liquid inlet of the filter 12 through a first pipeline, a liquid outlet of the filter 12 is connected with a liquid inlet of the electrolytic bath 3 through a second pipeline, a liquid outlet of the electroplating bath 11 is connected with a liquid inlet of the filter 12 through a third pipeline, a liquid outlet of the filter 12 is connected with a liquid inlet of the electroplating bath 11 through a fourth pipeline, a first electromagnetic valve 14I is arranged on the first pipeline, a second electromagnetic valve 15 II is arranged on the second pipeline, a third electromagnetic valve 16 III is arranged on the third pipeline, and a fourth electromagnetic valve 13 IV is arranged on the fourth pipeline. When the electromagnetic valves I and IV are opened, the alkaline copper plating regeneration liquid flows from the electroplating bath 3 to the electroplating bath 11, and when the electromagnetic valves II and III are opened, the alkaline copper plating liquid flows from the electroplating bath 11 to the electroplating bath 3.

Two ends of the same circulating pipeline are respectively inserted into two positions of the cathode chamber 4, and the circulating pipeline is provided with a circulating pump 2. Forming a liquid circulation loop.

The automatic control center 1 is also provided with an automatic control center 1, the automatic control center 1 is provided with P L C, an oxidation-reduction potentiometer 10 and a cathode liquid level meter are arranged in the cathode chamber 4, an anode liquid level meter is arranged in the anode chamber 6, the oxidation-reduction potentiometer 10, the cathode liquid level meter, the anode liquid level meter, a circulating pump 2, a filter 12, a first electromagnetic valve 14, a second electromagnetic valve 15, a third electromagnetic valve 16 and a fourth electromagnetic valve 13 are all in signal connection with the automatic control center 1, the automatic control center 1 controls the opening and closing of the first electromagnetic valve, the second electromagnetic valve, the third electromagnetic valve and the fourth electromagnetic valve 13 according to the reading of the anode liquid level meter and the cathode liquid level meter so as to control the inlet and the outlet of liquid, the electrolytic progress of the alkaline copper plating regeneration liquid in the.

The specific operation process is as follows:

the pipeline 9, the automatic control center 1, the filter 12 and the circulating pump 2 are correctly installed. The circuit of the automatic control center 1 is connected, the electrolytic bath 3 is loaded, the electroplating bath 11 is connected, the operation process of the utility model is as follows:

(1) and opening a switch of the automatic control center 1, entering a setting page of the touch screen, setting parameters of related control points, and setting working currents of step electrolysis at current densities of 0.5A/dm2, 0.1A/dm2 and 0.05A/dm2 respectively. The rectifier is connected with the automatic control center 1, the negative plate and the positive plate 8 are both connected with the rectifier, and the current density is adjusted through the rectifier.

(2) After setting each parameter, starting an automatic button, formally entering a working state by the system, starting electrolysis, and finishing regeneration of the copper plating solution in the cathode chamber 4 when the reading of the oxidation reduction potentiometer 10 in the cathode chamber 4 reaches a set value. The system enters the next cycle. When the reading of the oxidation-reduction potentiometer 10 reaches a set value, the circulation pump 2 is started, and the circulation pump 2 is stopped until the electrolysis is completed.

(3) When a cycle is completed, the circulation pump 2 stops working, at this time, the electromagnetic valves I and IV on the connecting pipeline 9 of the liquid outlet of the electrolytic bath 3 and the liquid inlet of the filter 12 and the connecting pipeline 9 of the liquid inlet of the electroplating bath 11 and the liquid outlet of the filter 12 are opened, and simultaneously, the filter 12 is started to start transferring the copper plating regeneration liquid in the electrolytic bath 3 until the liquid level reaches the lower limit of the cathode liquid level meter and the anode liquid level meter. Then, the connecting pipeline 9 of the liquid outlet of the electroplating bath 11 and the liquid inlet of the filter 12 and the electromagnetic valves II and III on the connecting pipeline 9 of the liquid inlet of the electrolytic bath 3 and the liquid outlet of the filter 12 are opened simultaneously, and the electroplating liquid is pumped into the electrolytic bath 3 until the liquid level reaches the upper limit of the cathode liquid level meter and the anode liquid level meter. At this point, the next cycle begins.

In addition to the manner mentioned in this example, the number and arrangement of the cathode chambers 4 and anode chambers 6 can be changed, for example, two rows of three columns of anode chambers 6 are arranged in a rectangular cathode chamber 4, or three rows of three columns of anode chambers 6 are arranged. The DSA cathode mesh 5 may be rectangular only and surround the plurality of anode cells 6. These variations are all within the scope of the present invention.

The above embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be equivalent replacement modes, and all are included in the scope of the present invention.

Claims

1. The on-line electrolytic regeneration recovery system for the alkaline cyanide-free copper plating solution is characterized in that: the device comprises an electrolytic cell, wherein the electrolytic cell is communicated with an electroplating bath through a pipeline, a cathode chamber and an anode chamber are arranged in the electrolytic cell, the anode chamber is arranged in the cathode chamber, the cathode chamber is separated from the anode chamber through a cation exchange membrane, a cathode plate is arranged in the cathode chamber, an anode plate is arranged in the anode chamber, and a liquid flow driving device is arranged on the pipeline.

2. The on-line electrolytic regeneration recovery system for alkaline cyanide-free copper plating solution according to claim 1, characterized in that: a plurality of anode chambers enclosed by cation exchange membranes are arranged in the electrolytic cell, cathode chambers are enclosed between the electrolytic cell and the anode chambers, and a cathode plate is arranged around each anode chamber.

3. The on-line electrolytic regeneration recovery system for alkaline cyanide-free copper plating solution according to claim 2, characterized in that: the electrolytic cell is a cubic electrolytic cell, the anode chambers are uniformly distributed in the electrolytic cell, the anode chambers are cubic anode chambers, and the anode plates are arranged in the middle of the anode chambers.

4. The on-line electrolytic regeneration recovery system for alkaline cyanide-free copper plating solution according to claim 1, characterized in that: the liquid flow driving device is a filter, a liquid outlet of the electrolytic bath is connected to a liquid inlet of the filter through a first pipeline, a liquid outlet of the filter is connected to a liquid inlet of the electrolytic bath through a second pipeline, a liquid outlet of the electrolytic bath is connected to a liquid inlet of the filter through a third pipeline, a liquid outlet of the filter is connected to a liquid inlet of the electrolytic bath through a fourth pipeline, a first electromagnetic valve is arranged on the first pipeline, a second electromagnetic valve is arranged on the second pipeline, a third electromagnetic valve is arranged on the third pipeline, and a fourth electromagnetic valve is arranged on the fourth pipeline.

5. The on-line electrolytic regeneration recovery system for alkaline cyanide-free copper plating solution according to claim 1, characterized in that: two ends of the same circulating pipeline are respectively inserted into two positions of the cathode chamber, and the circulating pipeline is provided with a circulating pump.

6. The on-line electrolytic regeneration recovery system for alkaline cyanide-free copper plating solution according to claim 5, characterized in that: the device is characterized by further comprising an automatic control center, wherein an oxidation-reduction potentiometer and a cathode liquid level meter are arranged in the cathode chamber, an anode liquid level meter is arranged in the anode chamber, and the oxidation-reduction potentiometer, the cathode liquid level meter, the anode liquid level meter, a circulating pump, a filter, a first electromagnetic valve, a second electromagnetic valve, a third electromagnetic valve and a fourth electromagnetic valve are all in signal connection with the automatic control center.

7. The on-line electrolytic regeneration recovery system for alkaline cyanide-free copper plating solution according to claim 1, characterized in that: the cathode plate is a DSA cathode net or a graphite cathode net.

8. The on-line electrolytic regeneration recovery system for alkaline cyanide-free copper plating solution according to claim 1, characterized in that: the anode plate is made of pure copper.