CN211019488U

CN211019488U - L ED chip mounter PCB board positioning mechanism

Info

Publication number: CN211019488U
Application number: CN201922183615.3U
Authority: CN
Inventors: 熊建平
Original assignee: Sichuan Ounuola Optoelectronics Technology Co ltd
Current assignee: Sichuan Ounuola Optoelectronics Technology Co ltd
Priority date: 2019-12-09
Filing date: 2019-12-09
Publication date: 2020-07-14
Anticipated expiration: 2029-12-09

Abstract

The utility model discloses a L ED chip mounter PCB board positioning mechanism, include the conveying groove that constitutes by two curb plates, be equipped with a plurality of pivots on the curb plate, the cover has the frictional layer that the one deck is surperficial rough in the pivot, establish the backup pad in the transmission inslot, backup pad length matches with the PCB board of conveying, the backup pad is equipped with the breach with pivot handing-over department, the backup pad bottom is equipped with a plurality of lift pillars, backup pad one end is equipped with preceding baffle, elevating movement is made to preceding baffle, the backup pad other end is equipped with the backplate, straight line and elevating movement are made to the backplate, the separation blade is established at the interval on the regional curb plate of backup pad.

Description

L ED chip mounter PCB board positioning mechanism

Technical Field

The utility model belongs to the surface mounting technology especially relates to L ED chip mounter PCB board positioning mechanism.

Background

Surface Mount Technology (SMT) is the most popular Technology and process in the electronic assembly industry. The surface-mounted component (SMC/SMD, chip component in chinese) with no pins or short leads is mounted on the surface of a Printed Circuit Board (PCB) or other substrate, and then soldered and mounted by means of reflow soldering or dip soldering.

The surface mounting device is arranged behind a dispensing machine or a screen printing machine, and is accurately placed on a PCB (printed Circuit Board) pad by moving a mounting head. The chip mounter is electronic manufacturing equipment which has the largest value proportion and the highest technical content in the whole SMT production equipment and has the largest influence on the production capacity and efficiency of the whole assembly.

The conveying mechanism of the chip mounter is a component which can not be lost in the chip mounter, the traditional chip mounter has relatively single positioning on a PCB during chip mounting, the effect is not good when a mounting head carries out chip mounting, and the positioning mechanism of the chip mounter has an improved space on the existing basis.

SUMMERY OF THE UTILITY MODEL

The utility model aims to optimize current L ED chip mounter positioning mechanism, provide a L ED chip mounter PCB board positioning mechanism that the paster is convenient, location effect is good.

L ED chip mounter PCB board positioning mechanism, include the transfer chute that comprises two blocks of curb plates, be equipped with a plurality of pivots on the curb plate, the cover has the frictional layer of one deck roughness in surface in the pivot, establish the backup pad in the transfer chute, backup pad length matches with the PCB board of conveying, backup pad and pivot handing-over department are equipped with the breach, the backup pad bottom is equipped with a plurality of lift pillars, backup pad one end is equipped with preceding baffle, elevating movement is made to preceding baffle, the backup pad other end is equipped with the backplate, the backplate is made sharp and elevating movement, the separation blade is established at the interval on the regional curb plate of backup pad.

And the rotating shafts on the side plates are synchronized through gears and are connected with the motor through the gears to move.

The utility model discloses a theory of operation: the PCB board that comes from last one-level transport mechanism gets into the conveying inslot, the pivot rotates, epaxial frictional layer of pivot drives PCB and reaches backup pad upper portion, preceding baffle rises and carries on spacingly, pivot stall, the backplate rises and carries out linear motion, the baffle is close to forward, make PCB both ends be close to preceding baffle and backplate, the backup pad rises and drives PCB and be close to the separation blade, make backup pad and separation blade centre gripping PCB, paste the suction head and absorb the part and carry out the paster, after the paster is accomplished, the backup pad descends and makes PCB arrange in the pivot, preceding baffle descends, backplate decline linear motion return, the pivot rotates and drives PCB board to next transport mechanism.

The utility model has the advantages that: utilize preceding baffle, backplate, backup pad and separation blade to carry out the centre gripping to PCB to reach the accurate location to PCB, at this moment because PCB's the highest position is in a plane with the highest position of curb plate, it is more convenient to paste the pick-up and carry out the paster.

Drawings

FIG. 1 is a schematic top view of a positioning mechanism of a PCB board of an L ED chip mounter;

fig. 2 is a front view structural schematic diagram of a positioning mechanism of a PCB board of an L ED chip mounter.

Detailed Description

Embodiment 1, it is right to combine fig. 1, fig. 2 below the utility model discloses make further explanation, L ED chip mounter PCB board positioning mechanism, include the transfer chute that comprises two blocks of curb plates 1, extend a plurality of pivots 2 in opening a plurality of through-holes that have from the curb plate, the cover has the frictional layer of one deck roughness in surface in the pivot, establish backup pad 3 in the transfer chute, backup pad length matches with the PCB board of conveying, the backup pad is equipped with the square notch that makes things convenient for the pivot to expose with pivot handing-over department, the backup pad bottom is equipped with a plurality of lift pillars 4, backup pad one end is equipped with preceding baffle 5, preceding baffle bottom has lift pillar to drive preceding baffle and make elevating movement, the backup pad other end is equipped with backplate 6, the backplate bottom is equipped with the lift post, the lift post is arranged in can make linear motion's slider, thereby drive backplate and make sharp and elevating movement, interval is equipped with spacing and the separation blade 7 of centre gripping on the regional curb plate of backup pad, pivot on the curb plate is synchronized to make the pivot rotate to a direction through the gear, and.

Claims

The positioning mechanism for the PCB of the L ED chip mounter comprises a conveying groove formed by two side plates (1), and is characterized in that a plurality of rotating shafts (2) are arranged on the side plates, a friction layer with a rough surface is sleeved on each rotating shaft, a supporting plate (3) is arranged in the conveying groove, the length of the supporting plate is matched with that of a conveyed PCB, a gap is formed in the joint of the supporting plate and the rotating shafts, a plurality of lifting support columns (4) are arranged at the bottom of the supporting plate, a front baffle (5) is arranged at one end of the supporting plate and moves up and down, a rear baffle (6) is arranged at the other end of the supporting plate and moves linearly and up and down, and baffle plates (7.
2. The L ED PCB positioning mechanism of chip mounter according to claim 1, wherein the shafts on the side plates are synchronized through gears and connected to the motor for movement through the gears.