CN211017344U - Vehicle-mounted antenna module and vehicle-mounted communication terminal - Google Patents
Vehicle-mounted antenna module and vehicle-mounted communication terminal Download PDFInfo
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- CN211017344U CN211017344U CN201921834907.2U CN201921834907U CN211017344U CN 211017344 U CN211017344 U CN 211017344U CN 201921834907 U CN201921834907 U CN 201921834907U CN 211017344 U CN211017344 U CN 211017344U
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Abstract
The application provides a vehicle-mounted antenna module and a vehicle-mounted communication terminal. The vehicle-mounted antenna module and the vehicle-mounted communication terminal both comprise heat exchange modules, each heat exchange module comprises a cold side and a hot side, the temperature of the cold side is lower than that of the hot side, and the heat exchange modules are used for conducting heat from the cold side to the hot side and forming low temperature on the cold side. The heat-generating element can be cooled by attaching the cold-side surface of the heat exchange module to the heat-generating element of the vehicle-mounted antenna module or the vehicle-mounted communication terminal. The heat exchange module can be connected with a soaking metal plate, a radiator or a metal shell of a vehicle, and the heat absorbed by the heat exchange module can be conducted to the hot side and transferred to the environment by the soaking metal plate, the radiator or the metal shell of the vehicle. Therefore, the technical scheme provided by the application can reduce the temperature of the heating element when the heating element operates in a high-temperature environment, so that the heating element can stably operate in the high-temperature environment.
Description
Technical Field
The application relates to the technical field of electronic component heat dissipation, in particular to a vehicle-mounted antenna module and a vehicle-mounted communication terminal capable of reducing the operating temperature of a heating element in a high-temperature environment.
Background
The development of mobile communication technologies, such as the fifth generation mobile communication technology (5G), has promoted the development of internet of vehicles (connected car) and autonomous driving technologies. By additionally arranging the 5G antenna for the automobile, the automobile can be connected to a high-speed and low-delay 5G network, the mutual interconnection between the automobile and between the automobile and other communication equipment is realized, and the automobile antenna has a wide application prospect in the aspects of improving the driving experience of the automobile, driving safety and the like.
Fig. 1 is a schematic view of an automobile with an antenna attached. As shown in fig. 1, in order to improve the quality of communication between the automobile and the outside, an antenna and electrical components for processing an antenna signal are generally mounted on the roof of the automobile, and these electrical components include a Printed Circuit Board (PCB) and a crystal module (including various types of chips, etc.) mounted on the PCB for processing the antenna signal. Because the running and parking environments of the automobile are mostly outdoor, the automobile roof can be directly exposed to outdoor sunlight and has higher temperature, when the temperature of the automobile roof rises, the crystal module arranged on the automobile roof can generate abnormal phenomena such as overheating and frequency reduction, if the temperature of the automobile roof reaches the threshold temperature of the crystal module (for example, the threshold temperature of a semiconductor chip is usually 105 ℃), the crystal module can be overheated, self-protected and even damaged, and therefore, the crystal module arranged on the automobile roof can stably work only by effectively radiating heat.
At present, the heat dissipation of the heating elements such as the crystal module mainly adopts an air-cooling heat dissipation mode, that is, a fan is additionally arranged on the heating elements, the air flow near the heating elements is accelerated by the fan, and the heat generated by the heating elements is taken away for heat dissipation. The air-cooled heat dissipation method cannot make the temperature of the heating element reach below the ambient temperature, and the higher the ambient temperature is, the higher the temperature of the heating element is, and the worse the heat dissipation effect of the air-cooled heat dissipation method is. Therefore, the air-cooled heat dissipation cannot meet the heat dissipation requirement of the heating element when the temperature of the car roof reaches or approaches to the threshold temperature of the heating element.
SUMMERY OF THE UTILITY MODEL
The application provides a vehicle-mounted antenna module and a vehicle-mounted communication terminal, which can reduce the temperature of a heating element when the heating element operates in a high-temperature environment.
In a first aspect, the present application provides a vehicle antenna module, comprising: the antenna comprises an antenna shell, a printed circuit board module, a heat exchange module, a soaking metal plate and radiating fins; the heat exchange module comprises a cold side and a hot side, the temperature of the cold side is lower than that of the hot side, and the heat exchange module is used for conducting heat from the cold side to the hot side; the printed circuit board module comprises a printed circuit board, an antenna and a crystal module, wherein the antenna and the crystal module are mounted on the printed circuit board; the soaking metal plate is attached to the hot side surface; the radiating fins are attached to one side of the soaking metal plate, which is back to the heat exchange module; the antenna shell is arranged on one side, facing the heat exchange module, of the soaking metal plate, the soaking metal plate and the antenna shell are provided with fixing structures matched with each other, and the soaking metal plate and the antenna shell are fixedly connected through the fixing structures to seal the printed circuit board module and the heat exchange module in the antenna shell.
The utility model provides a technical scheme, utilize heat exchange module can follow the characteristic of heat conduction from the cold side to the hot side, with cold side and the laminating of printed circuit board module, with hot side and the laminating of soaking metal sheet, make heat exchange module can absorb the heat that produces such as crystal module on the printed circuit board module at the cold side, cool off the printed circuit board module, can give the soaking metal sheet with the heat transfer who absorbs at the hot side, utilize soaking metal sheet and fin to give off the heat in the environment. Therefore, the technical scheme provided by the application can reduce the temperature of the heating elements such as the crystal module and the like when the heating elements operate in a high-temperature environment, so that the temperature of the heating elements can be lower than the ambient temperature, and the heating elements can also stably operate even if the ambient temperature is increased to the threshold temperature of the heating elements.
Optionally, the crystal module is arranged on a side of the printed circuit board facing the heat exchange module; and the cold side of the crystal module is in fit connection. From this, heat exchange module can directly laminate with the crystal module, makes heat exchange module can directly be crystal module cooling.
Optionally, the printed circuit board is attached to the cold side; the crystal module is arranged on one side of the printed circuit board, which is back to the heat exchange module. Therefore, the heat exchange module can be attached to the printed circuit board, so that a heat exchange channel is established between the crystal module and the heat exchange module through the printed circuit board, and the heat exchange module can indirectly cool the crystal module and other heating elements in a printed circuit board cooling mode.
Optionally, the soaking metal plate is recessed towards a direction far away from the heat exchange module to form a first groove; the heat exchange module is arranged in the first groove, and the hot side surface is attached to the bottom of the first groove; the radiating fins are sunken towards the direction far away from the soaking metal plate to form second grooves matched with the first grooves in shape; the first groove is embedded into the second groove, and the first groove is tightly attached to the second groove. Therefore, the heat exchange module, the soaking metal plate and the radiator are connected in a nested mode through the first groove and the second groove, the contact area among the heat exchange module, the soaking metal plate and the radiator is increased, and the improvement of the heat transfer efficiency among the heat exchange module, the soaking metal plate and the radiator is facilitated.
Optionally, a heat conducting medium is arranged between the heat exchange module and the crystal module, and the cold side surface is attached to the crystal module through the heat conducting medium. The heat-conducting medium can fill the gap between the heat exchange module and the crystal module, and the heat transfer efficiency between the cold side surface and the crystal module is improved.
Optionally, the antenna is arranged on a side of the printed circuit board facing away from the heat exchange module. Therefore, the antenna is directly exposed under the antenna shell, no other obstruction exists between the antenna and the antenna shell, and the signal strength of the antenna and external equipment in communication is not affected.
Optionally, the heat exchange module is a thermoelectric cooler (TEC). Thus, by utilizing the peltier effect of the thermoelectric cooler, the cold side and the hot side can be formed by energizing the peltier effect, wherein the temperature of the cold side can be much lower than the ambient temperature, and therefore, the temperature of the heat generating element can be reduced by using the cold side to cool the heat generating element, and the temperature of the heat generating element can be greatly reduced.
Optionally, the thermoelectric cooler comprises a plurality of thermocouple pairs formed by joining an N-type semiconductor and a P-type semiconductor; a plurality of thermocouple pairs are arranged between the two ceramic electrodes; the thermocouple pair is used to transfer heat from the cold side to the hot side when an electric current is passed through it.
Optionally, the heat sink is provided with a fin structure on one side back to the soaking metal plate; the fin structure comprises a plurality of fins, and the fins extend towards the direction far away from the soaking metal plate; the plurality of fins are arranged in parallel at intervals. The fin structure can increase the heat dissipation area of the heat dissipation sheet and improve the heat dissipation efficiency of the heat dissipation sheet.
In a second aspect, the present application provides a vehicle-mounted communication terminal, including: the terminal comprises a terminal shell, a printed circuit board module, a heat conducting medium and a heat exchange module; the terminal shell is arranged on the inner side of a metal shell of the vehicle and provided with an opening, and the opening is arranged facing the metal shell; the heat exchange module is arranged in the open hole, the heat exchange module comprises a cold side and a hot side, the cold side is arranged facing the terminal shell, the hot side is arranged facing the metal shell, the temperature of the cold side is lower than that of the hot side, and the heat exchange module is used for conducting heat from the cold side to the hot side; the printed circuit board module is arranged in the terminal shell and comprises a printed circuit board, an antenna and a crystal module, wherein the antenna and the crystal module are arranged on the printed circuit board; the heat-conducting medium is arranged between the heat exchange module and the metal shell, and the hot side face is attached to the metal shell through the heat-conducting medium.
The technical scheme that this application provided, utilize heat exchange module can follow the characteristic of heat to hot side conduction from the cold side, with cold side and the laminating of printed circuit board module, with the laminating of the metal casing of hot side and vehicle, regard metal casing as soaking metal sheet and radiator, make heat exchange module can absorb the heat that produces such as crystal module on the printed circuit board module at the cold side, cool off the printed circuit board module, can give the metal casing with the heat transfer of absorption at the hot side, give off the heat in the environment through the metal casing. Therefore, the technical scheme provided by the application can reduce the temperature of the heating elements such as the crystal module and the like when the heating elements operate in a high-temperature environment, so that the temperature of the heating elements can be lower than the ambient temperature, and the heating elements can also stably operate even if the ambient temperature is increased to the threshold temperature of the heating elements.
Optionally, the crystal module is arranged on a side of the printed circuit board facing the heat exchange module; and the cold side of the crystal module is in fit connection. From this, heat exchange module can directly laminate with the crystal module, makes heat exchange module can directly be crystal module cooling.
Optionally, the printed circuit board is attached to the cold side; the crystal module is arranged on one side of the printed circuit board, which is back to the heat exchange module. Therefore, the heat exchange module can be attached to the printed circuit board, so that a heat exchange channel is established between the crystal module and the heat exchange module through the printed circuit board, and the heat exchange module can indirectly cool the crystal module and other heating elements in a printed circuit board cooling mode.
Optionally, the heat exchange module is a thermoelectric cooler (TEC). Thus, by utilizing the peltier effect of the thermoelectric cooler, the cold side and the hot side can be formed by energizing the peltier effect, wherein the temperature of the cold side can be much lower than the ambient temperature, and therefore, the temperature of the heat generating element can be reduced by using the cold side to cool the heat generating element, and the temperature of the heat generating element can be greatly reduced.
Optionally, the thermoelectric cooler comprises a plurality of thermocouple pairs formed by joining an N-type semiconductor and a P-type semiconductor; a plurality of thermocouple pairs are arranged between the two ceramic electrodes; the thermocouple pair is used to transfer heat from the cold side to the hot side when an electric current is passed through it.
In a third aspect, the present application provides a vehicle comprising the vehicle antenna module of the first aspect. The roof casing of vehicle is provided with the cavity that is used for holding vehicle antenna module, and vehicle antenna module sets up in the cavity, and the roof casing still is provided with the antenna house, and the antenna house lock is installed on the cavity, seals the cavity, makes vehicle antenna module hide inside the roof casing, does not influence the roof pleasing to the eye.
In a fourth aspect, the present application provides a vehicle comprising the vehicle-mounted communication terminal of the second aspect. The vehicle-mounted communication terminal is hidden and arranged on the inner side of a roof shell of a vehicle, and is connected with an external antenna of the vehicle through a cable and the like, wherein the external antenna can be a shark fin antenna at the rear part of the roof. The vehicle-mounted communication terminal establishes communication connection with the mobile device through the external antenna, and vehicle information display and control of the mobile device APP are achieved.
Drawings
FIG. 1 is a schematic view of an automobile with an antenna attached;
FIG. 2 is a schematic structural diagram of a current air-cooling heat dissipation scheme;
fig. 3 is an exploded view of a heat sink according to a first embodiment of the present application;
fig. 4 is a schematic structural view of a soaking metal plate provided in the first embodiment of the present application;
fig. 5 is a schematic structural view of a heat sink provided in the first embodiment of the present application;
FIG. 6 is a schematic structural view of a heat exchange module provided in a first embodiment of the present application;
fig. 7 is a cross-sectional view of the heat dissipating device according to the first embodiment of the present application;
FIG. 8 is a schematic structural diagram of a heat dissipation device for dissipating heat of a printed circuit board module;
FIG. 9 is a schematic view of another structure of the heat dissipation device for dissipating heat of a printed circuit board module;
fig. 10 is a schematic structural diagram of a vehicle-mounted antenna module according to a fourth embodiment of the present application;
fig. 11 is a B-direction sectional view of a vehicle-mounted antenna module according to a fourth embodiment of the present application;
fig. 12 is a schematic view illustrating the mounting of a vehicle antenna module provided in a fourth embodiment of the present application on a vehicle roof;
FIG. 13 is a schematic diagram of a vehicle mounted communication terminal communicating with a mobile device;
fig. 14 is a schematic structural diagram of a vehicle-mounted communication terminal provided in a fifth embodiment of the present application;
fig. 15 is a flowchart of a temperature control method according to a sixth embodiment of the present application.
Illustration of the drawings:
011-radiating fins, 012-fans, 100-heat exchange modules, 200-soaking metal plates, 210-first grooves, 220-fixed structures, 300-radiating fins, 310-fin structures, 311-fins, 320-second grooves, 400-heating elements, 500-printed circuit board modules, 510-printed circuit boards, 520-antennas, 530-crystal modules, 600-antenna shells, 610-fixed structures, 700-heat conducting media, 800-shells, 810-openings, 910-roof shells, 920-interior trim, 930-vehicle antenna modules, 940-cavities, 950-antenna covers, 960-vehicle communication terminals, 970-external antennas, 980-mobile devices.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly described below with reference to the drawings in the embodiments of the present application. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all embodiments. Other embodiments based on the embodiments of the present application and obtained by a person of ordinary skill in the art without any creative effort belong to the protection scope of the present application.
Fig. 2 is a schematic structural diagram of a current air-cooling heat dissipation scheme.
As shown in fig. 1, the current air-cooled heat dissipation scheme includes a heat sink 011 and a fan 012. The heat sink 011 is attached to the heating element 400 for absorbing heat generated by the heating element 400, and the fan 012 is disposed on the heat sink 011 and blows air toward the heat sink 011 to accelerate air flow near the heating element 400 and take away the heat generated by the heating element 400 for heat dissipation. The air-cooled heat dissipation method cannot make the temperature of the heating element 400 reach below the ambient temperature, and the higher the ambient temperature is, the higher the temperature of the heating element 400 is, the worse the heat dissipation effect of the air-cooled heat dissipation method is, and when the ambient temperature reaches or approaches to the threshold temperature of the heating element 400, the air-cooled heat dissipation method cannot meet the heat dissipation requirement of the heating element 400. Further, the fan 012 generates noise during operation, and if the fan 012 is installed on a roof, the riding experience of passengers in the vehicle may be impaired. In addition, the air-cooled heat dissipation mode requires good fluidity of air, and the space of the roof is relatively closed, so that the requirement of the air-cooled heat dissipation mode on the fluidity of air cannot be met. In addition, the space of the roof is relatively flat, and if the fan 012 is to be placed on the roof, the thickness of the roof must be increased, which affects the aesthetic appearance of the entire vehicle.
In order to solve the above problems, the present application provides a heat sink, and an in-vehicle antenna module and an in-vehicle communication terminal including the same, which can reduce the temperature of a heating element 400 (e.g., a crystal module such as a chip) below an ambient temperature.
The following is a first embodiment of the present application.
A first embodiment of the present application provides a heat dissipating device. Fig. 3 is an exploded view of a heat dissipation device according to a first embodiment of the present disclosure. As shown in fig. 3, the heat dissipating device includes: heat exchange module 100, soaking metal plate 200, and heat radiating fins 300. In which the heat exchange module 100, the soaking metal plate 200, and the heat radiating fins 300 are stacked in the a direction of fig. 3, and the soaking metal plate 200 is located between the heat exchange module 100 and the heat radiating fins 300.
The heat exchange module 100 includes a cold side and a hot side, the cold side and the hot side are opposite, and the heat exchange module 100 can conduct heat from the cold side to the hot side under external action (e.g., voltage, current, pressure, light, etc.) or spontaneously, so that the cold side has a temperature lower than the ambient temperature. The heat exchange module 100 has a hot side attached to one side of the soaking metal plate 200, and the heat sink 300 is attached to the other side of the soaking metal plate 200 corresponding to the heat exchange module 100. A heat conducting medium, such as heat conducting silicone grease or a heat conducting pad, may be filled between the heat exchange module 100 and the soaking metal plate 200 to fill a gap that may exist after the heat exchange module 100 and the soaking metal plate 200 are attached, so as to facilitate heat transfer between the heat exchange module 100 and the soaking metal plate 200; a heat conducting medium can be filled between the soaking metal plate 200 and the heat radiating fin 300 to fill a gap which may exist after the soaking metal plate 200 and the heat radiating fin 300 are attached, so that heat can be transferred between the soaking metal plate 200 and the heat radiating fin 300; the heat transfer path from the heat exchange module 100 to the soaking metal plate 200 and then to the heat radiating fins 300 is uninterrupted, and high heat transfer efficiency is achieved.
Fig. 4 is a schematic structural view of a soaking metal plate 200 according to the first embodiment of the present application. As shown in fig. 4, the soaking metal plate 200 is recessed in the direction a away from the heat exchange module 100 to form a first groove 210, and the size of the first groove 210 is greater than or equal to that of the heat exchange module 100, so that the heat exchange module 100 can be placed in the first groove 210. The soaking metal plate 200 may be made of copper, aluminum, or the like having excellent heat conductive properties. The size of the soaking metal plate 200 is larger than that of the heat exchange module 100, so that the soaking metal plate 200 can completely cover the heat exchange module 100, has a larger contact area with the heat exchange module 100, sufficiently absorbs heat from the heat exchange module 100, and improves heat dissipation performance of the heat exchange module 100.
Fig. 5 is a schematic structural diagram of a heat sink 300 according to a first embodiment of the present application. As shown in fig. 5, the heat sink 300 is hollowed out on the side facing the soaking metal plate 200 to form a second groove 320 matching the shape of the first groove 210. The first groove 210 of the soaking metal plate 200 may be embedded in the second groove 320 of the heat sink 300 such that the first groove 210 and the second groove 320 are brought into close contact, increasing the contact area of the soaking metal plate 200 and the heat sink 300 and improving the heat transfer efficiency between the soaking metal plate 200 and the heat sink 300. The side of the heat sink 300 opposite to the soaking metal plate 200 is provided with a fin structure 310, which includes a plurality of fins 311 arranged in parallel at intervals, and the fins extend away from the soaking metal plate. The fin structure 310 may increase the surface area of the heat sink 300, which is beneficial for improving the heat dissipation performance of the heat sink 300.
Fig. 6 is a schematic structural diagram of a heat exchange module 100 according to a first embodiment of the present application. As shown in fig. 6, the heat exchange module 100 may be a thermoelectric cooler (TEC), which is a cooling device made using the peltier effect of a semiconductor. The peltier effect means that when current passes through a galvanic couple composed of two semiconductor materials, heat transfer occurs across the galvanic couple, namely: heat is transferred from one end to the other, creating a phenomenon where one end absorbs heat and the other end releases heat. N-type semiconductors and P-type semiconductors obtained based on bismuth telluride heavily doped with impurities are the main materials for manufacturing thermoelectric coolers, and bismuth telluride elements are electrically connected in series and generate heat in parallel. The thermoelectric cooler comprises a plurality of thermocouple pairs (groups) formed by joining N-type semiconductors and P-type semiconductors, which are connected together by electrodes and are disposed between two ceramic electrodes. When current flows from the thermoelectric cooler, the thermocouple pair transfers heat from one side of the thermoelectric cooler to the other side of the thermoelectric cooler, causing the thermoelectric cooler to generate a hot side (the side into which heat is transferred) and a cold side (the side from which heat is transferred), wherein the cold side may be at a temperature much lower than ambient temperature.
It should be added here that the heat exchange module 100 in the present application may be other refrigerators besides the thermoelectric cooler. The refrigerator may include a hot side and a cold side as shown in fig. 6, wherein heat in the refrigerator can be conducted from the cold side to the hot side under external action (e.g., voltage, current, pressure, etc.) or spontaneously, causing the cold side to have a lower temperature.
Fig. 7 is a B-direction sectional view of the heat sink according to the first embodiment of the present application. As shown in fig. 7, the heat sink 300 and the soaking metal plate 200 form a tight embedded connection using respective groove structures. The heat exchange module 100 is disposed in the first groove 210 of the soaking metal plate 200, a hot side of the heat exchange module 100 is disposed facing the first groove 210, and the hot side of the heat exchange module 100 is in contact with the bottom of the first groove 210. The depth H1 of the first groove 210 in the a direction may be less than or equal to the thickness B1 of the heat exchange module 100 in the a direction, such that, when the heat exchange module 100 is disposed in the first groove 210, the cold side of the heat exchange module 100 is higher than the soaking metal plate 200, so that the cold side of the heat exchange module 100 can be in contact with the heat generating elements 400. The depth H1 of the first groove 210 along the direction a may also be greater than the thickness B1 of the heat exchange module 100 along the direction a, so that when the heat exchange module 100 is disposed in the first groove 210, the cold side of the heat exchange module 100 is lower than the soaking metal plate 200, and the heat generating element 400 may be partially disposed in the first groove 210 to contact the heat exchange module 100, which is beneficial to reduce the total thickness of the heat sink and the heat generating element 400 after contact.
The heat generating element 400 includes, but is not limited to, a Printed Circuit Board (PCB), a crystal module (including various chips such as a system on a chip (SOC), a radio frequency front end chip, a modem chip, etc.), and other electronic elements capable of generating heat during operation.
The working principle of the heat dissipation device according to the first embodiment of the present application will be described in detail with reference to fig. 7. As shown in fig. 7, the heat generating element 400 is attached to the cold side of the heat exchange module 100; the heat exchange module 100 is capable of conducting heat from the cold side to the hot side while in operation, such that the cold side has a temperature below ambient; therefore, the heat exchange module 100 can cool the heat generating element 400 on the cold side, so that the temperature of the heat generating element 400 is greatly reduced and is lower than the ambient temperature, and the components can stably operate at high ambient temperature. The heat on the hot side of the heat exchange module 100 can be diffused to the soaking metal plate 200 and further diffused to the heat dissipation fins 300 through the soaking metal plate 200. The heat sink 300 has the fin structure 310, which can generate a larger contact area with the environment and efficiently diffuse heat into the environment.
The technical scheme provided by the first embodiment of the application has the following beneficial effects: the heat dissipation device provided by the first embodiment of the present application forms a cooling and heat transfer path from the component to the external environment, and can lower the temperature of the heat generating element 400 to below the ambient temperature, and even if the ambient temperature is higher than the threshold temperature for normal operation of the heat generating element 400, the temperature of the heat generating element 400 can also be lowered to below the threshold temperature, and overheating protection, frequency reduction (when the heat generating element 400 is a semiconductor chip) and damage do not occur, so that the heat generating element 400 can stably operate at a high ambient temperature.
The following is a second embodiment of the present application.
The second embodiment of the present application provides an example of the heat dissipation device applied to heat dissipation of the printed circuit board module 500. Fig. 8 is a schematic structural diagram of a heat dissipation device applied to heat dissipation of a printed circuit board module 500. As shown in fig. 8, the printed circuit board module 500 includes a printed circuit board 510 and various components mounted on the printed circuit board 510. For example: when the printed circuit board module 500 is an in-vehicle smart antenna system, the mounted components of the printed circuit board 510 may include an antenna 520, and a crystal module 530 (including various chips, etc.) for processing antenna signals.
In the second embodiment of the present application, the cold side of the heat exchange module 100 is attached to the surface of the crystal module 530, so that the crystal module 530 can be directly cooled, and the temperature of the crystal module 530 is always lower than the ambient temperature. Therefore, even if the ambient temperature is higher than the threshold temperature for normal operation of the heat generating element 400, the temperature of the crystal module 530 can be lowered below the threshold temperature, and overheating protection, frequency reduction and damage do not occur, so that the crystal module 530 can operate stably.
The following is a third embodiment of the present application.
The third embodiment of the present application provides another implementation in which the heat dissipation device is applied to the printed circuit board module 500. Fig. 9 is another structural diagram of the heat dissipation device applied to heat dissipation of the pcb module 500. As shown in fig. 9, the printed circuit board module 500 includes a printed circuit board 510 and various components mounted on the printed circuit board 510. For example: when the printed circuit board module 500 is an in-vehicle smart antenna module, the components mounted on the printed circuit board 510 may include an antenna 520, and a crystal module 530 (including various chips, etc.) for processing antenna signals.
In the third embodiment of the present application, the cold side of the heat exchange module 100 is directly attached to the printed circuit board 510, so as to directly cool the printed circuit board 510, reduce the overall temperature of the printed circuit board 510, and make the local temperature of the printed circuit board 510 lower than the ambient temperature. When the crystal module 530 mounted on the printed circuit board 510 generates heat, a larger temperature difference is generated between the crystal module 530 and the printed circuit board 510, so that the heat of the crystal module 530 is accelerated to be conducted to the printed circuit board 510, which is beneficial to reducing the temperature of the crystal module 530.
It should be added that the cold side of the heat exchange module 100 can be attached to the position of the printed circuit board 510 corresponding to the crystal module 530 with a large amount of heat generated, so that a heat exchange channel with the shortest distance is established between the crystal module 530 and the heat exchange module 100 via the printed circuit board 510, which is beneficial to reducing the temperature of the crystal module 530 below the ambient temperature. Therefore, even if the ambient temperature is higher than the threshold temperature for normal operation of the heat generating element 400, the temperature of the crystal module 530 can be lowered below the threshold temperature, and overheating protection, frequency reduction and damage do not occur, so that the crystal module 530 can operate stably.
The following is a fourth embodiment of the present application.
A fourth embodiment of the present application provides a vehicle antenna module. The vehicle-mounted antenna module comprises the heat dissipation device of the previous embodiments of the application. Fig. 10 is a schematic structural diagram of a vehicle-mounted antenna module according to a fourth embodiment of the present application. As shown in fig. 10, the vehicle-mounted antenna module includes an antenna housing 600, a printed circuit board module 500, a heat conductive medium 700, a heat exchange module 100, a soaking metal plate 200, and a heat sink 300. Wherein the heat exchange module 100, the soaking metal plate 200 and the heat dissipation fins 300 are stacked, the heat exchange module 100 is disposed at one side of the soaking metal plate 200, the heat dissipation fins 300 are disposed at the other side of the soaking metal plate 200, and the soaking metal plate 200 is located between the heat exchange module 100 and the heat dissipation fins 300. The hot side of the heat exchange module 100 is disposed facing the soaking metal plate, the soaking metal plate 200 is recessed in a direction away from the heat exchange module 100 to form a first groove 210, and the size of the first groove 210 is greater than or equal to that of the heat exchange module 100. The heat exchange module 100 is disposed in the first groove 210, and the hot side of the heat exchange module is attached to the bottom of the first groove 210. The soaking metal plate 200 may be made of copper, aluminum, or the like having excellent heat conductive properties. The size of the soaking metal plate 200 is larger than that of the heat exchange module 100 so that the soaking metal plate 200 can completely cover the heat exchange module 100, sufficiently absorb heat from the heat exchange module 100, and improve heat dissipation performance of the heat exchange module 100. The heat sink 300 is recessed in a direction away from the soaking metal plate 200 at a side facing the soaking metal plate 200 to form a second groove 320 matching the shape of the first groove 210. The first groove 210 of the soaking metal plate 200 may be embedded into the second groove 320 of the heat sink 300, so that the first groove 210 and the second groove 320 are closely attached, the contact area between the soaking metal plate 200 and the heat sink 300 is increased, and the heat transfer efficiency between the soaking metal plate 200 and the heat sink 300 is improved. The printed circuit board module 500 is disposed facing the cold side of the heat exchange module 100, and the printed circuit board module 500 includes a printed circuit board 510, an antenna 520, and a crystal module 530. The antenna 520 is disposed on a side of the printed circuit board 510 facing away from the heat exchange module 100. The crystal module 530 is disposed on a side of the printed circuit board 510 facing the heat exchange module 100, and the crystal module 200 is attached to a cold side of the heat exchange module 100. The soaking metal plate 200 and the antenna housing 600 are provided with a fixing structure 220 and a fixing structure 610 which are matched with each other, the antenna housing 600 is buckled on the soaking metal plate 200 along the direction from the printed circuit board module 500 to the radiating fin 300 (i.e. the direction A in fig. 9), and is fixedly connected with the soaking metal plate 200 through the fixing structure 220 and the fixing structure 610, so that the printed circuit board module 500 and the heat exchange module 100 are sealed in the antenna shell 600, the printed circuit board module 500 and the heat exchange module 100 are isolated from the external environment, and the printed circuit board module 500 and the heat exchange module 100 are prevented from being soaked in water or influenced by sunshine, dust and the like. The vehicle-mounted antenna module provided by the embodiment of the application can be mounted on a vehicle body of an automobile, such as the roof of the automobile, so that the automobile has the capability of carrying out wireless communication with other network equipment.
Fig. 11 is a B-direction sectional view of a vehicle-mounted antenna module according to a fourth embodiment of the present application. As shown in fig. 11, the antenna housing 600 has an arc-shaped configuration that matches the curvature of the roof of the vehicle. The antenna 520 is disposed on a side of the printed circuit board 510 facing the case 600. The crystal module 530 is disposed on the side of the printed circuit board 510 facing the soaking metal plate. The crystal module 530 is attached to the cold side of the heat exchange module 100 by the heat transfer medium 700. The soaking metal plate 200 is attached to the hot side of the heat exchange module 100.
In the embodiment of the present application, the antenna housing 600 may be made of non-metallic materials such as plastics and fibers, so that electromagnetic wave signals can penetrate through the antenna housing 600 and be received by the antenna 520, and electromagnetic wave signals emitted by the antenna 520 can also penetrate through the antenna housing 600 and be received by other devices. The antenna housing 600 may also be made of a metal material, and a gap is formed by removing the material, and the gap is filled with a non-metal material such as plastic, so as to form a micro-slot antenna 520 structure.
Fig. 12 is a schematic view of the mounting of a vehicle-mounted antenna module on a vehicle roof according to a fourth embodiment of the present application. As shown in fig. 12, a roof housing 910 of an automobile is provided with a cavity 940 for accommodating a vehicle-mounted antenna module 930, the vehicle-mounted antenna module 930 is disposed in the cavity 940, the roof housing 910 is further provided with a radome 950, the radome 950 is snap-fitted over the cavity 940 to seal the cavity 940, so that the vehicle-mounted antenna module 930 is hidden inside the roof housing 910, and the appearance of the roof is not affected.
The following describes in detail beneficial effects that can be achieved by the vehicle-mounted antenna module according to the fourth embodiment of the present application with reference to fig. 11. The vehicle antenna module can be arranged on a housing of the motor vehicle, for example on the roof of the vehicle. Since the environment of driving and parking is mostly outdoors, the roof of the automobile is often exposed to sunlight and the temperature is very high. The high temperature environment of the vehicle roof brings challenges to the normal operation of the vehicle-mounted intelligent module, and the superposition of the high temperature environment and the heat generated during the operation of the crystal module 530 can make the temperature of the crystal module 530 close to or even higher than a threshold temperature (for example, the threshold temperature of the semiconductor chip is about 105 ℃), so that the crystal module 530 is overheated, frequency-reduced, self-protected during power failure, or even damaged. Conventional vehicle antenna modules. The cooling of the crystal module 530 is realized by using a fan to dissipate heat, that is, the fan accelerates the air flow near the crystal module 530 to take away heat. Because the temperature of the crystal module 530 cannot be lower than the ambient temperature due to the heat dissipation by the fan, the cooling effect of the heat dissipation by the fan on the crystal module 530 is poor in a high-temperature environment, and the crystal module 530 still has a risk of having an excessively high temperature. The vehicle-mounted antenna module provided by the fourth embodiment of the application radiates through the heat radiating device provided by any one of the embodiments, so that the temperature of the crystal module 530 can be reduced to be below the ambient temperature, and even if the vehicle roof is exposed to sunlight to reach a high temperature, the temperature of the crystal module 530 cannot be close to the threshold temperature, so that the crystal module 530 can continuously and stably operate without frequency reduction, triggering self-protection and damage. In addition, the vehicle-mounted antenna module provided by the fourth embodiment of the application has no fan, so that noise is not generated, an air channel does not need to be added on the roof, the structure is compact, the thickness of the roof is not increased, the attractiveness of the whole vehicle is not affected, and the use experience of a user is improved.
The following is a fifth embodiment of the present application.
A fifth embodiment of the present application provides a vehicle-mounted communication terminal. The vehicle-mounted communication terminal part comprises the heat dissipation device of the previous embodiments of the application. The vehicle-mounted communication terminal is also called a vehicle-mounted T-BOX (telematics BOX), is one of four main components of a vehicle networking system (the vehicle networking system comprises a host, the vehicle-mounted T-BOX, a mobile device APP and a background system), and is mainly used for communicating with the background system/the mobile device to realize vehicle information display and control of the mobile device APP. The mobile device may be, for example, a mobile phone, a tablet computer, a smart wearable device, and the like.
Fig. 13 is a schematic diagram of the in-vehicle communication terminal communicating with the mobile device. As shown in fig. 13, the vehicle-mounted communication terminal 960 is hidden inside the roof housing 910 of the vehicle, and the vehicle-mounted communication terminal 960 is connected to an external antenna 970 of the vehicle, which may be a shark fin antenna at the rear of the roof, by a cable or the like. The vehicle-mounted communication terminal 960 establishes communication connection with the mobile device 980 through the external antenna 970, and vehicle information display and control of the mobile device APP are achieved.
Fig. 14 is a schematic structural diagram of a vehicle-mounted communication terminal according to a fifth embodiment of the present application. As shown in fig. 14, the in-vehicle communication terminal includes a terminal housing 800, a printed circuit board module 500, a heat transfer medium 700, and a heat exchange module 100. Wherein the in-vehicle communication terminal may be disposed inside a metal case of the vehicle, such as the inside of the roof case 910. Thus, the roof case 910 corresponds to the soaking metal plate 200 in any of the foregoing embodiments. The terminal housing 800 is provided with an opening 810, and the opening 810 is disposed facing the roof housing 910; the heat exchange module 100 is disposed within the aperture 810, the heat exchange module 100 including a cold side disposed facing the terminal housing 800 and a hot side disposed facing the roof housing 910, the cold side having a temperature lower than a temperature of the hot side, the heat exchange module 100 for conducting heat from the cold side to the hot side; the printed circuit board module 500 is disposed in the terminal housing 800, the printed circuit board module 500 includes a printed circuit board 510, an antenna 520 mounted on the printed circuit board, and a crystal module 530, the printed circuit board module 510 is attached to the cold side; the heat transfer medium 700 is disposed between the heat exchange module 100 and the metal case 800, and the hot side and the metal case 800 are attached to each other by the heat transfer medium 700 to form a heat transfer path from the printed circuit board module 500 to the roof case 910. Wherein, the cold side of the printed circuit board module 500 and the heat exchange module 100 is attached, which may specifically include: the crystal module 530 is attached to the cold side of the heat exchange module 100 (e.g., the second embodiment) or the printed circuit board 510 is attached to the cold side of the heat exchange module 100 (e.g., the third embodiment).
Generally, the roof housing 910 is usually made of metal material such as steel plate, and has good heat conductivity and large area; therefore, the soaking metal plate 200 taken from the roof case 910 has good heat dissipation performance due to a large heat dissipation area; in this case, it is not necessary to provide an additional heat sink for the soaking metal plate 200 (i.e., the roof housing 910), which is advantageous for simplifying the structure of the in-vehicle communication terminal and reducing the volume of the in-vehicle communication terminal. In addition, the metal roof housing 910, because of its good conductivity, can be electrically coupled to the printed circuit board module 500 to be used as an antenna of the vehicle-mounted communication terminal, which is beneficial to further simplifying the structure of the vehicle-mounted communication terminal and reducing the volume of the vehicle-mounted communication terminal.
The following provides a detailed description of advantageous effects that can be achieved by the vehicle-mounted communication terminal according to the fifth embodiment of the present application, with reference to fig. 14. The vehicle-mounted communication terminal provided by the fifth embodiment of the present application establishes a heat transfer path from the printed circuit board module 500 to the roof housing 910, reduces the temperature of the crystal module 530 to below the ambient temperature by using the heat exchange module 100, transfers the heat generated by the crystal module 530 to the roof housing 910, and rapidly radiates the heat to the environment by using the large heat radiation area of the roof housing 910. Therefore, even if the roof case 910 is exposed to sunlight and reaches a high temperature, the temperature of the crystal module 530 does not approach the threshold temperature under the cooling of the heat exchange module 100, thereby ensuring that the crystal module 530 can be continuously and stably operated without frequency reduction, triggering self-protection and damage. In addition, the terminal housing, the printed circuit board module 500, the heat conducting medium 700 and the heat exchange module 100 of the vehicle-mounted communication terminal provided in the fifth embodiment of the present application are all disposed in the interlayer space between the roof housing 910 and the roof of the interior trim 920, so that the vehicle body space is not additionally occupied, and the roof thickness is not increased; in addition, the vehicle-mounted communication terminal provided by the fifth embodiment of the application has no fan, does not generate noise, does not need to add an air duct on the roof of the vehicle, and does not affect the appearance of the whole vehicle.
The embodiment of the application also provides a vehicle, which comprises but is not limited to an automobile, a rail vehicle, an engineering vehicle and the like. The automobile can be, for example, a small passenger car, a medium passenger car, a large passenger car, a truck, a special vehicle (such as a fire truck, an ambulance, a police car, etc.), and the rail vehicle can be, for example, a passenger train, a freight train, a magnetic levitation train, a subway train, etc.; the working vehicle may be, for example, a loader, an excavator, a harvester, a road roller, or the like. The vehicle may include one or more of the heat dissipation device, the vehicle-mounted antenna module, or the vehicle-mounted communication terminal provided in any of the above embodiments of the present application.
Illustratively, as shown in fig. 12, the vehicle includes a vehicle-mounted antenna module 930. The roof shell 910 of the vehicle is provided with a cavity 940 for accommodating the vehicle-mounted antenna module 930, the vehicle-mounted antenna module 930 is arranged in the cavity 940, the roof shell 910 is further provided with an antenna cover 950, and the antenna cover 950 is buckled and installed on the cavity 940 to seal the cavity 940, so that the vehicle-mounted antenna module 930 is hidden inside the roof shell 910, and the appearance of the roof is not affected.
Illustratively, as shown in fig. 13, the vehicle includes a vehicle-mounted communication terminal 960. The vehicle-mounted communication terminal 960 is hidden inside the roof housing 910 of the vehicle, and the vehicle-mounted communication terminal 960 is connected to an external antenna 970 of the vehicle, which may be a shark fin antenna at the rear of the roof, by a cable or the like. The vehicle-mounted communication terminal 960 establishes communication connection with the mobile device 980 through the external antenna 970, and vehicle information display and control of the mobile device APP are achieved.
The following is a sixth embodiment of the present application.
A sixth embodiment of the present application provides a temperature control method. The temperature control method can be applied to the heat dissipation device, the vehicle-mounted antenna module or the vehicle-mounted communication terminal provided by any of the foregoing embodiments. Fig. 15 is a flowchart of the temperature control method. As shown in fig. 15, the temperature control method includes:
in step S101, it is determined whether the temperature of the heating element is greater than or equal to a first threshold.
The heat generating component in the present application includes, but is not limited to, a Printed Circuit Board (PCB), a crystal module (including various chips, such as a system on a chip (SOC), a radio frequency front end chip, a modem chip, etc.), and other electronic components capable of generating heat during operation.
The first threshold is less than a threshold temperature of the heat generating element. For example, when the heat generating element is a crystal module, the first threshold may be a temperature that is lower than the threshold temperature and at which overheating and down-conversion of the crystal module do not occur. The temperature of the heating element can be measured by a temperature sensor built in the heating element, and can also be measured by other external sensors.
Step S102, if the temperature of the heating element is greater than or equal to a first threshold value, the heat exchange module is started.
If the temperature of the heating element is greater than or equal to the first threshold, it is indicated that the temperature of the heating element is higher and may rise further. If the temperature of the heating element is further increased, the heating element is overheated and lowered to be even higher than the threshold temperature, and the heating element is damaged. Therefore, the heat exchange module needs to be started to cool the heating element.
In step S103, it is determined whether the temperature of the heating element is less than or equal to a second threshold.
The second threshold may be equal to or lower than the first threshold.
And step S104, if the temperature of the heating element is less than or equal to a second threshold value, closing the heat exchange module.
When the temperature of the heating element is smaller than or equal to the first threshold, the temperature of the heating element is reduced to be within a normal temperature range, and the heating element can normally operate. Thus, the heat exchange module may be shut down to reduce the power consumption of the heat exchange module. After that, if the temperature of the heating element rises but is less than the first threshold, the heat exchange module is kept in the off state, and if the temperature of the heating element is greater than or equal to the first threshold, the heat exchange module is turned on again.
According to the method provided by the sixth embodiment of the application, the temperature of the heating element can be controlled between the first threshold value and the second threshold value which are lower than the threshold temperature, and the normal operation of the heating element can be ensured; in addition, the method provided by the sixth embodiment of the present application controls the heat exchange module to be intermittently turned on and off according to the temperature of the heating element, which is also beneficial to reducing the power consumption of the heat exchange module, so that if the heat exchange module is powered by an on-board storage battery, the endurance time of the storage battery in a non-charging state can be prolonged.
The heat dissipation module provided by the embodiment of the application can be applied to various scenes which work in a high-temperature environment and have requirements on heat dissipation of equipment or components, for example: vehicle-mounted antenna, outdoor communication base station, communication satellite, computer chip, etc. For the application of the technical solutions provided in the embodiments of the present application to other designs, detailed descriptions are omitted here, and those skilled in the art can also think of applying the technical solutions provided in the embodiments of the present application to other designs without departing from the protection scope of the embodiments of the present application.
Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
It will be understood that the present application is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.
Claims (16)
1. A vehicle-mounted antenna module is characterized in that,
the method comprises the following steps: the antenna comprises an antenna shell, a printed circuit board module, a heat exchange module, a soaking metal plate and radiating fins;
the heat exchange module comprises a cold side and a hot side, the cold side has a temperature lower than that of the hot side, and the heat exchange module is used for conducting heat from the cold side to the hot side;
the printed circuit board module comprises a printed circuit board, an antenna and a crystal module, wherein the antenna and the crystal module are mounted on the printed circuit board; the soaking metal plate is attached to the hot side surface;
the heat radiating fins are attached to one side of the soaking metal plate, which is back to the heat exchange module;
the antenna shell is arranged on one side of the printed circuit board facing the heat exchange module, the soaking metal plate and the antenna shell are provided with fixing structures matched with each other, and the soaking metal plate and the antenna shell are fixedly connected through the fixing structures and seal the printed circuit board module and the heat exchange module in the antenna shell.
2. The vehicle antenna module of claim 1,
the crystal module is arranged on one side of the printed circuit board facing the heat exchange module;
the cold side of the crystal module is in fit connection.
3. The vehicle antenna module of claim 1,
the printed circuit board is in fit connection with the cold side;
the crystal module is arranged on one side of the printed circuit board, which is back to the heat exchange module.
4. The vehicle antenna module of claim 1,
the soaking metal plate is sunken towards the direction far away from the heat exchange module to form a first groove;
the heat exchange module is arranged in the first groove, and the hot side surface is attached to the bottom of the first groove;
the radiating fins are sunken towards the direction far away from the soaking metal plate to form second grooves matched with the first grooves in shape;
the first groove is embedded into the second groove, and the first groove is tightly attached to the second groove.
5. The vehicle antenna module of claim 2, wherein a heat conducting medium is disposed between the heat exchanging module and the crystal module, and the cold side surface is attached to the crystal module through the heat conducting medium.
6. The vehicle antenna module of claim 1, wherein the antenna is disposed on a side of the printed circuit board facing away from the heat exchange module.
7. The vehicle antenna module of any of claims 1-6, wherein the heat exchange module is a thermoelectric cooler.
8. The vehicle antenna module of claim 7,
the thermoelectric cooler comprises a plurality of thermoelectric couple pairs formed by joining an N-type semiconductor and a P-type semiconductor;
a plurality of thermocouple pairs are arranged between the two ceramic electrodes;
the thermocouple pair is configured to transfer heat from the cold side to the hot side when an electrical current is passed through the thermocouple pair.
9. The vehicle antenna module of claim 1,
the radiating fin is provided with a fin structure at one side back to the soaking metal plate;
the fin structure comprises a plurality of fins, and the fins extend towards the direction far away from the soaking metal plate;
the fins are arranged in parallel at intervals.
10. A vehicle-mounted communication terminal is characterized in that,
the method comprises the following steps: the terminal comprises a terminal shell, a printed circuit board module, a heat conducting medium and a heat exchange module;
the terminal shell is arranged on the inner side of a metal shell of a vehicle, and is provided with an opening facing the metal shell;
the heat exchange module is arranged in the opening, the heat exchange module comprises a cold side and a hot side, the cold side is arranged facing the terminal shell, the hot side is arranged facing the metal shell, the temperature of the cold side is lower than that of the hot side, and the heat exchange module is used for conducting heat from the cold side to the hot side;
the printed circuit board module is arranged in the terminal shell and comprises a printed circuit board, an antenna and a crystal module, wherein the antenna and the crystal module are arranged on the printed circuit board;
the heat-conducting medium is arranged between the heat exchange module and the metal shell, and the hot side face is attached to the metal shell through the heat-conducting medium.
11. The vehicle communication terminal according to claim 10,
the crystal module is arranged on one side of the printed circuit board facing the heat exchange module;
the cold side of the crystal module is in fit connection.
12. The vehicle communication terminal according to claim 10,
the printed circuit board is in fit connection with the cold side;
the crystal module is arranged on one side of the printed circuit board, which is back to the heat exchange module.
13. The vehicle communication terminal according to any one of claims 10 to 12, wherein the heat exchange module is a thermoelectric cooler.
14. The vehicle communication terminal according to claim 13,
the thermoelectric cooler comprises a plurality of thermoelectric couple pairs formed by joining an N-type semiconductor and a P-type semiconductor;
a plurality of thermocouple pairs are arranged between the two ceramic electrodes;
the thermocouple pair is used for transferring heat from one end of the thermocouple pair to the other end of the thermocouple pair when current passes through the thermocouple pair.
15. A vehicle, characterized in that,
comprising a vehicle antenna module according to any of claims 1-9;
the roof shell of the vehicle is provided with a cavity for accommodating the vehicle-mounted antenna module;
the vehicle-mounted antenna module is arranged in the cavity;
the roof shell is further provided with an antenna housing, and the antenna housing is buckled and installed on the cavity to seal the cavity.
16. A vehicle, characterized in that,
comprising the vehicle-mounted communication terminal and the external antenna of any one of claims 10-14;
the vehicle-mounted communication terminal is arranged on the inner side of a roof shell of the vehicle;
the vehicle-mounted communication terminal is connected with the external antenna through a cable.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110808443A (en) * | 2019-10-29 | 2020-02-18 | 华为技术有限公司 | Vehicle-mounted antenna module and vehicle-mounted communication terminal |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110808443A (en) * | 2019-10-29 | 2020-02-18 | 华为技术有限公司 | Vehicle-mounted antenna module and vehicle-mounted communication terminal |
| WO2021082962A1 (en) * | 2019-10-29 | 2021-05-06 | 华为技术有限公司 | Vehicle-mounted antenna module and vehicle-mounted communication terminal |
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