CN211017014U - Wafer wet etching system - Google Patents
Wafer wet etching system Download PDFInfo
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- CN211017014U CN211017014U CN201921866659.XU CN201921866659U CN211017014U CN 211017014 U CN211017014 U CN 211017014U CN 201921866659 U CN201921866659 U CN 201921866659U CN 211017014 U CN211017014 U CN 211017014U
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- 238000001039 wet etching Methods 0.000 title claims abstract description 35
- 239000007788 liquid Substances 0.000 claims abstract description 357
- 238000005530 etching Methods 0.000 claims abstract description 192
- 239000013589 supplement Substances 0.000 claims description 6
- 230000001502 supplementing effect Effects 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 4
- 238000005259 measurement Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 63
- 239000000243 solution Substances 0.000 description 27
- 239000011550 stock solution Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
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Abstract
The utility model relates to a wafer wet etching system, include: the wafer wet etching device comprises a controller and a wafer etching machine; an etching liquid supply device comprising: the first etching liquid supply device comprises a first liquid storage container for containing etching liquid, a first pipeline for connecting the first liquid storage container and the wafer etching machine, and a first valve arranged on the first pipeline; the second etching liquid supply device comprises a second liquid storage container for containing etching liquid, a second pipeline for connecting the second liquid storage container and the wafer etching machine, and a second valve arranged on the second pipeline, the first etching liquid supply device further comprises a first continuous liquid level measuring device arranged in the first liquid storage container, and the second etching liquid supply device further comprises a second continuous liquid level measuring device arranged in the second liquid storage container.
Description
Technical Field
The utility model relates to a wafer wet etching system especially relates to a can listen wafer wet etching system of liquid level in the stock solution container who stores etching liquid in succession.
Background
Currently, an etching liquid supply device for a single-wafer etching machine for wafers generally has at least two liquid storage containers for storing etching liquid, each liquid storage container being provided with a contact level gauge located at a different liquid level. The supply of the etching liquid is provided by switching between the two liquid reservoirs.
On one hand, when one of the liquid storage containers supplies etching liquid until the liquid level reaches a certain relatively lower liquid level, the number of wafers to be etched cannot be intelligently calculated according to the amount of the residual etching liquid and the etching operation cannot be executed for recipes with different etching durations due to the adoption of the contact type liquid level meter which cannot acquire the accurate liquid level at the liquid level. Therefore, the etching liquid in the liquid storage container is not suitable to be used for etching the wafer continuously, so that the risk that the etching liquid in the liquid storage container is insufficient to etch the single wafer is avoided. On the other hand, when the remaining etching solution in the storage container is insufficient to replenish the etching solution, the required amount and concentration of the replenishment acid cannot be calculated because the accurate level of the remaining etching solution cannot be obtained, and in summary, the remaining etching solution in the storage container must be drained, and another storage container containing a sufficient amount of etching solution is switched to supply the etching solution to complete the etching of the subsequent wafer.
Therefore, the residual etching liquid in the liquid storage container is exhausted, so that waste is caused. Therefore, a solution that overcomes the above-mentioned drawbacks is needed.
SUMMERY OF THE UTILITY MODEL
Therefore, the utility model provides an etching solution supply device for wafer sculpture.
The utility model provides a wafer wet etching system, include:
the wafer wet etching device comprises a controller and a wafer etching machine;
an etching liquid supply device comprising:
the first etching liquid supply device comprises a first liquid storage container for containing etching liquid, a first pipeline for connecting the first liquid storage container and the wafer etching machine, and a first valve arranged on the first pipeline; and
a second etching liquid supply device, which comprises a second liquid storage container for containing etching liquid, a second pipeline for connecting the second liquid storage container and the wafer etching machine, and a second valve arranged on the second pipeline,
it is characterized in that the preparation method is characterized in that,
the first etching liquid supply device also comprises a first continuous liquid level measuring device arranged in the first liquid storage container, the second etching liquid supply device also comprises a second continuous liquid level measuring device arranged in the second liquid storage container,
wherein the first and second continuous level measurement devices are configured to detect levels of etching liquid in the first reservoir and the second reservoir, respectively, and to transmit detection signals to the controller,
the controller is configured to compare the acquired first liquid level value in the first liquid storage container and the acquired second liquid level value in the second liquid storage container with a first liquid level threshold value and control the opening and closing of the first valve and the second valve, so that the first etching liquid supply device and the second etching liquid supply device can continuously supply the etching liquid to the wafer etching machine.
In one embodiment, the controller is configured to:
when a first valve is opened and a second valve is closed, comparing the first liquid level value with the first liquid level threshold value, and when the first liquid level value is larger than the first liquid level threshold value and the difference between the first liquid level value and the first liquid level threshold value corresponds to a liquid amount smaller than a preset value, controlling the first valve to be closed and the second valve to be opened; or,
and when a second valve is opened and a first valve is closed, comparing the second liquid level value with the first liquid level threshold, and when the second liquid level value is larger than the first liquid level threshold and the liquid amount corresponding to the difference is smaller than the preset value, controlling the second valve to be closed and the first valve to be opened, wherein the preset value corresponds to the amount of etching liquid required for etching a single wafer.
In one embodiment, the first and second continuous liquid level measuring devices are selected from the group consisting of ultrasonic level meters, magnetostrictive level meters, floating ball level meters.
In one embodiment, the first and second valves are selected from pneumatically or electrically controlled valves.
In one embodiment, the first or second conduit is further provided with a fluid delivery device.
In one embodiment, the system further comprises an etching liquid replenishing device configured to supply an etching liquid to the first and/or second etching liquid supply device, wherein,
the controller is further configured to:
when the first valve is closed, acquiring a first liquid level value detected by the first continuous liquid level measuring device, comparing the first liquid level value with a second liquid level threshold, calculating a liquid amount corresponding to the difference when the first liquid level value is smaller than the second liquid level threshold, and controlling the etching liquid supplementing device to supplement the etching liquid with the calculated liquid amount to the first liquid storage container and/or to control the etching liquid supplementing device to supplement the etching liquid with the calculated liquid amount to the first liquid storage container
When the second valve is closed, a second liquid level value detected by the second continuous liquid level measuring device is obtained, the second liquid level value is compared with a second liquid level threshold, when the second liquid level value is smaller than the second liquid level threshold, the liquid amount corresponding to the difference between the second liquid level value and the second liquid level threshold is calculated, and the etching liquid supplementing device is controlled to supplement the etching liquid of the calculated liquid amount to the second liquid storage container.
In one embodiment, the first liquid level threshold value corresponds to the lowest liquid level value of the first liquid storage container and/or the second liquid storage container when the flow rate of the etching liquid supplied to the wafer wet etching device is stable.
In one embodiment, the first and second reservoirs have the same volume and the first level threshold is a level corresponding to 5-10% of the volume.
In one embodiment, the first and second reservoirs have the same volume, and the second liquid level threshold is a liquid level corresponding to 90-95% of the volume.
The utility model discloses an etching liquid supply device is through having set up continuous type liquid level sensing device, can listen in real time the real-time liquid level of stock solution container when supplying the etching liquid, consequently can be at the current stock solution container of unnecessary evacuation, calculate the quantity that the etching liquid in the stock solution container can the sculpture wafer to calculate the accurate volume that needs supply etching liquid by the real-time liquid level value of measuring, thereby avoided the waste of etching liquid.
Drawings
FIG. 1 is a schematic diagram of a wafer wet etching system; and
fig. 2 is a schematic diagram of the wafer wet etching system of the present invention.
Detailed Description
Fig. 1 is a schematic diagram of a wafer wet etching system, wherein the wafer wet etching system includes a wafer etching machine and an etching solution supply device, wherein the etching solution supply device is provided with a liquid storage container 100a and a liquid storage container 100b for storing an etching solution (e.g., an acid solution) to be supplied.
The liquid storage containers 100a and 100b are each provided with a plurality of sensors for detecting the level of the etching liquid. For example, the liquid reservoir 100a is provided with contact type liquid level sensors at a low liquid level 11a, a low liquid level 12a, a high liquid level 13a, and a high liquid level 14a, respectively, from the bottom to the top. Similarly, the liquid storage container 100b is provided with contact type liquid level sensors at a low liquid level 11b, a low liquid level 12b, a high liquid level 13b, and a high liquid level 14b from bottom to top, respectively. The contact type liquid level sensor can be a discrete type liquid level sensor, so that only a signal whether a certain liquid level is triggered can be given, and the real-time liquid level cannot be sensed.
The liquid storage containers 100a and 100b are connected by pipes, respectively, and the pipes are collected and supplied to the wafer etching machine 200.
It should be noted that the liquid storage containers 100a and 100b do not supply the etching liquid at the same time, that is, the liquid storage container 100b stops supplying the etching liquid and maintains the ready state while the liquid storage container 100a supplies the etching liquid, and vice versa.
A valve 150a is arranged on the pipeline of the liquid storage container 100a, a valve 150b is arranged on the pipeline of the liquid storage container 100b, and the valves 150a and 150b are pneumatic or electric control valves, for example, so as to remotely switch the supply of the etching liquid by the two liquid storage containers, specifically, when the etching liquid is supplied by the liquid storage container 100a, the valve 150a is in an open state, and the valve 150b is in a closed state; when the liquid reservoir 100b supplies the etching liquid, the valve 150b is in an open state, and the valve 150a is in an open state.
While the liquid reservoir 100a is being supplied with the etching liquid, the liquid reservoir 100b holds a sufficient amount of the etching liquid therein and is kept in a ready state, at which time the liquid level in the liquid reservoir 100b is relatively high, for example, at the high liquid level 13 b.
When the etching liquid is supplied to the low liquid level 12a from the liquid storage container 100a, the currently cleaning task, for example, the currently wafer etching task, is continuously completed. Subsequently, since the specific value of the liquid level for calculating the subsequent etching liquid mixing process cannot be determined and therefore the number of wafers which can be etched by the amount of the remaining etching liquid cannot be calculated, at this time, after all the remaining etching liquid in the liquid storage container 100a needs to be discharged to be empty, the liquid storage container 100b is switched to supply the etching liquid.
While the stock solution container 100b is being supplied with the etching liquid, the stock solution container 100a that has been discharged to the empty is replenished with the etching liquid. Replenishment is stopped when a sufficient amount of etching liquid has been replenished, at which time the liquid reservoir 100a is at, for example, a high liquid level 13 a.
Similarly, the case where the liquid reservoir 100b supplies the etching liquid to the low level 12b is the same as that performed by the liquid reservoir 100 a.
The etching liquid is circularly switched and supplied in the above way until the etching task is finished.
It follows that during the switching of the supply of etching liquid from the reservoir 100a to the reservoir 100b, the etching liquid below the low level 12a or 12b must be drained, which results in a great deal of waste.
Based on this, the utility model provides a new wafer wet etching system, specifically, this wafer wet etching system uses continuous type liquid level sensing device to replace above-mentioned contact liquid level sensing device.
The wafer wet etching system and the etching liquid supply flow thereof according to the present invention will be described in detail with reference to fig. 2.
Fig. 2 is the schematic diagram of the wafer wet etching system of the present invention, wherein the wafer wet etching system of the present invention includes a wafer wet etching apparatus and an etching liquid supply apparatus. In particular, the wafer etching apparatus of the present invention may include, for example, a wafer etching machine for etching a wafer, and the wafer etching machine may include, for example, an etching chamber for etching a single wafer, but is not limited thereto. In addition, the wafer wet etching device can also comprise a controller. Therefore, the wafer wet etching system shown in fig. 2 includes a wafer wet etching apparatus 400, and the wafer wet etching apparatus 400 includes a controller 410 and a wafer etching machine 420.
The Controller 410 may be a Micro Controller Unit (MCU), and the wafer etching tool 420 may be a single wafer etching tool.
The utility model discloses a wafer wet etching system still includes etching solution feeding mechanism, and this etching solution feeding mechanism is including the stock solution container 300a and the stock solution container 300b of storing etching solution, and it is respectively through pipe connection and supply etching solution to wafer sculpture board 420. The pipelines may independently supply the etching solution to the wafer etching machine 420, or may be integrated into a single pipeline before connecting the wafer etching machine 420 and then supply the etching solution to the wafer etching machine 420.
Different with the above-mentioned etching liquid supply device who adopts contact liquid level sensing device is, the utility model discloses a liquid storage container 300a and liquid storage container 300b respectively are provided with a pair of continuous type liquid level sensing device on top and bottom. The continuous liquid level measuring device can be selected from an ultrasonic liquid level meter, a magnetostrictive liquid level meter and a floating ball type liquid level meter, and can output an accurate liquid level value of etching liquid at any moment.
The results of these measured level devices are typically communicated to the controller 410 by wire or wirelessly. Preferably, the remote signal provided by the continuous liquid level measuring device is transmitted to the controller 410 by means of a signal cable.
In one embodiment, the continuous liquid level sensing devices are ultrasonic liquid level sensing devices (32aa, 32ab) and (32ba, 32 bb).
Wherein, a pair of ultrasonic liquid level sensing devices (32aa, 32ab) can continuously detect the liquid level value in the liquid storage container 300a, that is, no matter what liquid level the etching liquid in the liquid storage container 300a is, the ultrasonic liquid level sensing devices (32aa, 32ab) can output real-time liquid level signals. The same is true for the liquid storage container 300b, the ultrasonic sensing devices (32ba, 32 bb).
The pipeline for connecting the liquid storage container 300a and the wafer etching machine 420 and the pipeline for connecting the liquid storage container 300b and the wafer etching machine 420 are respectively provided with a valve 350a and a valve 350 b. The valves 350a, 350b are, for example, pneumatically or electrically controlled valves. The valves 350a and 350b are connected to the controller 410 by cables. The controller 410 controls the opening and closing of the valves 350a and 350b through signal cables, thereby controlling the switching of the etching liquid supply of the two reservoir tanks. Specifically, when the storage container 300a supplies the etching solution, the control unit 410 controls the valve 350a to be opened and the valve 350b to be closed; when the storage container 300b supplies the etching liquid, the control unit 410 controls the valve 350b to be opened and the valve 350a to be closed.
The storage containers 300a and 300b do not simultaneously supply the etching solution to the wafer etching machine 420, that is, the storage container 300b is kept in a ready state while the storage container 300a supplies the etching solution, and vice versa.
The etching liquid supply device of the present invention may further include a fluid supply device (not shown), and particularly, a pump, such as but not limited to a centrifugal pump or a positive displacement pump, may be disposed on the pipelines of the liquid storage containers 300a and 300 b.
The etching liquid supply device of the present invention may further include a flow rate measuring device (not shown), and particularly, a flow meter may be disposed on the pipelines of the liquid storage container 300a and the liquid storage container 300 b.
The flow of the etching liquid supplied by the etching liquid supplying device of the present invention will be described below.
First, for the reservoir 300a and the reservoir 300b, the values of the safety levels 31a and 31b are set
(each identified as La, safetyAnd Lb, safety) And transmitted to the controller 410 via a signal cable, typically, the safety level is set to a minimum level that ensures a steady flow of the etching solution when supplied to the wafer etching station 420, i.e., below the liquid level of the liquid storage container 300a when the liquid level is below La, safetyDepending on the capacity of the liquid storage container, the arrangement and the diameter of the pipeline, or on the results of a plurality of tests of wafer etching, the safety liquid levels of the liquid storage containers 300a and 300b are usually set to 5-10%, for example, 5L, but not limited thereto.
It is understood that the safety fluid levels of the reservoir 300a and the reservoir 300b may be the same or different. The skilled person can set the settings according to the actual situation. It is preferred that the safety levels of the reservoir 300a and the reservoir 300b be set to the same level threshold for uniform operation.
Taking the liquid storage container 300a as an example, the current liquid level L is obtained by the continuous liquid level sensing devices (32aa, 32ab)a。
In the liquid storage container 300a, when the amount of the etching liquid consumed for etching each specification of wafers is A, the amount of the etching liquid can be determined byLa-A×na≥La, safetyCalculating the maximum value of n as na＝int[(La-La, safety)/A]Wherein int is a para-bracket [ alpha ], []The result of the inner calculation is rounded down to a function of the nearest integer.
Complete the naAfter the wafer is etched, the controller 410 controls the valve 350a to close and the valve 350b to open to switch the container 300b to supply the etching solution to the wafer etching machine 420.
Obviously, the calculated liquid level value L of the liquid storage container 300a at this timea' (i.e. L)a-A×na) And La, safetyThe amount of liquid corresponding to the difference is less than the amount of etching liquid required for etching the single wafer.
Meanwhile, the etching liquid supply device obtains L the measured accurate level of the etching liquid currently remaining in the liquid storage container 300a according to a pair of ultrasonic sensing devices (32aa, 32ab)a", that is, the amount of the etching liquid replenishing the reservoir container 300a is determined based on the amount of the remaining etching liquid, so as to perform the subsequent etching step. The supply of the etching liquid may be performed by an etching liquid supply device, for example, up to the H level of the reservoir 300a, for example, 90% of the volume of the reservoir 300a, but is not limited thereto. The replenishment of the etching liquid is performed, for example, by a metering pump or the like, but is not limited thereto.
The calculated level L of the reservoir 300a is determined due to losses in the liquid supply processa' (i.e. L)a-A×na) Is not necessarily equal to the precise level L a' of the etching liquid remaining in the reservoir 300a, and therefore cannot be based on the calculated value L of the current levela' instead, the measured value L of the current liquid level must be useda"to determine the amount of etching liquid to be replenished.
The amount of the supplementary etching liquid is calculated as the amount of the etching liquid corresponding to the difference between the set target liquid level value and the measured value of the current liquid level.
Similarly, the current level L of the reservoir 300b is obtained by a continuous level sensing devicebAnd sets a safety level L for the reservoir 300bb, safety。
Also, in the liquid storage container 300b, forWhen the amount of the etching liquid consumed for etching each wafer is A, L is defined asb-A×nb≥Lb, safetyCalculate nbHas a maximum value of nb＝int[(Lb-Lb, safety)/A]Wherein the function int [ 2 ]]As defined above.
Complete the nbAfter the wafer is etched, the controller 410 controls the valve 350b to close and the valve 350a to open to switch the container 300a to supply the etching solution to the wafer etching machine 420.
Similarly, the calculated liquid level value L of the liquid storage container 300b at this timeb' (i.e. L)b-A×nb) Andl b, safetyThe amount of liquid corresponding to the difference is less than the amount of etching liquid required for etching the single wafer.
Meanwhile, the etching liquid supply device obtains L the measured accurate level of the etching liquid remaining in the liquid storage container 300b according to a pair of ultrasonic sensing devices (32ba, 32bb)b", that is, the amount of the etching liquid of the replenishment liquid storage container 300b is determined based on the amount of the remaining etching liquid, so that the subsequent etching step is performed. In a manner similar to that described for the reservoir 300 a.
The above switching of the supply of the etching liquid to the reservoir 300a and the reservoir 300b is repeated until the etching task is completed.
The utility model discloses a liquid level sensing device of liquid storage container changes behind the ultrasonic wave level gauge, the real-time liquid level of liquid storage container when can listen the supply etching liquid in real time, consequently can be at the current liquid storage container of unnecessary evacuation, and the quantity that the etching liquid in the accurate calculation liquid storage container can sculpture the wafer to calculate the quantity of supplementary etching liquid from this, thereby avoided the waste of etching liquid.
The above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the examples, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the scope of the claims of the present invention.
Claims (9)
1. A wafer wet etching system, comprising:
the wafer wet etching device comprises a controller and a wafer etching machine;
an etching liquid supply device comprising:
the first etching liquid supply device comprises a first liquid storage container for containing etching liquid, a first pipeline for connecting the first liquid storage container and the wafer etching machine, and a first valve arranged on the first pipeline; and
a second etching liquid supply device, which comprises a second liquid storage container for containing etching liquid, a second pipeline for connecting the second liquid storage container and the wafer etching machine, and a second valve arranged on the second pipeline,
it is characterized in that the preparation method is characterized in that,
the first etching liquid supply device also comprises a first continuous liquid level measuring device arranged in the first liquid storage container, the second etching liquid supply device also comprises a second continuous liquid level measuring device arranged in the second liquid storage container,
wherein the first and second continuous level measurement devices are configured to detect levels of etching liquid in the first reservoir and the second reservoir, respectively, and to transmit detection signals to the controller,
the controller is configured to compare the acquired first liquid level value in the first liquid storage container and the acquired second liquid level value in the second liquid storage container with a first liquid level threshold value and control the opening and closing of the first valve and the second valve, so that the first etching liquid supply device and the second etching liquid supply device can continuously supply the etching liquid to the wafer etching machine.
2. The wafer wet etching system of claim 1, wherein the controller is configured to:
when a first valve is opened and a second valve is closed, comparing the first liquid level value with the first liquid level threshold value, and when the first liquid level value is larger than the first liquid level threshold value and the difference between the first liquid level value and the first liquid level threshold value corresponds to a liquid amount smaller than a preset value, controlling the first valve to be closed and the second valve to be opened; or,
and when a second valve is opened and a first valve is closed, comparing the second liquid level value with the first liquid level threshold, and when the second liquid level value is larger than the first liquid level threshold and the liquid amount corresponding to the difference is smaller than the preset value, controlling the second valve to be closed and the first valve to be opened, wherein the preset value corresponds to the amount of etching liquid required for etching a single wafer.
3. The wafer wet etching system of claim 1, wherein the first and second continuous liquid level measurement devices are selected from an ultrasonic liquid level meter, a magnetostrictive liquid level meter, and a floating ball type liquid level meter.
4. The wafer wet etching system of claim 1, wherein the first and second valves are selected from pneumatic or electrically controlled valves.
5. The wafer wet etching system of claim 1, wherein the first pipeline or the second pipeline is further provided with a fluid conveying device.
6. The wafer wet etching system according to claim 1 or 2, wherein the system further comprises an etching liquid replenishing device configured to supply an etching liquid to the first and/or second etching liquid supply device, wherein,
the controller is further configured to:
when the first valve is closed, acquiring a first liquid level value detected by the first continuous liquid level measuring device, comparing the first liquid level value with a second liquid level threshold, calculating a liquid amount corresponding to the difference when the first liquid level value is smaller than the second liquid level threshold, and controlling the etching liquid supplementing device to supplement the etching liquid with the calculated liquid amount to the first liquid storage container and/or to control the etching liquid supplementing device to supplement the etching liquid with the calculated liquid amount to the first liquid storage container
When the second valve is closed, a second liquid level value detected by the second continuous liquid level measuring device is obtained, the second liquid level value is compared with a second liquid level threshold, when the second liquid level value is smaller than the second liquid level threshold, the liquid amount corresponding to the difference between the second liquid level value and the second liquid level threshold is calculated, and the etching liquid supplementing device is controlled to supplement the etching liquid of the calculated liquid amount to the second liquid storage container.
7. The wafer wet etching system according to claim 1 or 2, wherein the first liquid level threshold value corresponds to a lowest liquid level value of the first liquid storage container and/or the second liquid storage container when the flow rate of the etching liquid supplied to the wafer wet etching device is stable.
8. The wafer wet etching system of claim 7, wherein the first and second reservoir containers have the same volume, and the first level threshold is a level corresponding to 5-10% of the volume.
9. The wafer wet etching system of claim 6, wherein the first and second reservoir containers have the same volume, and the second liquid level threshold is a liquid level corresponding to 90-95% of the volume.
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| CN201921866659.XU CN211017014U (en) | 2019-10-31 | 2019-10-31 | Wafer wet etching system |
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| CN201921866659.XU CN211017014U (en) | 2019-10-31 | 2019-10-31 | Wafer wet etching system |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107976723A (en) * | 2017-12-25 | 2018-05-01 | 中国工程物理研究院激光聚变研究中心 | Optical element processing unit (plant) and its system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107976723A (en) * | 2017-12-25 | 2018-05-01 | 中国工程物理研究院激光聚变研究中心 | Optical element processing unit (plant) and its system |
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