CN211017009U - T0-252 semiconductor packaging testing device - Google Patents
T0-252 semiconductor packaging testing device Download PDFInfo
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- CN211017009U CN211017009U CN201922371937.0U CN201922371937U CN211017009U CN 211017009 U CN211017009 U CN 211017009U CN 201922371937 U CN201922371937 U CN 201922371937U CN 211017009 U CN211017009 U CN 211017009U
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Abstract
The utility model discloses a TO-252 semiconductor packaging testing device, which is used for being installed on semiconductor testing and sorting equipment and comprises a fixed seat, an upper testing sheet group and a lower testing sheet group which are horizontally arranged on the fixed seat and are arranged along the height, a left adjusting block and a right adjusting block which are arranged at the two sides of the lower testing sheet group and can move up and down, and a semiconductor positioning seat arranged at the front side of the lower testing sheet group; the upper test piece group comprises a plurality of upper test pieces which are contacted with the semiconductor pins, and the lower test piece group comprises a plurality of lower test pieces which are contacted with the semiconductor pins; the left adjusting block is respectively provided with a first adjusting rod and a second adjusting rod which are positioned on the upper side and the lower side of the upper testing sheet group; and the right adjusting block is respectively provided with a third adjusting rod and a fourth adjusting rod which are positioned on the upper side and the lower side of the lower testing sheet group. The utility model discloses novel structure, the debugging is convenient, and the adjustable pin of cliping the semiconductor product of test strip and assurance test strip provides the test condition of preferred, guarantees higher semiconductor product quality and production efficiency.
Description
Technical Field
The utility model belongs to the technical field of semiconductor test sorting facilities, concretely relates to be applied to T0-252 semiconductor package testing arrangement of semiconductor test sorting facilities.
Background
At present, a test claw device used on semiconductor test sorting equipment and used for being in contact with a semiconductor pin adopts a discrete test mode, when a semiconductor product is tested, a certain pin is likely not to be in good contact and is still tested, so that the test result is likely to be more products with poor contact, the one-time passing qualification rate is finally influenced, and the production efficiency of an enterprise is seriously influenced. Because the product is tested without complete contact, there is a risk of burning out of the semiconductor product to some extent.
It is seen that improvements and enhancements to the prior art are needed.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned prior art's weak point, the utility model aims to provide a T0-252 semiconductor package testing arrangement, novel structure, the debugging is convenient, and the adjustable pin of cliping the semiconductor product of guaranteeing the test card of just guaranteeing the test card of test card, provides the test condition of preferred, has guaranteed the quality and the production efficiency of semiconductor product.
In order to achieve the purpose, the utility model adopts the following technical proposal:
a TO-252 semiconductor package testing device is used for being installed on semiconductor testing and sorting equipment and comprises a fixed seat, an upper testing sheet group and a lower testing sheet group which are horizontally arranged on the fixed seat and arranged along the height, a left adjusting block and a right adjusting block which are arranged on two sides of the lower testing sheet group and can move up and down, and a semiconductor positioning seat arranged on the front side of the lower testing sheet group; the upper test piece group comprises a plurality of upper test pieces which are contacted with the semiconductor pins, and the lower test piece group comprises a plurality of lower test pieces which are contacted with the semiconductor pins; the left adjusting block is respectively provided with a first adjusting rod and a second adjusting rod which are positioned on the upper side and the lower side of the upper testing sheet group; and the right adjusting block is respectively provided with a third adjusting rod and a fourth adjusting rod which are positioned on the upper side and the lower side of the lower testing sheet group.
In the TO-252 semiconductor package testing device, the number of the upper test piece and the lower test piece is 3.
In the TO-252 semiconductor package testing device, the upper test piece and the lower test piece are both L-shaped and are symmetrical about a horizontal plane.
In the TO-252 semiconductor package testing device, the upper testing sheet is detachably arranged on the top surface of the fixed seat, and the lower testing sheet is detachably arranged on the bottom surface of the fixed seat; the fixed seat is provided with a supporting frame; the supporting frame is fixedly connected to a machine table of the semiconductor testing and sorting equipment.
In the TO-252 semiconductor package testing device, the first adjusting rod and the second adjusting rod are horizontally arranged and staggered in the horizontal direction; the third adjusting rod and the fourth adjusting rod are horizontally arranged and are staggered in the horizontal direction.
In the TO-252 semiconductor package testing device, the left adjusting block is detachably connected with a left fixing frame capable of moving vertically, and the right adjusting block is detachably connected with a right fixing frame capable of moving vertically.
In the TO-252 semiconductor package testing device, the left adjusting block is provided with a first kidney-shaped hole which is suitable for a screw TO pass through and is in threaded connection with the left fixing frame; the right adjusting block is provided with a second waist-shaped hole which is suitable for a screw to pass through and is in threaded connection with the right fixing frame.
In the TO-252 semiconductor package testing device, the top surface and the bottom surface of the fixing seat are respectively and correspondingly provided with a groove suitable for placing an upper test piece and a lower test piece, and the fixing seat is provided with a fixing block which is positioned in the groove and used for fixing the upper test piece and the lower test piece.
Has the advantages that:
the utility model provides a T0-252 semiconductor package testing arrangement, novel structure, the debugging is convenient, and the adjustable pin of cliping the semiconductor product of test strip and assurance test strip of test strip provides the test condition of preferred, has guaranteed the quality and the production efficiency of semiconductor product.
The utility model discloses the both sides of testing piece group and testing piece group under at last are equipped with left regulating block and right regulating block, but vertical removal's left regulating block is equipped with and is used for adjusting first regulation pole and the second regulation pole of distance between testing piece group and the semiconductor pin, it is same, but vertical removal's right regulating block is equipped with and is used for adjusting third regulation pole and the fourth regulation pole of distance between testing piece group and the semiconductor pin down, in order to make and test the piece, the pin of semiconductor product can be contacted to the test piece down, make the semiconductor product test under the good condition of complete contact, improve the product through rate, product quality and production efficiency.
Drawings
Fig. 1 is a first perspective view of a T0-252 semiconductor package testing apparatus according to the present invention.
Fig. 2 is a perspective view of the T0-252 semiconductor package testing apparatus according to the present invention.
Fig. 3 is a perspective view of the T0-252 semiconductor package testing apparatus according to the present invention.
Fig. 4 is a right side view of the structure of the T0-252 semiconductor package testing device provided by the present invention.
Detailed Description
The utility model provides a T0-252 semiconductor package testing arrangement, for making the utility model discloses an aim at, technical scheme and effect are clearer, make clear and definite, and it is right to refer to the attached drawing below and to mention the embodiment the utility model discloses further detailed description. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
Referring TO fig. 1, 2, 3 and 4, the present invention provides a TO-252 semiconductor package testing apparatus for being mounted on a base of a testing station of a semiconductor testing and sorting device, which comprises a fixing base 1, an upper testing sheet set 51 and a lower testing sheet set 52 horizontally disposed on the fixing base 1 and arranged along a height, a left adjusting block 2 and a right adjusting block 3 disposed on two sides of the lower testing sheet set 52 and capable of moving up and down, and a semiconductor positioning base 4 disposed on a front side of the lower testing sheet set 52; the upper test chip group 51 comprises a plurality of upper test chips which are in contact with semiconductor pins, and the lower test chip group 52 comprises a plurality of lower test chips which are in contact with semiconductor pins; the left adjusting block 2 is respectively and correspondingly provided with a first adjusting rod 21 and a second adjusting rod 22 which are positioned on the upper side and the lower side of the upper test sheet group 51; the right adjusting block 3 is correspondingly provided with a third adjusting rod 31 and a fourth adjusting rod 32 which are respectively positioned at the upper side and the lower side of the lower testing sheet group 52.
The upper test piece and the lower test piece are respectively and correspondingly provided with the first adjusting rod, the second adjusting rod, the third adjusting rod and the fourth adjusting rod so as to adjust the positions of the upper test piece and the lower test piece and enable the upper test piece and the lower test piece to be in complete contact with or completely separate from pins of a product, so that automatic adjustment of the upper test piece and the lower test piece is realized, better test conditions are provided, and the situation of poor contact is avoided.
As shown in FIGS. 1 and 2, in this embodiment, the number of the upper and lower test pads is 3 each, corresponding TO the number of pins of the TO-252 semiconductor product, and each pair of the upper and lower test pads sandwiches one pin of the product, and the upper and lower test pads are L-shaped and symmetrical about a horizontal plane, and form a test jaw TO sandwich the product pins.
As shown in fig. 1, 2 and 3, the upper test strip is detachably disposed on the top surface of the fixing base 1, and the lower test strip is detachably disposed on the bottom surface of the fixing base 1. Specifically, fixing base 1 is equipped with the recess 12 that is suitable for the test strip to lay respectively at its top surface, fixing base 1 is equipped with the fixed block 11 that is located recess 12 and is used for fixed test strip, goes up test strip and fixed block 11 and has all seted up the through-hole, and the screw passes the through-hole of fixed block 11, goes up the through-hole threaded connection of test strip to fixing base 1 in proper order. Similarly, fixing base 1 is equipped with the recess that is suitable for test strip to lay respectively in its bottom surface, the fixing base is equipped with the fixed block that is located the recess and is used for fixed test strip down.
In addition, the fixed seat 1 is provided with a support frame 6; the fixed seat 1 is fixed on a support frame 6 through bolts, and the support frame 6 is fixedly connected on a machine table of semiconductor testing and sorting equipment (not shown in the figure) in the prior art through bolts.
As shown in fig. 1, 2 and 4, the first adjustment lever 21 and the second adjustment lever 22 are horizontally disposed and are staggered in the horizontal direction; the third adjusting rod 31 and the fourth adjusting rod 32 are horizontally arranged and are staggered in the horizontal direction. In this embodiment, the first adjustment lever 21 and the second adjustment lever 22 are always in contact with the top surface and the bottom surface of the upper test strip, respectively, and the third adjustment lever 31 and the fourth adjustment lever 32 are always in contact with the top surface and the bottom surface of the lower test strip, respectively.
As shown in fig. 1, 2, and 3, the left adjusting block 2 is detachably connected to a vertically movable left fixing frame 23, and the right adjusting block 3 is detachably connected to a vertically movable right fixing frame 33. The left adjusting block 2 is driven to move up and down by the left fixing frame 23 which can move vertically, the right adjusting block 3 is driven to move up and down by the right fixing frame 33 which can move vertically, and then the distance between the upper test piece, the lower test piece and the product pin is adjusted, so that the upper test piece, the lower test piece and the product pin are contacted or separated. In this embodiment, the telescopic cylinder can drive the left fixing frame 23 and the right fixing frame 33 to move back and forth in the vertical direction.
The working process is as follows: the left fixing frame 23, the right fixing frame 33 and the semiconductor positioning seat 4 are respectively installed on a test supporting seat of the existing test sorting equipment, when the test sorting equipment runs, a suction nozzle on a main workbench of the test sorting equipment adsorbs a semiconductor product to the semiconductor positioning seat 4, and after the semiconductor product is fixed on the semiconductor positioning seat 4 and positioned, the left adjusting block 2 moves downwards to enable the first adjusting rod 21 to apply downward pressing acting force on the upper test sheet group 51, so that the upper test sheets are in one-to-one corresponding contact with pins of the semiconductor; meanwhile, the right adjusting block 3 moves upwards to cause the fourth adjusting rod 32 to apply an upward pressing acting force on the lower test piece group 52, so that the lower test pieces are in one-to-one corresponding contact with the pins of the semiconductor; finally, the pins of the semiconductor product are clamped by the upper test piece and the lower test piece, so that a better contact effect between the test pieces and the pins is achieved, the condition of poor contact is avoided, a higher one-time passing rate is ensured during testing, and better guarantee is provided for the quality and the production efficiency of the product.
After the test is finished, the left adjusting block 2 and the right adjusting block 3 move reversely to drive the upper test piece and the lower test piece to be separated from the pins of the product, so that the next semiconductor product to be tested can be replaced conveniently.
As shown in fig. 1 and 2, the left adjusting block 2 is provided with a first kidney-shaped hole 24 for allowing a screw to pass through and be screwed to the left fixing frame 23; the right adjusting block 3 is provided with a second kidney-shaped hole 34 which is suitable for a screw to pass through and is in threaded connection with the right fixing frame 33. If the distance difference between the upper test piece and the product pin before contact is too large, the screws can be unscrewed, the left adjusting block 2 or the right adjusting block 3 can be correspondingly adjusted in height position, and the screws are screwed after adjustment, so that the upper test piece and the lower test piece can be simultaneously clamped to the product pin under the driving of the left fixing frame 23 and the right fixing frame 33 respectively.
To sum up, the utility model provides a T0-252 semiconductor package testing arrangement, novel structure, the debugging is convenient, and the adjustable pin of cliping the semiconductor product of test piece and assurance test piece of test piece provides the test condition of preferred, has guaranteed the quality and the production efficiency of semiconductor product.
The utility model discloses the both sides of testing piece group and testing piece group under at last are equipped with left regulating block and right regulating block, but vertical removal's left regulating block is equipped with and is used for adjusting first regulation pole and the second regulation pole of distance between testing piece group and the semiconductor pin, it is same, but vertical removal's right regulating block is equipped with and is used for adjusting third regulation pole and the fourth regulation pole of distance between testing piece group and the semiconductor pin down, in order to make and test the piece, the pin of semiconductor product can be contacted to the test piece down, make the semiconductor product test under the good condition of complete contact, improve the product through rate, product quality and production efficiency.
It should be understood that equivalent alterations and modifications can be made by those skilled in the art according to the technical solution of the present invention and the inventive concept thereof, and all such alterations and modifications should fall within the scope of the appended claims.
Claims (8)
1. A TO-252 semiconductor package testing device is used for being installed on semiconductor testing and sorting equipment and is characterized by comprising a fixed seat, an upper testing sheet group and a lower testing sheet group which are horizontally arranged on the fixed seat and arranged along the height, a left adjusting block and a right adjusting block which are arranged on two sides of the lower testing sheet group and can move up and down, and a semiconductor positioning seat arranged on the front side of the lower testing sheet group; the upper test piece group comprises a plurality of upper test pieces which are contacted with the semiconductor pins, and the lower test piece group comprises a plurality of lower test pieces which are contacted with the semiconductor pins; the left adjusting block is respectively provided with a first adjusting rod and a second adjusting rod which are positioned on the upper side and the lower side of the upper testing sheet group; and the right adjusting block is respectively provided with a third adjusting rod and a fourth adjusting rod which are positioned on the upper side and the lower side of the lower testing sheet group.
2. The TO-252 semiconductor package testing device as claimed in claim 1, wherein the number of the upper test pads and the lower test pads is 3.
3. The TO-252 semiconductor package testing device of claim 1, wherein the upper and lower test pads are each L-shaped and symmetrical about a horizontal plane.
4. The TO-252 semiconductor package test device as claimed in claim 1, wherein the upper test strip is detachably mounted on the top surface of the holder, and the lower test strip is detachably mounted on the bottom surface of the holder; the fixed seat is provided with a supporting frame; the supporting frame is fixedly connected to a machine table of the semiconductor testing and sorting equipment.
5. The TO-252 semiconductor package testing device as claimed in claim 1, wherein the first adjusting bar and the second adjusting bar are horizontally disposed and are staggered in a horizontal direction; the third adjusting rod and the fourth adjusting rod are horizontally arranged and are staggered in the horizontal direction.
6. The TO-252 semiconductor package testing device as claimed in claim 1, wherein the left adjustment block is detachably connected with a vertically movable left holder, and the right adjustment block is detachably connected with a vertically movable right holder.
7. The TO-252 semiconductor package testing device of claim 6, wherein the left adjustment block is provided with a first kidney-shaped hole adapted for a screw TO pass through and be screwed TO a left mounting bracket; the right adjusting block is provided with a second waist-shaped hole which is suitable for a screw to pass through and is in threaded connection with the right fixing frame.
8. The TO-252 semiconductor package testing device as claimed in claim 1, wherein the fixing base is correspondingly provided with a groove adapted TO receive the upper test pad and the lower test pad at the top surface and the bottom surface thereof, respectively, and the fixing base is provided with a fixing block disposed in the groove for fixing the upper test pad and the lower test pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922371937.0U CN211017009U (en) | 2019-12-25 | 2019-12-25 | T0-252 semiconductor packaging testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922371937.0U CN211017009U (en) | 2019-12-25 | 2019-12-25 | T0-252 semiconductor packaging testing device |
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| Publication Number | Publication Date |
|---|---|
| CN211017009U true CN211017009U (en) | 2020-07-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201922371937.0U Active CN211017009U (en) | 2019-12-25 | 2019-12-25 | T0-252 semiconductor packaging testing device |
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| CN (1) | CN211017009U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114684581A (en) * | 2022-05-31 | 2022-07-01 | 四川明泰微电子科技股份有限公司 | Plastic envelope chip detects uses loading attachment |
| CN115932550A (en) * | 2022-12-29 | 2023-04-07 | 佛山市蓝箭电子股份有限公司 | Semiconductor testing device |
-
2019
- 2019-12-25 CN CN201922371937.0U patent/CN211017009U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114684581A (en) * | 2022-05-31 | 2022-07-01 | 四川明泰微电子科技股份有限公司 | Plastic envelope chip detects uses loading attachment |
| CN114684581B (en) * | 2022-05-31 | 2022-08-23 | 四川明泰微电子科技股份有限公司 | Plastic envelope chip detects uses loading attachment |
| CN115932550A (en) * | 2022-12-29 | 2023-04-07 | 佛山市蓝箭电子股份有限公司 | Semiconductor testing device |
| CN115932550B (en) * | 2022-12-29 | 2023-08-29 | 佛山市蓝箭电子股份有限公司 | Semiconductor testing device |
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