CN211010868U - Infrared light source for high-thermal-conductivity aluminum nitride substrate - Google Patents

Infrared light source for high-thermal-conductivity aluminum nitride substrate Download PDF

Info

Publication number
CN211010868U
CN211010868U CN201921576235.XU CN201921576235U CN211010868U CN 211010868 U CN211010868 U CN 211010868U CN 201921576235 U CN201921576235 U CN 201921576235U CN 211010868 U CN211010868 U CN 211010868U
Authority
CN
China
Prior art keywords
light source
infrared light
screw
base board
aluminium nitride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201921576235.XU
Other languages
Chinese (zh)
Inventor
李少飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Xusheng Semiconductor Co.,Ltd.
Original Assignee
Shenzhen Xusheng Semiconductor Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Xusheng Semiconductor Co ltd filed Critical Shenzhen Xusheng Semiconductor Co ltd
Priority to CN201921576235.XU priority Critical patent/CN211010868U/en
Application granted granted Critical
Publication of CN211010868U publication Critical patent/CN211010868U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The utility model belongs to the technical field of infrared light source technique and specifically relates to an infrared light source that can be used to high heat conduction aluminium nitride base board, including aluminium nitride base board, aluminium nitride base board's upper and lower both sides all are equipped with the fin, and are equipped with a plurality of infrared light sources on the aluminium nitride base board, two from top to bottom the fin passes through fixed establishment to be fixed on aluminium nitride base board, the surface of fin is equipped with the utmost point post groove that a plurality of groups are used for grafting utmost point post on the infrared light source, and every group utmost point post groove all is equipped with two of mutual symmetry, and all is equipped with a plurality of. The utility model discloses a fixed fin that sets up can be realized on aluminium nitride base board to setting up of fixed establishment to guarantee aluminium nitride base board high thermal conductivity and thermal diffusivity at the during operation.

Description

Infrared light source for high-thermal-conductivity aluminum nitride substrate
Technical Field
The utility model relates to an infrared light source technical field specifically is an infrared light source that can be used to high heat conduction aluminium nitride base board.
Background
The infrared light source is an electric device which can be seen in real life, and can be applied to the aluminum nitride substrate, but the existing aluminum nitride substrate is poor in heat conductivity and heat dissipation due to the fact that a plurality of infrared light sources are mounted, and normal work of the aluminum nitride substrate can be influenced after a long time. In view of the above, an infrared light source for an aluminum nitride substrate with high thermal conductivity is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a can be used to high heat conduction aluminum nitride base board's infrared light source to solve the problem that provides in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides an infrared light source that can be used to high heat conduction aluminium nitride base board, includes aluminium nitride base board, aluminium nitride base board's upper and lower both sides all are equipped with the fin, and are equipped with a plurality of infrared light sources on the aluminium nitride base board, two from top to bottom the fin passes through fixed establishment to be fixed on aluminium nitride base board, the surface of fin is equipped with the utmost point post groove that a plurality of groups are used for grafting utmost point post on the infrared light source, and every group utmost point post groove all is equipped with two of mutual symmetry, and all is equipped with a plurality of louv.
Preferably, the heat dissipation holes are at least three circles around each group of pole column grooves.
Preferably, the fixing mechanism comprises a middle vertical rod, a through hole is formed in the middle vertical rod, side clamping blocks are arranged on the upper side and the lower side of the middle vertical rod, and each side clamping block is internally provided with a threaded hole.
Preferably, a first screw rod and a second screw rod are arranged inside the middle vertical rod, the first screw rod and the second screw rod are fixedly connected in a welding mode, the tail end of the first screw rod penetrates through a threaded hole located above the first screw rod, and the tail end of the second screw rod penetrates through a threaded hole located below the second screw rod.
Preferably, a knob is arranged at the tail end of the first screw rod.
Preferably, the tail end of the second screw is provided with a limiting block.
Preferably, the screw thread winding directions of the first screw and the second screw are opposite.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses a fixed fin that sets up can be realized on aluminium nitride base board to setting up of fixed establishment to guarantee aluminium nitride base board high thermal conductivity and thermal diffusivity at the during operation.
Drawings
FIG. 1 is a schematic side view of the overall structure of the present invention;
FIG. 2 is a top view of the heat sink of the present invention;
FIG. 3 is an enlarged view of the point A in FIG. 2 according to the present invention;
FIG. 4 is a schematic view of the fixing mechanism of the present invention;
fig. 5 is an enlarged view of the point B in fig. 4 according to the present invention.
In the figure: the solar cell comprises an aluminum nitride substrate 1, a heat radiating fin 2, a pole column groove 200, a heat radiating hole 201, an infrared light source 3, a fixing mechanism 4, a middle vertical rod 400, a through hole 401, a side clamping block 402, a threaded hole 403, a first screw rod 404, a second screw rod 405, a knob 406 and a limiting block 407.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution:
the utility model provides an infrared light source that can be used to high heat conduction aluminium nitride base board, including aluminium nitride base board 1, aluminium nitride base board 1's upper and lower both sides all are equipped with fin 2, and be equipped with a plurality of infrared light sources 3 on the aluminium nitride base board 1, two fin 2 are fixed on aluminium nitride base board 1 through fixed establishment 4 from top to bottom, fin 2's surface is equipped with the utmost point post groove 200 that a plurality of groups are used for pegging graft utmost point post on the infrared light source 3, every utmost point post groove 200 of group all is equipped with two of mutual symmetry, and all be equipped with a plurality of louvres.
In this embodiment, at least three circles of heat dissipation holes 201 are formed around each group of the post slots 200, and the arrangement of the heat dissipation holes 201 arranged at equal intervals in a ring shape can well achieve high heat dissipation and high heat conduction of the aluminum nitride substrate 1.
In this embodiment, the fixing mechanism 4 includes a middle vertical rod 400, a through hole 401 is provided in the middle vertical rod 400, side clamping blocks 402 are provided on the upper and lower sides of the middle vertical rod 400, and a threaded hole 403 is provided in each side clamping block 402.
It should be noted that the surrounding directions of the threads on the hole wall surfaces of the upper threaded hole 403 and the lower threaded hole 403 are opposite, wherein the upper threaded hole 403 is in threaded connection with the first threaded rod 404, and the lower threaded hole 403 is in threaded connection with the second threaded rod 405.
In this embodiment, a first screw 404 and a second screw 405 are arranged inside the middle vertical rod 400, the first screw 404 and the second screw 405 are fixedly connected by welding, the end of the first screw 404 penetrates through the threaded hole 403 located above, and the end of the second screw 405 penetrates through the threaded hole 403 located below.
In this embodiment, a knob 406 is disposed at the end of the first screw 404.
It is worth noting that the knob 406 and the first screw 404 are fixed by welding, and the diameter of the knob 406 is larger than that of the upper threaded hole 403.
In this embodiment, the end of the second screw 405 is provided with a stop block 407.
It should be noted that the stop block 407 and the second screw 405 are fixed by welding, and the diameter of the stop block 407 is larger than the diameter of the threaded hole 403 located below.
In this embodiment, the winding directions of the threads on the surfaces of the first screw 404 and the second screw 405 are opposite.
The utility model discloses an infrared light source that can be used to high heat conduction aluminium nitride base board when using, laminate two fin 2 respectively in the upper and lower both sides of aluminium nitride base board 1, place fixing mechanism 4 between the end of two fin 2 from top to bottom again, (fixing mechanism 4 is under initial condition, the distance between two upper and lower side clamp splice 402 is greater than the thickness sum of aluminium nitride base board 1 and two fin 2), press two upper and lower side clamp splice 402 with the hand, then rotate knob 406 and drive first screw rod 404 and second screw rod 405 rotation, because first screw rod 404 and second screw rod 405 respectively with two upper and lower side clamp splice 402 threaded connection, consequently can drive side clamp splice 402 and do linear motion when first screw rod 404 and second screw rod 405 rotate, again because the screw thread of first screw rod 404 and second screw rod 405 encircles the opposite direction, therefore the two rotates simultaneously can drive two upper and lower two side clamp splice 402 synchronous reverse direction movements, through the mode, the two side clamping blocks 402 can be close to each other and completely and tightly attached to the radiating fins 2, so that the two radiating fins 2 and the aluminum nitride substrate 1 can be clamped, the aluminum nitride substrate 1 can be well conducted and radiated through the radiating fins 2, and the radiating fins 2 can be fixed and taken down according to needs in a fixing mode, so that the aluminum nitride substrate fixing device is very convenient.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (7)

1. An infrared light source for a high thermal conductivity aluminum nitride substrate, comprising an aluminum nitride substrate (1), characterized in that: the upper and lower both sides of aluminium nitride base board (1) all are equipped with fin (2), and are equipped with a plurality of infrared light source (3) on aluminium nitride base board (1), two from top to bottom fin (2) are fixed on aluminium nitride base board (1) through fixed establishment (4), the surface of fin (2) is equipped with utmost point post groove (200) that a plurality of groups are used for pegging graft utmost point post on infrared light source (3), and every group utmost point post groove (200) all are equipped with two of mutual symmetry, and all are equipped with a plurality of louvres (201) around every group utmost point post groove (200).
2. The infrared light source of claim 1, wherein: the heat dissipation holes (201) are at least three circles around each group of pole column grooves (200).
3. The infrared light source for the high thermal conductivity aluminum nitride substrate as claimed in claim 2, wherein: the fixing mechanism (4) comprises a middle vertical rod (400), a through hole (401) is formed in the middle vertical rod (400), side clamping blocks (402) are arranged on the upper side and the lower side of the middle vertical rod (400), and each side clamping block (402) is internally provided with a threaded hole (403).
4. The infrared light source for the high thermal conductivity aluminum nitride substrate as claimed in claim 3, wherein: the middle vertical rod (400) is internally provided with a first screw (404) and a second screw (405), the first screw (404) and the second screw (405) are fixedly connected in a welding mode, the tail end of the first screw (404) penetrates through a threaded hole (403) located above, and the tail end of the second screw (405) penetrates through a threaded hole (403) located below.
5. The IR light source according to claim 4, wherein: the tail end of the first screw rod (404) is provided with a knob (406).
6. The infrared light source for the high thermal conductivity aluminum nitride substrate as claimed in claim 5, wherein: and the tail end of the second screw (405) is provided with a limiting block (407).
7. The infrared light source of claim 6, wherein: the winding directions of the threads on the surfaces of the first screw (404) and the second screw (405) are opposite.
CN201921576235.XU 2019-09-20 2019-09-20 Infrared light source for high-thermal-conductivity aluminum nitride substrate Active CN211010868U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921576235.XU CN211010868U (en) 2019-09-20 2019-09-20 Infrared light source for high-thermal-conductivity aluminum nitride substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921576235.XU CN211010868U (en) 2019-09-20 2019-09-20 Infrared light source for high-thermal-conductivity aluminum nitride substrate

Publications (1)

Publication Number Publication Date
CN211010868U true CN211010868U (en) 2020-07-14

Family

ID=71474896

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921576235.XU Active CN211010868U (en) 2019-09-20 2019-09-20 Infrared light source for high-thermal-conductivity aluminum nitride substrate

Country Status (1)

Country Link
CN (1) CN211010868U (en)

Similar Documents

Publication Publication Date Title
CN211010868U (en) Infrared light source for high-thermal-conductivity aluminum nitride substrate
CN210182973U (en) Lighting bus duct
CN209739271U (en) Front heat dissipation device of electric bicycle
CN212436159U (en) Radiator based on graphene heat dissipation material
CN212978122U (en) Assembling clamp for fin radiator production
CN210771489U (en) Ultrahigh heat conduction LED circuit substrate
CN212390313U (en) Improved structure of LED lamp tube
CN209963043U (en) Assembly platform for producing semiconductor light-emitting element
CN203686956U (en) Radiator
CN103322444B (en) Heat transfer substrate is from the preparation method of clamping LED tubular lamp
CN217883077U (en) Novel micromotor medium plate structure
CN217716089U (en) Combined radiating fin
CN220985627U (en) Photovoltaic junction box
CN213343127U (en) High-elasticity heat-conducting silica gel sheet
CN219674163U (en) Heat radiation structure of LED lamp
CN212252515U (en) Installation reinforcement of LED lamp
CN210519334U (en) Heat dissipation fixing base of power strip
CN210743955U (en) SMD schottky diode
CN209354974U (en) A kind of aluminum substrate ontology with installation foundation trench
CN213272086U (en) LED lamp capable of improving heat dissipation effect
CN210511538U (en) Supporting structure for LED circuit board
CN210780570U (en) Alternating current solar module
CN216121693U (en) Fixing device for power line
CN212258700U (en) High-efficient heat dissipation module
CN208886418U (en) A kind of LED lamp heat sink

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: 518000 zone a, 8 and 9, floor 1, building e, Guancheng Low Carbon Industrial Park, No. 20, Hedi Road, Gongming street, Guangming New Area, Shenzhen, Guangdong

Patentee after: Guangdong Xusheng Semiconductor Co.,Ltd.

Address before: 518000 zone a, 8 and 9, floor 1, building e, Guancheng Low Carbon Industrial Park, No. 20, Hedi Road, Gongming street, Guangming New Area, Shenzhen, Guangdong

Patentee before: SHENZHEN XUSHENG SEMICONDUCTOR CO.,LTD.

CP01 Change in the name or title of a patent holder
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of utility model: An infrared light source for high thermal conductivity aluminum nitride substrate

Effective date of registration: 20220630

Granted publication date: 20200714

Pledgee: Heyuan Branch of China Construction Bank Co.,Ltd.

Pledgor: Guangdong Xusheng Semiconductor Co.,Ltd.

Registration number: Y2022440000125

PE01 Entry into force of the registration of the contract for pledge of patent right
PC01 Cancellation of the registration of the contract for pledge of patent right

Date of cancellation: 20230215

Granted publication date: 20200714

Pledgee: Heyuan Branch of China Construction Bank Co.,Ltd.

Pledgor: Guangdong Xusheng Semiconductor Co.,Ltd.

Registration number: Y2022440000125

PC01 Cancellation of the registration of the contract for pledge of patent right
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of utility model: An infrared light source for aluminum nitride substrate with high thermal conductivity

Effective date of registration: 20230224

Granted publication date: 20200714

Pledgee: Heyuan Branch of China Construction Bank Co.,Ltd.

Pledgor: Guangdong Xusheng Semiconductor Co.,Ltd.

Registration number: Y2023980033429

PE01 Entry into force of the registration of the contract for pledge of patent right