CN210998133U - Wax-free adsorption pad - Google Patents
Wax-free adsorption pad Download PDFInfo
- Publication number
- CN210998133U CN210998133U CN201922240274.9U CN201922240274U CN210998133U CN 210998133 U CN210998133 U CN 210998133U CN 201922240274 U CN201922240274 U CN 201922240274U CN 210998133 U CN210998133 U CN 210998133U
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- China
- Prior art keywords
- adsorption pad
- wax
- pad body
- shaped movable
- pad main
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a no wax adsorbs pad, including adsorbing the pad main part, there are a plurality of standing grooves along the width direction equidistance shaping of adsorbing the pad main part on the top surface of adsorbing the pad main part, and the length direction shaping of the bottom surface both sides along adsorbing the pad main part of standing groove is fluted, the equal shaping of both sides of adsorbing the pad main part at the standing groove has the draw-in groove that communicates with the standing groove, installs the pivot that sets up along the width direction of adsorbing the pad main part in the draw-in groove, be equipped with L shape fly leaf in the recess, the horizontal end of L shape fly leaf is placed in the recess, the vertical setting of the vertical end of L shape fly leaf is in the draw-in groove, the pivot runs through the junction of L shape fly leaf horizontal end and vertical end and normal.
Description
Technical Field
The utility model belongs to the technical field of the adsorption pad and specifically relates to a no wax adsorbs pad is related to.
Background
With the development of semiconductor technology, the quality of the substrate surface is required to be higher and higher. Both human and automated operations involve 2 actions for substrate polishing, namely the taking and placing of substrate pieces. The size of a cavity opening of an existing common adsorption pad structure is larger than the size of a wafer by about 0.5mm, the wafer is easily damaged if the size of the cavity opening is too large, the tolerance exists between the size of the cavity opening and the size of the wafer, when the maximum size of the wafer meets the size of the minimum cavity opening, the gap between the size of the cavity opening and the size of the wafer can be only 0.1mm or even smaller, the wafer placing is difficult, particularly when the wafer is placed automatically, the requirement on the accuracy of automation is very high, and the wafer is difficult to be placed into the cavity opening accurately. After the substrate is polished, the wafer needs to be taken out from the cavity opening of the adsorption pad, the front surface (polishing surface) of the substrate cannot be touched after polishing, the back surface of the substrate is contacted with the adsorption pad, certain tension exists, a wafer taking device is commonly used at present and extends into the back surface of the substrate from a gap between the cavity opening and the wafer to tilt the substrate, and the substrate is easy to damage due to the mode of directly taking the wafer without damaging the tension.
Disclosure of Invention
The utility model discloses an it is not enough to overcome above-mentioned condition, aims at providing the technical scheme that can solve above-mentioned problem.
The utility model provides a no wax adsorbs pad, includes the adsorption pad main part, has a plurality of standing grooves along the width direction equidistance shaping of adsorption pad main part on the top surface of adsorption pad main part, and the bottom surface both sides of standing groove are fluted along the length direction shaping of adsorption pad main part, the adsorption pad main part has the draw-in groove that communicates with the standing groove in the equal shaping of both sides of standing groove, installs the pivot that sets up along the width direction of adsorption pad main part in the draw-in groove, be equipped with L shape fly leaf in the recess, the horizontal end of L shape fly leaf is placed in the recess, and the vertical setting of the vertical end of L shape fly leaf is in the draw-in groove, the pivot runs through the junction of L shape fly leaf horizontal end and vertical end and normal.
Furthermore, the adsorption pad body is made of semiconductor silicon crystal materials.
Furthermore, the lateral surface of the vertical end of the L-shaped movable plate is connected with a pull rod arranged along the length direction of the adsorption pad main body, the pull rod penetrates through the adsorption pad main body to extend to the outer side of the adsorption pad main body, and the pull rod is in sliding fit with the adsorption pad main body.
Furthermore, soft rubber layers are arranged on the top surface of the horizontal end and the inner side surface of the vertical end of the L-shaped movable plate.
Further, the top surface of the soft rubber layer and the bottom surface of the placing groove are on the same horizontal plane.
Compared with the prior art, the utility model has the advantages that the structure is novel, the tension between the back of the wafer substrate and the adsorption pad can be destroyed when the pull rod is pulled slowly, and the L-shaped plate can hold the wafer out, thereby avoiding damage.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of the present invention;
fig. 2 is another schematic structural diagram of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below, and it should be understood that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 and 2, in the embodiment of the present invention, a wax-free adsorption pad includes an adsorption pad main body 1, a plurality of placing grooves are formed on the top surface of the adsorption pad main body 1 along the width direction equal distance of the adsorption pad main body 1, the bottom surfaces of the placing grooves are formed with grooves along the length direction of the adsorption pad main body 1, the adsorption pad main body 1 is formed with slots communicated with the placing grooves on both sides, a rotating shaft 3 is installed in the slots and arranged along the width direction of the adsorption pad main body 1, an L-shaped movable plate 2 is arranged in the grooves, the horizontal end of the L-shaped movable plate 2 is arranged in the grooves, the vertical end of the L-shaped movable plate 2 is vertically arranged in the slots, and the rotating shaft 3 runs through the connecting part of the horizontal end and the vertical end of the L-shaped movable plate 2 and is rotatably matched with the.
Further, the adsorption pad body 1 is made of a semiconductor silicon crystal material.
Furthermore, the outer side surface of the vertical end of the L-shaped movable plate 2 is connected with a pull rod 5 arranged along the length direction of the absorption pad main body 1, the pull rod 5 penetrates through the absorption pad main body 1 to extend to the outer side of the absorption pad main body 1, and the pull rod 5 is in sliding fit with the absorption pad main body 1.
Furthermore, the soft rubber layer 4 is arranged on the top surface of the horizontal end and the inner side surface of the vertical end of the L-shaped movable plate 2.
Further, the top surface of the soft rubber layer 4 and the bottom surface of the placing groove are on the same horizontal plane.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Claims (5)
1. The wax-free adsorption pad comprises an adsorption pad body and is characterized in that a plurality of placing grooves are formed in the top surface of the adsorption pad body along the width direction of the adsorption pad body at equal intervals, grooves are formed in two sides of the bottom surface of each placing groove along the length direction of the adsorption pad body, clamping grooves communicated with the placing grooves are formed in two sides of the adsorption pad body, a rotating shaft arranged along the width direction of the adsorption pad body is installed in each clamping groove, L-shaped movable plates are arranged in each groove, the horizontal ends of the L-shaped movable plates are placed in the grooves, the vertical ends of the L-shaped movable plates are vertically arranged in the clamping grooves, and the rotating shaft penetrates through the connecting positions of the horizontal ends and the vertical ends of the L-shaped movable plates and is in running fit with the connecting positions.
2. The wax-free absorbent pad of claim 1, wherein: the adsorption pad main body is made of semiconductor silicon crystal materials.
3. The wax-free adsorption pad of claim 1, wherein the outer side surface of the vertical end of the L-shaped movable plate is connected with a pull rod arranged along the length direction of the adsorption pad body, the pull rod penetrates through the adsorption pad body and extends to the outer side of the adsorption pad body, and the pull rod is in sliding fit with the adsorption pad body.
4. The wax-free adsorption pad of claim 1, wherein soft rubber layers are mounted on the top surface of the horizontal end and the inner side surface of the vertical end of the L-shaped movable plate.
5. The wax-free absorbent pad of claim 4, wherein: the top surface of the soft rubber layer and the bottom surface of the placing groove are on the same horizontal plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922240274.9U CN210998133U (en) | 2019-12-14 | 2019-12-14 | Wax-free adsorption pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922240274.9U CN210998133U (en) | 2019-12-14 | 2019-12-14 | Wax-free adsorption pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210998133U true CN210998133U (en) | 2020-07-14 |
Family
ID=71472563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922240274.9U Expired - Fee Related CN210998133U (en) | 2019-12-14 | 2019-12-14 | Wax-free adsorption pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210998133U (en) |
-
2019
- 2019-12-14 CN CN201922240274.9U patent/CN210998133U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200714 Termination date: 20201214 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |