CN210984728U - Display panel and electronic device - Google Patents

Abstract

The present disclosure relates to a display panel and an electronic apparatus. The display panel includes: a rigid substrate; an organic light emitting layer laminated above the rigid substrate; and the thin film packaging layer is connected to the rigid substrate and is matched with the rigid substrate to wrap the organic light emitting layer.

Description

Display panel and electronic device

Technical Field

The present disclosure relates to the field of terminal technologies, and in particular, to a display panel and an electronic device.

Background

Currently, some electronic devices are often configured with a rigid display panel to display image information through the display panel to enable interaction between the electronic device and a user. Generally, when a light emitting unit in a rigid display panel is packaged, a glass packaging process is adopted, which causes an air gap between a substrate and glass, and since the glass packaging needs to be performed by bonding packaging through glass raw materials (the glass raw materials are mainly glass cement consisting of glass powder, and are melted under laser irradiation to perform bonding action), the glass raw materials are hard materials and are brittle, so that the glass packaging is easy to break when external force is applied, and a black screen or a patterned screen of the display panel is caused.

SUMMERY OF THE UTILITY MODEL

The present disclosure provides a display panel and an electronic device to solve the disadvantages of the related art.

According to a first aspect of embodiments of the present disclosure, there is provided a display panel including:

a rigid substrate;

an organic light emitting layer laminated above the rigid substrate;

and the thin film packaging layer is connected to the rigid substrate and is matched with the rigid substrate to wrap the organic light emitting layer.

Optionally, the organic light emitting layer includes:

a thin film transistor unit disposed on the rigid substrate;

and the light-emitting unit is arranged above the thin film transistor unit, and the thin film transistor unit is positioned between the light-emitting unit and the rigid substrate.

Optionally, the method further includes:

and the touch layer is positioned on one side of the thin film packaging layer, which is far away from the organic light emitting layer.

Optionally, the touch layer includes a capacitive touch layer or an optical touch layer.

Optionally, the method further includes:

the cover plate is located above the film packaging layer, and the surface, far away from the film packaging layer, of the cover plate forms the outer surface of the display panel.

Optionally, the rigid substrate comprises a low temperature polycrystalline silicon substrate.

Optionally, the rigid substrate comprises a transparent substrate.

According to a second aspect of the embodiments of the present disclosure, there is provided an electronic device including the display panel according to any one of the embodiments.

Optionally, the display panel includes a transparent display area and a non-transparent display area;

the electronic device further comprises a camera assembly, and the camera assembly is arranged corresponding to the transparent display area.

Optionally, at least a portion of the rigid substrate is made of a transparent material, and an area made of the transparent material on the rigid substrate corresponds to the transparent display area.

The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:

according to the embodiments, the thin film encapsulation layer and the rigid substrate are matched to wrap the organic light emitting layer, so that the organic light emitting layer is isolated from the outside, and the organic light emitting layer is protected. Furthermore, the film packaging layer can be formed through a film packaging process, and due to the fact that the flexibility of the film packaging layer is high, the probability of failure of the electronic equipment when the electronic equipment is subjected to external force can be reduced, and the service life of the electronic equipment is prolonged.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.

Fig. 1 is a schematic structural diagram illustrating a display panel according to an exemplary embodiment.

Fig. 2 is a schematic structural diagram illustrating another display panel according to an exemplary embodiment.

Fig. 3 is a schematic structural diagram illustrating yet another display panel according to an exemplary embodiment.

Fig. 4 is a schematic structural diagram illustrating yet another display panel according to an exemplary embodiment.

Fig. 5 is a schematic structural diagram of an electronic device according to an exemplary embodiment.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

It is to be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present application. The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination", depending on the context.

In the related art, when a light emitting unit in a rigid display panel is packaged, a glass packaging process is generally adopted, which may cause an air gap between a substrate and glass, and since the glass packaging needs to be adhesively packaged by a glass raw material, which is a hard material and is relatively brittle, the glass packaging is easily broken when an external force is applied, which may cause a black screen or a flower screen of the display panel.

Based on this, the present disclosure provides a display panel 100 as shown in fig. 1, and the display panel 100 may include a rigid substrate 1, an organic light emitting layer 2, and a thin film encapsulation layer 3. The organic light emitting layer 2 can be stacked above the rigid substrate 1, and the thin film encapsulation layer 3 is connected to the rigid substrate 1 and is matched with the rigid substrate 1 to wrap the organic light emitting layer 2, so that the organic light emitting layer 2 is isolated from the outside, and the organic light emitting layer 2 is protected. Furthermore, the film packaging layer 3 can be formed through a film packaging process, and the flexibility of the film packaging layer 3 is high, so that the probability of failure of the electronic equipment when the electronic equipment is subjected to external force can be reduced, and the service life of the electronic equipment can be prolonged. The rigid substrate 1 may include a low-temperature polysilicon substrate, so as to achieve the purposes of being light, thin and low in power consumption.

In this embodiment, as shown in fig. 2, the display panel 100 may further include a touch layer 4, the touch layer 4 may be located on a side of the thin film encapsulation layer 3 away from the organic light emitting layer 2, and a touch operation performed by a user on the display panel 100 may be detected through the touch layer 4, so that an electronic device configured with the display panel 100 responds to the touch operation. The touch layer 4 may be a capacitive touch layer, so as to obtain a touch operation of a user through a detected capacitance change; or the touch layer 4 may also be an optical touch layer, which is not limited by the present disclosure.

In the above embodiments, as shown in fig. 3, the organic light emitting layer 2 may include the thin film transistor unit 21 and the light emitting unit 22, the thin film transistor unit 21 may be disposed on the rigid substrate 1, the light emitting unit 22 may be disposed above the thin film transistor unit 21, and the thin film transistor unit 21 is located between the light emitting unit 22 and the rigid substrate 1. The light emitting unit 22 may include organic light emitting diodes, and each organic light emitting diode may be electrically connected to the thin film transistor unit 21, so that the thin film transistor unit 21 controls the organic light emitting diode to be turned off and turned on.

Based on the technical solution of the present disclosure, as shown in fig. 4, the display panel 100 may further include a cover plate 5, the cover plate 5 is located above the film encapsulation layer 3, and the surface of the cover plate 5 away from the film encapsulation layer 3 may form an outer surface of the display panel 100, so as to protect the internal touch layer 4, the film encapsulation layer 3, and the organic light emitting layer 2.

As shown in fig. 5, the present disclosure also provides an electronic device 200 as shown in fig. 5, where the electronic device 200 may include the display panel 100 as described in any one of fig. 1 to 4. Further, the electronic apparatus 200 may further include a camera assembly 201, the display panel 100 may include a transparent display area 10 and a non-transparent display area 102, and the transparent display area 101 may be disposed corresponding to the camera assembly 201. Based on this, the camera assembly 201 can obtain light through the transparent display area 101, and the transparent display area 101 can also be used for showing image information, so that the front shooting function of the electronic device 200 is not influenced while the screen occupation ratio of the electronic device 200 is improved, and the user experience is improved.

In this embodiment, at least a portion of the rigid substrate 1 included in the display panel 100 is made of a transparent material, and an area made of the transparent material on the rigid substrate 1 corresponds to the transparent display area 101, so as to prevent the color on the rigid substrate 1 from affecting the imaging of the camera module 201.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (10)

1. A display panel, comprising:

a rigid substrate;

an organic light emitting layer laminated above the rigid substrate;

and the thin film packaging layer is connected to the rigid substrate and is matched with the rigid substrate to wrap the organic light emitting layer.

2. The display panel according to claim 1, wherein the organic light emitting layer comprises:

a thin film transistor unit disposed on the rigid substrate;

and the light-emitting unit is arranged above the thin film transistor unit, and the thin film transistor unit is positioned between the light-emitting unit and the rigid substrate.

3. The display panel according to claim 1, further comprising:

and the touch layer is positioned on one side of the thin film packaging layer, which is far away from the organic light emitting layer.

4. The display panel according to claim 3, wherein the touch layer comprises a capacitive touch layer or an optical touch layer.

5. The display panel according to claim 1, further comprising:

the cover plate is located above the film packaging layer, and the surface, far away from the film packaging layer, of the cover plate forms the outer surface of the display panel.

6. The display panel of claim 1, wherein the rigid substrate comprises a low temperature poly-silicon substrate.

7. The display panel of claim 1, wherein the rigid substrate comprises a transparent substrate.

8. An electronic device characterized by comprising the display panel according to any one of claims 1 to 7.

9. The electronic device of claim 8, wherein the display panel comprises a transparent display area and a non-transparent display area;

the electronic device further comprises a camera assembly, and the camera assembly is arranged corresponding to the transparent display area.

10. The electronic device according to claim 9, wherein at least a portion of the rigid substrate is made of a transparent material, and an area of the rigid substrate made of the transparent material corresponds to the transparent display area.

Images