CN210972361U - Heat dissipation type packaging structure for PCB - Google Patents

Heat dissipation type packaging structure for PCB Download PDF

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Publication number
CN210972361U
CN210972361U CN201921744241.1U CN201921744241U CN210972361U CN 210972361 U CN210972361 U CN 210972361U CN 201921744241 U CN201921744241 U CN 201921744241U CN 210972361 U CN210972361 U CN 210972361U
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China
Prior art keywords
pcb
heat dissipation
bolt
supporting platform
dissipation type
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CN201921744241.1U
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Chinese (zh)
Inventor
李桂华
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Jiangsu Shangfu Electronics Co ltd
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Jiangsu Shangfu Electronics Co ltd
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Priority to CN201921744241.1U priority Critical patent/CN210972361U/en
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Abstract

The utility model discloses a heat dissipation type packaging structure that PCB board was used belongs to the packaging technology field. The method comprises the following steps: the supporting assembly comprises a supporting platform, a mounting groove formed in the upper surface of the supporting platform, and a plurality of cylinders vertically fixed on the supporting platform; encapsulation subassembly, including the dustcoat, set up on the dustcoat and the position with the hollow sleeve pipe of a plurality of that the cylinder is corresponding, vertical fixing the stopper of cylinder one side is seted up down in proper order on the stopper from last a plurality of spacing groove is seted up on the hollow sleeve pipe and with the spacing hole of stopper homonymy, and pass spacing hole joint with joint subassembly of spacing inslot. The utility model is different from the bolt fixed connection in the prior art, the fixed connection between the support platform and the outer cover is realized by adopting the clamping component, and the disassembly and the installation are both convenient; the height required during packaging can be adjusted according to the height of the electronic components on the PCB; is quick and practical.

Description

Heat dissipation type packaging structure for PCB
Technical Field
The utility model belongs to the technical field of the encapsulation, especially, relate to a heat dissipation type packaging structure that PCB board was used.
Background
In the use of electronic devices, Printed Circuit Boards (PCBs) are increasingly used, and PCBs are generally used, which are fixed by fixing the PCBs on a certain supporting platform and then covering the supporting platform with a cover. And then the outer cover and the supporting platform are fixedly connected in a bolt connection mode, but the fixing mode is troublesome in dismounting and mounting, one outer cover is required to be screwed down or dismounted, the mounting and dismounting cannot be carried out quickly, and the process is complicated. And the PCB board is sealed in supporting platform and dustcoat, and the radiating effect is not good.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a solve the technical problem who exists among the above-mentioned background art, provide a heat dissipation type packaging structure that PCB board that can install fast and dismantle and application scope is wide is used.
The utility model discloses a following technical scheme realizes: a heat dissipation type package structure for a PCB board, comprising:
the supporting assembly comprises a supporting platform, a mounting groove formed in the upper surface of the supporting platform, and a plurality of cylinders vertically fixed on the supporting platform;
encapsulation subassembly, including the dustcoat, set up on the dustcoat and the position with the hollow sleeve pipe of a plurality of that the cylinder is corresponding, vertical fixing the stopper of cylinder one side is seted up down in proper order on the stopper from last a plurality of spacing groove is seted up on the hollow sleeve pipe and with the spacing hole of stopper homonymy, and pass spacing hole joint with joint subassembly of spacing inslot. The connection mode that adopts the joint replaces screw nut's rotation, the simple operation to the spacing groove is a plurality of, can realize that the dustcoat of co-altitude is fixed.
In a further embodiment, the clamping assembly comprises: the connecting column is fixed on the outer side of the hollow sleeve and is concentric with the limiting hole, and the bolt is inserted into the connecting column and the limiting hole;
the inner wall of one end, far away from the limiting groove, of the connecting column is provided with an inwardly extending clamping ring, the outer surface of the bolt is provided with an annular boss along the circumference of the bolt, and the annular boss is located between the limiting hole and the clamping ring; when the annular boss abuts against the limiting hole, the bolt abuts against the limiting groove; when the annular boss is abutted to the clamping ring, the bolt is separated from the limiting hole.
By adopting the technical scheme: the cooperation of bolt and spacing groove realizes location locking to set up interact's annular boss and snap ring on bolt and spliced pole, be used for preventing that the bolt breaks away from the spliced pole.
In a further embodiment, the clamping assembly further comprises: the connecting pin is closely arranged at one end of the bolt far away from the limiting hole, and the connecting piece is hinged with the tail end of the bending plate at the central position; the connecting end of the connecting piece is rotationally clamped between the connecting pin and the connecting column.
By adopting the technical scheme: in order to better control the moving direction of the bolt, a connecting piece capable of controlling the bolt is arranged, and the operation speed is increased.
In a further embodiment, the connecting ends of the connections are hook-shaped.
By adopting the technical scheme: the connecting piece is convenient to rotate between the connecting pin and the connecting column under the action of external force, and friction is reduced.
In a further embodiment, guide plates are fixed vertically upwards on both sides of the support platform.
By adopting the technical scheme: not only plays a role of guiding, but also can play a role of dust prevention.
In a further embodiment, a guide post is arranged on one side of the cylinder, and a guide rod is fixed on one side of the hollow sleeve and corresponds to the position of the guide post.
By adopting the technical scheme: the guide function is realized, and the cylinder can be conveniently and directly inserted into the hollow sleeve.
In a further embodiment, the inner surface of the outer cover is provided with a plurality of grooves.
By adopting the technical scheme: the thickness of the outer cover is reduced, and the heat dissipation performance is improved.
The utility model has the advantages that: the utility model is different from the bolt fixed connection in the prior art, the fixed connection between the support platform and the outer cover is realized by adopting the clamping component, and the disassembly and the installation are both convenient; the height required during packaging can be adjusted according to the height of the electronic components on the PCB; is quick and practical.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation type package structure for a PCB.
Fig. 2 is a cross-sectional view of a heat dissipation type package structure for a PCB.
FIG. 3 is a schematic view of the clamping assembly.
Figure 4 is an exploded view of the snap assembly.
Fig. 5 is an exploded view of the bolt and connecting post.
Each of fig. 1 to 5 is labeled as: supporting platform 1, mounting groove 2, cylinder 3, dustcoat 4, hollow sleeve 5, stopper 6, spacing groove 7, spacing hole 8, spliced pole 9, bolt 10, snap ring 11, annular boss 12, bent plate 13, connecting pin 14, connecting piece 15, deflector 16, guide post 17, guide bar 18.
Detailed Description
The project is further described with reference to the specific embodiment and the attached drawing description.
First, applicants have found, through a number of practices: the PCB is fixed on a certain supporting platform, and an outer cover is sleeved on the PCB. And then the outer cover and the supporting platform are fixedly connected in a bolt connection mode, but the fixing mode is troublesome in dismounting and mounting, one outer cover is required to be screwed down or dismounted, the mounting and dismounting cannot be carried out quickly, and the process is complicated.
In order to save the process and realize quick mounting and dismounting, the applicant designs a heat dissipation type packaging structure for a PCB, comprising: supporting platform 1, mounting groove 2, cylinder 3, dustcoat 4, hollow sleeve 5, stopper 6, spacing groove 7, spacing hole 8, spliced pole 9, bolt 10, snap ring 11, annular boss 12, bent plate 13, connecting pin 14, connecting piece 15, deflector 16, guide post 17, guide bar 18.
As shown in fig. 1 and 2, a plurality of mounting grooves 2 are formed in the supporting platform 1, and the mounting grooves 2 are used for fixing a PCB. The number of the cylinders 3 is four, and the cylinders are respectively fixed at four top corners of the mounting groove 2.
The four top corners of the outer cover 4 are provided with hollow sleeves 5, the positions of the hollow sleeves 5 correspond to the positions of the cylinders 3, and when the outer cover 4 is buckled on the supporting platform 1, the cylinders 3 are just inserted into the hollow sleeves 5, so that the locking and positioning between the cylinders 3 and the hollow sleeves 5 are realized. As shown in fig. 3 and 4, a limiting block 6 in the vertical direction is fixed on one side of the cylinder 3, and three limiting grooves 7 are sequentially arranged on the limiting block 6 from top to bottom. The hollow sleeve 5 is provided with a limiting hole 8, the limiting hole 8 and the limiting block 6 are arranged at the same side, and the limiting hole 8 is connected with the limiting groove 7 through a clamping component. The connection mode that adopts the joint replaces screw nut's rotation, the simple operation to spacing groove 7 is a plurality of, can realize that not co-altitude dustcoat 4 is fixed.
Specifically, the joint subassembly includes: inside is hollow and both ends open's spliced pole 9, spliced pole 9 sets up the outside of hollow sleeve 5 and with spacing hole 8 is concentric, still includes to pass simultaneously spliced pole 9 and spacing hole 8 and extend to the bolt 10 in the spacing groove 7. I.e. the bolt 10 is used to achieve a locking position between the hollow sleeve 5 and the cylinder 3.
However, in the above structure, the latch 10 is easily separated from the coupling post 9 or cannot firmly lock the hollow sleeve 5 and the cylinder 3. Consequently the inner wall of the one end of spliced pole 9 keeping away from spacing groove 7 is equipped with inwardly extending snap ring 11, the surface of bolt 10 is provided with annular boss 12 along its circumference, annular boss 12 is located between spacing hole 8 and the snap ring 11, the external diameter of annular boss 12 is greater than spacing hole 8's internal diameter. When the annular boss 12 abuts against the limiting hole 8, the bolt 10 abuts against the limiting groove 7, and locking and fixing are achieved; when the annular boss 12 abuts against the clamping ring 11, the plug pin 10 is separated from the limiting hole 8, and the plug pin 10 is not separated from the connecting column 9 due to the limitation of the clamping ring 11.
Through the structure, the locking and positioning of the cylinder 3 and the hollow sleeve 5 can be quickly realized, but the bolt 10 is small and is not well controlled during operation. To this end, the clamping assembly further comprises: a bending plate 13 fixed on the connecting column 9, a connecting pin 14 tightly installed at one end of the bolt 10 far away from the limiting hole 8, and a connecting piece 15 hinged with the tail end of the bending plate 13 at the central position; the connecting end of the connecting piece 15 is rotatably clamped between the connecting pin 14 and the connecting column 9. In order to allow the connecting element 15 to rotate without resistance under the action of external forces, the connecting ends of the connection are hook-shaped. The connecting piece 15 capable of controlling the bolt 10 is arranged, so that the force application object can be directly found and the force can be applied conveniently.
In order to enable the cylinder 3 to be accurately aligned with the hollow pipe sleeve, guide plates 16 are vertically and upwardly fixed on two sides of the supporting platform 1, the guide plates 16 are used for guiding two sides of the outer cover 4, the accurate alignment of the outer cover 4 and the supporting platform 1 is controlled, and meanwhile, the guide plates 16 increase the sealing performance of the joint of the outer cover 4 and the supporting platform 1 and can play a role in dust prevention.
And a guide post 17 is arranged on one side of the column 3, the guide post 17 is of an open structure, a guide rod 18 is fixed on one side of the hollow sleeve 5, and the position of the guide rod 18 corresponds to that of the guide post 17. Namely, after the guide post 17 is clamped with the guide rod 18, the cylinder 3 can be directly ensured to be accurately aligned with the hollow pipe sleeve.
On this basis, in order to have a better heat dissipation function, a plurality of grooves are formed on the inner surface of the outer cover 4. The thickness of the outer cover 4 is reduced, and the heat dissipation performance is improved.
The utility model discloses a theory of operation: when the assembly is needed, the guide plates on the two sides of the supporting platform are matched with the outer cover, the outer cover is located right above the supporting platform, then the clamping positions of the guide columns and the guide rods are aligned, and the cylinders are inserted into the hollow pipe sleeves. According to the height of the outer cover, a corresponding limiting groove on a limiting block on the adjusting cylinder corresponds to the limiting hole, the bottom end of the connecting piece is loosened, the bolt is inserted into the limiting hole and abuts against the limiting groove, and locking and positioning are achieved.

Claims (7)

1. A heat dissipation type packaging structure for a PCB board, comprising:
the supporting assembly comprises a supporting platform, a mounting groove formed in the upper surface of the supporting platform, and a plurality of cylinders vertically fixed on the supporting platform;
encapsulation subassembly, including the dustcoat, set up on the dustcoat and the position with the hollow sleeve pipe of a plurality of that the cylinder is corresponding, vertical fixing the stopper of cylinder one side is seted up down in proper order on the stopper from last a plurality of spacing groove is seted up on the hollow sleeve pipe and with the spacing hole of stopper homonymy, and pass spacing hole joint with joint subassembly of spacing inslot.
2. The heat dissipation type package structure for the PCB of claim 1, wherein the clip assembly comprises: the connecting column is fixed on the outer side of the hollow sleeve and is concentric with the limiting hole, and the bolt is inserted into the connecting column and the limiting hole;
the inner wall of one end, far away from the limiting groove, of the connecting column is provided with an inwardly extending clamping ring, the outer surface of the bolt is provided with an annular boss along the circumference of the bolt, and the annular boss is located between the limiting hole and the clamping ring; when the annular boss abuts against the limiting hole, the bolt abuts against the limiting groove; when the annular boss is abutted to the clamping ring, the bolt is separated from the limiting hole.
3. The heat dissipation type package structure for PCB as claimed in claim 2, wherein the clip assembly further comprises: the connecting pin is closely arranged at one end of the bolt far away from the limiting hole, and the connecting piece is hinged with the tail end of the bending plate at the central position; the connecting end of the connecting piece is rotationally clamped between the connecting pin and the connecting column.
4. The heat dissipation package structure for PCB of claim 3, wherein the connecting end is hook-shaped.
5. The heat dissipation type package structure for a PCB as recited in claim 1, wherein guide plates are vertically fixed upward at both sides of the supporting platform.
6. The heat dissipation type package structure for the PCB as recited in claim 1, wherein a guiding post is disposed on one side of the cylinder, a guiding rod is fixed on one side of the hollow sleeve, and the guiding rod corresponds to the guiding post.
7. The heat dissipation type package structure for a PCB as recited in claim 1, wherein the inner surface of the housing is formed with a plurality of grooves.
CN201921744241.1U 2019-10-17 2019-10-17 Heat dissipation type packaging structure for PCB Active CN210972361U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921744241.1U CN210972361U (en) 2019-10-17 2019-10-17 Heat dissipation type packaging structure for PCB

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921744241.1U CN210972361U (en) 2019-10-17 2019-10-17 Heat dissipation type packaging structure for PCB

Publications (1)

Publication Number Publication Date
CN210972361U true CN210972361U (en) 2020-07-10

Family

ID=71459358

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921744241.1U Active CN210972361U (en) 2019-10-17 2019-10-17 Heat dissipation type packaging structure for PCB

Country Status (1)

Country Link
CN (1) CN210972361U (en)

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CP03 Change of name, title or address
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Address after: Kanglou Road, Industrial Concentration Zone, Dailou Town, Jinhu County, Huai'an City, Jiangsu Province, 211600

Patentee after: Jiangsu Shangfu Electronics Co.,Ltd.

Address before: 211700 Kanglou Road, Industrial Concentration Zone, Dalou Town, Jinhu County, Huai'an City, Jiangsu Province

Patentee before: Jiangsu Shangfu Electronics Co.,Ltd.