CN210959219U

CN210959219U - Host shell, integrated host and vehicle-mounted multimedia

Info

Publication number: CN210959219U
Application number: CN201921188931.3U
Authority: CN
Inventors: 谢敏
Original assignee: Shanghai Qinggan Intelligent Technology Co Ltd
Current assignee: Shanghai Qinggan Intelligent Technology Co Ltd
Priority date: 2019-07-25
Filing date: 2019-07-25
Publication date: 2020-07-07
Anticipated expiration: 2029-07-25

Abstract

The utility model provides a host computer shell, an integration host computer and an on-vehicle multimedia. The main chassis includes the casing for install a plurality of hardware modules, the casing includes: a bottom cover plate; and the frame is integrally formed by die casting and is detachably and fixedly connected with the bottom cover plate, the frame comprises a first surface and a second surface which are oppositely arranged, a third surface and a fourth surface which are oppositely arranged and a fifth surface which is oppositely arranged with the bottom cover plate, and partial area of the fifth surface is die cast into a radiating fin structure.

Description

Host shell, integrated host and vehicle-mounted multimedia

Technical Field

The utility model relates to an on-vehicle multimedia field especially relates to a mainframe shell, integration host computer and an on-vehicle multimedia.

Background

With the improvement of living standard, the living range of people is larger and larger, and vehicles become necessary products of ordinary families as the most convenient private transportation tools. With the expansion of human activities, people spend more and more time on vehicles, and the requirements on entertainment systems on vehicles are higher and higher. In which, vehicle multimedia is becoming more and more important as an entertainment center in a vehicle.

As the holding capacity of vehicles on the market gets larger and larger, vehicle interconnection has become a necessary trend. The internet of vehicles is a huge interactive network formed by information such as vehicle position, speed and route. The network information can be used for calculating the optimal routes of different vehicles or reporting road conditions in time and the like. The T-Box module is a communication module which is arranged on the vehicle and used for realizing interconnection of the vehicle and the internet of vehicles.

Two separate processors are usually provided in the existing vehicle for implementing the functions of the vehicle-mounted multimedia and the T-Box module, respectively. This arrangement wastes resources and occupies a large space.

Moreover, the mutual interference of heat dissipation between the high-power amplifier and devices such as a processor and a cache can be caused. And two assemblies are needed among the middle frame, the radiating fins and the die casting of the host shell, so that the manufacturing and assembling time is increased.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects, the utility model aims at providing a host case, integrative die-casting has the fin on the die casting of this host case, and the inside MPU that is provided with of host case is regional, the power amplifier is regional, antenna area and battery are regional, and every region has carried out individualized setting based on its different functions, and simultaneously, MPU can independently realize the function of on-vehicle multimedia and T-Box module.

According to the utility model discloses an aspect provides the mainframe shell, a serial communication port, include:

a housing for mounting a plurality of hardware modules, the housing comprising:

a bottom cover plate; and

the integrated die-casting frame is fixedly connected with the bottom cover plate in a detachable mode, the frame comprises a first face and a second face which are arranged oppositely, a third face and a fourth face which are arranged oppositely, and a fifth face which is arranged oppositely to the bottom cover plate, and partial area of the fifth face is die-cast into a radiating fin structure.

Still further, the plurality of hardware modules include a power amplifier, an antenna, a power supply, and an MPU, and the fifth aspect is configured to have a power amplifier area, an antenna area, a power supply area, and an MPU area based on their corresponding hardware modules, and the power amplifier area and the MPU area are die-cast into the heat sink structure.

Further, the power amplifier area and the MPU area are isolated by the antenna area and the power supply area.

Further, the power amplifier area and the antenna area are adjacent in a first direction, the power supply area and the power amplifier area are adjacent in a second direction, and the MPU area is adjacent to the antenna arrangement area and the power supply arrangement area.

Furthermore, the antenna area comprises a WIFI antenna area and a Bluetooth antenna area, the WIFI antenna area is arranged along the second direction, and the Bluetooth antenna area is arranged along the first direction.

Furthermore, the periphery of the power supply area is thinned.

Still further, the first face is provided with a board-to-board connector socket so as to be connected with the display screen, and guide post sockets are arranged on two sides of the board-to-board connector socket.

Furthermore, the third surface and the one end of first face contact and the fourth surface with one end of first face contact is provided with the bolt installing mouth respectively so that fix the display screen.

Furthermore, the second surface is provided with a plurality of Bluetooth antenna ports, a USB connector and a power socket.

Still further, the distal chip end of the housing is provided with a vent hole.

Further, the bottom cover plate is an electrolytic plate.

Furthermore, the frame is made of an aluminum alloy material.

Further, the bottom cover plate is fixedly connected with the frame through bolts.

According to another aspect of the present invention, there is provided an integrated host, the integrated host comprises any one of the above-mentioned host case, power amplifier, antenna, power supply and MPU installed in the host case.

According to the utility model discloses a further aspect provides an on-vehicle multimedia, include as above-mentioned arbitrary one the mainframe shell, install in power amplifier, antenna, power, MPU and display screen in the mainframe shell, the back of display screen is provided with board to board connector, guide post and fastening structure, the display screen with the third face and the fourth face of mainframe shell pass through fastening structure fixed connection.

The utility model discloses an integrative die-casting shaping fin structure on the casing of host computer shell has avoided needing to make heat radiation structure and casing respectively among the prior art, and the problem of heat abstractor and casing equipment assembly has improved the radiating efficiency of production efficiency, assembly efficiency and host computer shell again after the preparation is accomplished. A plurality of hardware modules including a power amplifier, an antenna, a power supply and an MPU are installed in the main case, so that the problem that the hardware modules are installed respectively through a plurality of independent cases or heat dissipation devices in the prior art is avoided. The MPU is used as a vehicle-mounted T-Box host and a multimedia host, so that the aim of combining the T-Box and the multimedia host into a whole is fulfilled. The heat insulation effect is achieved by thinning part of the material area on the shell. Thermal interference among the hardware modules is avoided by isolating the hardware modules with large heat production. By arranging different antennas in different directions, signal interference between multiple antennas is avoided. The heat dissipation efficiency in the host is accelerated by providing ventilation holes at the far chip end of the housing.

Drawings

The above features and advantages of the present disclosure will be better understood upon reading the detailed description of embodiments of the disclosure in conjunction with the following drawings.

Fig. 1 is a schematic perspective view of a main chassis according to an embodiment of the present invention;

fig. 2 is a schematic structural view of a fifth surface of a frame according to an embodiment of the present invention;

fig. 3 is a schematic structural view of a first side of a frame according to an embodiment of the present invention;

fig. 4 is a schematic structural view of a third face of the frame according to an embodiment of the present invention;

fig. 5 is a schematic structural view of a fourth surface of a frame according to an embodiment of the present invention;

fig. 6 is a schematic structural view of a second face of the frame according to an embodiment of the present invention;

fig. 7 is a schematic structural view of a bottom cover plate of the housing according to an embodiment of the present invention;

fig. 8 is a schematic structural diagram of an in-vehicle multimedia according to an embodiment of the present invention.

For clarity, a brief description of the reference numerals is given below:

s1 first side;

s2 second side;

s3, third face;

the fourth surface of S4;

the fifth surface of S5;

r1 first region, power amplifier region;

r2 second region, antenna region;

r21 WIFI antenna area;

r22 bluetooth antenna area;

r3 third region, power region;

r4 fourth region, MPU region;

h, a vent hole;

j1 board-to-board connector socket;

j2, J3 guidepost receptacles;

j4, J5 bolt mounting ports;

J6-J9 antenna ports;

j10 USB port;

j11 power connector port.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. It is noted that the aspects described below in connection with the figures and the specific embodiments are only exemplary and should not be understood as imposing any limitation on the scope of the present invention.

The following description is presented to enable any person skilled in the art to make and use the invention and is incorporated in the context of a particular application. Various modifications, as well as various uses in different applications will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to a wide range of embodiments. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

In the following detailed description, numerous specific details are set forth in order to provide a more thorough understanding of the invention. It will be apparent, however, to one skilled in the art that the practice of the invention may not necessarily be limited to these specific details. In other instances, well-known structures and devices are shown in block diagram form, rather than in detail, in order to avoid obscuring the present invention.

Note that where used, the designations left, right, front, back, top, bottom, positive, negative, clockwise, counterclockwise, first, second, third, fourth, and fifth are used merely for convenience and do not imply any particular fixed orientation or order. In fact, they are used to reflect the relative position and/or orientation between the various parts of the object.

In describing the embodiments of the present invention in detail, for convenience of illustration, the drawings showing the device structure in various directions are not necessarily to scale, and the drawings are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and height should be included in the actual fabrication.

According to an aspect of the present invention, a host casing is provided for installing a host and various devices adapted to the host.

In one embodiment, the main chassis includes a housing 100, and a plurality of spaces for installing hardware modules are provided inside the housing 100, and the plurality of spaces for installing hardware modules are used for installing corresponding hardware modules.

Fig. 1 shows a perspective view of a housing 100, and the housing 100 includes six faces to form an internal hollow housing, and the six faces may be respectively provided as flat or concave-convex surfaces as required, that is, the six faces may be faces having a certain thickness.

One surface of the housing 100 is a bottom cover plate 110, the remaining five surfaces form a frame 120, and the five surfaces forming the frame 120 are integrally die-cast. The bottom cover plate 110 is detachably coupled to the frame 120. Such as by bolting. Correspondingly, the portion of the bottom cover plate 110 connected with the frame 120 may be provided with mounting holes for bolt fastening, respectively.

For convenience of description, five surfaces of the frame 120 are referred to as a first surface S1, a second surface S2, a third surface S3, a fourth surface S4, and a fifth surface S5. The first surface S1, the second surface S2, the third surface S3 and the fourth surface S4 are fixedly connected with one edge line of the fifth surface S5 respectively, the first surface S1, the second surface S2, the third surface S3 and the fourth surface S4 are perpendicular to the fifth surface S5 to form the frame 120, the first surface S1 and the second surface S2 are arranged oppositely, and the third surface S3 and the fourth surface S4 are arranged oppositely.

The bottom cover plate 110 is detachably and fixedly connected to the other edge of the first face S1, the second face S2, the third face S3 and the fourth face S4 along a line such that the bottom cover plate 110 is disposed opposite to the fifth face S5. Preferably, the bottom cover plate 110 may be an electrolytic plate.

Fig. 2 shows a schematic structure of the fifth surface S5 of the frame 120. Preferably, a partial region of the fifth surface S5 is die-cast into a heat sink structure. The partial region is related to the arrangement position of the hardware module in the housing, that is, the region corresponding to the mounting position of the high-power device with high heat generating capability is set as a heat sink structure with high heat dissipation efficiency.

The heat sink structure is a structure in which the degree of unevenness and the shape of unevenness of a material constituting a surface are designed to increase the heat dissipation effect of the surface. The heat sink structure of the region can be specifically determined according to the heat generating capacity of the power device corresponding to the heat sink structure in the shell and the required heat dissipation efficiency of the power device.

The heat sink structure is a component of the frame 120, which avoids the problem that the heat sink structure and the housing are required to be manufactured separately and then assembled after the manufacturing in the prior art. The production efficiency and the assembly efficiency are improved.

It is understood that, in order to improve the heat dissipation efficiency of the housing 100, the five surfaces of the frame 120 forming the housing may be integrally die-cast with a material having good heat conductivity, such as an aluminum alloy material.

Furthermore, in an embodiment, the plurality of hardware modules installed in the main chassis include a power amplifier, an antenna, a power supply, and an MPU, which avoids the problem in the prior art that the hardware modules are installed separately through a plurality of independent housings or heat dissipation devices.

Thereby, the fifth plane S5 is provided with a power amplifier region, an antenna region, a power supply region, and an MPU region. The power amplifier area and the MPU area are die-cast into a radiating fin structure to meet the radiating requirements of the power amplifier and the MPU.

The MPU is used as a vehicle-mounted T-Box host and a multimedia host, and the purpose of combining the T-Box and the multimedia host into a whole is achieved.

Furthermore, in order to prevent the problem of heat dissipation interference between the power amplifier and the MPU, the installation positions of the hardware modules in the main chassis may be specially set.

Preferably, the power amplifier region is isolated from the MPU region, i.e., the power amplifier region is not adjacent to the MPU region, i.e., there is no contact portion. Specifically, the power amplifier region and the MPU region may be isolated by an antenna region and a power supply region.

The fifth surface S1 of the frame 120 shown in fig. 2 is divided into four regions, wherein the first region R1 corresponds to a power amplifier region, the second region R2 corresponds to an antenna region, the third region R3 corresponds to a power supply region, and the fourth region R4 corresponds to an MPU region. Wherein the second region R2 and the third region R3 isolate the first region R1 and the fourth region R4.

It is understood that the shapes of the regions may be correspondingly configured according to the size and shape of the actual hardware module. In the embodiment shown in fig. 2, the power amplifier area is adjacent to the antenna area in the first direction, the power supply area is adjacent to the power amplifier area in the second direction, and the MPU area is adjacent to the antenna area and the power supply area.

Preferably, in order to further avoid the problem of heat dissipation interference between the MPU region and the power amplifier region, an isolation process such as material thinning is performed on a portion between the MPU region and the power amplifier region.

Further, to meet the communication requirements of the vehicle with the external devices, the antenna area may include antennas of multiple communication protocols. Such as a bluetooth communication protocol, a WIFI communication protocol, or other communication protocol.

The bluetooth protocol is based on IEEE 802.11 standard technology of wireless lan, and is a short-distance wireless connection technology for replacing cables or wires of portable electronic devices or fixed electronic devices, and can perform data and voice transmission in real time. The MPU can send data to the mobile terminal through the Bluetooth network when the mobile terminal is required to display the data.

The WIFI protocol is a wireless protocol, which is also referred to as 802.11b standard. The transmission rate can reach 11Mbps, and the effective distance is longer. The coverage is large, 300 meters can be answered outdoors, and the longest indoor distance can reach 100 meters. Specifically, a SIM card may be set in an antenna area to form a vehicle-mounted WIFI hotspot sharing network, and an external device such as a mobile terminal may connect to the T-Box through the WIFI hotspot.

Specifically, in the embodiment shown in fig. 2, the antenna region R2 is divided into a first antenna region R21 and a second antenna region R22. It is understood that the housings corresponding to the first antenna region R21 and the second antenna region R22 are visible for mounting different antennas, such as WIFI antennas and bluetooth antennas, respectively.

To avoid signal interference problems between antennas of different communication protocols, a certain threshold of isolation is set between the first antenna region R21 and the second antenna region R22 and the directions are staggered. In the embodiment shown in fig. 5, the first antenna region R21 is disposed in the second direction, and the second antenna region R22 is disposed in the first direction.

Preferably, in order to prevent the heat generation problem of the hardware module near the power supply from affecting the health state or the working performance of the power supply, the part of the power supply region R3 on the fifth surface S5 adjacent to other hardware regions is subjected to heat source isolation treatment such as material thinning.

Further, fig. 3 shows a schematic structural view of the first face S1 of the frame 120, on which a board-to-board connector socket J1 is disposed, and a board-to-board connector mounted inside the housing is exposed through the board-to-board connector socket J1, so that the display screen is connected with the board-to-board connector through the board-to-board connector socket J1.

Guide post sockets J2 and J3 are provided on both sides of board-to-board connector socket J1. It is understood that the shapes of the guide post sockets J2 and J3 can be respectively arranged correspondingly based on the cross-sectional shapes of two guide posts on the display screen. The distance between the guidepost receptacles J2 and J3 may be set based on the spacing of the two guideposts on the display screen, and may be set approximately equal.

Further, fig. 4 shows a structural schematic view of the third face S3 of the frame 120, and a bolt mounting port is provided at an end of the third face S3 connected to the first face S1 to fix the display screen.

Further, fig. 5 shows a schematic structural view of a fourth surface S4 of the frame 120, and a bolt mounting opening is provided at one end of the fourth surface S3 connected to the first surface S1 to fix the display screen.

It is understood that the distance between the bolt mounting holes on the third surface S3 and the fourth surface S4 may be determined by the distance between two fastening structures provided on the display screen.

Further, fig. 6 shows a schematic structural diagram of the second side S2 of the frame 120, and interfaces of various communication standards can be arranged on the second side S2 according to the communication requirements of the vehicle. For example, a radio antenna port J6, an LTE diversity antenna port J7, a GPS antenna port J8, an LTE main set antenna port J9, a USB connector port J10, and/or other interfaces may be included.

Further, a power connector socket J11 may be further provided on the second side S2.

Preferably, to further improve the heat dissipation performance of the main chassis, a plurality of vent holes H are disposed at the far chip end of the housing 100.

Fig. 7 shows a schematic structural view of the bottom cover plate 110, and as shown in the schematic structural views of the bottom cover plate 110 and five faces of the frame 120 shown in fig. 2 to 7, a plurality of vent holes H are provided thereon. The plurality of vent holes may have the same or different apertures.

The chip mounted inside the housing may be mounted generally opposite the bottom cover plate 110, the chip is generally opposite the fifth surface S5 of the frame 120, and the region of the fifth surface S5 opposite the chip surface is the proximal chip end. As can be understood from the foregoing description, the power amplifier region and the MPU region on the fifth surface S5 are more facing the chip, so that the volume and area of the heat dissipation material are increased as much as possible by using the heat dissipation plate structure to conduct heat to the periphery, and the other regions can be referred to as a far chip end, and the far chip end can be provided with a ventilation hole to accelerate air circulation inside the housing for heat dissipation.

Further, the housing shown in fig. 1 to 7 is further provided with a plurality of mounting holes based on the mounting relationship between the internal hardware module and the external hardware module, and specifically, the mounting holes may be provided based on the mounting position and the mounting component of the hardware module, which is not described herein again.

According to the utility model discloses a another aspect improves an integration host computer. In one embodiment, the integrated host comprises a main chassis, a power amplifier, an antenna, a power supply, and an MPU.

The main machine shell is hollow, and installation spaces for the power amplifier, the antenna, the power supply and the MPU are arranged in the main machine shell and are respectively used for installing the power amplifier, the antenna, the power supply and the MPU.

The antenna is used to communicate with an internal or external device to receive or transmit signals or data.

The power supply is used for supplying power.

The power amplifier is used to amplify an input signal, such as an audio signal received by the antenna or an audio signal output by the MPU for playback.

The main chassis includes a housing, fig. 1 shows a perspective view of the housing 100 in a specific embodiment, and the housing 100 includes six surfaces to form a hollow housing, and the six surfaces may be respectively configured as flat or concave-convex surfaces according to the functional requirements of the power amplifier, the antenna, the power supply and the MPU, that is, the six surfaces may be surfaces with a certain thickness.

Fig. 2 shows a schematic structure of the fifth surface S5 of the frame 120. Preferably, the region corresponding to the power amplifier on the fifth surface S5 is set as a power amplifier region R1, the region corresponding to the antenna is set as an antenna region R2, the region corresponding to the power supply is set as a power supply region R3, and the region corresponding to the MPU is set as an MPU region R4. The power amplifier region R1 and MPU region R4 are die cast into a heat sink structure.

Of four regions in the fifth face S1 of the frame 120 shown in fig. 2, the antenna region R2 and the power supply region R3 isolate the power amplifier region R1 and the MPU region R4.

It is understood that the shapes of the regions may be set according to the sizes and shapes of the corresponding hardware modules. In the embodiment shown in fig. 2, the power amplifier region R1 is adjacent to the antenna region R2 in the first direction, the power supply region R3 is adjacent to the power amplifier region R1 in the second direction, and the MPU region R4 is adjacent to the antenna region R2 and the power supply region R3.

Preferably, in order to further avoid the problem of heat dissipation interference between the MPU region and the power amplifier region, the intermediate portion between the MPU region R4 and the power amplifier region R1 is subjected to an isolation process such as material thinning.

Further, to meet the communication requirements of the vehicle with the external devices, the antenna may include antennas of multiple communication protocols. Such as a bluetooth communication protocol, a WIFI communication protocol, or other communication protocol.

Specifically, in the embodiment shown in fig. 2, the antenna region R2 is divided into a WIFI antenna region R21 and a bluetooth antenna region R22.

In order to avoid the problem of signal interference between antennas of different communication protocols, a certain threshold value of isolation is set between the WIFI antenna area R21 and the Bluetooth antenna area R22, and the directions are staggered. In the embodiment shown in fig. 5, the WIFI antenna area R21 is disposed in the second direction, and the bluetooth antenna area R22 is disposed in the first direction.

In order to prevent the heat generated by the hardware modules near the power supply from affecting the health state or the working performance of the power supply, heat insulation treatment can be performed inside a battery compartment of the power supply.

Preferably, the power region R3 on the fifth surface S5 is subjected to an isolated heat source process such as material thinning and the like in a portion adjacent to other hardware regions.

Further, the integrated host further comprises a board-to-board connector, and the interface and the socket of the board-to-board connector are respectively mounted on the display screen where the integrated host is butted with the display screen so as to couple the display screen with the integrated host for signal and data transmission.

Correspondingly, as shown in fig. 3, the first side S1 of the frame 120 is provided with a board-to-board connector socket J1, and the board-to-board connector mounted inside the housing is exposed through the board-to-board connector socket J1, so that the display screen is connected with the board-to-board connector through the board-to-board connector socket J1.

Preferably, the bluetooth antenna may include antennas of various communication standards according to the requirements of the vehicle for communication. In one embodiment, the bluetooth antenna may include a radio antenna, an LTE diversity antenna, a GPS antenna, an LTE master antenna, and the like to meet different communication requirements.

Further, the all-in-one host machine can also comprise a USB interface and a power connector.

Correspondingly, fig. 6 shows a schematic structural diagram of the second surface S2 of the frame 120, and the second surface S2 is provided with a radio antenna port J6, an LTE diversity antenna port J7, a GPS antenna port J8, an LTE main-set antenna port J9, a USB connection port J10, and a power connector socket J11.

Further, the housing shown in fig. 1 to 7 is further provided with a plurality of mounting holes based on the mounting relationship with the power amplifier, the antenna, the power supply, the MPU, the board-to-board connector, the power connector, or the display screen, and specifically may be provided based on the mounting positions of the power amplifier, the antenna, the power supply, the MPU, the board-to-board connector, the power connector, or the display screen, which is not described herein again.

According to still another aspect of the present invention, there is provided an in-vehicle multimedia simultaneously used as a T-Box module of a vehicle.

In one embodiment, as shown in fig. 8, the in-vehicle multimedia includes a main chassis, a power amplifier, an antenna, a power supply, an MPU, and a display screen.

The power supply is used for supplying power.

The display screen is used for displaying the display data output by the MPU. Preferably, the display screen may be a changeable display screen assembly.

Further, the integrated host also comprises an interface of the board-to-board connector, and a socket of the board-to-board connector, which is butted with the integrated host, is arranged on the back of the display screen, so that the display screen and the integrated host are coupled to transmit signals and data.

To facilitate the installation of the display screen, two guide posts may be provided at both ends of the board-to-board connector at the back of the display screen to facilitate the alignment of the display screen with the board-to-board connector on the integrated host. Preferably, the guide posts can be divided into a main guide post and a sub guide post.

Correspondingly, guide post sockets J2 and J3 are provided on both sides of the board-to-board connector socket J1 on the first face S1 of the frame 120. It is understood that the shapes of the guide post sockets J2 and J3 can be respectively arranged correspondingly based on the cross-sectional shapes of two guide posts on the display screen. The distance between the guidepost receptacles J2 and J3 may be set based on the spacing of the two guideposts on the display screen, and may be set approximately equal.

During installation, the main guide post on the display screen can be inserted into the guide post socket J3, and the auxiliary guide post is inserted into the guide post socket J2 to align the display screen and the board-to-board connector on the integrated host.

Preferably, the back of the display screen is provided with a fastening structure. And may specifically include a left fastening structure and a right fastening structure.

Correspondingly, fig. 4 shows a structural schematic view of the third face S3 of the frame 120, and a bolt mounting port is provided on one end of the third face S3 connected to the first face S1 to be fixed with the left fastening structure.

Further correspondingly, fig. 5 shows a structural schematic view of the fourth face S4 of the frame 120, and a bolt mounting port is provided on one end of the fourth face S3 connected with the first face S1 to be fixed with the right fastening structure.

During installation, the guide post can be inserted firstly to butt joint the board-to-board connector, and after the butt joint is completed, the left fastening structure and the right fastening structure are fixed on the bolt installation openings on the fourth surface S4 and the third surface S3 respectively through the bolt component, so that the display screen is fixed on the integrated host.

The previous description is provided to enable any person skilled in the art to practice the various aspects described herein. It is to be understood that the scope of the invention is to be defined by the appended claims and not by the specific constructions and components of the embodiments illustrated above. Those skilled in the art can make various changes and modifications to the embodiments within the spirit and scope of the present invention, and such changes and modifications also fall within the scope of the present invention.

Claims

1. A main chassis, comprising:

a housing for mounting a plurality of hardware modules, the housing comprising:

a bottom cover plate; and

2. The host enclosure of claim 1, wherein the plurality of hardware modules include a power amplifier, an antenna, a power supply, and an MPU, and the fifth aspect is configured to be based on its corresponding hardware module being disposed in a power amplifier area, an antenna area, a power supply area, and an MPU area, the power amplifier area and MPU area being die cast into the heat sink structure.

3. The main chassis of claim 2, wherein the power amplifier area and the MPU area are isolated by the antenna area and the power supply area.

4. The main chassis of claim 3, wherein the power amplifier area is adjacent to the antenna area in a first direction, the power supply area is adjacent to the power amplifier area in a second direction, and the MPU area is adjacent to the antenna placement area and the power supply placement area.

5. The main chassis of claim 4, wherein the antenna area comprises a WIFI antenna area and a Bluetooth antenna area, the WIFI antenna area being disposed along the second direction, the Bluetooth antenna area being disposed along the first direction.

6. The main chassis of claim 2, wherein a periphery of the power supply area is thinned.

7. The main chassis of claim 1, wherein said first side is provided with board-to-board connector sockets for facilitating connection to a display screen, said board-to-board connector sockets being provided with guide post sockets on both sides.

8. The main chassis of claim 7, wherein a bolt mounting hole is formed at one end of the third surface contacting the first surface and one end of the fourth surface contacting the first surface, respectively, so as to fix the display screen.

9. The main chassis of claim 1, wherein the second side is provided with a plurality of bluetooth antenna ports, a USB connector port, and a power outlet.

10. The host housing of claim 1, wherein the housing is provided with a vent at the distal chip end.

11. The main chassis of claim 1, wherein the bottom cover plate is an electrolytic plate.

12. The main chassis of claim 1, wherein the frame is made of aluminum alloy.

13. The main chassis of claim 1, wherein the bottom cover plate is fixedly connected to the frame by bolts.

14. An integrated host computer, characterized in that the integrated host computer comprises a host computer shell as claimed in any one of claims 1 to 13, a power amplifier, an antenna, a power supply and an MPU installed in the host computer shell.

15. An on-vehicle multimedia, characterized in that, include the host casing of any claim 1 ~ 13, install in power amplifier, antenna, power, MPU and display screen in the host casing, the back of display screen is provided with board to board connector, guide post and fastening structure, the display screen with the third face and the fourth face of host casing pass through fastening structure fixed connection.