CN210959025U - Pre-positioning device of circuit board hot melting machine - Google Patents

Pre-positioning device of circuit board hot melting machine Download PDF

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Publication number
CN210959025U
CN210959025U CN201922249475.5U CN201922249475U CN210959025U CN 210959025 U CN210959025 U CN 210959025U CN 201922249475 U CN201922249475 U CN 201922249475U CN 210959025 U CN210959025 U CN 210959025U
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China
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circuit board
board hot
cylinder
blowing platform
fixedly connected
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CN201922249475.5U
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李秀娟
苏春齐
王攀峰
周俊杰
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Simmtech Electronics Xi'an Co ltd
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Simmtech Electronics Xi'an Co ltd
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Abstract

The utility model discloses a prepositioning device of circuit board hot melt machine relates to circuit board production facility field. The technical key points are as follows: the utility model provides a pre-positioner of circuit board hot melt machine, includes the blowing platform, blowing bench surface is close to its relative both sides border vertical direction and is provided with the reference column, a plurality of through-holes have been seted up with the regional corresponding position of circuit board hot melt to the blowing platform, the top level of the four sides of blowing platform is provided with the clamp plate, the clamp plate below is provided with the lifting unit who drives its lift, be provided with the sideslip subassembly of drive clamp plate towards blowing platform horizontal motion on the blowing platform. The utility model has the advantages of improve the prepositioning precision of circuit board.

Description

Pre-positioning device of circuit board hot melting machine
Technical Field
The utility model belongs to the technical field of circuit board production facility and specifically relates to a prepositioning device of circuit board hot melt machine is related to.
Background
The printed circuit board is a multi-layer circuit board with more than three layers, which is a trend nowadays, and the PCB products are mostly developed towards a high density thin board (HDI) or a high layer number (Multilayer) type, so that the alignment precision of each layer is required during the pressing process of each printed circuit board, and therefore, the pressing technology of the printed circuit board has been developed to an electromagnetic induction type heat melting machine by the conventional riveting method. The inner layer and the film are aligned and then placed on an operation table of a hot melting machine, the magnetic flux is changed in an electromagnetic induction mode to heat, and when the temperature of the film rises to a set temperature, the film is tightly combined with the inner layer.
The pre-positioning device in the prior art is shown in fig. 1 and comprises a discharging table 1, positioning columns 2 are welded on the upper surface of the discharging table 1 close to the two opposite side edges of the discharging table in the vertical direction, positioning holes matched with the positioning columns 2 can be formed in a circuit board, and a plurality of through holes 3 are formed in the positions, corresponding to the hot melting area of the discharging table 1 and the circuit board, of the discharging table.
The above prior art solution has the following drawbacks: carry out the hot melt during operation, the operator puts the circuit board one deck on the blowing bench, puts and sends into the hot melt machine after accomplishing, and two welded joints of hot melt machine stretch into the through-hole and carry out the hot melt to the circuit board, because every layer of circuit board is all very thin, when placing the circuit board, the easy perk of corner of circuit board leads to the prepositioning precision of circuit board lower, influences product quality.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, the utility model aims to provide a prepositioning device of circuit board hot melt machine, it has the advantage that improves the prepositioning precision of circuit board.
The above object of the present invention can be achieved by the following technical solutions:
the utility model provides a pre-positioner of circuit board hot melt machine, includes the blowing platform, blowing bench surface is close to its relative both sides border vertical direction and is provided with the reference column, a plurality of through-holes have been seted up with the regional corresponding position of circuit board hot melt to the blowing platform, the top level of the four sides of blowing platform is provided with the clamp plate, the clamp plate below is provided with the lifting unit who drives its lift, be provided with the sideslip subassembly of drive clamp plate towards blowing platform horizontal motion on the blowing platform.
By adopting the technical scheme, after a plurality of layers of circuit boards are placed on the discharging table, the transverse moving assembly drives the lifting assembly and the pressing plate to horizontally move towards the discharging table until the pressing plate is positioned above the edge of the circuit board, and the lifting assembly drives the pressing plate to descend to press the edge of the circuit board, so that the edge of the circuit board is prevented from tilting, and the pre-positioning precision of the circuit board is improved.
The present invention may be further configured in a preferred embodiment as: and a plurality of abdicating grooves are formed in the position, close to the circuit board hot melting area, of the pressing plate.
Through adopting above-mentioned technical scheme, the clamp plate can not occupy the hot melt region when compressing tightly the circuit board, so can only compress tightly the edge of circuit board, the groove of stepping down can avoid the hot melt region for the clamp plate compresses tightly the region of circuit board wideer.
The present invention may be further configured in a preferred embodiment as: one side of the pressing plate, which faces the discharging platform, is fixedly connected with Teflon cloth.
Through adopting above-mentioned technical scheme, the circuit board can be avoided pressing the clamp plate to hinder by the teflon, can guarantee simultaneously again that the circuit board is compressed tightly.
The present invention may be further configured in a preferred embodiment as: and a rubber pad is arranged between the Teflon cloth and the pressing plate.
Through adopting above-mentioned technical scheme, the rubber pad plays the effect of shock attenuation buffering, further avoids the clamp plate to crush circuit board.
The present invention may be further configured in a preferred embodiment as: the lifting assembly comprises a lifting cylinder arranged in the vertical direction, and a piston rod of the lifting cylinder is fixedly connected with the pressing plate.
Through adopting above-mentioned technical scheme, adopt lift cylinder drive clamp plate to go up and down, simple structure, convenient operation.
The present invention may be further configured in a preferred embodiment as: the transverse moving assembly comprises a transverse moving cylinder, a connecting plate and a guide rod, the transverse moving cylinder is horizontally arranged, a cylinder body of the transverse moving cylinder is fixedly connected with the discharging table, a piston rod of the transverse moving cylinder is fixedly connected with the connecting plate, a cylinder body of the lifting cylinder is fixedly connected with the connecting plate, one end of the guide rod is fixedly connected with the discharging table, the axis of the guide rod is parallel to that of the transverse moving cylinder, and a guide hole in sliding connection with the guide rod is formed in the connecting plate.
Through adopting above-mentioned technical scheme, sideslip cylinder is when drive lift cylinder and clamp plate horizontal movement, and the guiding hole cooperation of guide bar and connecting plate plays the guide effect to the motion of clamp plate, improves the predetermined positioning accuracy of circuit board.
The present invention may be further configured in a preferred embodiment as: the lifting mechanism is characterized in that a fixed block is arranged between a piston rod of the lifting cylinder and the pressing plate, the fixed block is fixedly connected with the piston rod of the lifting cylinder, the pressing plate is connected with the fixed block in a sliding mode, and an adjusting assembly for adjusting the distance between the pressing plates is arranged on the fixed block.
By adopting the technical scheme, when the length and the width of the circuit board are changed, the distance between the pressing plates is changed by the adjusting assembly through the sliding pressing plate, so that the circuit board pre-positioning device is suitable for pre-positioning of circuit boards with different sizes.
The present invention may be further configured in a preferred embodiment as: the adjusting part comprises a dovetail tenon, a dovetail groove and a locking bolt, the dovetail groove is arranged on the upper surface of the fixing block, the dovetail tenon is in sliding connection with the dovetail groove, the dovetail tenon is fixedly connected with the pressing plate, and the locking bolt penetrates through the dovetail and is abutted against the inner wall of the dovetail groove.
Through adopting above-mentioned technical scheme, when the interval of clamp plate is adjusted to needs, unscrew the locking bolt, the forked tail tenon of slip arrives the assigned position, screws up the locking bolt, accomplishes the regulation.
To sum up, the utility model discloses a following at least one useful technological effect:
1. after a plurality of layers of circuit boards are placed on the discharging table, the transverse moving assembly drives the lifting assembly and the pressing plate to horizontally move towards the discharging table until the pressing plate is located above the edge of the circuit board, and the lifting assembly drives the pressing plate to descend to press the edge of the circuit board, so that the edge of the circuit board is prevented from tilting, and the pre-positioning precision of the circuit board is improved.
2. When the transverse moving cylinder drives the lifting cylinder and the pressing plate to move horizontally, the guide rods are matched with the guide holes of the connecting plate, the movement of the pressing plate is guided, and the pre-positioning precision of the circuit board is improved.
3. When the spacing of the pressing plates needs to be adjusted, the locking bolts are unscrewed, the dovetail tenons slide to the designated positions, the locking bolts are screwed, adjustment is completed, and the dovetail tenon clamping device is suitable for pre-positioning of circuit boards of different sizes.
Drawings
FIG. 1 is a schematic diagram of a pre-positioning device of a prior art hot-melt machine;
FIG. 2 is a schematic diagram of a pre-positioning device of a circuit board hot-melting machine;
FIG. 3 is a bottom view of a pre-positioning device of a circuit board hot-melt machine;
fig. 4 is a schematic view of a part of a pre-positioning device of a circuit board hot-melting machine.
Reference numerals: 1. a discharge table; 2. a positioning column; 3. a through hole; 4. pressing a plate; 5. a yielding groove; 6. teflon cloth; 7. a rubber pad; 8. a lifting cylinder; 9. a transverse moving cylinder; 10. a connecting plate; 11. a guide bar; 12. a guide hole; 13. a fixed block; 14. a dovetail joint; 15. dovetail mortises; 16. locking the bolt; 17. and (5) yielding notches.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Referring to fig. 2 and 3, for the utility model discloses a prepositioning device of circuit board hot melt machine, including the blowing platform 1 of rectangle, the welding of blowing platform 1 upper surface is close to its relative both sides border vertical direction has reference column 2, and reference column 2 sets up to three and is isosceles triangle distribution, can avoid the circuit board to put the wrong direction like this, and a plurality of waists shape's through-hole 3 is seted up with the regional corresponding position of circuit board hot melt to blowing platform 1, and in this embodiment, the quantity of the through-hole 3 on every limit is 6. Rectangular clamp plate 4 is provided with to the top level of the four sides of blowing platform 1, and clamp plate 4 below is provided with the lifting unit who drives its lift, and lifting unit includes along the lift cylinder 8 of vertical direction setting, lift cylinder 8's piston rod and clamp plate 4 fixed connection. The transverse moving assembly is arranged on the discharging platform 1 and drives the pressing plate 4 to move horizontally towards the discharging platform 1, the transverse moving assembly comprises transverse moving cylinders 9, connecting plates 10 and guide rods 11, the transverse moving cylinders 9 are horizontally arranged and the cylinder bodies of the transverse moving cylinders 9 are fixedly connected with the discharging platform 1 through bolts, piston rods of the transverse moving cylinders 9 are fixedly connected with the connecting plates 10 through screws, the cylinder bodies of the lifting cylinders 8 are fixedly connected with the connecting plates 10 through screws, the guide rods 11 are arranged to be two and located on two sides of the transverse moving cylinders 9 respectively, one ends of the guide rods 11 are welded to the discharging platform 1, the axis of the guide rods 11 is parallel to the axis of the transverse moving cylinders 9, guide holes 12 which are connected with the guide rods 11 in a sliding mode are formed in the connecting plates 10, the guide rods 11 are matched with the guide holes 12 of the connecting plates.
After a plurality of layers of circuit boards are placed on the discharging table 1, the transverse moving cylinder 9 drives the lifting cylinder 8 and the pressing plate 4 to horizontally move towards the discharging table 1 until the pressing plate 4 is located above the edge of the circuit board, and the lifting cylinder 8 drives the pressing plate 4 to descend to press the edge of the circuit board, so that the edge of the circuit board is prevented from tilting, and the pre-positioning precision of the circuit board is improved.
Referring to fig. 2 and 4, because the pressing plate 4 can not occupy the hot melting area when pressing the circuit board, therefore, the pressing plate 4 has been offered a plurality of grooves of stepping down 5 near the regional position of circuit board hot melting, still has offered the breach of stepping down 17 that is the U-shaped with reference column 2 matched with on the pressing plate 4, in this embodiment, the groove of stepping down 5 on every pressing plate 4 is 6. The avoiding groove 5 can avoid the hot melting area, so that the area of the pressing plate 4 for pressing the circuit board is wider.
One side of the pressing plate 4 facing the discharging table 1 is fixedly connected with Teflon cloth 6, a rubber pad 7 is arranged between the Teflon cloth 6 and the pressing plate 4, and the rubber pad 7 is bonded with the pressing plate 4 and the Teflon cloth 6. The circuit board can be avoided pressing by clamp plate 4 to the teflon, can guarantee simultaneously again that the circuit board is compressed tightly, and rubber pad 7 plays the effect of shock attenuation buffering, further avoids clamp plate 4 to press the circuit board.
In order to conveniently adjust the distance between the pressing plates 4, a fixing block 13 is arranged between a piston rod of the lifting cylinder 8 and the pressing plates 4, the fixing block 13 is fixedly connected with the piston rod of the lifting cylinder 8 through a screw, the pressing plates 4 are slidably connected with the fixing block 13, and adjusting components for adjusting the distance between the pressing plates 4 are arranged on the fixing block 13. The adjusting component comprises a dovetail tenon 14, a dovetail groove 15 and a locking bolt 16, the dovetail groove 15 is arranged on the upper surface of the fixing block 13, the dovetail tenon 14 is connected with the dovetail groove 15 in a sliding mode, the dovetail tenon 14 is fixedly connected with the pressing plate 4, the locking bolt 16 penetrates through the dovetail tenon 14 and is abutted against the inner wall of the dovetail groove 15, and the waist-shaped through hole 3 can enable the hot melting head to change the hot melting position.
When the length and the width of the circuit board are changed, the locking bolt 16 is unscrewed, the dovetail tenon 14 is slid to a specified position, the locking bolt 16 is screwed, and adjustment is completed, so that the circuit board pre-positioning device is suitable for pre-positioning of circuit boards with different sizes.
The implementation principle of the embodiment is as follows: after a plurality of layers of circuit boards are placed on the discharging table 1, the transverse moving cylinder 9 drives the lifting cylinder 8 and the pressing plate 4 to horizontally move towards the discharging table 1 until the pressing plate 4 is located above the edge of the circuit board, and the lifting cylinder 8 drives the pressing plate 4 to descend to press the edge of the circuit board, so that the edge of the circuit board is prevented from tilting, and the pre-positioning precision of the circuit board is improved.
The embodiment of this specific implementation mode is the preferred embodiment of the present invention, not limit according to this the utility model discloses a protection scope, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.

Claims (8)

1. The utility model provides a prepositioning device of circuit board hot melt machine, includes blowing platform (1), blowing platform (1) upper surface is close to its relative both sides border vertical direction and is provided with reference column (2), a plurality of through-holes (3) have been seted up with the regional corresponding position of circuit board hot melt to blowing platform (1), its characterized in that, the top level of the four sides of blowing platform (1) is provided with clamp plate (4), clamp plate (4) below is provided with the lifting unit who drives its lift, be provided with the sideslip subassembly that drives clamp plate (4) towards blowing platform (1) horizontal motion on blowing platform (1).
2. The pre-positioning device of the circuit board hot melting machine according to claim 1, wherein the pressing plate (4) is provided with a plurality of abdicating grooves (5) at a position close to the circuit board hot melting area.
3. The pre-positioning device of the circuit board hot melting machine according to claim 1, wherein one side of the pressure plate (4) facing the discharging table (1) is fixedly connected with Teflon cloth (6).
4. The pre-positioning device of the circuit board hot melting machine according to claim 3, wherein a rubber pad (7) is arranged between the Teflon cloth (6) and the pressing plate (4).
5. The pre-positioning device of the circuit board hot melting machine according to claim 1, wherein the lifting assembly comprises a lifting cylinder (8) arranged along the vertical direction, and a piston rod of the lifting cylinder (8) is fixedly connected with the pressing plate (4).
6. The pre-positioning device of the circuit board hot melting machine as claimed in claim 5, wherein the traverse assembly comprises a traverse cylinder (9), a connecting plate (10) and a guide rod (11), the traverse cylinder (9) is horizontally arranged, a cylinder body of the traverse cylinder is fixedly connected with the discharging table (1), a piston rod of the traverse cylinder (9) is fixedly connected with the connecting plate (10), a cylinder body of the lifting cylinder (8) is fixedly connected with the connecting plate (10), one end of the guide rod (11) is fixedly connected with the discharging table (1), an axis of the guide rod (11) is parallel to an axis of the traverse cylinder (9), and a guide hole (12) in sliding connection with the guide rod (11) is formed in the connecting plate (10).
7. The pre-positioning device of the circuit board hot melting machine according to claim 6, wherein a fixing block (13) is arranged between a piston rod of the lifting cylinder (8) and the pressing plate (4), the fixing block (13) is fixedly connected with the piston rod of the lifting cylinder (8), the pressing plate (4) is slidably connected with the fixing block (13), and an adjusting component for adjusting the distance between the pressing plates (4) is arranged on the fixing block (13).
8. The circuit board hot melt machine prepositioning device of claim 7, characterized in that, the adjusting part includes dovetail (14), dovetail groove (15) and locking bolt (16), dovetail groove (15) are seted up in fixed block (13) upper surface, dovetail (14) and dovetail groove (15) sliding connection, dovetail (14) and clamp plate (4) fixed connection, locking bolt (16) pass dovetail (14) and with dovetail groove (15) inner wall butt.
CN201922249475.5U 2019-12-14 2019-12-14 Pre-positioning device of circuit board hot melting machine Active CN210959025U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201922249475.5U CN210959025U (en) 2019-12-14 2019-12-14 Pre-positioning device of circuit board hot melting machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201922249475.5U CN210959025U (en) 2019-12-14 2019-12-14 Pre-positioning device of circuit board hot melting machine

Publications (1)

Publication Number Publication Date
CN210959025U true CN210959025U (en) 2020-07-07

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Application Number Title Priority Date Filing Date
CN201922249475.5U Active CN210959025U (en) 2019-12-14 2019-12-14 Pre-positioning device of circuit board hot melting machine

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111885856A (en) * 2020-08-07 2020-11-03 博敏电子股份有限公司 Fusion method and tool for improving interlayer alignment precision of multilayer circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111885856A (en) * 2020-08-07 2020-11-03 博敏电子股份有限公司 Fusion method and tool for improving interlayer alignment precision of multilayer circuit board

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