CN210958728U - Typec earphone chip and typec earphone of integrated FM function - Google Patents
Typec earphone chip and typec earphone of integrated FM function Download PDFInfo
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- CN210958728U CN210958728U CN201922394109.9U CN201922394109U CN210958728U CN 210958728 U CN210958728 U CN 210958728U CN 201922394109 U CN201922394109 U CN 201922394109U CN 210958728 U CN210958728 U CN 210958728U
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Abstract
The utility model provides a typec earphone chip of integrated FM function, including the chip body to and chip peripheral interface circuit, chip body internal collection first signal processing circuit for handle the FM signal, and the second signal processing circuit, the audio signal that is used for handling typec interface input; an adder is further integrated in the chip body, and the FM signal and the typec audio signal are multiplexed into a first audio processing module; the peripheral interface circuit comprises an FM antenna interface connected with the FM antenna, a typec interface matched with the intelligent equipment interface and a signal output interface connected with the loudspeaker. The utility model discloses on integrating the earphone chip with the FM function, through the signal stack back, directly by earphone speaker broadcast, the FM signal no longer carries out signal processing through typec interface passback to the mobile phone chip, has effectively solved the poor problem of prior art FM signal reception performance.
Description
Technical Field
The utility model relates to a wireless communication technical field, in particular to typec earphone chip and typec earphone of integrated FM function.
Background
With the social progress and the improvement of the living standard of people, the earphone becomes an indispensable living article for people. The traditional earphone interface is a 3.5mm earphone jack, is a common earphone jack, and is mainly used for portable equipment such as mobile phones and notebook computers. The USBtype-C interface, USB-C for short, also called typec in the utility model discloses the bottom that is located the smart mobile phone is used for usage such as charging, data transmission most of the time. the type-c interface earphone directly decodes audio high-fidelity DAC and directly adds the audio high-fidelity DAC on the earphone, and can really realize sound effect close to HiFi (high fidelity).
FM (frequency modulation) is frequency modulation, and conventionally, FM is used to refer to general FM broadcasting (76-108MHz, 87-108MHz in China, 76-90MHz in Japan), and the like. The conventional typec earphone is generally provided with a crystal oscillator, so that the cost is increased and the space is occupied. And typec headset generally does not have FM function, and the FM function is at the cell-phone end.
In the prior art, a mobile phone generally has an FM function, and an earphone chip does not have the FM function. 3.5mm audio interface earphone, especially do not have the FM function. It has the following two defects: on one hand, the earphone antenna is connected to the mobile phone through typec, and the typec interface can affect FM radio frequency, so that FM receiving performance can be affected; on the other hand, the earphone antenna is connected to the mobile phone through a typec interface, which affects the charging performance of the mobile phone, especially the quick charging.
Therefore, in view of the above problems in the prior art, there is a need for a chip of typec interface earphone integrating FM functions and typec interface earphone, which integrates FM functions into the earphone chip and is played by an earphone speaker. FM audio signals and typec audio signals can be subjected to signal superposition and played by an earphone loudspeaker, so that the audio mixing function is realized.
SUMMERY OF THE UTILITY MODEL
One aspect of the present invention is to provide a typec earphone chip integrated with FM function, wherein the chip includes a chip body and a chip peripheral interface circuit; wherein the content of the first and second substances,
the chip body is internally integrated with a first signal processing circuit used for receiving and processing FM signals and a second signal processing circuit used for receiving and processing audio signals input through a typec interface;
the FM signal processed by the first signal processing circuit and the audio signal processed by the second signal processing circuit are multiplexed by a first audio processing module to carry out audio processing;
the peripheral interface circuit comprises an FM antenna interface connected with an FM antenna, a typec interface matched with the intelligent equipment interface and a signal output interface connected with a loudspeaker;
the FM antenna interface is connected with the first signal processing circuit and used for receiving the FM signal from the FM antenna and transmitting the FM signal to the first signal processing circuit;
the typec interface is connected with the second signal processing circuit and used for receiving the audio signal and transmitting the audio signal to the second signal processing circuit;
the signal output interface is connected with the first audio processing module and used for outputting the processed signal to the loudspeaker.
Preferably, the first signal processing circuit includes an FM signal receiving circuit, an FM signal demodulating circuit, and a first resampling module that are connected in sequence; the FM signal receiving circuit is connected with an FM antenna interface of the peripheral interface circuit;
the second signal processing circuitry comprises typec signal transceiving circuitry; the typec signal transceiving circuit is connected with a typec interface of the peripheral interface circuit;
an adder is further integrated in the chip body to realize audio mixing of the FM audio signal and the typec audio signal.
Preferably, the FM antenna interface is a single-ended interface; or the FM antenna interface is a double-end interface of a differential circuit.
Preferably, the typec interface includes a VBus pin, a DP pin, a DN pin, a CC line pin, and a GND pin, where the DP pin and the DN pin are connected to the typec signal transceiver circuit.
Preferably, the signal output interface comprises a first set of pins and a second set of pins, wherein,
the first group of pins comprise an LP pin and an LN pin, one end of the LP pin is connected with the first audio processing module, the other end of the LP pin is connected with the left channel loudspeaker, and the LN pin is connected with the left channel loudspeaker;
the second group of pins comprise an RP pin and an RN pin, one end of the RP pin is connected with the first audio processing module, the other end of the RP pin is connected with the right channel loudspeaker, and the RN pin is connected with the right channel loudspeaker.
Preferably, the chip body is further integrated with a third signal processing circuit, the third signal processing circuit comprises an analog-to-digital conversion circuit and a second audio processing module,
the peripheral interface circuit also comprises a microphone interface which is connected with the analog-to-digital conversion circuit and inputs signals collected by a microphone to the analog-to-digital conversion circuit;
the second audio processing module is connected with the typec signal transceiving circuit, transmits the signal input by the analog-to-digital conversion circuit to the typec signal transceiving circuit, and transmits the signal to the intelligent device through the typec interface.
Preferably, the microphone interface includes a mic pin and a GND pin, one end of the mic pin is connected to the analog-to-digital conversion circuit, the other end of the mic pin is connected to the microphone, and the GND pin is connected to the microphone.
Another aspect of the present invention is to provide a typec earphone integrated with FM functions, the earphone includes a left speaker device, a right speaker device, a typec connector, and a connecting portion located between the typec connector and the speaker devices;
the connecting part is electrically connected with the typec connector and the left loudspeaker equipment and the right loudspeaker equipment; the chip is embedded in the connecting portion.
Preferably, the typec connector is electrically connected with a typec interface on the chip; the left loudspeaker device and the right loudspeaker device are electrically connected with the signal output interface on the chip.
Preferably, the FM antenna multiplexes an earphone audio line; the FM antenna is electrically connected with the FM antenna interface on the chip.
The utility model discloses the people provides a pair of typec earphone chip and typec earphone of integrated FM function realizes typec and FM function on earphone single chip, can not need the crystal oscillator on being applied to the earphone, realizes the FM and receives. The utility model discloses on integrating the earphone chip with the FM function, directly by the earphone speaker broadcast, the FM signal no longer carries out signal processing through typec interface passback to the mobile phone chip, has effectively solved the poor problem of prior art FM signal reception performance.
The utility model discloses the people provides a pair of typec earphone chip and typec earphone of integrated FM function, typec audio frequency and FM can save the space at the chip integration, reduce taking of chip space on the whole, can do the typec interface littleer, can save the cost.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive of the invention, as claimed.
Drawings
Further objects, functions and advantages of the present invention will become apparent from the following description of embodiments of the present invention, with reference to the accompanying drawings, in which:
fig. 1 schematically shows a schematic structural diagram of a typec earphone chip integrated with FM function in an embodiment of the present invention.
Fig. 2 shows a schematic diagram of an FM double-ended interface in another implementation of the present invention.
Fig. 3 shows a schematic diagram of a typec headset with integrated FM functionality in a further embodiment of the invention.
Detailed Description
The objects and functions of the present invention and methods for accomplishing the same will be apparent by reference to the exemplary embodiments. However, the present invention is not limited to the exemplary embodiments disclosed below; it can be implemented in different forms. The nature of the description is merely to assist those skilled in the relevant art in a comprehensive understanding of the specific details of the invention.
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings, the same reference numerals denote the same or similar parts, or the same or similar steps.
The following will provide a detailed description of the present invention through specific embodiments, in the prior art, FM is usually integrated in a chip of a smart device (e.g., a mobile phone, a pad, etc.), and an antenna of an earphone receives FM radio frequency signals and transmits the signals to the mobile phone for processing through a usb (type) interface. In order to solve the FM signal reception performance that the scheme appears among the prior art to and the influence to the cell-phone charges, the utility model provides a typec earphone chip and typec earphone of integrated FM function.
As shown in fig. 1, in an embodiment of the present invention, a schematic structural diagram of a chip of a typec earphone integrating FM functions includes a chip body and a chip peripheral interface circuit. Integrated in the chip body is a first signal processing circuit 100 for receiving and processing FM signals, and a second signal processing circuit 200 for receiving and processing audio signals input through the typec interface. The FM signal processed by the first signal processing circuit 100 and the audio signal processed by the second signal processing circuit 200 are multiplexed by the first audio processing module 500 for audio processing.
The peripheral interface circuit comprises an FM antenna interface connected with the FM antenna, a typec interface matched with the intelligent equipment interface and a signal output interface connected with the loudspeaker.
The FM antenna interface is connected to the first signal processing circuit 100, and is configured to receive an FM signal from the FM antenna and transmit the FM signal to the first signal processing circuit 100.
the typec interface is connected to the second signal processing circuit 200 for receiving the audio signal and transmitting to the second signal processing circuit 200.
The signal output is connected to the first audio processing module 500, and is used for outputting the processed signal to a speaker.
The first signal processing circuit 100 includes an FM signal receiving circuit 101, a signal demodulating circuit 102, and a first resampling module 103, which are connected in sequence, where the FM signal receiving circuit 101 is connected to an FM antenna interface of a peripheral interface circuit.
The second signal processing circuit 200 includes a typec signal transceiving circuit 201, and the typec signal transceiving circuit 201 is connected to a typec interface of the peripheral interface circuit. An adder 400 is further integrated in the chip body to realize audio mixing of the FM audio signal and the typec audio signal.
In some embodiments, the second signal processing circuit 200 comprises a typec signal transceiving circuit 201 and a second resampling module 202 connected in sequence. The adder 400 is connected to the first resampling module 103 and the second resampling module 202, and realizes mixing of the FM audio signal and the typec audio signal.
In this embodiment, the FM antenna of the earphone receives a signal, and inputs the FM signal to the chip body of the earphone in a single-ended manner, and after the FM signal receiving circuit receives the FM signal, the analog-to-digital converter converts the analog signal into a digital signal. The FM signal is input to the adder 400 after passing through the signal demodulation circuit 102 and the first resampling module 103. The audio signal input from the typec interface is input to the adder 400 via the typec signal transceiver circuit 201 and the second resampling module 202. In some embodiments, the FM signal is transmitted to the first audio processing module 500 by the adder 400 after passing through the first signal processing circuit 100, or the typec audio signal is transmitted to the first audio processing module 500 by the adder 400 after passing through the second signal processing circuit.
In other embodiments, after the FM signal passes through the first signal processing circuit 100, the typec audio signal passes through the second signal processing circuit, and the two signals are superimposed and transmitted to the first audio processing module 500 for processing by the adder.
According to the utility model discloses an embodiment, including the FM antenna interface of connecting the FM antenna, the typec interface that matches with the smart machine interface at the peripheral interface circuit of chip body to and connect the signal output interface of speaker.
In this embodiment, the FM antenna interface is a single-ended interface (FMANT), and the FM antenna interface is connected to the FM signal receiving circuit 101 to input FM signals, and the antenna signals are connected to the chip. In other embodiments, the antenna signal may be coupled to the chip by a dual-port interface, which is described in detail below.
According to the embodiment of the present invention, typec interface connection typec transceiver circuitry 201 inputs typec audio signal, inserts typec audio signal into the chip. Specifically, the typec interface in this embodiment includes a VBus pin, a DP pin, a DN pin, a CC line pin, and a GND pin, where the DP pin and the DN pin are connected to a typec signal transceiver circuit, and are used to transmit typec data to typec transceiver circuit 201.
VBus pin and smart machine's VBus pin match for earphone chip power supply, CC line pin matches with smart machine's CC line pin, is used for judging the plug-in direction of equipment: the forward/reverse insertion, and the GND pin is grounded. According to the utility model discloses an embodiment, signal output interface connects the speaker, with signal output to speaker. Specifically, the signal output interface is connected to the first audio processing module 500, and converts the signal processed by the first audio processing module 500 into an analog signal through the digital-to-analog converter and outputs the analog signal to the speaker. The present embodiment includes a left channel speaker 601 and a right channel speaker 602, and the signals of the left and right channels are output to different speakers through two sets of pins.
The signal output interface in this embodiment includes a first set of pins and a second set of pins. The first group of pins includes an LP pin (positive electrode) and an LN pin (negative electrode), one end of the LP pin is connected to the first audio processing module 500, the other end of the LP pin is connected to the left channel speaker 601, and the LN pin is connected to the left channel speaker 601. Specifically, the other end of the LP pin is connected to the positive terminal of the left channel speaker 601, and the LN pin is connected to the negative terminal of the left channel speaker 601.
The second group of pins includes an RP pin (positive electrode) and an RN pin (negative electrode), one end of the RP pin is connected to the first audio processing module 500, the other end of the RP pin is connected to the right channel speaker 602, and the RN pin is connected to the right channel speaker 602. Specifically, the other end of the RP pin is connected to the positive terminal of the right speaker 602, and the RN pin is connected to the negative terminal of the right speaker 601.
In some embodiments, the signal output interface is a single pin, and the speaker includes an audio terminal and a ground terminal, and the audio terminal is connected to the pin of the signal output interface.
According to the utility model discloses an embodiment, the chip body still integrates third signal processing circuit 300 for handle the audio signal that earphone microphone 700 gathered. The third signal processing circuit 300 comprises an analog-to-digital conversion circuit (ADC)301 and a second audio processing module 302.
The peripheral interface circuit includes a microphone interface, and the microphone interface is connected to an analog-to-digital conversion circuit (ADC)301, and inputs a signal collected by the microphone to the analog-to-digital conversion circuit (ADC) 301. The second audio processing module 302 is connected to the typec signal transceiver circuit 201, and transmits the signal input by the analog-to-digital conversion circuit 301 to the typec signal transceiver circuit 201, and transmits the signal to the intelligent device through a typec interface.
According to the utility model discloses an in the embodiment, the microphone interface includes mic pin and GND pin, and analog-to-digital conversion circuit 301 is connected to mic pin one end, and microphone 700 is connected to the other end of mic pin, and the microphone is connected to the GND pin.
It should be noted that the present invention is directed to integrate a circuit for processing FM radio frequency signals into a single chip of an earphone, so as to solve the problem of poor FM reception performance caused by the existing FM function at the mobile phone end. The circuit involved in the embodiments is not particularly limited, and those skilled in the art may adopt the existing circuit design and arrange the circuit in the manner of the present invention. For example, according to specific implementation situations, in some embodiments, an up-sampling module, a filter circuit, a digital-to-analog conversion circuit, a volume adjustment circuit, an equalization circuit, and the like may be integrated in a chip, which is not described herein again.
As shown in fig. 2, another embodiment of the present invention is a schematic diagram of an FM dual-port interface, in which the FM antenna interface is a dual-port interface of a differential circuit, and the FM antenna receives signals by using the dual-port interface and inputs the signals to the chip.
Specifically, the chip body adopts two PIN PINs: FMANTP pin and FMANTN pin. The two PIN PINs are connected to the FM antenna by a differential circuit (as shown in fig. 2), and the FM antenna signal is input to the FM signal receiving circuit 101, so that the FM antenna signal is connected to the chip of the earphone.
According to the embodiment of the present invention, fig. 3 shows a schematic diagram of an integrated FM function typec earphone in another embodiment of the present invention. A typec earphone integrated with FM function includes two speaker devices of left and right, i.e., a left channel speaker 601 and a right channel speaker 602, a typec connector 900, and a connection part 800 between the typec connector 900 and the speaker devices.
The connection part 800 is electrically connected with the typec connector 900 and the left and right speaker devices, and the chip is embedded in the connection part 800. The chip is provided by the present invention, and the specific chip structure has been explained in detail above, and is not described herein again. In some embodiments, the connecting portion has a card slot adapted to the shape of the chip, and the chip is fixed by being inserted into the card slot.
The left and right speaker devices are electrically connected to the signal output interface on the chip, i.e. the left channel speaker 601 and the right channel speaker 602 are connected to the signal output interface 603, and in the embodiment, the left channel speaker 601 and the right channel speaker 602 are connected to the signal output interface 603 through wires.
In some embodiments, in single-ended mode, the LP pin is connected to the LP end of the speaker, and the LN pin is connected to ground; the RP pin is connected with the RP end of the loudspeaker, and the RN pin is grounded. In other embodiments, the dual-port mode, the LP pin is connected to the LP end of the speaker, and the LN pin is connected to the LN end of the speaker; the RP pin is connected with the RP end of the loudspeaker, and the RN pin is connected with the RN end of the loudspeaker.
The FM antenna multiplexes the audio line of the headset and is electrically connected to the FM antenna interface 104 on the chip. The FM antenna interface 104 connects the FM signal to the chip via a single-ended interface or a double-ended interface.
According to the embodiment of the present invention, the earphone is further provided with a microphone 700, and the microphone interface 701 of the chip is connected to the microphone 700 through a wire. The microphone interface 701 accesses the acquired microphone signal into the chip.
The utility model provides a pair of typec earphone chip and typec earphone of integrated FM function realizes typec and FM function on earphone single chip, can not need the crystal oscillator on being applied to the earphone, realizes the FM and receives. The utility model discloses on integrating the earphone chip with the FM function, through the signal stack back, directly by earphone speaker broadcast, the FM signal no longer carries out signal processing through typec interface passback to the mobile phone chip, has effectively solved the poor problem of prior art FM signal reception performance.
The utility model discloses the people provides a pair of type earphone chip and type earphone of integrated FM function, type audio frequency and FM can economize the space at the chip integration, reduce taking of chip space on the whole, can do the type interface littleer, practice thrift and economize the cost.
The various illustrative logical blocks, or elements described in connection with the embodiments disclosed herein may be implemented or performed with a general purpose processor, a digital signal processor, an Application Specific Integrated Circuit (ASIC), a field programmable gate array or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. A general-purpose processor may be a microprocessor, but in the alternative, the processor may be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices, e.g., a digital signal processor and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a digital signal processor core, or any other similar configuration.
Those of skill in the art will also appreciate that the various illustrative logical blocks, units, and steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate the interchangeability of hardware and software, various illustrative components, elements, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design requirements of the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present embodiments.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
Claims (10)
1. A typec earphone chip integrating FM function is characterized in that the chip comprises a chip body and a chip peripheral interface circuit; wherein the content of the first and second substances,
the chip body is internally integrated with a first signal processing circuit used for receiving and processing FM signals and a second signal processing circuit used for receiving and processing audio signals input through a typec interface;
the FM signal processed by the first signal processing circuit and the audio signal processed by the second signal processing circuit are multiplexed by a first audio processing module to carry out audio processing;
the peripheral interface circuit comprises an FM antenna interface connected with an FM antenna, a typec interface matched with the intelligent equipment interface and a signal output interface connected with a loudspeaker;
the FM antenna interface is connected with the first signal processing circuit and used for receiving the FM signal from the FM antenna and transmitting the FM signal to the first signal processing circuit;
the typec interface is connected with the second signal processing circuit and used for receiving the audio signal and transmitting the audio signal to the second signal processing circuit;
the signal output interface is connected with the first audio processing module and used for outputting the processed signal to the loudspeaker.
2. The FM-function-integrated typec earphone chip of claim 1, wherein the first signal processing circuit comprises an FM signal receiving circuit, an FM signal demodulating circuit, and a first resampling module connected in this order; the FM signal receiving circuit is connected with an FM antenna interface of the peripheral interface circuit;
the second signal processing circuitry comprises typec signal transceiving circuitry; the typec signal transceiving circuit is connected with a typec interface of the peripheral interface circuit;
an adder is further integrated in the chip body to realize audio mixing of the FM audio signal and the typec audio signal.
3. The FM-integrated typec earphone chip of claim 1, wherein the FM antenna interface is a single-ended interface; or
The FM antenna interface is a double-end interface of a differential circuit.
4. The FM-function-integrated typec earphone chip of claim 2, wherein the typec interface comprises a VBus pin, a DP pin, a DN pin, a CC line pin, and a GND pin, wherein the DP pin and the DN pin connect the typec signal transceiver circuit.
5. The FM enabled typec headset chip of claim 1, wherein the signal output interface comprises a first set of pins and a second set of pins, wherein,
the first group of pins comprise an LP pin and an LN pin, one end of the LP pin is connected with the first audio processing module, the other end of the LP pin is connected with the left channel loudspeaker, and the LN pin is connected with the left channel loudspeaker;
the second group of pins comprise an RP pin and an RN pin, one end of the RP pin is connected with the first audio processing module, the other end of the RP pin is connected with the right channel loudspeaker, and the RN pin is connected with the right channel loudspeaker.
6. The FM enabled typec headset chip of claim 2, wherein the chip body further integrates a third signal processing circuit, the third signal processing circuit comprising an analog-to-digital conversion circuit and a second audio processing module,
the peripheral interface circuit also comprises a microphone interface which is connected with the analog-to-digital conversion circuit and inputs signals collected by a microphone to the analog-to-digital conversion circuit;
the second audio processing module is connected with the typec signal transceiving circuit, transmits the signal input by the analog-to-digital conversion circuit to the typec signal transceiving circuit, and transmits the signal to the intelligent device through the typec interface.
7. The FM function integrated typec earphone chip of claim 6, wherein the microphone interface comprises a mic pin and a GND pin, wherein one end of the mic pin is connected to the analog-to-digital conversion circuit, the other end of the mic pin is connected to the microphone, and the GND pin is connected to the microphone.
8. A typec earphone integrated with FM function is characterized in that the earphone comprises a left loudspeaker device, a right loudspeaker device, a typec connector and a connecting part between the typec connector and the loudspeaker devices;
the connecting part is electrically connected with the typec connector and the left loudspeaker equipment and the right loudspeaker equipment; and the chip according to any one of claims 1 to 7 is embedded in the connection portion.
9. The FM enabled typec headphones of claim 8, wherein the typec connector is electrically connected with typec interface on the chip;
the left loudspeaker device and the right loudspeaker device are electrically connected with the signal output interface on the chip.
10. The FM-enabled typec headset of claim 8, wherein the FM antenna multiplexes a headset audio line;
the FM antenna is electrically connected with the FM antenna interface on the chip.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113206906A (en) * | 2021-05-18 | 2021-08-03 | 维沃移动通信有限公司 | Electronic equipment assembly and digital earphone |
| CN113411444A (en) * | 2021-06-03 | 2021-09-17 | 维沃移动通信有限公司 | Electronic equipment assembly and terminal equipment |
| CN113949755A (en) * | 2020-07-17 | 2022-01-18 | 荣耀终端有限公司 | Electronic equipment and wired earphone |
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2019
- 2019-12-25 CN CN201922394109.9U patent/CN210958728U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113949755A (en) * | 2020-07-17 | 2022-01-18 | 荣耀终端有限公司 | Electronic equipment and wired earphone |
| CN113949755B (en) * | 2020-07-17 | 2023-01-31 | 荣耀终端有限公司 | Electronic equipment and wired earphone |
| CN113206906A (en) * | 2021-05-18 | 2021-08-03 | 维沃移动通信有限公司 | Electronic equipment assembly and digital earphone |
| CN113206906B (en) * | 2021-05-18 | 2023-09-22 | 维沃移动通信有限公司 | Electronic device assembly and digital earphone |
| CN113411444A (en) * | 2021-06-03 | 2021-09-17 | 维沃移动通信有限公司 | Electronic equipment assembly and terminal equipment |
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