CN210956620U - Chip packaging system for smart card - Google Patents
Chip packaging system for smart card Download PDFInfo
- Publication number
- CN210956620U CN210956620U CN201922429895.1U CN201922429895U CN210956620U CN 210956620 U CN210956620 U CN 210956620U CN 201922429895 U CN201922429895 U CN 201922429895U CN 210956620 U CN210956620 U CN 210956620U
- Authority
- CN
- China
- Prior art keywords
- chip
- rodless cylinder
- suction nozzle
- smart card
- packaging system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- 238000013519 translation Methods 0.000 claims abstract description 26
- 239000011241 protective layer Substances 0.000 claims description 5
- 238000009434 installation Methods 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Abstract
The utility model relates to a chip packaging system for smart card has solved the lower problem of artifical installation chip efficiency. The vibration plate comprises a machine table, wherein a first rodless cylinder is horizontally arranged on one side of the upper surface of the machine table, a translation plate is horizontally connected onto a sliding block of the first rodless cylinder, a vibration plate is arranged on the other side of the upper surface of the machine table, and an outlet of the vibration plate is communicated with a feeding track. The one end of board upper surface is provided with the mounting bracket, and the level is provided with the rodless cylinder on the mounting bracket, and the piston rod of rodless cylinder of second is mutually perpendicular with the piston rod of first rodless cylinder, and the vertical lift cylinder that is connected with on the slider of rodless cylinder of second, the piston rod of lift cylinder is connected with vacuum suction head, and vacuum suction head intercommunication has the vacuum pump, and the vertical intercommunication in bottom of vacuum suction head has the suction nozzle, and the suction nozzle is linked together through vacuum suction head with the vacuum pump. The utility model discloses can be automatically with on chip mounting inner panel, improve production efficiency, save a large amount of time and manpower.
Description
Technical Field
The utility model belongs to the technical field of the technique of smart card packing plant and specifically relates to a chip packaging system for smart card is related to.
Background
The intelligent card is a general name of a plastic card with a microchip embedded inside, needs to perform data interaction through a reader-writer, is generally provided with a CPU, an RAM and an I/O (input/output), can automatically process a large amount of data without interfering the work of a host CPU (central processing unit), can filter wrong data to reduce the burden of the host CPU, and is suitable for occasions with a large number of ports and high communication speed requirements. The smart card has the advantages of good antimagnetic, mechanical damage prevention and chemical damage prevention capabilities, good safety, large storage capacity and the like, so the smart card is widely applied to the fields of finance and finance, traffic and tourism, medical treatment and health, entertainment, school management and the like, is extremely convenient to use, and is deeply popular with people.
The smart card mainly comprises an inner plate, an outer plate and a chip fixedly installed on the inner plate, a through groove used for placing the chip is usually formed in the inner plate during processing, then an adhesive tape is adhered to one side face of the inner plate and covers the through groove, then the chip is placed in the through groove to enable the adhesive tape to fix the chip, and finally the outer plate is fixed on two sides of the inner plate in a pressing mode.
However, at present, the chips are generally placed in the through grooves manually, the through grooves and the chips are generally small in size, the chips are troublesome to place, the efficiency is low in production of a production line, and much labor and time cost is spent.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a chip package system for smart card.
The above utility model discloses an above-mentioned utility model purpose can realize through following technical scheme:
a chip packaging system for a smart card comprises a machine table, wherein a first rodless cylinder is horizontally arranged on one side of the upper surface of the machine table, a translation plate is horizontally connected on the sliding block of the first rodless cylinder, a vibration disc is arranged on the other side of the upper surface of the machine table, the outlet of the vibrating disk is communicated with a feeding track, one end of the upper surface of the machine table is provided with a mounting rack, a second rodless cylinder is horizontally arranged on the mounting frame, a cylinder barrel of the second rodless cylinder is vertical to a cylinder barrel of the first rodless cylinder, a mounting plate is vertically connected on the sliding block of the second rodless cylinder, a lifting cylinder is arranged on the mounting plate, a piston rod of the lifting cylinder is connected with a vacuum suction head which is communicated with a vacuum pump, the bottom of the vacuum suction head is vertically communicated with a suction nozzle, and the suction nozzle is communicated with the vacuum pump through the vacuum suction head.
By adopting the technical scheme, when processing, the inner plate of a chip to be installed is placed on the translation plate, the translation plate is controlled to translate through the first rodless cylinder to drive the inner plate to move, the chip is conveyed into the feeding track by the vibration disc, the second rodless cylinder drives the vacuum suction head to translate to the upper side of the feeding track, the lifting cylinder moves to drive the vacuum suction head to move downwards and suck the chip through the suction nozzle, the lifting cylinder resets, the second rodless cylinder drives the vacuum suction head to translate to the upper side of the inner plate, the lifting cylinder descends to enable the suction nozzle to place the chip into a chip groove on the inner plate to complete installation, then the first rodless cylinder drives the translation plate to continue to move to install, the chip is continuously installed on the inner plate in a circulating mode, the production efficiency is greatly improved, and a large amount of time and manpower.
The utility model discloses further set up to: the translation plate is provided with a positioning groove.
Through adopting above-mentioned technical scheme, the constant head tank is used for fixing a position the inner panel of placing on the translation board, makes the inner panel keep fixed, avoids the in-process inner panel of installation chip to take place the translation and lead to the chip to be difficult to install the chip inslot on the inner panel.
The utility model discloses further set up to: the lateral wall of constant head tank sets up along the direction that keeps away from each other upwards slope gradually.
Through adopting above-mentioned technical scheme, the enlargement setting of constant head tank notch can play the guide effect to the installation of inner panel, makes the inner panel place the constant head tank more easily in, avoids the notch edge of constant head tank to cause the hindrance to the installation of inner panel, also can protect the inner panel simultaneously, reduces the wearing and tearing of inner panel and constant head tank notch edge, avoids the inner panel to damage.
The utility model discloses further set up to: and a protective layer is arranged at the bottom of the positioning groove.
Through adopting above-mentioned technical scheme, the protective layer can further protect the inner panel of placing in the constant head tank, has further reduced the wearing and tearing between inner panel and the constant head tank inner wall.
The utility model discloses further set up to: and one end of the translation plate is provided with a taking and placing groove, and the taking and placing groove is communicated with the positioning groove.
Through adopting above-mentioned technical scheme, get setting up of putting the groove and be convenient for hand the inner panel when carrying out the dismouting to the inner panel, convenient operation excessively exert oneself and lead to inner panel bending fracture when avoiding the dismouting.
The utility model discloses further set up to: the mounting plate is horizontally connected with a positioning plate, the positioning plate is provided with a positioning hole, the suction nozzle penetrates through the positioning hole in a sliding mode, and the outer wall of the suction nozzle is in clearance fit with the inner wall of the positioning hole.
Through adopting above-mentioned technical scheme, the setting of locating plate and locating hole can carry on spacingly to the suction nozzle, makes the suction nozzle keep vertical to put into the chip inslot on the inner panel with the chip, improved the precision of chip installation.
The utility model discloses further set up to: and a rubber ring is arranged at the pipe orifice of the suction nozzle.
Through adopting above-mentioned technical scheme, the rubber circle can play the guard action to the chip, avoids between suction nozzle and the chip contact and leads to the surface of chip impaired, also can improve the leakproofness between chip and the suction nozzle simultaneously, leaks gas when avoiding absorbing the chip and leads to the chip to drop.
The utility model discloses further set up to: the suction nozzle is detachably connected with the vacuum suction head.
Through adopting above-mentioned technical scheme, the suction nozzle sets up to dismantling to be connected conveniently and carries out the dismouting to the suction nozzle with vacuum suction head to in the suction nozzle of size change adaptation according to the chip, be convenient for absorb the chip.
To sum up, the utility model discloses a beneficial technological effect does:
the first rodless cylinder can control the translation plate to drive the inner plate to move, the second rodless cylinder can drive the vacuum sucker to translate, the lifting cylinder can drive the vacuum sucker to lift, the suction nozzle is used for sucking the chip and placing the chip into a chip groove on the inner plate to complete installation, and the chip is continuously installed on the inner plate through automatic control circulation, so that the production efficiency is greatly improved, and a large amount of time and labor are saved;
the positioning groove can position the inner plate placed on the translation plate, so that the inner plate is kept fixed, the inner plate is prevented from translating in the process of installing the chip to cause position deviation, and the chip is prevented from being difficult to be installed in a chip groove on the inner plate;
the rubber ring is arranged to protect the chip, so that the surface of the chip is prevented from being damaged due to contact between the suction nozzle and the chip, the sealing performance between the chip and the suction nozzle can be improved, and the chip is prevented from falling due to air leakage when the chip is sucked.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a partially enlarged schematic view of a portion a in fig. 1.
Fig. 3 is a schematic view of the inner plate.
In the figure, 1, a machine; 11. a first rodless cylinder; 12. a translation plate; 121. positioning a groove; 122. a protective layer; 123. a taking and placing groove; 13. a vibrating pan; 14. a feeding track; 2. a mounting frame; 21. mounting a plate; 22. a second rodless cylinder; 23. a lifting cylinder; 24. a vacuum suction head; 25. a suction nozzle; 251. a rubber ring; 26. a vacuum pump; 27. positioning a plate; 271. and (7) positioning the holes.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1, for the utility model discloses a chip packaging system for smart card, including board 1, there is first no rod cylinder 11 one side of board 1 upper surface through bolt level fixed mounting, is used for placing the translation board 12 of inner panel through bolt level fixedly connected with on the slider of first no rod cylinder 11. The other side of the upper surface of the machine table 1 is provided with a vibration disc 13 for conveying chips, and an outlet of the vibration disc 13 is communicated with a feeding track 14.
Referring to fig. 1 and 2, a mounting frame 2 is fixedly mounted at one end of the upper surface of the machine table 1 through bolts, a second rodless cylinder 22 is horizontally and fixedly mounted on the mounting frame 2 through bolts, and a cylinder of the second rodless cylinder 22 is perpendicular to a cylinder of the first rodless cylinder 11. A rectangular mounting plate 21 is vertically and fixedly mounted on a sliding block of the second rodless cylinder 22 through a bolt, a lifting cylinder 23 is vertically and fixedly mounted on one side surface, back to the second rodless cylinder 22, of the mounting plate 21 through a bolt, a vacuum suction head 24 is vertically and downwardly mounted on a piston rod of the lifting cylinder 23 through a bolt, the vacuum suction head 24 is communicated with a vacuum pump 26 through a pipeline, a cylindrical suction nozzle 25 is vertically communicated with the bottom of the vacuum suction head 24, and the suction nozzle 25 is communicated with the vacuum pump 26 through the vacuum suction head 24.
An inner plate to be provided with a chip is placed on a translation plate 12, the translation plate 12 is controlled to drive the inner plate to move through a first rodless cylinder 11, the chip is conveyed into a feeding rail 14 through a vibration disc 13, a second rodless cylinder 22 drives a vacuum suction head 24 to translate to the position above the feeding rail 14, and a lifting cylinder 23 moves to drive the vacuum suction head 24 to move downwards and suck the chip through a suction nozzle 25. Then the lifting cylinder 23 is reset, the second rodless cylinder 22 drives the vacuum suction head 24 to translate to the upper part of the inner plate and correspond to a chip groove (shown in figure 3) on the inner plate, and the lifting cylinder 23 descends to enable the suction nozzle 25 to place a chip into the chip groove on the inner plate to complete installation. First no pole cylinder 11 drives translation board 12 and continues to remove and install, so circulate constantly with the chip mounting to the inner panel on, greatly improved production efficiency, saved a large amount of time and manpower.
In this embodiment, the suction nozzle 25 is connected to the vacuum suction head 24 by a screw so as to disassemble and assemble the suction nozzle 25, and the suction nozzle 25 can be conveniently replaced according to the size of the chip so as to suck the chip. The mouth of pipe department of suction nozzle 25 bonds and has rubber circle 251 to protect the chip, avoid between suction nozzle 25 and the chip contact and lead to the surface of chip impaired, also can improve the leakproofness between chip and the suction nozzle 25 simultaneously, leak gas and lead to the chip to drop when avoiding absorbing the chip.
Offer the constant head tank 121 with inner panel looks adaptation on translation board 12, place the inner panel when the installation chip and fix a position the inner panel in constant head tank 121, make the inner panel keep fixed, avoid the in-process inner panel of installation chip to take place the translation and lead to the chip to be difficult to install on the inner panel.
The lateral wall of constant head tank 121 is inclined gradually by middle part to upper portion along the direction of keeping away from each other and is set up the formation inclined plane to in guiding the installation of inner panel, make the inner panel place constant head tank 121 more easily, avoid the notch edge of constant head tank 121 to cause the hindrance to the installation of inner panel, also can protect the inner panel simultaneously, avoid inner panel and constant head tank 121 notch edge to wear and tear each other and damage.
The bottom of constant head tank 121 bonds there is the protective layer 122 of silica gel material, and then protects the lateral wall of inner panel, has further reduced the wearing and tearing between inner panel and the constant head tank 121 inner wall. Avoiding chip scratch.
The one end of translation board 12 is seted up one and is got groove 123 for semicircular in cross-section, gets groove 123 and is linked together with constant head tank 121, when carrying out the dismouting to the inner panel, the accessible is got groove 123 and is handed to the inner panel, convenient operation, excessive effort and lead to the inner panel fracture of buckling when avoiding the dismouting.
Referring to fig. 2, a rectangular positioning plate 27 is horizontally connected to the mounting plate 21, the positioning plate 27 is located below the vacuum suction head 24, a circular positioning hole 271 is formed in the positioning plate 27, the suction nozzle 25 is slidably inserted into the positioning hole 271, and the outer wall of the suction nozzle 25 is in clearance fit with the inner wall of the positioning hole 271. When the suction nozzle 25 goes up and down, the positioning hole 271 can limit the suction nozzle 25, so that the suction nozzle 25 is kept vertical, a chip is conveniently placed in a chip groove on the inner plate, and the chip mounting accuracy is improved.
The implementation principle of the embodiment is as follows: carry the chip in the pay-off track 14 through vibration dish 13, control translation plate 12 translation and drive the inner panel removal through first rodless cylinder 11, drive vacuum suction head 24 translation between pay-off track 14 and translation plate 12 through second rodless cylinder 22, drive vacuum suction head 24 through lift cylinder 23 and go up and down, suction nozzle 25 is used for holding the chip and putting into the chip inslot on the inner panel with the chip and accomplishing the installation, constantly install the chip on the inner panel through the automatic control circulation, production efficiency has greatly been improved, a large amount of time and manpower have been saved.
The embodiment of this specific implementation mode is the preferred embodiment of the present invention, not limit according to this the utility model discloses a protection scope, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.
Claims (8)
1. A chip packaging system for a smart card, comprising: comprises a machine table (1), wherein a first rodless cylinder (11) is horizontally arranged on one side of the upper surface of the machine table (1), a translation plate (12) is horizontally connected on a sliding block of the first rodless cylinder (11), a vibration disc (13) is arranged on the other side of the upper surface of the machine table (1), an outlet of the vibration disc (13) is communicated with a feeding track (14), a mounting frame (2) is arranged at one end of the upper surface of the machine table (1), a second rodless cylinder (22) is horizontally arranged on the mounting frame (2), a cylinder barrel of the second rodless cylinder (22) is vertical to the cylinder barrel of the first rodless cylinder (11), a mounting plate (21) is vertically connected on a sliding block of the second rodless cylinder (22), a lifting cylinder (23) is arranged on the mounting plate (21), and a piston rod of the lifting cylinder (23) is connected with a vacuum suction head (24), the vacuum suction head (24) is communicated with a vacuum pump (26), the bottom of the vacuum suction head (24) is vertically communicated with a suction nozzle (25), and the suction nozzle (25) is communicated with the vacuum pump (26) through the vacuum suction head (24).
2. The chip packaging system for smart card as claimed in claim 1, wherein: the translation plate (12) is provided with a positioning groove (121).
3. The chip packaging system for smart card as claimed in claim 2, wherein: the side walls of the positioning grooves (121) are gradually and upwards obliquely arranged along the direction away from each other.
4. The chip packaging system for smart card as claimed in claim 2, wherein: and a protective layer (122) is arranged at the bottom of the positioning groove (121).
5. The chip packaging system for smart card as claimed in claim 2, wherein: one end of the translation plate (12) is provided with a taking and placing groove (123), and the taking and placing groove (123) is communicated with the positioning groove (121).
6. The chip packaging system for smart card as claimed in claim 1, wherein: the mounting plate (21) is connected with a positioning plate (27) horizontally, the positioning plate (27) is provided with a positioning hole (271), the suction nozzle (25) penetrates through the positioning hole (271) in a sliding mode, and the outer wall of the suction nozzle (25) is in clearance fit with the inner wall of the positioning hole (271).
7. The chip packaging system for smart card as claimed in claim 1, wherein: and a rubber ring (251) is arranged at the nozzle of the suction nozzle (25).
8. The chip packaging system for smart card as claimed in claim 1, wherein: the suction nozzle (25) is detachably connected with the vacuum suction head (24).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922429895.1U CN210956620U (en) | 2019-12-27 | 2019-12-27 | Chip packaging system for smart card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922429895.1U CN210956620U (en) | 2019-12-27 | 2019-12-27 | Chip packaging system for smart card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210956620U true CN210956620U (en) | 2020-07-07 |
Family
ID=71397864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922429895.1U Expired - Fee Related CN210956620U (en) | 2019-12-27 | 2019-12-27 | Chip packaging system for smart card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210956620U (en) |
-
2019
- 2019-12-27 CN CN201922429895.1U patent/CN210956620U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200707 |