CN210955153U - Miniature 8 pad smart card module - Google Patents
Miniature 8 pad smart card module Download PDFInfo
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- CN210955153U CN210955153U CN201921710273.XU CN201921710273U CN210955153U CN 210955153 U CN210955153 U CN 210955153U CN 201921710273 U CN201921710273 U CN 201921710273U CN 210955153 U CN210955153 U CN 210955153U
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Abstract
The utility model discloses a miniature 8 pad smart card module belongs to the smart card module field, miniature 8 pad smart card module includes carrier band and chip, a surface of carrier band is the face of weld, another surface of carrier band is the contact surface, be provided with the metallic circuit layer on the face of weld, be provided with 8 independent conductive metal pads on the contact surface, a surface of chip is provided with and is used for the alloy pad with metallic circuit layer electric connection, appearance size length × wide × after miniature 8 pad smart card module encapsulation is 9.62mm-13.00mm × 9.32.32 mm-11.80mm × 0.4mm-0.5mm the utility model discloses a miniature 8 pad smart card module can realize improving 8 pad smart card module integrated level, reduces the size.
Description
Technical Field
The utility model relates to a smart card module field especially relates to a miniature 8 pad smart card module.
Background
With the continuous development of the integrated circuit packaging technology, the integration level of the integrated circuit is increasing day by day, and the size requirement of the product is becoming more and more strict, which requires that the integrated circuit packaging enterprise can develop smaller and thinner products to meet new requirements.
In the field of smart card packaging, there is a great demand for smart cards in domestic and foreign markets. At present, the smart card industry is developing towards the line of technological innovation, new technologies are emerging continuously, new manufacturing technologies are increasing, and many old manufacturing technologies are improving and strengthening continuously, so that the requirements for improving the functions and the performances of the smart card are inevitable.
After the traditional 8-pad smart card module is packaged, a smart card chip is packaged inside the module, and the chip comprises functions of VCC, RST, CLK, I/O, GND and the like, the final size can only become 13.00mm × 11.80.80 mm, no space is available for miniaturization and miniaturization of the module, moreover, more customers also require more functions to be concentrated inside the 8-pad smart card module according to the fact that the integrated circuits are more and more highly integrated.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model aims to solve the technical problem of providing a miniature 8 pad smart card module to realize improving 8 pad smart card module integration, reduce size.
The utility model adopts the technical proposal that:
the utility model provides a pair of miniature 8 pad smart card modules, including carrier band and chip, a surface of carrier band is the face of weld, another surface of carrier band is the contact surface, be provided with the metal circuit layer on the face of weld, be provided with 8 independent electrically conductive metal pads on the contact surface, a surface of chip be provided with be used for with metal circuit layer electric connection's alloy pad, the appearance size length × width × after miniature 8 pad smart card module encapsulation is 9.62mm-13.00mm × 9.32.32 mm-11.80mm × 0.4.4 mm-0.5 mm.
As a further improvement of the scheme, the chip is positioned in the middle of the welding surface, and non-contact bonding pads are respectively arranged on the two sides of the chip on the welding surface.
As a further improvement of this solution, the alloy pads are tin alloy pads or gold alloy pads.
As a further improvement of this solution, 8 independent conductive metal pads are conductive metal pads conforming to the ISO7816 standard.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model provides a pair of miniature 8 pad smart card modules, through set up 8 independent electrically conductive metal pads on the contact surface at the carrier band, set up the metal circuit layer on the face of weld of carrier band, and set up the alloy pad on the chip surface, the chip passes through alloy pad and metal circuit layer electric connection, realize the installation between chip and the carrier band, the integrated level is high, and the appearance size length × width × behind the encapsulation of miniature 8 pad smart card module is 9.62mm-13.00mm × 9.32.32 mm-11.80mm × 0.4.4 mm-0.5mm, the size can reach × width × thick and be 9.62mm × 9.32.32 mm × 0.4.4 mm, effectively reduce the size of 8 pad smart card module, make 8 pad smart card module design the optimum size in the optional ISO7816 standard range from conventional size originally, make the module overall dimension reduce, can be applied to in more harsh environment, also can satisfy the requirement of customer to follow-up the customization smart card product.
In addition, conventional 8 pad smart card module can't add the non-contact pad in the module because the space is narrow and small, and this application sets up the non-contact pad respectively through the both sides that lie in the chip on the face of weld, and with the non-contact pad integration in 8 pad smart card module. Compare traditional 8 pad smart card modules and have higher environmental protection effect and higher integrated level, not only can continue the performance effect of traditional 8 pad smart card modules, but also greatly reduced raw materials cost, manufacturing cost and save cost for the operating cost is lower.
Drawings
Fig. 1 is a schematic cross-sectional structural diagram of a micro 8-pad smart card module according to an embodiment of the present invention;
fig. 2 is a schematic top view of a micro 8-pad smart card module according to an embodiment of the present invention;
fig. 3 is a schematic bottom view of a micro 8-pad smart card module according to an embodiment of the present invention.
In the figure:
1. carrying a belt; 2. a chip; 11. welding a surface; 12. a contact surface; 110. a metal wiring layer; 120. a conductive metal pad; 20. an alloy pad; 111. a non-contact pad.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings and technical solutions needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
The present invention will be further explained with reference to the accompanying drawings.
As shown in fig. 1 to 3, the micro 8-pad smart card module provided by this embodiment includes a carrier tape 1 and a chip 2, one surface of the carrier tape 1 is a bonding surface 11, the other surface of the carrier tape 1 is a contact surface 12, a metal circuit layer 110 is disposed on the bonding surface 11, 8 independent conductive metal pads 120 are disposed on the contact surface 12, an alloy pad 20 for electrically connecting with the metal circuit layer 110 is disposed on one surface of the chip 2, the metal circuit layer 110 is adapted to the alloy pad 20, so that the mounting integration level between the chip and the carrier tape is high, the stability is good, the overall size ×, the width ×, the width and the thickness of the packaged micro 8-pad smart card module are 9.62mm-13.00mm × 9.32.32 mm-11.80mm × 0.4mm-0.5mm, the size of the 8-pad smart card module is effectively reduced, so that the 8-pad smart card module is designed from the original conventional size to be an ISO size in a 7816 standard range, so that the overall size of the module is reduced, and can be applied to a more severe environment, and the requirements of a subsequent smart card can be made to a customized product.
Specifically, the 8 independent conductive metal pads 120 are conductive metal pads conforming to the ISO7816 standard.
Specifically, the alloy pad 20 is a tin alloy pad or a gold alloy pad. When the alloy bonding pad 20 of the chip 2 is electrically connected with the metal circuit layer 110 of the carrier tape 1, if the alloy bonding pad 20 is made of tin alloy, the processing technology adopts heating solidification for electrical connection; if the alloy bonding pad 20 is made of gold alloy, the processing technology uses ultrasonic welding for electrical connection.
In order to increase the use function of the smart card module, further, the metal circuit layer 110 is disposed in the middle of the bonding surface 11, the chip 2 is located in the middle of the bonding surface 11, and the non-contact pads 111 are disposed on the bonding surface 11 and located on two sides of the chip 2 respectively. Subsequently, the non-contact pad 111 of the bonding surface 11 can be bonded with an inner antenna of the smart card to have a non-contact function of the smart card. The non-contact type welding disc is integrated in the 8-welding disc intelligent card module, so that the original contact type intelligent card function is reserved after the 8-welding disc intelligent card module is packaged, and the non-contact type intelligent card function which is not possessed by the traditional 8-welding disc intelligent card module is added.
The specific manufacturing steps of the mini 8-pad smart card module are as follows:
step 1: an alloy bonding pad 20 is implanted on a functional bonding pad of the chip 2 by adopting a ball implantation process, and the alloy bonding pad 20 can be made of tin alloy or gold alloy.
Step 2: a contact surface 12 for data exchange with the outside and a soldering surface 11 for connection to the chip 2 are provided on the carrier tape 1.8 independent conductive metal pads 120 are manufactured on the contact surface 12 by adopting a line etching method according to the ISO7816 standard, and the conductive metal pads 120 are used for data exchange between a card reader and a smart card when the smart card is used.
And step 3: according to the specific position distribution of the alloy bonding pads 20 on the chip 2, a metal circuit layer 110 matched with the alloy bonding pads 20 on the chip 2 is manufactured on the welding surface 11 of the carrier tape 1.
And 4, step 4: the alloy pads 20 of the chip 2 are electrically connected to the metal wiring layer 110 on the bonding surface 11 of the carrier tape 1. If the alloy bonding pad 20 is made of tin alloy, the processing technology adopts heating solidification for electrical connection; if the alloy bonding pad 20 is made of gold alloy, the processing technology uses ultrasonic welding for electrical connection.
And 5, finally, packaging and protecting the chip 2 and the carrier tape 1 by filling glue, wherein the size of the manufactured micro 8-pad intelligent card module can reach 9.62mm × 9.32.32 mm × 0.4.4 mm.
To sum up, it can only be 13.00mm × 11.80.80 mm to compare traditional 8 pad smart card module size, the miniature 8 pad smart card module size that this embodiment provided can reach 9.62mm × 9.32.32 mm × 0.4.4 mm, realize the miniaturization to the module, miniaturized preparation, it has higher environmental protection effect and higher integrated level to compare traditional 8 pad smart card module, not only can continue the performance effect of traditional 8 pad smart card module, and can also greatly reduced material cost, manufacturing cost and save cost, make the operation cost lower.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the creative work should be covered within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.
Claims (4)
1. A miniature 8 pad smart card module, includes carrier band (1) and chip (2), its characterized in that:
one surface of the carrier tape (1) is a welding surface (11), the other surface of the carrier tape (1) is a contact surface (12), a metal circuit layer (110) is arranged on the welding surface (11), and 8 independent conductive metal welding pads (120) are arranged on the contact surface (12);
an alloy bonding pad (20) which is used for being electrically connected with the metal circuit layer (110) is arranged on one surface of the chip (2);
the packaged micro 8-pad smart card module has the overall dimension of length ×, width × and thickness of 9.62-13.00 mm × 9.32.32-11.80 mm × 0.4.4-0.5 mm.
2. A miniature 8-pad smart card module as set forth in claim 1, wherein:
the chip (2) is positioned in the middle of the welding surface (11);
non-contact bonding pads (111) are arranged on the two sides of the chip (2) on the welding surface (11) respectively.
3. A miniature 8-pad smart card module as set forth in claim 1, wherein:
the alloy pad (20) is a tin alloy pad or a gold alloy pad.
4. A miniature 8-pad smart card module as set forth in claim 1, wherein:
the 8 independent conductive metal pads (120) are conductive metal pads conforming to the ISO7816 standard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921710273.XU CN210955153U (en) | 2019-10-12 | 2019-10-12 | Miniature 8 pad smart card module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921710273.XU CN210955153U (en) | 2019-10-12 | 2019-10-12 | Miniature 8 pad smart card module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210955153U true CN210955153U (en) | 2020-07-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921710273.XU Active CN210955153U (en) | 2019-10-12 | 2019-10-12 | Miniature 8 pad smart card module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210955153U (en) |
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2019
- 2019-10-12 CN CN201921710273.XU patent/CN210955153U/en active Active
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