CN210955150U

CN210955150U - High temperature resistant RFID electronic tags

Info

Publication number: CN210955150U
Application number: CN201921353702.2U
Authority: CN
Inventors: 范丽丽
Original assignee: Xuzhou Connor Hi Tech Materials Science And Technology Co ltd
Current assignee: Xuzhou Connor Hi Tech Materials Science And Technology Co ltd
Priority date: 2019-08-20
Filing date: 2019-08-20
Publication date: 2020-07-07
Anticipated expiration: 2029-08-20

Abstract

The utility model discloses a high temperature resistant RFID electronic tag, which comprises a main body and an upper cover, wherein the main body and the upper cover main body are all made of FPC board material, the FPC board has corrosion resistance, high temperature resistance, strong electrical property, good flexibility, moisture resistance and arbitrary bending, the upper cover is fixedly connected with the main body, a first notch is arranged at the center of the main body, a lower clapboard is fixedly connected with the main body through a glue layer, an etching antenna is arranged on the upper end surface of the lower clapboard, a second notch is arranged at the center of the etching antenna, a chip is fixed in the second notch through a conductive glue layer, the chip is arranged in the etching antenna, the chip can be electrically connected with the etching antenna to work, the chip and the etching antenna work at high speed, the abrasion between the chip and the etching antenna is reduced, the service life of the RFID electronic tag is prolonged, the upper end and the lower end of the chip are provided with the upper partition plate and the lower partition plate, so that the chip and high temperature reach certain isolation effect, and the high temperature resistance effect is better achieved.

Description

High temperature resistant RFID electronic tags

Technical Field

The utility model relates to an electronic tags technical field specifically is a high temperature resistant RFID electronic tags.

Background

The RFID (radio frequency identification) of electronic label is a non-contact automatic identification technology, it identifies the target object automatically through the radio frequency signal, and obtain the relevant data, play a role in monitoring and managing, and realize this kind of function, first one must have electronic label reader writer and processing system to process the identification information, second one must paste the electronic label on the identified object, through the radio frequency signal that the reader writer sends, start the launcher in the chip of electronic label, transmit electronic code and identification information written in the electronic label to the system through the reader writer, carry on monitoring and management to the target, along with the temperature rise, the RFID radio frequency chip also shrinks and deforms accordingly, cause the damage of RFID radio frequency chip, therefore need to overcome the problem that the prior art exists.

According to the high-temperature-resistant RFID electronic tag, the main body and the upper cover main body are made of FPC plates, and the FPC plates have the advantages of corrosion resistance, high temperature resistance, strong electrical property, good flexibility, moisture resistance and random bending, are not limited by states when used, and are more convenient; the fixed column that upper cover lower extreme edge set up is the material of silica gel, has cooperated whole RFID electronic tags's bendability.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high temperature resistance RFID electronic tags to the problem among the prior art has been solved.

In order to achieve the above object, the utility model provides a following technical scheme: a high-temperature-resistant RFID electronic tag comprises a main body and an upper cover, wherein the upper cover is fixedly connected with the main body, a first notch is formed in the center of the main body, small holes are formed in the edge of the main body, a silica gel high-temperature-resistant coating is coated on the outer surface of the main body, the first notch comprises fixing holes, a glue layer, a lower partition plate, an etching antenna, a chip and an upper partition plate, two groups of fixing holes are formed in the edge of the lower end of the first notch, the lower partition plate is fixedly connected with the main body through the glue layer, the etching antenna is arranged on the upper end surface of the lower partition plate, the chip is arranged in the center of the etching antenna, the upper partition plate is;

the upper cover upper layer is coated with a silica gel high-temperature-resistant coating, the upper cover lower layer is provided with an FPC board, and the lower end edge is provided with a fixing column.

Preferably, the upper cover is clamped with the fixing hole at the bottom of the first notch through the fixing column and is an RFID electronic tag.

Preferably, the adhesive layer is made of a high-temperature-resistant silica gel adhesive.

Preferably, the etched antenna is made of copper.

Preferably, a second notch is formed in the center of the etching antenna, and the chip is fixedly connected with the second notch through a conductive adhesive layer.

Preferably, the main body and the upper cover are made of FPC board.

Preferably, the fixing column is a member made of a silica gel material.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. this high temperature resistant RFID electronic tags, first notch and the glue film that the lower baffle used are the material of high temperature resistant silica gel gluing agent, have improved whole FID electronic tags's high temperature resistance.

2. This high temperature resistant RFID electronic tags, etching antenna adopt the material of copper, and metallic copper high temperature resistance and corrosion resisting property are strong, and metallic copper can be crooked wantonly, has strengthened RFID electronic tags's practicality.

3. This high temperature resistance RFID electronic tags, the chip passes through conductive adhesive layer to be fixed in the second notch, and the chip is installed in the etching antenna, and chip ability electric connection etching antenna work, high-speed work just reduced the wearing and tearing of chip and etching antenna, improved the life of RFID electronic tags use.

4. According to the high-temperature-resistant RFID electronic tag, the main body and the upper cover main body are made of FPC plates, and the FPC plates have the advantages of corrosion resistance, high temperature resistance, strong electrical property, good flexibility, moisture resistance and random bending, are not limited by states when used, and are more convenient; the fixed column that upper cover lower extreme edge set up is the material of silica gel, has cooperated whole RFID electronic tags's bendability.

5. This high temperature resistance RFID electronic tags sets up baffle and lower baffle in the upper end of chip and lower extreme, makes chip and high temperature reach certain isolated effect, has better reached high temperature resistance's effect.

Drawings

Fig. 1 is a cross-sectional view of the RFID tag of the present invention;

fig. 2 is a schematic view of the overall structure of the RFID tag of the present invention;

FIG. 3 is a schematic view of the upper cover structure of the present invention;

fig. 4 is a cross-sectional view of the etched antenna of the present invention.

In the figure: 1. a main body; 11. a first notch; 111. a fixing hole; 12. a small hole; 13. a silica gel high temperature resistant coating; 14. a glue layer; 2. an upper cover; 21. an FPC board; 22. fixing a column; 3. a lower partition plate; 4. etching the antenna; 41. a chip; 42. a second notch; 43. a conductive adhesive layer; 5. and an upper partition plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, a high temperature resistant RFID tag comprises a main body 1 and an upper cover 2, wherein the main body 1 and the upper cover 2 are made of an FPC board 21, and the FPC board 21 has corrosion resistance, high temperature resistance, strong electrical performance, good flexibility, moisture resistance and arbitrary bending, and is not limited by the state during use, so that the high temperature resistant RFID tag is more convenient; the fixing column 22 arranged at the lower end edge of the upper cover 2 is a component made of silica gel material and matches with the flexibility of the whole RFID electronic tag, the upper cover 2 is fixedly connected with the main body 1, the center of the main body 1 is provided with a first notch 11, the edge of the main body 1 is provided with a small hole 12, the outer surface of the main body 1 is coated with a silica gel high temperature resistant coating 13, the first notch 11 comprises a fixing hole 111, a glue layer 14, a lower baffle 3, an etching antenna 4, a chip 41 and an upper baffle 5, the lower end edge of the first notch 11 is provided with two groups of fixing holes 111, the lower baffle 3 is fixedly connected with the main body 1 through the glue layer 14, the glue layer 14 used by the first notch 11 and the lower baffle 3 is made of high temperature resistant silica gel adhesive, the high temperature resistance of the whole FID electronic tag is improved, the upper end surface of the lower baffle 3 is provided with the etching antenna 4, the etching antenna 4 is, the practicality of the RFID electronic tag is enhanced, the chip 41 is arranged at the center of the etching antenna 4, the upper end and the lower end of the chip 41 are provided with the upper baffle 5 and the lower baffle 3, so that the chip 41 and high temperature reach certain isolation effect, the effect of high temperature resistance is better achieved, the upper surface of the etching antenna 4 is provided with the upper baffle 5, the upper end of the upper baffle 5 is provided with the upper cover 2, and the upper cover 2 is fixedly connected with the main body 1.

Referring to fig. 3, an upper cover 2 of the high temperature resistant RFID electronic tag includes an FPC board 21, a silicone high temperature resistant coating 13 and fixing posts 22, the silicone high temperature resistant coating 13 is coated on the upper layer of the upper cover 2, the FPC board 21 is disposed on the lower layer of the upper cover 2, the fixing posts 22 are disposed on the lower edge of the lower end, and the fixing posts 22 are made of a silicone material and are matched with the flexibility of the whole RFID electronic tag.

Referring to fig. 4, in the high temperature resistant RFID tag, a second notch 42 is formed in the center of the etching antenna 4, the chip 41 is fixed in the second notch 42 through the conductive adhesive layer 43, the chip 41 is installed in the etching antenna 4, the chip 41 can be electrically connected to the etching antenna 4 to work, the chip 41 and the etching antenna 4 work at high speed, the abrasion between the chip 41 and the etching antenna 4 is reduced, and the service life of the RFID tag is prolonged.

In summary, the following steps: a high-temperature resistant RFID electronic tag comprises a main body 1 and an upper cover 2, wherein the main body 1 and the upper cover 2 are made of FPC board 21, the FPC board 21 has corrosion resistance, high temperature resistance, strong electrical property, good flexibility, moisture resistance and arbitrary bending, and is not limited by the state when in use, so that the high-temperature resistant RFID electronic tag is more convenient; the fixing column 22 arranged at the lower end edge of the upper cover 2 is made of silica gel and matched with the flexibility of the whole RFID electronic tag, the upper cover 2 is fixedly connected with the main body 1, the center of the main body 1 is provided with a first notch 11, the edge of the main body 1 is provided with a small hole 12, the outer surface of the main body 1 is coated with a silica gel high-temperature resistant coating 13, the first notch 11 comprises a fixing hole 111, a glue layer 14, a lower baffle 3, an etching antenna 4, a chip 41 and an upper baffle 5, the lower end edge of the first notch 11 is provided with two groups of fixing holes 111, the lower baffle 3 is fixedly connected with the main body 1 through the glue layer 14, the glue layer 14 used by the first notch 11 and the lower baffle 3 is made of high-temperature resistant silica gel adhesive, the high temperature resistance of the whole FID electronic tag is improved, the upper end surface of the lower baffle 3 is provided with the etching antenna 4, the etching antenna 4, the practicality of RFID electronic tags has been strengthened, second notch 42 is seted up at etching antenna 4 center, chip 41 passes through conducting resin layer 43 to be fixed in second notch 42, chip 41 installs in etching antenna 4, chip 41 can the work of electric connection etching antenna 4, high-speed work has just reduced the wearing and tearing of chip 41 with etching antenna 4, the year of RFID electronic tags use has been improved, set up baffle 5 and lower baffle 3 in chip 41's upper end and lower extreme, make chip 41 and high temperature reach certain isolated effect, the effect of high temperature resistance has better been reached.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a high temperature resistance RFID electronic tags, includes main part (1) and upper cover (2), upper cover (2) fixed connection main part (1), its characterized in that: the antenna comprises a main body (1), wherein a first notch (11) is formed in the center of the main body (1), small holes (12) are formed in the edge of the main body (1), a silica gel high-temperature-resistant coating (13) is coated on the outer surface of the main body (1), the first notch (11) comprises two groups of fixing holes (111), a glue layer (14), a lower partition plate (3), an etching antenna (4), chips (41) and an upper partition plate (5), the lower end edge of the first notch (11) is provided with two groups of fixing holes (111), the lower partition plate (3) is fixedly connected with the main body (1) through the glue layer (14), the upper end surface of the lower partition plate (3) is provided with the etching antenna (4), the chip (41) is arranged in the center of the etching antenna (4), the upper end surface of the etching antenna (4) is provided with the upper partition plate (5), the; the upper cover (2) upper layer is coated with a silica gel high temperature resistant coating (13), the lower layer of the upper cover (2) is provided with an FPC board (21), and the lower end edge is provided with a fixing column (22).

2. The high temperature resistant RFID tag of claim 1, wherein: the upper cover (2) is clamped with the fixing hole (111) at the bottom of the first notch (11) through the fixing column (22) and is an RFID electronic tag.

3. The high temperature resistant RFID tag of claim 1, wherein: the adhesive layer (14) is made of a high-temperature-resistant silica gel adhesive.

4. The high temperature resistant RFID tag of claim 1, wherein: the etching antenna (4) is made of copper.

5. The high temperature resistant RFID tag of claim 1, wherein: a second notch (42) is formed in the center of the etching antenna (4), and the chip (41) is fixedly connected with the second notch (42) through a conductive adhesive layer (43).

6. The high temperature resistant RFID tag of claim 1, wherein: the fixing column (22) is a component made of silica gel.