CN210954962U - Computer machine case heat abstractor - Google Patents

Abstract

The utility model relates to a computer case cooling device, which effectively solves the problems that the existing computer case has low heat dissipation and heat dissipation efficiency and cannot avoid dust accumulation inside the case; The inner rear side of the chassis is fixedly connected with the power supply module, the CPU platform and the hard disk in order from top to bottom. The rear surface of the chassis is provided with two sets of rear air intake holes which are respectively opposite to the power supply module and the CPU platform. There is an exhaust fan fixedly connected inside the chassis, the front ends of the two exhaust fans are provided with air guide plates that are fixedly connected to the inside of the chassis, and the front ends of the two air guide plates are provided with a set of air outlet holes opened in the lower part of the side wall of the chassis, so One side of the air outlet is provided with an exhaust fan that is fixedly connected inside the case; the utility model has a simple structure, can improve the heat dissipation capacity, and can effectively prevent the deposition of dust in the case, and has strong practicability.

Description

A computer case cooling device

technical field

The utility model relates to the field of computer case technology, in particular to a computer case heat dissipation device.

Background technique

With the development of science and technology, the application of computers is becoming more and more extensive, and the speed of computers is also getting faster and faster. With the acceleration of speed, the performance of heat dissipation is also higher.

Existing heat dissipation is usually to install a heat dissipation plate on the chip, and then set a small fan on the heat dissipation plate to dissipate heat from the chip by blowing the fan. This heat dissipation method has less wind power and limited heat dissipation capacity. And in the process of heat dissipation, it is difficult to prevent dust from falling into the case and accumulating on the CPU and other electronic components.

Therefore, the present invention provides a computer case cooling device to solve this problem.

Utility model content

Aiming at the above situation, in order to overcome the defects of the prior art, the present invention provides a computer case cooling device, which effectively solves the problems of low heat dissipation and heat dissipation efficiency of the existing computer case and unavoidable dust accumulation inside the case.

The utility model comprises a chassis, which is characterized in that a power supply module, a CPU platform and a hard disk are fixedly connected to the inner rear side of the chassis in sequence from top to bottom; The opposite rear air intake holes, two sets of rear air intake holes are provided with a suction fan fixedly connected to the inside of the chassis, and the front ends of the two suction fans are provided with air guide plates that are fixedly connected to the inside of the chassis. An air outlet is formed on the lower part of the side wall of the case, and one side of the air outlet is provided with an exhaust fan fixedly connected to the inside of the case;

One end of the two deflectors close to the adjacent exhaust fans is arc-shaped and the end far away is horizontal, and a wind gradually narrowing from the back to the front is formed between the two deflectors and the adjacent power modules and the CPU platform. road.

Preferably, the front ends of the two air guide plates are provided with arc-shaped air guide plates that are fixedly connected to the inside of the chassis, and sticky dust pads are fixedly connected to the air guide plates.

Preferably, three groups of upper air inlet holes and three groups of lower air inlet holes are opened on a side wall opposite to the air outlet of the chassis;

The three sets of upper air intake holes are respectively located below the power module, below the lower air guide plate of the two air guide plates, and below the CPU platform;

The three sets of lower air intake holes are respectively located above the upper air guide plate of the two air guide plates, above the CPU platform and above the hard disk.

Preferably, a set of vertical side air inlet holes are opened on a side wall of the case and the air outlet hole opposite, and the side air inlet holes are located in front of the upper inlet holes.

Preferably, there are two groups of the air outlets, the two groups of air outlets are arranged in parallel on a side wall of the case, and one side of the two groups of air outlets is provided with an exhaust fan fixedly connected to the inside of the case.

Preferably, an activated carbon strip fixedly connected in the case is arranged between the power module and the rear end of the case.

Preferably, a flow guide block is integrally connected below the CPU platform.

The utility model makes improvements to the problems of low heat dissipation and heat dissipation efficiency of the existing computer case and cannot avoid dust accumulation inside the case. When adding a fan, a diagonal air intake hole is formed on the side wall of the case, so that the airflow entering the case can be improved. It can be directly blown to components such as the motherboard, so that the dust on the components floats and floats out from the air outlet of the chassis with the airflow, which effectively improves the heat dissipation capacity and prevents the accumulation of dust; additional exhaust at the air outlet The fan is used to increase the air flow rate, thereby improving the heat dissipation efficiency. At the same time, an arc-shaped diversion plate and a sticky dust pad are arranged on one side of the air outlet, so as to ensure that the dust in the air flow can be adhered when it hits the diversion plate, preventing the airflow from being in the diversion plate. A vortex or turbulent flow is formed nearby and the dust cannot be discharged, which effectively improves the ability of dust removal and dust removal.

Description of drawings

Fig. 1 is a three-dimensional schematic diagram of the present invention.

Figure 2 is a schematic diagram of the rear view of the utility model.

FIG. 3 is a second perspective view of the utility model.

FIG. 4 is a schematic left side view of the utility model.

FIG. 5 is a schematic cross-sectional view at A-A in FIG. 4 of the present utility model.

FIG. 6 is a schematic cross-sectional view at B-B in FIG. 4 of the present utility model.

FIG. 7 is a first three-dimensional schematic view of the utility model with the sidewall removed.

FIG. 8 is a second perspective view of the utility model with the sidewall removed.

Detailed ways

The foregoing and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of the embodiments with reference to FIGS. 1 to 8 . The structural contents mentioned in the following embodiments are all referenced to the accompanying drawings.

In the description of the present invention, it should be understood that the terms "up", "middle", "outside", "inside", etc. indicate orientation or positional relationships, and are only for the convenience of describing the present invention and simplifying the description, rather than It is indicated or implied that the components or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as a limitation of the present invention.

Exemplary embodiments of the present invention will be described below with reference to the accompanying drawings.

Embodiment 1, the present invention is a computer case cooling device, including a case 1, the case 1 is a common case 1 used to provide a fixed foundation for subsequent structures, and the interior rear side of the case 1 is from top to bottom. A power supply module 2, a motherboard platform 3, a hard disk 4 and other common computer parts are fixedly connected in turn, wherein the motherboard platform 3 is used to carry the computer motherboard, which is a common accessory of the existing computer main box 1, and will not be described in detail here. It is characterized in that, the rear surface of the chassis 1 is provided with two sets of rear air intake holes 5 which are respectively opposite to the power module 2 and the main board platform 3, and one side of the two sets of rear air intake holes 5 is provided with a suction fan 6 fixedly connected to the inside of the chassis 1. 1 and 8, the two groups of rear air intake holes 5 are used for blowing and dissipating heat for the power supply module 2 and the computer motherboard on the motherboard platform 3 respectively. 6. The front ends are provided with deflectors 7 that are fixedly connected to the inside of the chassis 1. The two deflectors 7 have an arc-shaped end close to the adjacent suction fan 6 and an end that is far away from the horizontal. The two deflectors 7 and Between the adjacent power modules 2 and the main board platform 3, a gradually narrowed air duct is formed from the back to the front. Referring to Figures 7 and 8 here, the function of the deflector 7 is to use the Venturi effect to make the passage of the power module 2 The air flow below and the air flow above the motherboard platform 3 are accelerated, so that the air flow per unit time is increased, and the heat dissipation efficiency is improved. At the same time, the accelerated air flow can also prevent dust from staying and depositing. The motherboard platform 3 on one side of the exhaust fan 6 is located at the lower center of the rear of the exhaust fan 6, so that part of the airflow generated by the adjacent exhaust fans 6 can flow to the downwind of the motherboard platform 3 and pass through the hard disk 4, thereby cooling the hard disk 4. , due to the low heat generation of hard disk 4, the fan is no longer set separately;

The front ends of the two air guide plates 7 are provided with a set of air outlet holes 8 opened at the lower part of the side wall of the case 1. One side of the air outlet holes 8 is provided with an exhaust fan 9 that is fixedly connected to the inside of the case 1. The air inside the chassis 1 is exhausted, and the air outlet 8 and the exhaust fan are used to make the airflow form a complete circulating airflow inside the chassis 1. Reduce dust deposits.

Embodiment 2, on the basis of Embodiment 1, the front ends of the two air guide plates 7 are provided with arc-shaped air guide plates 10 that are fixedly connected to the inside of the chassis 1. Referring to FIGS. 7 and 8, the arc-shaped air guide plates 10 can make the airflow drawn into the chassis 1 by the two exhaust fans 6, after being accelerated by the deflector 7, can all flow to the air outlet 8 on the front side wall of the chassis 1 under the action of the deflector 10, and cooperate with the exhaust. Air fan 9, so as to lead out the air flow in the chassis 1. The air guide plate 10 is fixedly connected with a sticky dust pad. After the high-speed airflow contacts the air guide plate 10, the dust in the airflow will hit the air guide plate 10 and cooperate with the drainage plate 10. The stray airflow near the board 10 forms a turbulent flow or vortex, which affects the discharge of dust. The setting of the sticky pad can make the dust that hits the guide board 10 directly adhered, thereby preventing the dust from staying in the chassis 1 and in the chassis. 1. Falling deposition after stopping work, reducing the deposition of dust in the chassis 1.

Embodiment 3, on the basis of Embodiment 1, three groups of upper air intake holes 11 and three groups of lower air intake holes 12 are opened on a side wall opposite to the case 1 and the air outlet hole 8. Figure 5, Figure 6,

The three sets of upper air intake holes 11 are respectively located below the power module 2 , below the lower air deflector 7 of the two air guide plates 7 , and below the motherboard platform 3 , and the upper air intake holes 11 are upwardly inclined through holes. One end is low and the other end inside the chassis 1 is high. When the high-speed airflow generated by the exhaust fan 6 and the deflector 7 flows, a negative pressure is generated in the response position in the chassis 1, so as to inhale the external air, and the external air enters through the upper air intake hole 11. The incoming airflow impacts on the power module 2, the deflector 7 and the motherboard platform 3, thereby raising the dust deposited thereon, and the circulating airflow takes away the raised dust;

The three sets of lower air intake holes 12 are respectively located above the upper air guide plate 7 of the two air guide plates 7, above the motherboard platform 3 and above the hard disk 4, and the lower air intake holes 12 are downwardly inclined through holes. The outer end of the chassis 1 is high and the inner end of the chassis 1 is low. When the high-speed airflow generated by the exhaust fan 6 and the deflector 7 flows through, a negative pressure is generated in the response position in the chassis 1, so that the outside air is sucked in and the outside air passes through. The lower air inlet 12 enters, and the incoming air impinges on the deflector 7 , the motherboard platform 3 and the hard disk 4 , thereby raising the dust deposited thereon, and the circulating airflow takes away the raised dust.

Embodiment 4, on the basis of Embodiment 3, a set of vertical side air inlet holes 13 are opened on a side wall of the chassis 1 and the air outlet hole 8 opposite, and the side air inlet holes 13 are located in the upper inlet hole. 3, 4, 7, and 8, the side air intake holes 13 are provided to drive the air in the chassis 1 to flow to the side of the air outlet 8 in advance, and the flowing air will form a negative pressure in the chassis 1. The air outside the chassis 1 will enter the interior of the chassis 1 through the side air intake holes 13 and merge into the air flow in the chassis 1, and because there is a small distance between the air guide plate 7 and the air guide plate 10, this space is the side The space into which the air entered by the air inlet hole 13 joins, this setting can make the air flow tend to flow to the side of the air outlet hole 8 in advance before the guide plate 10 , so as to facilitate the circulation of the air flow in the chassis 1 .

Embodiment 5, on the basis of Embodiment 1, there are two groups of the air outlet holes 8, the air outlet holes 8 of the two groups are arranged in parallel on a side wall of the chassis 1, and one side of the air outlet holes 8 of the two groups is arranged side by side. Both are provided with an exhaust fan 9 that is fixedly connected to the inside of the chassis 1. Referring to Figure 1 and Figure 7, the two groups of air outlets 8 and the exhaust fan 9 can provide greater power for airflow and accelerate the airflow in the chassis 1. At the same time, the total area of the air outlet holes 8 is made larger, which facilitates better dust removal and dust removal.

Embodiment 6, on the basis of Embodiment 1, an activated carbon strip 14 fixedly connected in the case 1 is arranged between the power module 2 and the rear surface of the case 1. Referring to FIG. 8, the power module 2 and the rear wall of the case 1 Due to the existence of airflow, dust is easy to enter in the gap between them, and the activated carbon bar 14 can effectively prevent dust from entering, which is convenient for cleaning.

Embodiment 7, on the basis of Embodiment 1, a guide block 15 is integrally connected to the bottom of the mainboard platform 3, because the mainboard platform 3 on the side of the suction fan 6 located below is located at the lower center of the rear of the suction fan 6. , so that a part of the airflow generated by the adjacent suction fans 6 can flow downwind of the motherboard platform 3 and pass through the hard disk 4, and the setting of the air guide block 15 makes the airflow passing under the motherboard platform 3 can be closer to the hard disk 4, while diversion The air passage between the block 15 and the hard disk 4 can be narrower, thereby increasing the flow rate of the air flow, improving the heat dissipation capacity and preventing dust deposition.

When the utility model is in use, the external air is drawn in by two exhaust fans 6, and the acceleration effect of the deflector 7 makes the air flow through the power supply module 2, the main board and the hard disk 4, so as to better dissipate heat and prevent dust. At the same time, the negative pressure in the chassis 1 makes the external air enter the interior of the chassis 1 through the upper air intake hole 11 and the lower air intake hole 12, and the power module 2, the main board, the hard disk 4, the deflector 7 and the deflector block 15 may be The accumulated dust is blown, so that the dust enters the front of the chassis 1 with the high-speed air flow. Also under the action of negative pressure, the outside air enters through the side air inlet holes 13, so that the air flow is deflected in the direction of the air outlet holes 8. The direction of the air flow is exhausted through the exhaust fan 9 and the air outlet 8.

The utility model makes improvements to the problems of low heat dissipation and heat dissipation efficiency of the existing computer case and cannot avoid dust accumulation inside the case. When adding a fan, a diagonal air intake hole is formed on the side wall of the case, so that the airflow entering the case can be improved. It can be directly blown to components such as the motherboard, so that the dust on the components floats and floats out from the air outlet of the chassis with the airflow, which effectively improves the heat dissipation capacity and prevents the accumulation of dust; additional exhaust at the air outlet The fan is used to increase the air flow rate, thereby improving the heat dissipation efficiency. At the same time, an arc-shaped diversion plate and a sticky dust pad are arranged on one side of the air outlet, so as to ensure that the dust in the air flow can be adhered when it hits the diversion plate, preventing the airflow from being in the diversion plate. A vortex or turbulent flow is formed nearby and the dust cannot be discharged, which effectively improves the ability of dust removal and dust removal.

Claims (7)

1. A heat dissipation device of a computer case comprises a case (1), wherein a power module (2), a mainboard platform (3), a hard disk (4) and other common computer parts are fixedly connected with the rear side of the interior of the case (1) from top to bottom in sequence, it is characterized in that the rear end face of the case (1) is provided with two groups of rear air inlet holes (5) which are respectively opposite to the power module (2) and the mainboard platform (3), one side of each of the two groups of rear air inlet holes (5) is provided with an exhaust fan (6) fixedly connected inside the case (1), the front ends of the two exhaust fans (6) are provided with guide plates (7) fixedly connected inside the case (1), the front ends of the two guide plates (7) are provided with a group of air outlet holes (8) arranged at the lower part of the side wall of the case (1), an exhaust fan (9) fixedly connected with the inside of the case (1) is arranged on one side of the air outlet (8);

two guide plate (7) be close to adjacent exhaust fan (6) one end for the arc and the one end level of keeping away from, form the wind channel that narrows gradually forward after following between two guide plate (7) and adjacent power module (2), mainboard platform (3).

2. The heat dissipation device of the computer case according to claim 1, wherein the front ends of the two flow guide plates (7) are provided with arc-shaped flow guide plates (10) fixedly connected to the inside of the computer case (1), and the flow guide plates (10) are fixedly connected with dust-sticking pads.

3. The heat dissipation device of the computer case as claimed in claim 1, wherein a side wall of the case (1) opposite to the air outlet (8) is provided with three sets of upper air inlet holes (11) and three sets of lower air inlet holes (12);

the three groups of upper air inlet holes (11) are respectively positioned below the power module (2), below the lower guide plate (7) in the two guide plates (7) and below the main plate platform (3);

the three groups of lower air inlet holes (12) are respectively positioned above the upper guide plate (7) in the two guide plates (7), above the mainboard platform (3) and above the hard disk (4).

4. The heat dissipation device of the computer case according to claim 3, wherein a set of vertical side air inlet holes (13) is formed in a side wall of the case (1) opposite to the air outlet holes (8), and the side air inlet holes (13) are located in front of the upper air inlet holes.

5. The heat dissipation device of the computer case as claimed in claim 1, wherein there are two sets of the air outlets (8), the two sets of the air outlets (8) are arranged on a side wall of the computer case (1) in parallel, and one side of each set of the air outlets (8) is provided with an exhaust fan (9) fixedly connected to the inside of the computer case (1).

6. The heat sink for computer case as claimed in claim 1, wherein an activated carbon strip (14) is disposed between the power module (2) and the rear end of the case (1) and fixedly connected in the case (1).

7. The heat dissipation device of computer case as claimed in claim 1, wherein a flow guiding block (15) is integrally connected below the motherboard platform (3).

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