CN210928459U

CN210928459U - Heat radiation structure and electric bridge combiner of electric bridge combiner

Info

Publication number: CN210928459U
Application number: CN201922136183.0U
Authority: CN
Inventors: 卢坚
Original assignee: Rosenberger Technologies Co Ltd
Current assignee: Prologis Communication Technology Suzhou Co Ltd
Priority date: 2019-12-03
Filing date: 2019-12-03
Publication date: 2020-07-03
Anticipated expiration: 2029-12-03

Abstract

The utility model discloses a heat radiation structure and electric bridge combiner of electric bridge combiner, heat radiation structure sets up at least one device holding tank including apron, PCB board and at least one combiner device on the apron terminal surface relative with the PCB board, and combiner device part or whole hold in the device holding tank, are provided with on the PCB board and walk the line, and the combiner device is connected with walking the line electricity. The utility model discloses under the condition that does not increase the whole volume of combiner and cost, improve its radiating efficiency.

Description

Heat radiation structure and electric bridge combiner of electric bridge combiner

Technical Field

The utility model relates to an electric bridge combiner especially relates to a heat radiation structure and electric bridge combiner of electric bridge combiner.

Background

As is known, when a high-power bridge is combined, a large amount of heat is generated by an absorption load, so that the temperature of the PCB board and the combiner is rapidly raised, and after the high-power bridge is powered on for a period of time in severe cases, the heat cannot be dissipated in time, so that the PCB board and the combiner are deformed, damaged and fail to work. The test has to be performed by continuously increasing the depth of the heat dissipation teeth, which greatly increases the cost and volume of the bridge.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art's defect, provide a heat radiation structure and electric bridge combiner of electric bridge combiner.

In order to achieve the above object, the utility model provides a following technical scheme: a heat radiation structure of an electric bridge combiner comprises a cover plate, a PCB and at least one combiner, wherein at least one device accommodating groove is formed in one end face of the cover plate, which is opposite to a PC B plate, part or all of the combiner is accommodated in the device accommodating groove, a routing is arranged on the PCB, and the combiner is electrically connected with the routing.

Preferably, the cover plate is further provided with a wiring groove corresponding to the wiring position on the PCB.

Preferably, the device receiving groove includes one or a combination of two or more of an isolator receiving groove, a bridge piece receiving groove, and a load receiving groove.

Preferably, the heat dissipation structure further comprises a cavity, the PCB board is accommodated in the cavity, and the cover plate covers an end surface of the cavity.

Preferably, the other end face of the cavity far away from the cover plate is provided with heat dissipation teeth.

Preferably, the cover plate is a metal cover plate.

Preferably, the isolator is a double-section isolator.

Preferably, the bridge bit 3DB bridge bit.

The utility model discloses still announced another technical scheme: the utility model provides an electric bridge combiner, combiner includes apron, PCB board, at least one combiner and cavity, the PCB board holds in the cavity, the apron lid closes on the cavity, set up at least one device holding tank on the apron and the relative terminal surface of PCB board, combiner part or whole hold in the device holding tank, be provided with on the PCB board and walk the line, combiner with walk the line electricity and be connected.

The utility model has the advantages that:

1. through setting up the device holding tank that is used for holding the device on the apron for the key device of combiner more is close to in the bottom surface of apron, makes the device to the non-contact air convection heat dissipation of apron, improves and conducts to the apron heat dissipation for direct contact, is showing the speed that has improved heat conduction and laps, has improved the radiating efficiency and has reduced the temperature rise.

2. Through set up the routing groove corresponding with the line position of walking on the PCB board on the apron for the distance increase between the bottom surface of walking on the PCB board and PCB board prevents to take place the coupling.

3. According to the scheme, the radiating teeth do not need to be lengthened, the overall dimension of the combiner does not need to be increased, the processing time of the cover plate is shortened, and therefore the cost is saved.

Drawings

Fig. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic view of the split structure of FIG. 1;

FIG. 3 is a schematic view of a split structure in the reverse direction of FIG. 1;

fig. 4 is a schematic sectional structure diagram of the present invention.

Reference numerals:

10. the heat dissipation structure comprises a cover plate, 11, an isolator accommodating groove, 12, a load accommodating groove, 13, a wiring groove, 20, a PCB, 30, a cavity, 31, heat dissipation teeth, 40, an isolator, 50 and a load.

Detailed Description

The technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the present invention.

The utility model discloses a heat radiation structure and electric bridge combiner of electric bridge combiner, through improving the structure of apron, realize under the condition that does not increase volume and cost, improve the radiating efficiency of combiner.

With reference to fig. 1 to 4, an embodiment of the present invention discloses an electric bridge combiner, which includes a cover plate 10, a PCB 20, a combiner and a cavity 30, wherein the cover plate 10 is provided with a device holding groove for accommodating the combiner, and a wiring groove (not shown) corresponding to a wiring on the PCB 20, so as to improve the heat dissipation efficiency of the combiner.

Specifically, in the present embodiment, the cavity 30 includes an upper end surface and a lower end surface opposite to each other, a row of heat dissipation teeth 31 is disposed on the upper end surface, and each heat dissipation tooth 31 is disposed vertically upward; the lower end surface of the cavity 30 is open, the PCB 20 is accommodated in the cavity 30, and the PCB 20 is provided with traces (not shown).

The combiner device is fixed to the cavity 30 and electrically connected to the traces on the PCB board 20. In this embodiment, the combiner device includes a plurality of isolators 40, a plurality of bridge pieces (not shown), and a plurality of loads 50, wherein an input end of each isolator 40 is connected to one input signal, and an output end of each isolator is connected to an input end of each bridge piece; the output end of the bridge piece is directly connected with the load 50, or connected with the input end of another bridge piece, or directly output. In this embodiment, the isolator 40 and the load 50 pass through the PCB 20 and are fixed on the cavity 30 by a fixing structure (e.g. a screw), and the isolator 40 is a two-section isolator and the bridge piece is a 3DB bridge piece.

The cover plate 10 covers the lower end surface of the cavity 30, and forms a closed accommodating space with the cavity 30, and the PCB 20 and the combiner are disposed in the accommodating space. Preferably, an end surface of the cap plate 10 opposite to the PCB board 20 (for convenience of description, the end surface is defined as an upper end surface of the cap plate) is provided with at least one device receiving groove formed by recessing the upper end surface of the cap plate 10 in a direction away from the lower end surface of the cavity 30. Each device accommodating groove is used for accommodating a combiner, and part or all of the combiner is accommodated in the corresponding device accommodating groove.

In practice, the cover plate 10 may be provided with any one or a combination of two or more of the isolator receiving groove 11 corresponding to the isolator 40, the bridge piece receiving groove (not shown) corresponding to the bridge piece, and the load receiving groove 12 corresponding to the load 50, that is, the cover plate 10 may be provided with only the isolator receiving groove 11 for accommodating the isolator 40, only the bridge piece receiving groove for accommodating the bridge piece, only the load receiving groove 12 for accommodating the load, or the isolator receiving groove 11 for accommodating the isolator 40 and the bridge piece receiving groove for accommodating the bridge piece, etc. In this embodiment, the corresponding device receiving grooves are formed in the cover plate 10 corresponding to the isolators 40 and the loads 50, that is, the isolator receiving grooves 11 and the load receiving grooves 12 are formed in the cover plate 10. The device holding tank is arranged so that the devices of the combiner are closer to the bottom surface of the cover plate 10 (namely, the lower end surface of the cover plate 10), the rate of heat conduction to the cover plate 10 is obviously improved, the heat dissipation efficiency is improved, and the temperature rise is reduced.

In addition, more preferably, a wiring groove 13 is further disposed on the upper end surface of the cover plate 10, a position of the wiring groove 13 on the cover plate 10 corresponds to a position of a wiring on the PCB 20, and the wiring groove 13 is also formed by being recessed from the upper end surface of the cover plate 10 in a direction away from the lower end surface of the cavity 30. The distance between the wiring on the PCB 20 and the bottom surface of the PCB 20 is increased by the arrangement of the wiring groove 13, so that on one hand, the probability of coupling is less, on the other hand, the heat of the PCB 20 is conducted to the cover plate 10, and the heat dissipation efficiency is improved. In this embodiment, the cover plate 10 is a metal cover plate.

The device holding tank that sets up on above-mentioned apron 10 and apron 10, trough 13 etc. constitute the utility model discloses the heat radiation structure of electric bridge combiner, this heat radiation structure's design improves its radiating efficiency under the condition that does not increase the whole volume of combiner and cost.

The technical contents and features of the present invention have been disclosed as above, however, those skilled in the art can still make various substitutions and modifications based on the teaching and disclosure of the present invention without departing from the spirit of the present invention, therefore, the protection scope of the present invention should not be limited to the contents disclosed in the embodiments, but should include various substitutions and modifications without departing from the present invention, and should be covered by the claims of the present patent application.

Claims

1. The heat dissipation structure of the electric bridge combiner is characterized by comprising a cover plate, a PCB and at least one combiner, wherein at least one device accommodating groove is formed in one end face of the cover plate, which is opposite to the PCB, part or all of the combiner is accommodated in the device accommodating groove, a routing line is arranged on the PCB, and the combiner is electrically connected with the routing line.

2. The heat dissipation structure of the bridge combiner of claim 1, wherein the cover plate is further provided with a routing slot corresponding to a routing position on the PCB.

3. The heat dissipating structure of a bridge combiner of claim 1, wherein the device receiving slot comprises one or a combination of two or more of an isolator receiving slot, a bridge blade receiving slot, and a load receiving slot.

4. The heat dissipation structure of the bridge combiner of claim 1, further comprising a cavity, wherein the PCB board is received in the cavity, and the cover plate covers an end surface of the cavity.

5. The heat dissipating structure of an electrical bridge combiner of claim 4, wherein a heat dissipating tooth is disposed on another end surface of the cavity away from the cover plate.

6. The heat dissipating structure of an electrical bridge combiner of claim 1, wherein the cover plate is a metal cover plate.

7. The heat dissipating structure of a bridge combiner of claim 3, wherein the isolator is a double section isolator.

8. The heat dissipating structure of a bridge combiner of claim 3, wherein the bridge pad is a 3DB bridge pad.

9. The bridge combiner is characterized by comprising a cover plate, a PCB (printed circuit board), at least one combiner and a cavity, wherein the PCB is accommodated in the cavity, the cover plate covers the cavity, at least one device accommodating groove is formed in one end surface of the cover plate, which is opposite to the PCB, part or all of the combiner is accommodated in the device accommodating groove, a routing wire is arranged on the PCB, and the combiner is electrically connected with the routing wire.

10. The bridge combiner of claim 9, wherein the cover plate further has routing slots corresponding to locations of the traces on the PCB.