CN210928153U - Printed circuit board and glue layer printing screen combining selective gold plating and tin spraying - Google Patents
Printed circuit board and glue layer printing screen combining selective gold plating and tin spraying Download PDFInfo
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- CN210928153U CN210928153U CN201921371858.3U CN201921371858U CN210928153U CN 210928153 U CN210928153 U CN 210928153U CN 201921371858 U CN201921371858 U CN 201921371858U CN 210928153 U CN210928153 U CN 210928153U
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- gilding
- printed circuit
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Abstract
The utility model discloses a printed circuit board that selectivity gilding and hot air solder leveling combine, the package rubbing board comprises a board body, the plate body divides into a plurality of base plates, is equipped with the circuit layer on each base plate respectively, be equipped with gilding region and hot air solder leveling surface treatment area on the circuit layer, gilding regional distribution is located in the hot air solder leveling surface treatment area, still distribute the gilding pad of non-regular shape in the hot air solder leveling surface treatment area; the glue layer printing net is used for printing the glue layer of the gold-plated pad and comprises a net body, wherein the net body is provided with meshes matched with the gold-plated pad in shape; aiming at the irregular-shaped gold-plating pad, the printed circuit board is printed with a high-temperature-resistant strippable adhesive layer and then is subjected to tin spraying surface treatment, so that the technical problem that the irregular-shaped gold-plating pad cannot be subjected to gold plating and tin spraying surface treatment is solved, the diversity of product surface treatment selection is enriched, and the product diversity and cost control are obviously improved.
Description
Technical Field
The utility model relates to a printed circuit technical field, in particular to selectivity gilding and printed circuit board that hot air solder leveling combines and glue film printing screen that printing gilding pad was used.
Background
At present, a Printed Circuit Board (PCB) gold-plated and tin-sprayed plate mainly has the following two processing modes: 1. regularly plating gold on the fingers or the gold-plating pads, protecting the fingers or the gold-plating pads by using an adhesive tape, and then spraying tin; 2. and (4) irregularly plating gold on the pad, recommending a customer to change a surface treatment mode, and then spraying tin. However, the conventional tin spraying and gold plating processing mode cannot meet the design requirements of customers, the irregular gold plating pad cannot be subjected to gold plating and tin spraying surface treatment, and the change of the customer surface treatment mode can affect the original design starting point and production cost of customers and is not beneficial to product diversity expansion.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to solve one of the technical problem that exists among the prior art at least, provide a printed circuit board and the dedicated glue film printing screen of irregular gilding pad that selectivity gilding and tin spraying combine, can solve the unable preparation gilding of irregular gilding pad and add tin spraying surface treatment's a difficult problem, it is practical reliable.
According to the utility model discloses an aspect provides a pair of printed circuit board that selectivity gilding and hot air solder leveling combine, the package rubbing board body, a plurality of base plates are divided into to the plate body, are equipped with the circuit layer on each base plate respectively, be equipped with gilding region and hot air solder leveling surface treatment area on the circuit layer, gilding regional distribution is located in the hot air solder leveling surface treatment area, still there is the gilding pad of non-regular shape in the hot air solder leveling surface treatment area, the printing has the glue film that high temperature resistant and strippable removed on the gilding pad.
Preferably, the edge of the glue layer protrudes outwards from the edge of the gold-plated pad, and the protruding range is 0.5mm-1 mm.
Preferably, the thickness of the glue layer ranges from 0.4mm to 0.6 mm.
Preferably, the glue layer is peelable blue glue.
According to the utility model discloses an on the other hand provides a glue film printing screen for the glue film of the foretell gilding pad of printing, including the dictyosome, be equipped with on the dictyosome with the mesh that the gilding pad shape matches.
Preferably, the size of the openings of the mesh is 0.5mm to 1mm larger than the shape and size of the gold-plated pad.
Has the advantages that: aiming at the irregular-shaped gold-plating pad, the printed circuit board is printed with a high-temperature-resistant strippable adhesive layer on the gold-plating pad and then subjected to tin spraying surface treatment, so that the technical problem that the irregular-shaped gold-plating pad cannot be subjected to gold plating and tin spraying surface treatment is solved, the diversity of product surface treatment selection is enriched, and the product diversity and cost control are obviously improved.
Drawings
The present invention will be further described with reference to the accompanying drawings and examples;
fig. 1 is a schematic view of an overall structure of a printed circuit board according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a substrate according to an embodiment of the present invention;
fig. 3 is an enlarged schematic view of a portion a in fig. 2.
Detailed Description
This section will describe in detail the embodiments of the present invention, preferred embodiments of the present invention are shown in the attached drawings, which are used to supplement the description of the text part of the specification with figures, so that one can intuitively and vividly understand each technical feature and the whole technical solution of the present invention, but they cannot be understood as the limitation of the protection scope of the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.
Referring to fig. 1 to 3, an embodiment provides a printed circuit board, which includes a board body 10, where the board body 10 is typeset according to design requirements of a product, the board body 10 is divided into a plurality of substrates 11, and each substrate 11 is printed with a circuit layer 12. The surface of the circuit layer 12 is provided with a gold plating area 13 and a tin spraying surface processing area 14, and the distribution positions of the gold plating area 13 and the tin spraying surface processing area 14 are designed according to the product requirements.
In this embodiment, the circuit layer 12 on each substrate 11 includes two printed circuit patterns with similar shapes, the areas in the printed circuit patterns include a gold-plating area 13 and a tin-spraying surface processing area 14, the gold-plating pads 15 are in irregular shapes and are distributed in the tin-spraying surface processing area 14, wherein the gold-plating area 13 is substantially a ring-shaped area, the gold-plating pads 15 are mainly distributed inside the ring-shaped area of the gold-plating area 13 and are also substantially distributed in a ring shape, and of course, the gold-plating pads 15 are also distributed outside the gold-plating area 13, and the distribution positions and the shapes are irregular. Since the gold-plated pad15 is irregular in shape, it is difficult to attach the shield using a conventional tape.
Referring to fig. 2 and 3, a layer of adhesive layer is covered on the gold-plating pad15 in a printing mode, the adhesive layer is high-temperature resistant and can be stripped, then tin spraying surface treatment is carried out, and the adhesive layer can be stripped after the tin spraying surface treatment is finished, so that the gold-plating pad15 in an irregular shape can be combined with the tin spraying surface treatment, and the operation is simple, convenient and fast.
In order to enable the glue layer to effectively cover the gold-plating pad15, the periphery of the printed glue layer protrudes out of the periphery of the gold-plating pad15, the protruding size range is 0.5mm-1mm, the thickness range of the glue layer is 0.5mm, the adopted glue layer is peelable blue glue, the peelable blue glue is printed on the gold-plating pad15 in a screen printing mode, the gold-plating pad15 is prevented from being influenced in the tin-spraying surface treatment process, the peelable blue glue has good toughness and flexibility, the peeling operation is simple and easy, and no residual materials or pollution materials are left on the surface of the material.
The process of forming the paste layer of the gold-plated pad15 will be described below.
Step 1: drawing a film aiming at the irregular-shaped gold-plated pad15, wherein the design windowing of the film is 0.5-1mm larger than that of the single side of the gold-plated pad 15;
step 2: the glue layer printing net special for manufacturing the film is suitable for printing a glue layer on the gold-plated pad, and comprises a net body, wherein after the film is exposed, a mesh hole matched with the gold-plated pad15 in shape is formed in the net body, and the opening size of the mesh hole is 0.5-1mm larger than the shape size of the gold-plated pad 15;
and step 3: adopting the glue layer printing net to print a layer of high-temperature resistant peelable blue glue with the thickness of 0.5mm on the gold-plating pad15 of the printed circuit board, and printing the glue layer printing net on the gold-plating pad15 through a silk-screen printing process;
and 4, step 4: baking at 120 ℃ and 150 ℃ for 30min respectively, and then carrying out tin spraying surface treatment, wherein the retention time from the completion of plate baking to the tin spraying surface treatment is controlled to be not more than half an hour.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.
Claims (6)
1. The utility model provides a printed circuit board that selectivity gilding and hot air solder leveling combine, package rubbing board body, the plate body is divided into a plurality of base plates, is equipped with the circuit layer on each base plate respectively, be equipped with gilding region and hot air solder leveling surface treatment area on the circuit layer, gilding regional distribution is located in the hot air solder leveling surface treatment area, its characterized in that: and the tin spraying surface treatment area is also internally distributed with irregular-shaped gold-plating pads, and the gold-plating pads are printed with a high-temperature-resistant strippable glue layer.
2. The printed circuit board of claim 1, wherein: the edge of the adhesive layer protrudes outwards from the edge of the gold-plated pad, and the protruding range is 0.5mm-1 mm.
3. The printed circuit board combining selective gold plating and tin spraying according to claim 1 or 2, wherein: the thickness range of the glue layer is 0.4mm-0.6 mm.
4. The printed circuit board of claim 3, wherein: the glue layer is peelable blue glue.
5. An adhesive printing screen for printing the adhesive layer of the gold-plated pad of any one of claims 1 to 4, wherein: comprises a net body, wherein the net body is provided with a mesh hole matched with the gold-plated pad in shape.
6. The flexographic printing screen of claim 5, wherein: the opening size of the mesh is 0.5mm-1mm larger than the shape size of the gold-plated pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921371858.3U CN210928153U (en) | 2019-08-22 | 2019-08-22 | Printed circuit board and glue layer printing screen combining selective gold plating and tin spraying |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921371858.3U CN210928153U (en) | 2019-08-22 | 2019-08-22 | Printed circuit board and glue layer printing screen combining selective gold plating and tin spraying |
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| Publication Number | Publication Date |
|---|---|
| CN210928153U true CN210928153U (en) | 2020-07-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921371858.3U Active CN210928153U (en) | 2019-08-22 | 2019-08-22 | Printed circuit board and glue layer printing screen combining selective gold plating and tin spraying |
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| CN (1) | CN210928153U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112235961A (en) * | 2020-10-14 | 2021-01-15 | 大连崇达电路有限公司 | Manufacturing method for improving tin coating on gold surface of blue rubber plate |
-
2019
- 2019-08-22 CN CN201921371858.3U patent/CN210928153U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112235961A (en) * | 2020-10-14 | 2021-01-15 | 大连崇达电路有限公司 | Manufacturing method for improving tin coating on gold surface of blue rubber plate |
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