CN210901234U - Quick cooling system of syrup - Google Patents
Quick cooling system of syrup Download PDFInfo
- Publication number
- CN210901234U CN210901234U CN201920853618.0U CN201920853618U CN210901234U CN 210901234 U CN210901234 U CN 210901234U CN 201920853618 U CN201920853618 U CN 201920853618U CN 210901234 U CN210901234 U CN 210901234U
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- Prior art keywords
- cooling
- syrup
- wall
- machine body
- cooling pipe
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- Expired - Fee Related
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- 238000001816 cooling Methods 0.000 title claims abstract description 177
- 239000006188 syrup Substances 0.000 title claims abstract description 61
- 235000020357 syrup Nutrition 0.000 title claims abstract description 60
- 239000000110 cooling liquid Substances 0.000 claims abstract description 29
- 239000004065 semiconductor Substances 0.000 claims description 31
- 239000000919 ceramic Substances 0.000 claims description 22
- 239000002002 slurry Substances 0.000 claims description 12
- 102100035645 Biogenesis of lysosome-related organelles complex 1 subunit 1 Human genes 0.000 claims description 3
- 101100326171 Homo sapiens BLOC1S1 gene Proteins 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 abstract description 8
- 239000002826 coolant Substances 0.000 abstract description 7
- 125000004122 cyclic group Chemical group 0.000 abstract description 3
- 238000005057 refrigeration Methods 0.000 description 15
- 238000010586 diagram Methods 0.000 description 4
- 238000004378 air conditioning Methods 0.000 description 3
- 235000009508 confectionery Nutrition 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000012907 honey Nutrition 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000011897 real-time detection Methods 0.000 description 1
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model provides a syrup rapid cooling system, which comprises a machine body, a syrup pouring opening, a cooling chamber, a console, a bracket, a first circulating cooling pipe, a cooling cavity, a first electromagnetic valve, a syrup outlet, a cooling wall, a base, a second circulating cooling pipe, a placing frame, a cooling liquid box, a second electromagnetic valve and a rotary cover, wherein the cooling chamber is fixed on the inner side surface of the machine body through a bolt and is positioned on one side of the first circulating cooling pipe; the first circulating cooling pipe is fixed on the inner side wall of the machine body through screws; the cooling wall is fixed at the inner bottom of the machine body through screws, the other end of the cooling wall is communicated with one end of a second circulating cooling pipe, and the second circulating cooling pipe is fixed on the other inner side wall of the machine body through screws. The utility model discloses the cooling chamber, the stave, first circulative cooling pipe and second circulative cooling pipe's setting, messenger's syrup cooling that can be fine, and effectual realized can also carry out double cooling to the syrup to the cyclic utilization of coolant liquid, improve the refrigerated speed of syrup.
Description
Technical Field
The utility model belongs to the technical field of cooling device, especially, relate to a quick cooling system of syrup.
Background
The syrup is formed by adding water and acid to cook for a period of time and at a suitable temperature for cooling, since the syrup is thicker when cooled than when hot. Therefore, if the thick consistency is thinner than honey during boiling, the thick syrup becomes thicker after cooling, so that the cooling step of the syrup is critical.
The invention discloses a cooling device of popping candy production equipment, which is named as CN 203388208U and comprises a base, a rotating shaft, a turntable and at least three cooling pipes; the turntable is arranged on the base through a rotating shaft; all the cooling pipes are uniformly arranged on the turntable along the circumferential direction of the turntable and are arranged along the vertical direction; the cooling pipe comprises a long strip-shaped pipe body, a fixed upper end cover is arranged at the upper end of the pipe body, a lower end cover capable of being opened or closed is arranged at the lower end of the pipe body, a cooling water enclosure is arranged in the pipe wall of the pipe body, a cold water inlet communicated with the cooling water enclosure is arranged on the pipe wall of the lower end of the pipe body, a water outlet communicated with the cooling water enclosure is arranged on the pipe wall of the upper end of the pipe body, and a syrup valve and a carbon dioxide valve communicated with a cavity of the pipe. However, the cooling device of the existing popping candy production equipment has the problems of poor cooling effect, low cooling speed, incapability of recycling cooling liquid and no good use requirement.
Therefore, it is necessary to develop a rapid cooling system for syrup.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a quick cooling system of syrup to there is the cooling effect not good in the cooling device who solves current popping candy production facility, and cooling speed is not fast, can not the used circulation coolant liquid, and does not have the fine problem that satisfies the operation requirement. The quick syrup cooling system comprises a machine body, a syrup pouring port, a cooling chamber, a control console, a support, a first circulating cooling pipe, a cooling cavity, a first electromagnetic valve, a syrup outlet, a cooling wall, a base, a second circulating cooling pipe, a placing frame, a cooling liquid box, a second electromagnetic valve and a rotary cover, wherein the syrup pouring port is fixed at the upper middle part of the machine body through a screw, and the syrup outlet of the syrup pouring port penetrates through the machine body to be positioned in the machine body and behind the first circulating cooling pipe; the cooling chamber is fixed on the inner side surface of the machine body through a bolt and is positioned on one side of the first circulating cooling pipe; the control console is fixed on a bracket through a bolt, and the bracket is arranged on the outer side surface of the machine body through a screw; the first circulating cooling pipe is fixed on the inner side wall of the machine body through a screw, one end of the first circulating cooling pipe is communicated with one end of the cooling wall, and a cooling cavity is formed on the side of the first circulating cooling pipe and above the cooling wall; the first electromagnetic valve is arranged on the slurry outlet through a screw, the slurry outlet is positioned below the machine body, one end of the slurry outlet is communicated with the cooling cavity, and the other end of the slurry outlet is provided with a joint communicated with the outside; the cooling wall is fixed at the inner bottom of the machine body through screws, the other end of the cooling wall is communicated with one end of a second circulating cooling pipe, and the second circulating cooling pipe is fixed on the other inner side wall of the machine body through screws; the two bases are fixed at the bottom of the machine body through bolts respectively, and a placing frame is arranged on the other outer side surface of the machine body through screws; the cooling liquid box is placed on the placing frame, the upper interior of the cooling liquid box is communicated with the other end of the first circulating cooling pipe, and the lower interior of the cooling liquid box is communicated with the other end of the second circulating cooling pipe; the second electromagnetic valve is installed on one end, close to the cooling liquid box, of the second circulating cooling pipe through a screw, wherein a rotary cover is arranged on the upper portion of the cooling liquid box through threads, and cooling liquid can be poured into the cooling liquid box through the rotary cover; the control console comprises a table board, a switch group, a ceramic long sheet, a semiconductor refrigerating sheet, a radiating sheet and a controller, wherein the switch group is installed on the upper portion of the table board through threads, the semiconductor refrigerating sheet, the radiating sheet or the controller are sequentially arranged inside the table board, one side of the semiconductor refrigerating sheet is connected with the ceramic long sheet, and the radiating sheet is fixed at the inner bottom of the table board through screws and located on the other side face of the semiconductor refrigerating sheet; the controller is installed at the inner bottom of the table top through threads and is located on the side portion of the radiating fin.
The controller comprises a rectifier bridge, a fuse, a thermal relay, a driving module, a microprocessor and a signal processing module, wherein the rectifier bridge is connected with an external power supply through a power line, the rectifier bridge is connected with the fuse through a wire, and the fuse is connected with a switch group through a wire; the input end of the microprocessor is connected with a signal processing module through a signal wire, and the signal processing module is connected with the non-contact temperature sensor through the signal wire; the output end of the microprocessor is sequentially connected with a thermal relay, a radiating fin or a driving module through a signal wire, wherein the thermal relay is connected with the radiating fin and a first electromagnetic valve through the signal wire, and the first electromagnetic valve is connected with a second electromagnetic valve in parallel through a lead; the driving module is connected with the small fan through a signal wire; the rectifier bridge adopts 24V rectifier stacks of which the model is KBPC1010 plastic package, the fuse adopts a low-voltage fuse of which the model is RT14, the thermal relay adopts a model of NR2 and parameters of 25G/Z13A-25A, the driving module adopts a model of L298N, and the microprocessor adopts a model of AT89S51-24PU, so that alternating current can be effectively converted into required direct current, the use requirement can be better met, the selected model has low power consumption and cost, the work is stable and reliable, and the information receiving and processing speed is high.
The cooling chamber comprises a non-contact temperature sensor, a chamber body, a small fan and air holes, wherein the non-contact temperature sensor is fixed below the side of the chamber body through threads, the selected type is MEMS, and the sensing part is downward; the inner upper wall of the chamber body is provided with a small fan through a bolt, a ceramic long sheet is arranged below the small fan, and the small fan adopts a Saiyi FC-24V hanging type mute fan; the air holes are located below the ceramic long sheet and are six in number, the air holes are sequentially formed in the bottom wall of the chamber body, the air cooling transmitted by wind power can be used for cooling the cooling cavity through the air holes, and therefore syrup can be cooled better.
The cold end of the semiconductor refrigeration piece is contacted with one end of the ceramic long piece, and the other end of the ceramic long piece sequentially penetrates through the table board, the machine body and the chamber body, is arranged in the chamber body and is positioned below the small fan; the hot end of the semiconductor refrigeration piece is in contact with the radiating fin, the semiconductor refrigeration piece is TEC1-12718 in model number, the radiating fin is 7109DG in model number, the semiconductor refrigeration process is adopted, the generated cold air is transmitted to the cooling chamber through good ceramic conductivity, and therefore syrup is cooled more effectively.
The cooling wall comprises a wall body, a wall chamber, a first interface and a second interface, wherein the wall body forms the wall chamber inside; the first interface is arranged on the lower side surface of the wall body through a screw and communicated with the first circulating cooling pipe; the second interface passes through the screw and establishes another downside at the wall body, and the second interface communicates with each other with second circulative cooling pipe, and wherein the stave, first circulative cooling pipe and second circulative cooling pipe all adopt stainless steel material to make, and the effectual cyclic utilization who has realized the coolant liquid, and can carry out dual cooling to the syrup, improve the refrigerated speed of syrup, satisfy the needs of use, the conductivity can be good, resistant use.
Compared with the prior art, the utility model discloses following beneficial effect has:
1. the utility model discloses the cooling to the cooling chamber is realized passing through the bleeder vent to the air conditioning that can utilize wind-force to come the transmission to the setting of cooling chamber to better messenger's syrup cooling utilizes the temperature distribution of the measurement cooling intracavity temperature field that selected non-contact type temperature sensor can be fine, alright with the decision continuation or stop the cooling to the syrup.
2. The utility model discloses the cooling wall, the setting of first circulative cooling pipe and second circulative cooling pipe, the effectual cyclic utilization who has realized the coolant liquid, and can carry out dual cooling to the syrup, improve syrup refrigerated speed, satisfy the needs that use, the conductivity can be good, resistant use.
3. The utility model discloses the setting of semiconductor refrigeration piece and fin adopts semiconductor refrigeration technology and passes through the good conductibility of pottery, transmits the air conditioning that produces to the cooling chamber to realize the cooling to the syrup more effectively, and the adoption of fin not only carries out the heat dissipation to the hot junction of semiconductor refrigeration piece and handles, can also dispel the heat to the inside sealed environment of control cabinet.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic structural view of the cooling chamber of the present invention.
Fig. 3 is a schematic structural diagram of the console of the present invention.
Fig. 4 is a schematic structural view of the stave of the present invention.
Fig. 5 is a schematic diagram of the circuit connection of the semiconductor refrigeration chip of the present invention.
Fig. 6 is a schematic structural diagram of the working principle of the present invention.
In the figure:
1-machine body, 2-syrup pouring port, 3-cooling chamber, 31-non-contact temperature sensor, 32-chamber body, 33-small fan, 34-air hole, 4-control table, 41-table surface, 42-switch group, 43-ceramic long sheet, 44-semiconductor refrigeration sheet, 45-heat dissipation sheet, 46-controller, 461-rectifier bridge, 462-fuse, 463-thermal relay, 464-drive module, 465-microprocessor, 466-signal processing module, 5-bracket, 6-first circulating cooling pipe, 7-cooling cavity, 8-first electromagnetic valve, 9-slurry outlet, 10-cooling wall, 101-wall body, 102-wall chamber, 103-first interface, 104-second interface, 11-base, 12-second circulating cooling pipe, 13-placing rack, 14-cooling liquid box, 15-second electromagnetic valve and 16-rotary cover.
Detailed Description
The invention is further described below with reference to the accompanying drawings:
example (b):
as shown in figures 1 to 6
The utility model provides a quick cooling system for syrup, which comprises a machine body 1, a syrup pouring port 2, a cooling chamber 3, a control console 4, a support 5, a first circulating cooling pipe 6, a cooling cavity 7, a first electromagnetic valve 8, a syrup outlet 9, a cooling wall 10, a base 11, a second circulating cooling pipe 12, a placing rack 13, a cooling liquid box 14, a second electromagnetic valve 15 and a rotary cover 16, wherein the syrup pouring port 2 is fixed at the upper middle part of the machine body 1 through screws, and the syrup outlet position of the syrup pouring port 2 passes through the machine body to be positioned inside the machine body 1 and behind the first circulating cooling pipe 6; the cooling chamber 3 is fixed on the inner side surface of the machine body 1 through bolts and is positioned on one side of the first circulating cooling pipe 6; the control console 4 is fixed on a bracket 5 through a bolt, and the bracket 5 is arranged on the outer side surface of the machine body 1 through a screw; the first circulating cooling pipe 6 is fixed on the inner side wall of the machine body 1 through a screw, one end of the first circulating cooling pipe 6 is communicated with one end of the cooling wall 10, and a cooling cavity 7 is formed on the side of the first circulating cooling pipe 6 and above the cooling wall 10; the first electromagnetic valve 8 is arranged on the slurry outlet 9 through a screw, the slurry outlet 9 is positioned below the machine body 1, one end of the slurry outlet 9 is communicated with the cooling cavity 7, and the other end is provided with a joint communicated with the outside; the cooling wall 10 is fixed at the inner bottom of the machine body 1 through screws, the other end of the cooling wall 10 is communicated with one end of a second circulating cooling pipe 12, and the second circulating cooling pipe 12 is fixed at the other inner side wall of the machine body 1 through screws; two bases 11 are arranged and are respectively fixed at the bottom of the machine body 1 through bolts, and a placing frame 13 is arranged on the other outer side surface of the machine body 1 through screws; the cooling liquid box 14 is placed on the placing rack 13, the upper interior of the cooling liquid box 14 is communicated with the other end of the first circulating cooling pipe 6, and the lower interior of the cooling liquid box 14 is communicated with the other end of the second circulating cooling pipe 12; the second electromagnetic valve 15 is installed on one end of the second circulating cooling pipe 12 close to the cooling liquid tank 14 through a screw, wherein a rotary cover 16 is arranged on the upper portion of the cooling liquid tank 14 through threads, and cooling liquid can be poured into the cooling liquid tank 14 through the rotary cover 16; the control console 4 comprises a table board 41, a switch group 42, a ceramic long sheet 43, a semiconductor refrigerating sheet 44, a radiating sheet 45 and a controller 46, wherein the switch group 42 is installed on the upper portion of the table board 41 through threads, the semiconductor refrigerating sheet 44, the radiating sheet 45 or the controller 46 are sequentially arranged inside the table board 41, one side of the semiconductor refrigerating sheet 44 is connected with the ceramic long sheet 43, and the radiating sheet 45 is fixed at the inner bottom of the table board 41 through screws and is positioned on the other side face of the semiconductor refrigerating sheet 44; the controller 46 is mounted on the inner bottom of the table 41 by a screw and is located at the side of the heat sink 45.
The controller 46 includes a rectifier bridge 461, a fuse 462, a thermal relay 463, a driving module 464, a microprocessor 465 and a signal processing module 466, wherein the rectifier bridge 461 is connected with an external power source through a power line, the rectifier bridge 461 is connected with the fuse 462 through a wire, and the fuse 462 is connected with the switch group 42 through a wire; the input end of the microprocessor 465 is connected with a signal processing module 466 through a signal line, and the signal processing module 466 is connected with the non-contact type temperature sensor 31 through a signal line; the output end of the microprocessor 465 is sequentially connected with a thermal relay 463, a heat radiating fin 45 or a driving module 464 through signal lines, wherein the thermal relay 463 is connected with the heat radiating fin 45 and a first electromagnetic valve 8 through the signal lines, and the first electromagnetic valve 8 is connected with a second electromagnetic valve 15 in parallel through a lead; the driving module 464 is connected with the small fan 33 through a signal line; the rectifier bridge 461 adopts a 24V rectifier stack plastic-packaged by KBPC1010, the fuse 462 adopts a low-voltage fuse with the model of RT14, the thermal relay 463 adopts the model of NR2 and the parameters of 25G/Z13A-25A, the drive module 464 adopts the model of L298N, and the microprocessor 465 adopts the model of AT89S51-24PU, so that the alternating current can be effectively converted into the required direct current, the use requirement can be better met, the power consumption and the cost of the selected model are equal, the work is stable and reliable, and the information receiving and processing speed is higher.
The cooling chamber 3 comprises a non-contact temperature sensor 31, a chamber body 32, a small fan 33 and air holes 34, wherein the non-contact temperature sensor 31 is fixed below the side of the chamber body 32 through threads, the selected model is MEMS, and the sensing part is downward; the inner upper wall of the chamber body 32 is provided with a small fan 33 through a bolt, a ceramic long sheet 43 is arranged below the small fan 33, and the small fan 33 adopts a Saiyi FC-24V hanging type mute fan; the air holes 34 are positioned below the ceramic long sheet 43, six air holes 34 are sequentially arranged on the bottom wall of the chamber body 32, and the cooling of the cooling cavity 7 can be realized by the aid of the air force to enable the cooling air transmitted through the air holes 34 to be better cooled, and the selected non-contact temperature sensor 31 can be used for well measuring the temperature distribution of the temperature field in the cooling cavity 7, so that the cooling of syrup can be continued or stopped.
The cold end of the semiconductor refrigeration sheet 44 is contacted with one end of the ceramic long sheet 43, and the other end of the ceramic long sheet 43 sequentially passes through the table board 41, the machine body 1 and the chamber body 32, is arranged in the chamber body 32, and is positioned below the small fan 33; the hot end of the semiconductor refrigeration piece 44 is in contact with the cooling fin 45, wherein the semiconductor refrigeration piece 44 is TEC1-12718 in model, the cooling fin 45 is 7109DG in model, the semiconductor refrigeration process is adopted, the generated cold air is transmitted to the cooling chamber 3 through good ceramic conductivity, and therefore syrup is cooled more effectively, the cooling fin 45 is used for not only conducting heat dissipation treatment on the hot end of the semiconductor refrigeration piece 44, but also conducting heat dissipation on the sealed environment inside the console 4, and the service life of a series of electrical appliances is prolonged.
The stave 10 comprises a wall body 101, a wall chamber 102, a first interface 103 and a second interface 104, wherein the wall chamber 102 is formed inside the wall body 101; the first interface 103 is arranged on the lower side surface of the wall body 101 through a screw, and the first interface 103 is communicated with the first circulating cooling pipe 6; the second interface 104 is arranged on the other lower side surface of the wall body 101 through a screw, and the second interface 104 is communicated with the second circulating cooling pipe 12, wherein the cooling wall 10, the first circulating cooling pipe 6 and the second circulating cooling pipe 12 are all made of stainless steel materials, the recycling of cooling liquid is effectively realized, syrup can be cooled in a double mode, the cooling speed of the syrup is improved, the use requirement is met, the conduction performance is good, and the use is durable.
Principle of operation
The utility model discloses in, the staff at first inserts the circular telegram of external power source through the plug, then will need refrigerated syrup to pour into to cooling chamber 7 in through syrup pouring opening 2, pour the coolant liquid into cooling liquid box 14 in, the back semiconductor refrigeration piece 44 just begins work after the circular telegram, the cold junction can be conducted air conditioning to cooling chamber 3 in through ceramic long piece 43, then under the cooperation of little fan 33 and bleeder vent 34, the air cooling in cooling chamber 7 will be cooled off, thereby carry out the first heavy cooling to the syrup, the heat that the hot junction distributed out can be dispelled the heat to it by fin 45, the overheated phenomenon that leads to the damage can not appear. Then open second solenoid valve 15 through switch group 42, the coolant liquid can flow into second circulative cooling pipe 12 this moment, in stave 10 and the second circulative cooling pipe 12, realize the second cooling to the syrup, utilize the very considerable speed that improves the syrup cooling of dual cooling, and the setting of its structure can also the circulated use coolant liquid, non-contact type temperature sensor 31 can real-time detection cooling chamber 7 in the temperature, thereby realize continuing or stopping cooling the syrup, after the syrup cooling reaches suitable degree, the staff can open first solenoid valve 8 through switch group 42 again, pack the syrup after will cooling into suitable appearance the inside through play thick liquid mouth 9, accomplish the work flow.
Utilize technical scheme, or technical personnel in the field are in the utility model discloses under technical scheme's the inspiration, design similar technical scheme, and reach above-mentioned technological effect, all fall into the utility model discloses a protection scope.
Claims (5)
1. Syrup quick cooling system, its characterized in that: the syrup cooling machine comprises a machine body (1), a syrup pouring port (2), a cooling chamber (3), a control console (4), a support (5), a first circulating cooling pipe (6), a cooling cavity (7), a first electromagnetic valve (8), a syrup outlet (9), a cooling wall (10), a base (11), a second circulating cooling pipe (12), a placing frame (13), a cooling liquid box (14), a second electromagnetic valve (15) and a rotary cover (16), wherein the syrup pouring port (2) is fixed in the upper middle of the machine body (1) through screws, and the syrup outlet of the syrup pouring port (2) penetrates through the machine body to be located inside the machine body (1) and is located behind the first circulating cooling pipe (6); the cooling chamber (3) is fixed on the inner side surface of the machine body (1) through a bolt and is positioned on one side of the first circulating cooling pipe (6); the control console (4) is fixed on a bracket (5) through a bolt, and the bracket (5) is arranged on the outer side surface of the machine body (1) through a screw; the first circulating cooling pipe (6) is fixed on the inner side wall of the machine body (1) through screws, one end of the first circulating cooling pipe (6) is communicated with one end of the cooling wall (10), and a cooling cavity (7) is formed on the side of the first circulating cooling pipe (6) and above the cooling wall (10); the first electromagnetic valve (8) is installed on the slurry outlet (9) through a screw, the slurry outlet (9) is positioned below the machine body (1), one end of the slurry outlet (9) is communicated with the cooling cavity (7), and the other end of the slurry outlet is provided with a joint communicated with the outside; the cooling wall (10) is fixed at the inner bottom of the machine body (1) through screws, the other end of the cooling wall (10) is communicated with one end of a second circulating cooling pipe (12), and the second circulating cooling pipe (12) is fixed on the other inner side wall of the machine body (1) through screws; two bases (11) are arranged and are respectively fixed at the bottom of the machine body (1) through bolts, and a placing rack (13) is arranged on the other outer side surface of the machine body (1) through screws; the cooling liquid box (14) is placed on the placing rack (13), the upper interior of the cooling liquid box (14) is communicated with the other end of the first circulating cooling pipe (6), and the lower interior of the cooling liquid box is communicated with the other end of the second circulating cooling pipe (12); the second electromagnetic valve (15) is installed on one end, close to the cooling liquid tank (14), of the second circulating cooling pipe (12) through screws, wherein a rotary cover (16) is arranged on the upper portion of the cooling liquid tank (14) through threads, and cooling liquid can be poured into the cooling liquid tank (14) through the rotary cover (16); the control console (4) comprises a console surface (41), a switch group (42), a ceramic long sheet (43), a semiconductor refrigerating sheet (44), a radiating sheet (45) and a controller (46), wherein the switch group (42) is installed on the upper portion of the console surface (41) through threads, the semiconductor refrigerating sheet (44), the radiating sheet (45) or the controller (46) are sequentially arranged inside the console surface (41), one side of the semiconductor refrigerating sheet (44) is connected with the ceramic long sheet (43), and the radiating sheet (45) is fixed at the inner bottom of the console surface (41) through screws and located on the other side face of the semiconductor refrigerating sheet (44); the controller (46) is installed at the inner bottom of the table top (41) through threads and is positioned at the side part of the radiating fin (45).
2. The syrup quick cooling system of claim 1 wherein: the controller (46) comprises a rectifier bridge (461), a fuse (462), a thermal relay (463), a driving module (464), a microprocessor (465) and a signal processing module (466), wherein the rectifier bridge (461) is connected with an external power supply through a power line, the rectifier bridge (461) is connected with the fuse (462) through a lead, and the fuse (462) is connected with the switch group (42) through a lead; the input end of the microprocessor (465) is connected with a signal processing module (466) through a signal line, and the signal processing module (466) is connected with the non-contact type temperature sensor (31) through the signal line; the output end of the microprocessor (465) is sequentially connected with a thermal relay (463), a radiating fin (45) or a driving module (464) through signal lines, wherein the thermal relay (463) is connected with the radiating fin (45) and a first electromagnetic valve (8) through the signal lines, and the first electromagnetic valve (8) is connected with a second electromagnetic valve (15) in parallel through a lead; the driving module (464) is connected with the small fan (33) through a signal line; the rectifier bridge (461) adopts a 24V rectifier stack plastic-packaged by KBPC1010, the fuse (462) adopts a low-voltage fuse with the model of RT14, the thermal relay (463) adopts the model of NR2 and the parameters of 25G/Z13A-25A, the driving module (464) adopts the model of L298N, and the microprocessor (465) adopts the model of AT89S51-24 PU.
3. The syrup quick cooling system of claim 1 wherein: the cooling chamber (3) comprises a non-contact temperature sensor (31), a chamber body (32), a small fan (33) and air holes (34), wherein the non-contact temperature sensor (31) is fixed below the side of the chamber body (32) through threads, the selected type is MEMS, and a sensing part is downward; the inner upper wall of the chamber body (32) is provided with a small fan (33) through a bolt, a ceramic long sheet (43) is arranged below the small fan (33), and the small fan (33) adopts a Saiyi FC-24V hanging type mute fan; the air holes (34) are positioned below the ceramic long sheet (43), and the number of the air holes (34) is six, and the air holes are sequentially arranged on the bottom wall of the chamber body (32).
4. The syrup quick cooling system of claim 1 wherein: the cold end of the semiconductor refrigerating sheet (44) is in contact with one end of the ceramic long sheet (43), the other end of the ceramic long sheet (43) sequentially penetrates through the table board (41), the machine body (1) and the chamber body (32), and the semiconductor refrigerating sheet is arranged inside the chamber body (32) and is positioned below the small fan (33); the hot end of the semiconductor refrigerating piece (44) is in contact with the radiating fin (45), wherein the semiconductor refrigerating piece (44) adopts a type of TEC1-12718, and the radiating fin (45) adopts a type of 7109 DG.
5. The syrup quick cooling system of claim 1 wherein: the cooling wall (10) comprises a wall body (101), a wall chamber (102), a first interface (103) and a second interface (104), wherein the wall body (101) internally forms the wall chamber (102); the first interface (103) is arranged on the lower side surface of the wall body (101) through a screw, and the first interface (103) is communicated with the first circulating cooling pipe (6); the second interface (104) is arranged on the other lower side surface of the wall body (101) through a screw, the second interface (104) is communicated with the second circulating cooling pipe (12), and the cooling wall (10), the first circulating cooling pipe (6) and the second circulating cooling pipe (12) are all made of stainless steel materials.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920853618.0U CN210901234U (en) | 2019-06-06 | 2019-06-06 | Quick cooling system of syrup |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920853618.0U CN210901234U (en) | 2019-06-06 | 2019-06-06 | Quick cooling system of syrup |
Publications (1)
Publication Number | Publication Date |
---|---|
CN210901234U true CN210901234U (en) | 2020-07-03 |
Family
ID=71359448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201920853618.0U Expired - Fee Related CN210901234U (en) | 2019-06-06 | 2019-06-06 | Quick cooling system of syrup |
Country Status (1)
Country | Link |
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CN (1) | CN210901234U (en) |
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2019
- 2019-06-06 CN CN201920853618.0U patent/CN210901234U/en not_active Expired - Fee Related
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