CN210893477U

CN210893477U - Subminiature temperature measurement sensor

Info

Publication number: CN210893477U
Application number: CN201922358699.XU
Authority: CN
Inventors: 林杰; 姚锦华; 程春松; 徐才林; 陈勇; 童华辉; 张磊; 林智炳
Original assignee: Fujian Cecc Electric Power Technology Co ltd; Putian Power Supply Co of State Grid Fujian Electric Power Co Ltd
Current assignee: Fujian Cecc Electric Power Technology Co ltd; Putian Power Supply Co of State Grid Fujian Electric Power Co Ltd
Priority date: 2019-12-25
Filing date: 2019-12-25
Publication date: 2020-06-30
Anticipated expiration: 2029-12-25

Abstract

The utility model relates to the technical field of electronics, in particular to subminiature temperature measurement sensor, through setting up radio frequency antenna circuit and main control circuit electricity and being connected, realize the sending and receiving of data, can transmit the temperature data received to the temperature detection circuit through setting up the main control circuit, when the system needs to detect the temperature, the voltage that can detect is converted into the temperature value through the temperature detection circuit, stores in the chip of main control circuit to realize the on-line monitoring to the junction position temperature; the subminiature temperature sensor designed by the scheme has a simple circuit structure, and can greatly reduce the space of a PCB (printed Circuit Board) when the subminiature PCB is packaged, thereby being beneficial to realizing the miniaturization of the temperature sensor.

Description

Subminiature temperature measurement sensor

Technical Field

The utility model relates to the field of electronic technology, in particular to subminiature temperature sensor.

Background

The potential fault of over-temperature rise of the contact parts of the electrical equipment caused by factors such as material aging, poor contact, current overload and the like needs to be monitored on line. In the prior art, a built-in battery is mostly adopted for supplying power to realize wireless monitoring, or a surface acoustic wave technology is adopted for carrying out passive wireless online temperature detection. The wireless passive temperature measurement sensor generally comprises an LDO conversion circuit, an MCU main control circuit and a radio frequency module circuit, wherein the LDO conversion circuit is mainly processed in a voltage reduction mode, the radio frequency module circuit adopts a whole integrated module with MCU main control, and the MCU main control circuit adopts a common low-power consumption MCU processing program.

With the above circuit configuration, there are several problems: the LDO conversion circuit is processed in a voltage reduction mode, so that the whole system can be driven to operate only by a large input voltage signal, and the whole machine product is large in size; the radio frequency module circuit and the MCU master control circuit are added together to use two MCU singlechips, so that the programming is complex, the occupied volume is large, and the miniaturization cannot be realized. Some MCUs with radio frequency functions are adopted as main control units in the market, but the types and the sizes of most MCUs are large, peripheral circuits are complex, the whole size needs to be large, the MCUs cannot be installed on small movable contacts, and the use range is limited.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model aims to solve the technical problems that: a subminiature temperature sensor is provided.

In order to solve the technical problem, the utility model discloses a technical scheme be:

a subminiature temperature measurement sensor comprises a temperature detection circuit, a master control circuit, a voltage conversion circuit, a filtering energy storage circuit and a radio frequency antenna circuit;

the main control circuit is respectively electrically connected with the temperature detection circuit, the voltage conversion circuit and the radio frequency antenna circuit, and the voltage conversion circuit is electrically connected with the filtering energy storage circuit.

Further, the filtering energy storage circuit comprises a capacitor C6, a capacitor C9, a capacitor C10, a capacitor C11, a capacitor C12, a capacitor C13, a diode D1, a diode D3 and a magnetic induction coil L1;

one end of the magnetic induction coil L1 is electrically connected to the cathode of the diode D1 and the anode of the diode D3, the cathode of the diode D3 is electrically connected to one end of the capacitor C6, one end of the capacitor C9, one end of the capacitor C10, one end of the capacitor C11 and one end of the capacitor C12, the other end of the magnetic induction coil L1 is electrically connected to the anode of the diode D1, the other end of the capacitor C6 and one end of the capacitor C13, and the other end of the capacitor C13, the other end of the capacitor C9, the other end of the capacitor C10, the other end of the capacitor C11 and the other end of the capacitor C12 are all grounded.

Further, the voltage conversion circuit comprises a chip U1, a chip U2, a resistor R1, a resistor R2, a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4, a capacitor C5, a capacitor C7, a capacitor C8, a capacitor C14, an inductor L1 and a diode D2;

the chip U1 includes a first pin, a second pin, a third pin and a fourth pin, the chip U2 includes a first pin, a second pin and a third pin, the first pin of the chip U1 is respectively electrically connected with one end of the capacitor C7, one end of the capacitor C8 and one end of the inductor L1, the other end of the inductor L1 is respectively electrically connected with one end of the capacitor C1, one end of the capacitor C2, one end of the capacitor C3, one end of the capacitor C4 and one end of the capacitor C5, the third pin of the chip U1 is respectively electrically connected with one end of the resistor R1, one end of the resistor R2 and one end of the capacitor C14, the fourth pin of the chip U1 is respectively electrically connected with the third pin of the chip U2 and the cathode of the diode D2, the other end of the resistor R1 is electrically connected with the first pin of the chip U2, the anode of the diode D2, the second pin of the chip U2 and the anode of the diode D2 are electrically connected with the cathode, The other end of the capacitor C14, the second pin of the chip U1, the other end of the capacitor C7, the other end of the capacitor C8, the other end of the capacitor C1, the other end of the capacitor C2, the other end of the capacitor C3, the other end of the capacitor C4 and the other end of the capacitor C5 are all grounded.

Further, the temperature detection circuit comprises a chip U3, a resistor R3, a resistor R4 and a capacitor C18, wherein the chip U3 comprises a first pin, a second pin, a third pin, a fourth pin and a fifth pin;

the first pin of the chip U3 is electrically connected with one end of the resistor R4, the fourth pin of the chip U3 is electrically connected with one end of the capacitor C18, and the second pin of the chip U3, the third pin of the chip U3 and the other end of the capacitor C18 are all grounded.

Further, the main control circuit comprises a chip U4, a resistor R5, a capacitor C22, a capacitor C27, a capacitor C28, a capacitor C29, a capacitor C30, a capacitor C31, a Y capacitor CY1 and a Y capacitor CY 2;

the chip U4 comprises a first pin, a second pin, a third pin, a fourth pin, a fifth pin, a sixth pin, a seventh pin, an eighth pin, a ninth pin, a tenth pin, an eleventh pin and a twelfth pin, the first pin of the chip U4 is electrically connected with one end of the resistor R5 and one end of the capacitor C22, the second pin of the chip U2 is electrically connected with one end of the capacitor C27, the ninth pin of the chip U4 is electrically connected with one end of the capacitor C28 and one end of the Y capacitor CY2, the other end of the Y capacitor CY2 is electrically connected with the tenth pin of the chip U4 and one end of the capacitor C29, the eleventh pin of the chip U4 is electrically connected with one end of the capacitor C30 and the third end of the Y capacitor CY1, the first end of the Y capacitor CY1 is electrically connected with the twelfth pin of the chip U4 and one end of the capacitor C31, the other end of the capacitor C22, the other end of the capacitor C27, the other end of the capacitor C28, the other end of the capacitor C29, the other end of the capacitor C30, the second end of the Y capacitor CY1, the fourth end of the Y capacitor CY1 and the other end of the capacitor C31 are all grounded.

Further, the radio frequency antenna circuit comprises a capacitor C19, a capacitor C20, a capacitor C21, a capacitor C23, a capacitor C24, a capacitor C25, a capacitor C26, a capacitor C32, an inductor L3, an inductor L4, an inductor L5, an inductor L6, an inductor L7 and an antenna A1;

one end of the inductor L4 is electrically connected to one end of the inductor L3 and one end of the capacitor C20 respectively, the other end of the inductor L4 is electrically connected to one end of the capacitor C26 and one end of the inductor L7 respectively, the other end of the capacitor C20 is electrically connected with one end of the capacitor C23, one end of the inductor L5 and the other end of the inductor L7 respectively, the other end of the inductor L5 is electrically connected to one end of the capacitor C24 and one end of the inductor L6 respectively, the other end of the inductor L6 is electrically connected to one end of the capacitor C25 and one end of the capacitor C21 respectively, the other end of the capacitor C21 is electrically connected with one end of the capacitor C32 and the antenna a1 respectively, the other end of the inductor L3 is electrically connected with one end of the capacitor C19, and the other end of the capacitor C19, the other end of the capacitor C26, the other end of the capacitor C23, the other end of the capacitor C24, the other end of the capacitor C25 and the other end of the capacitor C32 are all grounded.

The beneficial effects of the utility model reside in that:

the power taking circuit provides a working power supply for the whole temperature measuring system, so that the normal operation of the whole temperature measuring system is ensured; the temperature measuring circuit can transmit the measured temperature value to the control circuit for analysis and judgment, and transmits the temperature value to the receiving terminal through the radio frequency antenna circuit; the whole temperature measuring system is ensured to be in low-power consumption stable operation by arranging a control circuit; an antenna circuit is arranged to ensure that signals can be transmitted remotely in a wireless manner; the subminiature temperature sensor designed by the scheme has a simple circuit structure, and can greatly reduce the space of a PCB (printed Circuit Board) when the subminiature PCB is packaged, thereby being beneficial to realizing the miniaturization of the temperature sensor.

Drawings

Fig. 1 is a block diagram of an overall circuit module of a subminiature temperature sensor in accordance with the present invention;

fig. 2 is a schematic circuit diagram of a filter tank circuit of a subminiature temperature sensor according to the present invention;

fig. 3 is a schematic circuit diagram of a voltage converting circuit of a subminiature temperature measuring sensor according to the present invention;

fig. 4 is a schematic circuit diagram of a temperature sensing circuit of a subminiature temperature sensor according to the present invention;

fig. 5 is a schematic circuit diagram of a main control circuit of a subminiature temperature sensor according to the present invention;

fig. 6 is a schematic circuit diagram of a radio frequency antenna circuit of a subminiature temperature sensor according to the present invention;

description of reference numerals:

1. a temperature detection circuit; 2. a master control circuit; 3. a voltage conversion circuit; 4. a filtering energy storage circuit; 5. a radio frequency antenna circuit.

Detailed Description

In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.

Referring to fig. 1, the technical solution provided by the present invention is:

From the above description, the beneficial effects of the present invention are:

As can be seen from the above description, the magnetic induction coil L1 is a subminiature induction coil, which induces the current in the high-voltage cable and converts the current into an ac voltage value; the diode D1 is a switch diode and is used for rectifying signals and conducting positive half-wave voltage to the rear end of the circuit, negative half-wave voltage is discharged to the ground, and the capacitor C6 is a filter capacitor and is used for stabilizing and filtering the front-section induction voltage signals; the capacitor C9, the capacitor C10, the capacitor C11 and the capacitor C12 are energy storage capacitors, when a front-end induced voltage signal is too small, the four capacitors, namely the capacitor C9, the capacitor C10, the capacitor C11 and the capacitor C12, can store energy in a short time and release the energy to a back-end circuit, and therefore the whole circuit can enable the system to work under the condition that primary-side current is small; diode D3 is zener diode, with anterior segment signal clamp voltage 5.6V, prevents to puncture rear end IC chip, plays the guard action.

From the above description, the chip U2 is a voltage comparator, and when the current voltage storage exceeds 4.2V, the first pin of the chip U2 outputs high level; the chip U1 is a linear voltage stabilization chip, when the third pin of the chip U1 inputs a high level, the first pin of the chip U1 outputs a VCC voltage of 3.3V, and the VCC voltage is supplied to the whole system for working; the capacitor C1, the capacitor C2, the capacitor C3, the capacitor C4, the capacitor C5, the capacitor C7 and the capacitor C8 are filter capacitors and play a role in voltage stabilization.

From the above description, the capacitor C18 filters the voltage entering the chip U3, protects the chip U3, and the chip U3 is a temperature sensor digital chip, and is connected to the single chip microcomputer of the main control circuit through an I2C serial bus, and transmits the detected temperature data to the single chip microcomputer for analysis.

From the above description, the chip U4 is a master control single chip, and the resistor R5 and the capacitor C22 form a reset circuit, which is used for automatically resetting the single chip to restart when the master control single chip is halted; the chip U4 can be 4 × 4mm ultra-small packaged MCU, and has radio frequency wireless function, less peripheral circuits and greatly reduced space.

From the above description, the inductor L5, the capacitor C24, the inductor L6, the capacitor C25, the inductor L3, the capacitor C19, the inductor L7, and the capacitor C26 respectively form an LC filter for filtering radio frequency signals, the inductor L4 is used for preventing higher harmonics generated by oscillation from interfering with a power supply, a pin of a chip is protected, and the capacitor C23 is a low filter capacitor and plays a role in protecting signal stability.

Referring to fig. 1 to 6, a first embodiment of the present invention is:

referring to fig. 1, a subminiature temperature sensor includes a temperature detection circuit 1, a main control circuit 2, a voltage conversion circuit 3, a filtering energy storage circuit 4 and a radio frequency antenna circuit 5;

the main control circuit 2 is respectively electrically connected with the temperature detection circuit 1, the voltage conversion circuit 3 and the radio frequency antenna circuit 5, and the voltage conversion circuit 3 is electrically connected with the filtering energy storage circuit 4.

Referring to fig. 2, the filtering and energy storing circuit 4 includes a capacitor C6 (with a capacitance of 470nF), a capacitor C9 (with a capacitance of 22uF), a capacitor C10 (with a capacitance of 22uF), a capacitor C11 (with a capacitance of 22uF), a capacitor C12 (with a capacitance of 100nF), a capacitor C13 (with a capacitance of 470nF), a diode D1 (with a model of BAV99), a diode D3 (with a model of BZX384-C5V6), and a magnetic induction coil L1 (with a model of inverter);

Referring to fig. 3, the voltage conversion circuit 3 includes a chip U1 (model XC6504), a chip U2 (model SSP61CC4202MR), a resistor R1 (resistance 1M Ω), a resistor R2 (resistance 1M Ω), a capacitor C1 (capacitance 100nF, package 0402), a capacitor C2 (capacitance 1nF, package 0402), a capacitor C3 (capacitance 100nF, package 0402), a capacitor C4 (capacitance 100nF, package 0402), a capacitor C5 (capacitance 22uF, package 0603), a capacitor C7 (capacitance 1nF, package 0402), a capacitor C8 (capacitance 100nF, package 0402), a capacitor C14 (capacitance 100nF, package 0402), an inductor L1 (model BLM18HE152SN1), and a diode D2 (model BZX 384-C5V-6);

Referring to fig. 4, the temperature detecting circuit 1 includes a chip U3 (model number is TMP102), a resistor R3, a resistor R4 and a capacitor C18 (capacitance value is 100nF, package is 0402), the chip U3 includes a first pin, a second pin, a third pin, a fourth pin and a fifth pin;

Referring to fig. 5, the main control circuit 2 includes a chip U4 (model No. CC1310F64RSM), a resistor R5 (resistance 100K Ω, package No. 0402), a capacitor C22 (capacitance 100nF, package No. 0402), a capacitor C27 (capacitance 1uF, package No. 0402), a capacitor C28 (capacitance 12pF, package No. 0402), a capacitor C29 (capacitance 12pF, package No. 0402), a capacitor C30 (capacitance 5.6pF, package No. 0402), a capacitor C31 (capacitance 5.6pF, package No. 0402), a Y capacitor CY1 and a Y capacitor CY 2;

Referring to fig. 6, the rf antenna circuit 5 includes a capacitor C19 (with a capacitance of 330pF, 0402), a capacitor C20 (with a capacitance of 8.2pF, 0402), a capacitor C21 (with a capacitance of 330pF, 0402), a capacitor C23 (with a capacitance of 4.7pF, 0402), a capacitor C24 (with a capacitance of 12pF, 0402), a capacitor C25 (with a capacitance of 4.7pF, 0402), a capacitor C26 (with a capacitance of 8.2pF, 0402), a capacitor C32, an inductor L3 (with an inductance of 15nH, 0402), an inductor L4 (with an inductance of 33nH, 0402), an inductor L5 (with an inductance of 20nH, 0402), an inductor L6 (with an inductance of 20nH, an inductor L7 (with an inductance of 15nH, an inductor L2) and an antenna of 1, and a frequency of 59433);

Referring to fig. 1 to 6, the working principle of the subminiature temperature measuring sensor is as follows:

the magnetic induction coil L1 is a microminiature induction coil which induces the current in the high-voltage cable and converts the current into an alternating voltage value; the diode D1 is a switch diode and is used for rectifying signals and conducting positive half-wave voltage to the rear end of the circuit, negative half-wave voltage is discharged to the ground, and the capacitor C6 is a filter capacitor and is used for stabilizing and filtering the front-section induction voltage signals; the capacitor C9, the capacitor C10, the capacitor C11 and the capacitor C12 are energy storage capacitors, when a front-end induced voltage signal is too small, the four capacitors, namely the capacitor C9, the capacitor C10, the capacitor C11 and the capacitor C12, can store energy in a short time and release the energy to a back-end circuit, and therefore the whole circuit can enable the system to work under the condition that primary-side current is small; diode D3 is zener diode, with anterior segment signal clamp voltage 5.6V, prevents to puncture rear end IC chip, plays the guard action.

The chip U2 is a voltage comparator, and when the storage of the current terminal voltage exceeds 4.2V, the first pin of the chip U2 outputs high level; the chip U1 is a linear voltage stabilization chip, when the third pin of the chip U1 inputs a high level, the first pin of the chip U1 outputs a VCC voltage of 3.3V, and the VCC voltage is supplied to the whole system for working; the capacitor C1, the capacitor C2, the capacitor C3, the capacitor C4, the capacitor C5, the capacitor C7 and the capacitor C8 are filter capacitors and play a role in voltage stabilization.

The chip U3 is a temperature sensor digital chip, is connected with the singlechip of the main control circuit 2 through an I2C serial bus, and transmits the detected temperature data to the singlechip for analysis.

The chip U4 is a master control singlechip, and the resistor R5 and the capacitor C22 form a reset circuit which is used for automatically resetting the singlechip and restarting when the master control singlechip is halted; the chip U4 can be 4 × 4mm ultra-small packaged MCU, and has radio frequency wireless function, less peripheral circuits and greatly reduced space.

The chip U4 (master control single chip) of the master control circuit 2 has a radio frequency function, so that the required radio frequency peripheral circuit is simpler; the radio frequency wireless circuit is a 433MHz wireless communication module circuit, in FIG. 6, RX/TX, RF _ P and RF _ N are respectively connected with RX/TX pin, RF _ P pin and RF _ N pin of chip U4, when RX/TX pin of chip U4 is high level, RF _ P pin of chip U4 and RF _ N pin of chip U4 send data to outside; when RX _ TX of the chip U4 is low, RF _ P pin of the chip U4 and RF _ N pin of the chip U4 receive data transmitted from the outside.

In summary, the utility model provides a subminiature temperature sensor, through setting up radio frequency antenna circuit and main control circuit electricity and being connected, realize the sending and receiving of data, can transmit the temperature data received to the temperature detection circuit through setting up the main control circuit, when the system needs to detect the temperature, the accessible temperature detection circuit converts the voltage that detects into the temperature value, stores in the chip of main control circuit to realize the on-line monitoring to the position temperature of junction; the subminiature temperature sensor designed by the scheme has a simple circuit structure, and can greatly reduce the space of a PCB (printed Circuit Board) when the subminiature PCB is packaged, thereby being beneficial to realizing the miniaturization of the temperature sensor.

The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.

Claims

1. A subminiature temperature measurement sensor is characterized by comprising a temperature detection circuit, a master control circuit, a voltage conversion circuit, a filtering energy storage circuit and a radio frequency antenna circuit;

2. The subminiature thermometric sensor of claim 1, wherein the filter tank circuit comprises capacitor C6, capacitor C9, capacitor C10, capacitor C11, capacitor C12, capacitor C13, diode D1, diode D3, and magnetic coil L1;

3. The subminiature thermometric sensor of claim 1, wherein the voltage conversion circuitry comprises chip U1, chip U2, resistor R1, resistor R2, capacitor C1, capacitor C2, capacitor C3, capacitor C4, capacitor C5, capacitor C7, capacitor C8, capacitor C14, inductor L1, and diode D2;

4. The subminiature thermometric sensor of claim 1, wherein the temperature sensing circuit comprises a chip U3, a resistor R3, a resistor R4, and a capacitor C18, the chip U3 comprising a first pin, a second pin, a third pin, a fourth pin, and a fifth pin;

5. The subminiature thermometric sensor of claim 1, wherein the master control circuit comprises a chip U4, a resistor R5, a capacitor C22, a capacitor C27, a capacitor C28, a capacitor C29, a capacitor C30, a capacitor C31, a Y capacitor CY1, and a Y capacitor CY 2;

6. The subminiature thermometric sensor of claim 1, wherein the radio frequency antenna circuit comprises a capacitor C19, a capacitor C20, a capacitor C21, a capacitor C23, a capacitor C24, a capacitor C25, a capacitor C26, a capacitor C32, an inductor L3, an inductor L4, an inductor L5, an inductor L6, an inductor L7, and an antenna a 1;