CN210892850U

CN210892850U - Heat transfer element

Info

Publication number: CN210892850U
Application number: CN201921795311.6U
Authority: CN
Inventors: 李锦春
Original assignee: Guiyang Xinhao Optoelectronic Co ltd
Current assignee: Guiyang Xinhao Optoelectronic Co ltd
Priority date: 2019-10-24
Filing date: 2019-10-24
Publication date: 2020-06-30
Anticipated expiration: 2029-10-24

Abstract

The utility model relates to a heat transfer element technical field just discloses a heat transfer element, including the mounting panel, the fixed welding in bottom of mounting panel has the fixed plate. This heat transfer element, have the interception board of semicircle shape through the bottom fixed mounting at the fixed plate, this arrangement of interception board, can make hot-air contact with one side of semicircle interception board on the one hand, on the other hand hot-air can also contact with the fixed plate at semicircle interception board top, just so can guarantee that hot-air and heat conduction element's area of contact is bigger, the heat conduction effect of bringing is higher, can not lead to the loss of some heat, the energy consumption has been practiced thrift, 90 settings through semicircle interception board and fixed plate, make and form two vortex regions between semicircle interception board and the fixed plate, these two vortex regions can be disturbed through hot-air motion state, thereby make the air current can carry out the drunkenness between these two vortex regions, make the heat of hot-air can be longer with the contact time between the heat transfer element.

Description

Heat transfer element

Technical Field

The utility model relates to a heat transfer element technical field specifically is a heat transfer element.

Background

The heat transfer elements commonly used in the prior art are generally divided into two types, one is a rod-shaped heat conduction fin, and the other is a sheet-shaped heat conduction fin.

The heat conduction fins are arranged inside the large-scale conversion device for utilizing waste heat, are rod-shaped, are in contact with hot air through one end, and are in contact with media through the other end, so that the effect of heating the media is achieved, but the area of the rod-shaped heat conduction fins in contact with the hot air is too small, the flow speed of the hot air in a pipeline is very high, the contact time of the hot air and the heat conduction fins is too short, the energy can not be fully utilized, and the waste of a large amount of waste heat is caused.

SUMMERY OF THE UTILITY MODEL

The utility model provides a not enough to prior art, the utility model provides a heat transfer element, it is higher to possess the semicircle interception board increase with the area of contact heat conduction efficiency of hot-air, the semicircle interception board has guaranteed with the fixed plate that the turbulent flow district forms the advantage that the hot gas flow lingers time extension effectively guarantees heat conduction efficiency, the area undersize of current heat conduction fin and hot-air contact has been solved, and the velocity of flow of hot-air in the pipeline is very fast, just so make the time of hot-air and heat conduction fin contact too short, the make full use of the energy can't be accomplished, the problem of the waste of a large amount of waste heat has been caused.

The utility model provides a following technical scheme: the utility model provides a heat transfer element, includes the mounting panel, the fixed welding in bottom of mounting panel has the fixed plate, the fixed welding in middle section of fixed plate bottom has semicircle interception board, the top fixed mounting of mounting panel has the heat conduction post, the outer fixed welding along of heat conduction post has heat conduction fin.

Preferably, the mounting plate and the fixing plate are both circular in shape, and the diameter of the mounting plate is 3cm larger than that of the fixing plate.

Preferably, the semicircular interception plate is half circular in shape.

Preferably, the number of the heat conduction columns is eighteen, and the eighteen heat conduction columns are located at the top of the mounting plate and distributed in a circular shape.

Compared with the prior art, the utility model discloses possess following beneficial effect:

1. this heat transfer element through the intercepting board of the bottom fixed mounting at the fixed plate of semicircle shape, this intercepting board's setting can make hot-air contact with one side of semicircle intercepting board on the one hand, and on the other hand hot-air can also contact with the fixed plate at semicircle intercepting board top, just so can guarantee that hot-air and heat conduction element's area of contact is bigger, and the heat conduction effect of bringing is higher, can not lead to some thermal loss, has practiced thrift the energy consumption.

2. This heat transfer element blocks 90 settings of board and fixed plate through the semicircle for semicircle blocks and forms two vortex regions between board and the fixed plate, and these two vortex regions can be disturbed through hot-air motion state, thereby make the air current can carry out the drunkenness between these two vortex regions, make the heat of hot-air can be longer with the contact time between the heat conduction component, thereby guaranteed heat transfer element's heat transfer efficiency.

Drawings

FIG. 1 is a schematic front view of the present invention;

FIG. 2 is a side view of the structure of the present invention;

fig. 3 is a top view of the present invention.

In the figure: 1. mounting a plate; 2. a fixing plate; 3. a semicircular interception plate; 4. a heat-conducting column; 5. a heat conductive fin.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, a heat transfer element comprises a mounting plate 1, wherein the mounting plate 1 and a fixing plate 2 are both circular, the diameter of the mounting plate 1 is 3cm larger than the diameter of the fixing plate 2, the mounting plate 1 and the fixing plate 2 are both circular, and the mounting plate 1 and the fixing plate 2 can be fixed inside strange marks in a matched manner, so that the mounting plate 1 and the fixing plate 2 can be fixed inside the heat transfer element in a clamped manner by the arrangement that the diameter of the mounting plate 1 is 3cm larger than the diameter of the fixing plate 2, the mounting plate 1 and the fixing plate 2 can be clamped inside the heat transfer element to form a fixed state, the fixed stability is guaranteed, the stability of the heat transfer element in work is better, the fixing plate 2 is fixedly welded at the bottom of the mounting plate 1, a semicircular interception plate 3 is fixedly welded at the middle section of the bottom of the fixing plate 2, the semicircular interception plate 3 is half circular, and, the semicircular interception plate 3 can also have the effect of increasing the contact area with hot air on the basis of ensuring the hot air to pass through, so that the hot air is transferred to the semicircular interception plate 3, the heat transfer is more thorough, and the arrangement of the semicircular interception plate 3 can cause the hot air flow to be disturbed, so that the air flow can leap at two sides of the semicircular interception plate 3, the time for the hot air flow to stay at two sides of the semicircular interception plate 3 is longer, the stay time of the hot air flow can be ensured, the heat can be fully transferred, the heat can not be lost, heat-conducting columns 4 are fixedly arranged at the top of the mounting plate 1, the number of the heat-conducting columns 4 is eighteen, the eighteen heat-conducting columns 4 are circularly distributed at the top of the mounting plate 1, and the heat-conducting columns 4 can provide better heat-conducting effect through the eighteen arrangement of the heat-conducting columns 4, like this more high-efficient in the heating, can not cause thermal a large amount of losses yet, the setting that the top that eighteen heat conduction post 4 are located mounting panel 1 is circular distribution is in order to satisfy mounting panel 1's shape in addition, and the outer fixed welding of edge of heat conduction post 4 has heat conduction fin 5.

The theory of operation, when this device work, only need to pass through fixed plate 2 with this heat transfer component and fix the inside at the device, make one side of this semicircle interception board 3 towards the pipeline, like this when hot-air circulation in the pipeline, semicircle interception board 3 just can intercept hot-air, guarantee contact area and contact time between hot-air and the semicircle interception board 3, thereby thermal transmission has been guaranteed, the heat passes into heat conduction post 4 through fixed plate 2 and mounting panel 1 afterwards, realize the heat leading-in medium through heat conduction fin 5 above the heat conduction post 4 at last, can.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A heat transfer element comprising a mounting plate (1), characterized in that: the fixed welding in bottom of mounting panel (1) has fixed plate (2), the fixed welding in middle section of fixed plate (2) bottom has semicircle interception board (3), the top fixed mounting of mounting panel (1) has heat conduction post (4), the outer fixed welding of following of heat conduction post (4) has heat conduction fin (5).

2. A heat transfer element as recited in claim 1 wherein: the mounting plate (1) and the fixing plate (2) are both circular in shape, and the diameter of the mounting plate (1) is 3cm larger than that of the fixing plate (2).

3. A heat transfer element as recited in claim 1 wherein: the semicircular interception plate (3) is in a semicircular shape.

4. A heat transfer element as recited in claim 1 wherein: the number of the heat conduction columns (4) is eighteen, and the eighteen heat conduction columns (4) are located at the top of the mounting plate (1) and are distributed in a circular shape.