CN210862782U

CN210862782U - Semiconductor device's testing arrangement

Info

Publication number: CN210862782U
Application number: CN201922218912.7U
Authority: CN
Inventors: 昝佳琳
Original assignee: Heilongjiang Chenyuan Energy Technology Co ltd
Current assignee: Heilongjiang Chenyuan Energy Technology Co ltd
Priority date: 2019-12-11
Filing date: 2019-12-11
Publication date: 2020-06-26
Anticipated expiration: 2029-12-11

Abstract

The utility model relates to a semiconductor device tests technical field, and discloses a semiconductor device's testing arrangement, include: the testing device comprises a testing main body, a waterproof testing bin, a high-temperature testing bin and supporting legs, wherein the testing main body is a rectangular hollow box body, the waterproof testing bin and the high-temperature testing bin are arranged in the testing main body, a water storage tank is fixedly arranged on the lower wall surface outside the testing main body, slide ways are respectively arranged on the upper wall surface and the lower wall surface of the testing main body, and the slideway above the testing main body penetrates through the wall surface above the testing main body, two fixed plates are arranged inside the testing main body, and the front wall surface and the rear wall surface inside the testing main body are respectively fixedly provided with a heating wire, this semiconductor device's testing arrangement through being provided with waterproof test storehouse and high temperature test storehouse simultaneously in a test main part, makes semiconductor device's waterproof test and high temperature test can go on in same device, need not to go again to prepare a plurality of testing arrangement, has saved and has carried out the time that removes semiconductor device, has increased efficiency of software testing.

Description

Semiconductor device's testing arrangement

Technical Field

The utility model relates to a semiconductor device tests technical field, specifically is a semiconductor device's testing arrangement.

Background

Semiconductor devices are electronic devices that have electrical conductivity between a good electrical conductor and an insulator, and that use the special electrical properties of semiconductor materials to perform specific functions, and can be used to generate, control, receive, convert, amplify signals, and perform energy conversion. In order to ensure that the semiconductor device can be normally used after being produced, a series of tests need to be carried out on the semiconductor device, wherein the tests comprise a waterproof test and a semiconductor device working state test under a high-temperature environment, the conventional waterproof test and the high-temperature test of the semiconductor device generally use different test devices, when the waterproof test and the high-temperature test are carried out on the semiconductor device, a plurality of test devices need to be prepared, and when the semiconductor device is subjected to different tests, the semiconductor device needs to be removed and replaced by the test devices, so that the test workload and the test time are increased, and the test efficiency is reduced.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a semiconductor device's testing arrangement, possess advantages such as semiconductor device waterproof and high temperature test integration, solved semiconductor material and carried out waterproof and high temperature test and need prepare a plurality of testing arrangement, increased the problem of the work load of test.

(II) technical scheme

For realizing above-mentioned waterproof and high temperature test integration purpose of semiconductor device, the utility model provides a following technical scheme: a test apparatus for a semiconductor device, comprising: the testing device comprises a testing main body, a waterproof testing bin, a high-temperature testing bin and supporting legs, wherein the testing main body is a rectangular hollow box body, the hollow part of the testing main body penetrates through the left side wall surface of the testing main body, the left side of the testing main body is provided with a movable door, the movable door is a square flat plate, the length and the width of the movable door are the same as those of the left side wall surface of the testing main body, the upper frame and the lower frame of the left side wall surface of the testing main body are respectively provided with a bayonet, the right side wall surface of the movable door is fixedly provided with two convex blocks, the positions of the two convex blocks on the movable door respectively correspond to the positions of the two bayonets, the testing main body is internally provided with the waterproof testing bin and the high-temperature testing bin, the waterproof testing bin is positioned on the left side of the high, the upper wall surface and the lower wall surface inside the test main body are respectively fixedly provided with a clamping plate, the clamping plate is positioned behind the baffle plate, the front wall surface and the rear wall surface of the test main body are respectively provided with a water spraying bin, the two water spraying bins are respectively used for preventing the front side and the rear side of the test bin from being affected by water, the water spraying bin is communicated with the waterproof test bin through the five water spraying ports, the wall surface below the outer part of the test main body is fixedly provided with a water storage tank, the water storage tank is a rectangular hollow tank body and is positioned below the waterproof test bin, the right side wall surface of the water storage tank is provided with a circular hole, the right side of the water storage tank is provided with a water pump, a water pumping port of the water pump is fixedly arranged inside the circular hole on the right side of the water storage tank, a water, the water mist cutting net is formed by intersecting eleven transverse cutting blades and eight vertical cutting blades, a mist outlet formed by intersecting the cutting blades is communicated with a waterproof test bin, two rotating bearings are fixedly mounted above a test main body and correspond to each other left and right, a screw is movably mounted on the two rotating bearings and penetrates through a left rotating bearing, the screw is a cylinder with threads formed in one side surface, a manual turntable is fixedly mounted on the left wall surface of the screw, the manual turntable is controlled to drive the screw to rotate, the upper wall surface and the lower wall surface of the test main body are respectively provided with a slide way, the slide way above the test main body penetrates through the upper wall surface of the test main body, two moving blocks are arranged on the inner side of the upper slide way, each moving block is a cuboid, circular holes are formed in the moving blocks, the circular holes in the moving blocks penetrate through the left wall surface and the right, the screw rod is in threaded connection with the inner wall of the circular hole of the moving block, two fixed plates are arranged in the test main body, the fixed plates are rectangular flat plates and correspond to each other up and down, the left side surfaces and the right side surfaces of the upper fixed plate and the lower fixed plate are respectively connected through a fixed column, the upper wall surface of the upper fixed plate is fixedly connected with the lower wall surfaces of the two moving blocks, a slide block is fixedly installed on the lower wall surface of the lower fixed plate and is clamped in the lower slideway, the adjacent wall surfaces of the two fixed plates are respectively provided with a chute, a tension plate is fixedly installed in the chute and is positioned in the middle of the chute, the tension plate is a rectangular flat plate, the length and the height of the tension plate are the same as the width and the height of the inner wall of the chute, tension columns are respectively and fixedly installed on the left side and the right side surfaces of the tension, and the heating wire is located the baffle right side, and the round hole has been seted up to test subject right side wall, and test subject outside right side wall fixed mounting blast fan, and the blast fan and test subject right side round hole left and right sides correspond, test subject right side wall fixed mounting heating wire, four stabilizer blades of test subject below wall fixed mounting.

Preferably, the two lugs on the movable door are clamped into the bayonets, so that the movable door is fixedly connected with the test main body.

Preferably, the clamping plate consists of a left rectangular flat plate and a right rectangular flat plate.

Preferably, the baffle inserts the back from the rectangle hole in test subject the place ahead, can pass through splint, and is fixed with the baffle through splint, when the baffle inserted the test subject, can separate waterproof test bin and high temperature test bin.

Preferably, the water pump pumps out the clean water from the water storage tank, the water pump pressurizes the clean water and then sends the pressurized clean water into the water spraying bin at a high speed, and the clean water entering the water spraying bin at a high speed is sprayed into the waterproof test bin from five water spraying ports at a high speed.

Preferably, the water sprayed out at high speed in the water spraying bin is cut into water mist through the water mist cutting net, and the water mist enters the waterproof test bin from the water spraying port.

(III) advantageous effects

Compared with the prior art, the utility model provides a semiconductor device's testing arrangement possesses following beneficial effect:

1. this semiconductor device's testing arrangement through being provided with waterproof test storehouse and high temperature test storehouse simultaneously in a test main part, makes semiconductor device's waterproof test and high temperature test can go on in same device, need not to go again to prepare a plurality of testing arrangement, has saved the time of removing semiconductor device simultaneously, has increased efficiency of software testing.

2. This semiconductor device's testing arrangement, through be provided with waterproof test storehouse and high temperature test storehouse simultaneously in a test main part, after semiconductor device has carried out waterproof test, the semiconductor device surface can be attached to have the drop of water, remove semiconductor device to the high temperature test storehouse this moment, heater strip in the high temperature test storehouse can produce the state of high temperature test semiconductor device under high temperature environment, the high temperature that electric heating wire produced simultaneously can evaporate semiconductor surface attached drop of water, the stoving function after the waterproof test of semiconductor device has been realized.

3. This semiconductor device's testing arrangement, be provided with the blower fan through high temperature heating storehouse side, blower fan left side is provided with electric heating wire, when semiconductor device tests in high temperature test storehouse, the air current that the blower fan blew out becomes hot-blast through the heating wire, the hot-blast temperature rising in having accelerated the high temperature test storehouse that blew out, semiconductor device does waterproof test simultaneously and makes the vapor that adnexed water is heated the evaporation and forms can be blown away by the hot gas flow, it falls down to have avoided the condensation of vapor to become the globule in high temperature test storehouse top gathering again, adhere to on the semiconductor device surface once more.

4. This semiconductor device's testing arrangement through set up the screw rod above testing the main part, and semiconductor device fixing device top sets up the movable block, screw rod and movable block threaded connection, has realized rotating the screw rod and has driven semiconductor device and remove, has avoided when semiconductor device removes the high temperature test storehouse from waterproof test storehouse, the operation that need take out semiconductor device, and has avoided using the motor, has reduced the test work step and has reduced the consumption.

5. This semiconductor device's testing arrangement through being provided with water smoke cutting mesh, uses the high-speed rivers that the water pump was taken out to pass through water smoke cutting mesh, and rivers are cut into the water smoke, and the area that the water smoke is scattered is bigger lets the position of semiconductor device waterproof test more comprehensive.

Drawings

FIG. 1 is a front view of a testing apparatus for semiconductor devices;

FIG. 2 is a front sectional view of a testing apparatus for semiconductor devices;

FIG. 3 is a top view of a semiconductor device testing apparatus;

FIG. 4 is a left side sectional view of the testing apparatus for semiconductor devices;

FIG. 5 is a right side view of the testing apparatus for semiconductor devices;

FIG. 6 is an enlarged view of a water mist cutting net;

FIG. 7 is an enlarged view of portion A in FIG. two;

fig. 8 is an enlarged view of the portion B in fig. two.

In the figure: the device comprises a test main body 1, a waterproof test cabin 2, a high-temperature test cabin 3, a water storage tank 4, a support leg 5, a blowing fan 6, a water pump 7, a water pipe 8, a water spraying cabin 9, a manual rotating disc 10, a rotating bearing 11, a screw rod 12, a slideway 13, a movable block 14, a baffle plate 15, a bayonet 16, a fixed plate 17, a sliding chute 18, a clamping block 19, a fixed column 20, a sliding block 21, a clamping plate 22, a water spraying opening 23, a heating wire 24, a water mist cutting net 25, a vertical cutting piece 251, a transverse cutting piece 252, a mist outlet 253, a movable door 26, a tension column 27 and a tension plate 28.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 to 8, an apparatus for testing a semiconductor device includes: the testing device comprises a testing main body 1, a waterproof testing bin 2, a high-temperature testing bin 3 and support legs 5, wherein the testing main body 1 is a rectangular hollow box body, the hollow part of the testing main body 1 penetrates through the left side wall surface of the testing main body 1, the left side of the testing main body 1 is provided with a movable door 26, the movable door 26 is a square flat plate, the length and the width of the movable door 26 are the same as the length and the width of the left side wall surface of the testing main body 1, the upper frame and the lower frame of the left side wall surface of the testing main body 1 are respectively provided with a bayonet 16, the right side wall surface of the movable door 26 is fixedly provided with two convex blocks, the positions of the two convex blocks on the movable door 26 are respectively corresponding to the positions of the two bayonet 16, the movable door 26 is fixedly connected with the testing main body 1 by clamping the two convex blocks on the movable door 26 into the bayonet 16, the waterproof testing bin 2, the length of a square hole in the front of the test main body 1 is the same as the height of the wall in the front of the test main body 1, a baffle plate 15 is movably arranged at the inner side of a relief hole in the front of the test main body 1, the upper wall surface and the lower wall surface in the test main body 1 are respectively fixedly provided with a clamping plate 22, the clamping plate 22 is composed of a left rectangular flat plate and a right rectangular flat plate, the clamping plate 22 is positioned behind the baffle plate 15, the baffle plate 15 is inserted into the rectangular hole in the front of the test main body 1 and then passes through the clamping plate 22, the baffle plate 15 is fixed through the clamping plate 22, when the baffle plate 15 is inserted into the test main body 1, the waterproof test bin 2 is separated from the high-temperature test bin 3, the front wall surface and the rear wall surface of the test main body 1 are respectively provided with water spraying bins 9, the two water spraying bins 9 are respectively arranged at the front side and, the water storage tank 4 is fixedly installed on the wall surface below the outer portion of the test main body 1, the water storage tank 4 is a rectangular hollow box body, the water storage tank 4 is located below the waterproof test bin 2, a round hole is formed in the wall surface on the right side of the water storage tank 4, the water pump 7 is arranged on the right side of the water storage tank 4, a water pumping port of the water pump 7 is fixedly installed on the inner side of the round hole on the right side of the water storage tank 4, a water pipe 8 is fixedly installed at a water outlet on the right side of the water pump 7, the water outlet of the water pump 7 is respectively communicated with the front water spraying bin and the rear water spraying bin 9 through the water pipe 8, the water pump 7 pumps out clean water from the water storage tank 4, the water pump 7 is pressurized and then sends the pressurized water into the water spraying bins 9, the clean water entering the water spraying bins 9 at a high speed is sprayed into the waterproof test, and the cutting piece crosses the fog outlet 253 formed and communicates with waterproof test storehouse 2, when the water flow of high-speed water spurting in the water spray storehouse 9 will be cut into water mist through the water mist cutting net 25, the water mist enters the waterproof test storehouse 2 from the water spray 23, the upper side of the test body 1 is fixedly provided with two rotating bearings 11, and the two rotating bearings 11 correspond to each other from left to right, two rotating bearings 11 are movably provided with screw rods 12, and the screw rods 12 pass through the left rotating bearing 11, the screw rod 12 is a cylinder with a thread on one side, the left side wall of the screw rod 12 is fixedly provided with a manual rotary table 10, the upper and lower wall surfaces of the test body 1 are respectively provided with slideways 13 by operating the manual rotary table 10 to drive the screw rods 12 to rotate, and the slideway 13 above the test body 1 penetrates through the upper wall surface of the test body 1, the inner side of the slideway 13 is provided with two, the round hole on the moving block 14 penetrates through the left and right wall surfaces of the moving block 14, threads are arranged on the inner side of the round hole on the moving block 14, the screw rods 12 respectively penetrate through the round holes on the two moving blocks 14, the screw rods 12 are in threaded connection with the inner walls of the round holes on the moving block 14, the two moving blocks 14 are driven to move leftwards or rightwards simultaneously through forward transmission or reverse rotation of the screw rods 12, two fixing plates 17 are arranged inside the test main body 1, the fixing plates 17 are rectangular flat plates, the two fixing plates 17 correspond to each other up and down, the left and right side surfaces of the upper and lower fixing plates 17 are respectively connected through fixing columns 20, the upper wall surface of the upper fixing plate 17 is fixedly connected with the lower wall surfaces of the two moving blocks 14, a sliding block 21 is fixedly arranged on the lower wall surface of the lower fixing plate 17, the sliding, the two fixing plates 17 are respectively provided with a sliding groove 18 on the adjacent wall surfaces, a tension plate 28 is fixedly arranged in the sliding groove 18, the tension plate 28 is positioned in the middle of the sliding groove 18, the tension plate 28 is a rectangular flat plate, the length and the height of the tension plate 28 are the same as the width and the height of the inner wall of the sliding groove 18, tension columns 27 are respectively and fixedly arranged on the left side and the right side of the tension plate 28, the tension column 27 is a cylinder with elasticity, clamping blocks 19 are respectively and fixedly arranged at the tail ends of the left tension column 27 and the right tension column 27, a semiconductor device is placed between the upper fixing plate 17 and the lower fixing plate 17, the semiconductor device is clamped and fixed by the upper tension column 27 and the lower tension column 27, electric heating wires 24 are respectively and fixedly arranged on the front wall surface and the rear wall surface in the testing main body 1, the electric heating wire 24 is positioned on the right side of the baffle 15, a circular hole is arranged on the right side, the heating wire 24 is fixedly installed on the right side wall surface of the test main body 1, the screw 12 is rotated to drive the semiconductor device fixed in the middle of the fixing plate 17 to move rightwards to enter the high-temperature test chamber 3, the heating wire 24 and the blowing fan 6 are started, the heating wire 24 heats the semiconductor device, the air flow blown out by the blowing fan 6 is changed into hot air through the heating wire 24 on the right side to accelerate the temperature rise in the high-temperature test chamber 3, meanwhile, the semiconductor device is subjected to a waterproof test, so that the vapor formed by the evaporation of the attached water due to heating can be blown away by the hot air flow, the drying effect of the semiconductor device is realized.

When the device is used, the baffle 15 is inserted into the test main body 1, the movable door 26 is opened, the semiconductor device is fixed between the upper fixed block and the lower fixed block, the movable door 26 is closed, the water pump 7 is opened to spray water mist to the semiconductor device, after the waterproof test is finished, the baffle 15 is drawn out, the manual turntable 10 is operated to drive the screw 12 to rotate, the moving block 14 is driven by the screw 12 to move rightwards, so that the semiconductor device is driven to move towards the high-temperature test bin 3, after the semiconductor device moves to the high-temperature test bin 3, the heating wire 24 and the blower fan 6 are started, the heating wire 24 heats the semiconductor device, the air flow blown out by the blower fan 6 is changed into hot air through the right-side heating wire 24 to accelerate the temperature rise in the high-temperature test bin 3, meanwhile, the semiconductor device is subjected to the waterproof test, the attached water vapor evaporated by heating is blown away by, the movable door 26 is opened to take out the semiconductor device.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A test apparatus for a semiconductor device, comprising: test main part (1), waterproof test storehouse (2), high temperature test storehouse (3) and stabilizer blade (5), its characterized in that: the test main body (1) is a rectangular hollow box body, the hollow part of the test main body (1) penetrates through the left side wall surface of the test main body (1), the left side of the test main body (1) is provided with a movable door (26), a waterproof test bin (2) and a high-temperature test bin (3) are arranged inside the test main body (1), the waterproof test bin (2) is positioned on the left side of the high-temperature test bin (3), the front side wall surface of the test main body (1) is provided with a vertical square hole, the length of the square hole in the front of the test main body (1) is the same as the front side wall surface height of the test main body (1), a movable mounting baffle plate (15) at the inner side of a relief hole in the front of the test main body (1) is respectively provided with a water spraying bin (9) on the front and rear wall surfaces of the test main body (1), the two water spraying bins (9) are respectively arranged, the water spraying bin (9) is communicated with the waterproof test bin (2) through a water spraying opening (23), a water storage tank (4) is fixedly installed on the wall surface below the outer portion of the test main body (1), a water mist cutting net (25) is fixedly installed on the inner side wall surface of the water spraying opening (23), two rotating bearings (11) are fixedly installed above the test main body (1), the two rotating bearings (11) correspond to each other in the left-right direction, a screw rod (12) is movably installed on the two rotating bearings (11), the screw rod (12) penetrates through the left rotating bearing (11), a manual rotary table (10) is fixedly installed on the left side wall surface of the screw rod (12), slide ways (13) are respectively arranged on the upper wall surface and the lower wall surface of the test main body (1), the slide way (13) above the test main body (1) penetrates through the upper wall surface of the test main body (1), two movable blocks (14) are arranged on, fixed plate (17) are a rectangle flat board, and correspond about two fixed plate (17), two from top to bottom the side is connected through fixed column (20) respectively about fixed plate (17), wall fixed mounting heating wire (24) respectively around test main part (1) is inside, and heating wire (24) are located baffle (15) right side, and the round hole has been seted up to test main part (1) right side wall, and test main part (1) outside right side wall fixed mounting blast fan (6), and correspond about blast fan (6) and test main part (1) right side round hole, test main part (1) right side wall fixed mounting heating wire (24), four stabilizer blades (5) of test main part (1) below wall fixed mounting.

2. The test apparatus for a semiconductor device according to claim 1, wherein: the movable door (26) is a square flat plate, the length and the height of the movable door (26) are the same as the length and the width of the left side wall surface of the test main body (1), bayonets (16) are respectively formed in the upper frame and the lower frame of the left side wall surface of the test main body (1), two convex blocks are fixedly installed on the right side wall surface of the movable door (26), and the positions of the two convex blocks on the movable door (26) correspond to the positions of the two bayonets (16).

3. The test apparatus for a semiconductor device according to claim 1, wherein: the upper wall surface and the lower wall surface in the test main body (1) are respectively fixedly provided with a clamping plate (22), and the clamping plate (22) is positioned behind the baffle (15).

4. The test apparatus for a semiconductor device according to claim 1, wherein: the water storage tank (4) is a rectangular hollow tank body, the water storage tank (4) is located below the waterproof test bin (2), a circular hole is formed in the right side wall face of the water storage tank (4), and the water pump (7) is arranged on the right side of the water storage tank (4).

5. The apparatus for testing a semiconductor device according to claim 4, wherein: water pump (7) mouth fixed mounting that draws water is inboard at storage water tank (4) right side round hole, and water pump (7) right side delivery port fixed mounting water pipe (8), and water pump (7) delivery port pass through water pipe (8) respectively with two front and back spout water storehouse (9) intercommunication.

6. The test apparatus for a semiconductor device according to claim 1, wherein: the water mist cutting net (25) is formed by mutually crossing a row of transverse cutting pieces (252) and a row of vertical cutting pieces (251), and a mist outlet (253) formed by crossing the cutting pieces is communicated with the waterproof test bin (2).

7. The test apparatus for a semiconductor device according to claim 1, wherein: the moving block (14) is a cuboid, round holes are formed in the moving block (14), the round holes in the moving block (14) penetrate through the left wall surface and the right wall surface of the moving block (14), the screw rods (12) respectively penetrate through the round holes in the two moving blocks (14), and the screw rods (12) are in threaded connection with the inner walls of the round holes in the moving block (14).

8. The test apparatus for a semiconductor device according to claim 1, wherein: the upper wall surface of the upper fixing plate (17) is fixedly connected with the lower wall surfaces of the two moving blocks (14), the lower wall surface of the lower fixing plate (17) is fixedly provided with a sliding block (21), and the sliding block (21) is clamped in the lower slideway (13).

9. The test apparatus for a semiconductor device according to claim 1, wherein: two spout (18) have been seted up respectively to the close wall of fixed plate (17), spout (18) inside fixed mounting pulling force board (28), and pulling force board (28) are located spout (18) middle part, and pulling force board (28) are a rectangle flat board, and pulling force board (28) length and height is the same with spout (18) inner wall width height, and pulling force board (28) left and right sides fixed mounting pulling force post (27) respectively, and pulling force post (27) are a cylinder that has elasticity, controls two pulling force post (27) tail ends fixed mounting clamp splice (19) respectively.