CN210851211U

CN210851211U - Powerful quick cooling device of mould

Info

Publication number: CN210851211U
Application number: CN201921906332.0U
Authority: CN
Inventors: 孟志锋
Original assignee: Zhejiang Digo Mould Technology Co ltd
Current assignee: Zhejiang Digo Mould Technology Co ltd
Priority date: 2019-11-06
Filing date: 2019-11-06
Publication date: 2020-06-26
Anticipated expiration: 2029-11-06

Abstract

The utility model discloses a powerful quick cooling device of mould in the mould cooling technology field, including the upper die base, die holder and refrigerating plant etc, open the switch, external power source provides DC power supply for metal conductor, and the electron is followed the negative pole and is started, at first through P type semiconductor, absorbs the heat, reachs N type semiconductor, emits the heat again, every NP module of forming through N type semiconductor and P type semiconductor, has the heat to be sent to the hot tip by the cold junction, produces the cold source from this, and the heat-conducting piece is used for leading out the produced heat of hot tip rapidly. The cooled water in the lower die base plays a powerful rapid cooling role in the plastic groove. The utility model discloses a cooling device who sets up carries out direct cooling to water, and it is good to lead cold effect, is superior to the circulation through the cooling water and to the indirect cooling effect of work piece.

Description

Powerful quick cooling device of mould

Technical Field

The utility model relates to a mould cooling technology field, concrete field is a powerful quick cooling device of mould.

Background

The plastic mould is a combined mould which can be used for compression moulding, extrusion moulding, injection, blow moulding and low foaming forming, a series of plastic parts with different shapes and sizes can be processed by the coordination change of a mould convex film, a mould concave film and an auxiliary forming system.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a powerful quick cooling device of mould to solve the problem of mentioning in the background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a powerful quick cooling device of mould, includes upper die base and die holder, the inside of die holder is the cavity structure, the lower terminal surface of die holder is connected with refrigerating plant, be provided with inlet tube and outlet pipe on the lateral wall of die holder respectively, be provided with the ooff valve on the outlet pipe, the upper die base with be provided with pneumatic cylinder and guide bar subassembly between the die holder, be equipped with the sprue gate on the upper die base, the up end joint of sprue gate has the pouring flap, be equipped with the handle on the sprue gate lid, the lower extreme of sprue gate is connected with the one end of pouring pipeline, the ware of moulding plastics is installed to the other end of pouring pipeline, the outside of the ware of moulding plastics is equipped with the terrace die, just be located on the die holder with the position department that the terrace die corresponds is equipped.

Preferably, the cooling device comprises a cooling device shell, a partition plate is arranged on the inner side wall of the cooling device shell, the partition plate divides the cooling device shell into an upper refrigerating chamber and a lower heat conducting chamber, a semiconductor refrigerating sheet penetrates through the partition plate and comprises a cold end part and a hot end part, metal conductors are uniformly arranged on the lower surface of the cold end part and the upper surface of the hot end part respectively, an N-type semiconductor and a P-type semiconductor are arranged between the metal conductors on the upper side and the lower side in a staggered manner, a heat conducting piece is arranged on the lower surface of the hot end part, one end of a connecting rod is fixedly connected to each of two ends of the heat conducting piece, the other end of the connecting rod is fixedly connected with the inner side wall of the cooling device shell, a cold conducting piece is arranged on the upper surface of the cold end part, and the upper surface of the cold conducting, the outer side wall of the cooling device shell is provided with a switch, and the switch, the metal conductor and the external power supply are electrically connected.

Preferably, four corners of the lower end surface of the lower die base are fixedly connected with supporting legs.

Compared with the prior art, the beneficial effects of the utility model are that: a powerful rapid cooling device for a mold comprises a cooling device shell, wherein a partition plate is arranged on the inner side wall of the cooling device shell and divides the cooling device shell into an upper refrigerating chamber and a lower heat conducting chamber, a semiconductor refrigerating sheet penetrates through the partition plate and plays a refrigerating role and a direct cooling role for water in a cavity of a lower die holder, the semiconductor refrigerating sheet comprises a cold end part and a hot end part, metal conductors are uniformly arranged on the lower surface of the cold end part and the upper surface of the hot end part respectively, an N-type semiconductor and a P-type semiconductor are arranged between the metal conductors on the upper side and the lower side in a staggered mode, a heat conducting piece is arranged on the lower surface of the hot end part, two ends of the heat conducting piece are fixedly connected with one end of a connecting rod respectively, and the other end of the connecting rod is fixedly connected with the inner side wall of the, the upper surface of the cold end part is provided with a cold guide part, the upper surface of the cold guide part is fixedly connected with the upper wall of the cooling device shell, the outer side wall of the cooling device shell is provided with a switch, the metal conductor and an external power supply are electrically connected, the N-type semiconductor and the P-type semiconductor are common components forming the semiconductor refrigerating sheet, for the prior art, the switch is turned on, the external power supply provides direct current power supply for the metal conductor, electrons from the negative electrode firstly pass through the P-type semiconductor to absorb heat and reach the N-type semiconductor, and then emit the heat, and every time passing through an NP module consisting of the N-type semiconductor and the P-type semiconductor, the heat is sent to the hot end from the cold end, this produces a heat sink, which serves to rapidly dissipate the heat generated by the hot end. The cooled water in the lower die base plays a powerful rapid cooling role in the plastic groove.

The utility model discloses a cooling device who sets up carries out direct cooling to water, and it is good to lead cold effect, is superior to the circulation through the cooling water and to the indirect cooling effect of work piece.

Drawings

FIG. 1 is a sectional view of the main structure of the present invention;

fig. 2 is a sectional view of the refrigerating apparatus of the present invention;

fig. 3 is a front view of the main structure of the present invention.

In the figure: 1-an upper die holder, 2-a lower die holder, 3-a hydraulic cylinder, 4-a guide rod assembly, 5-a pouring gate, 6-a pouring gate cover, 7-a handle, 8-a pouring pipeline, 9-an injection molding device, 10-a male die, 11-a plastic groove, 12-a refrigerating device, 121-a cooling device shell, 122-a partition plate, 123-a refrigerating chamber, 124-a heat conducting chamber, 125-a semiconductor refrigerating sheet, 1251-a cold end, 1252-a hot end, 1253-a metal conductor, 127-a heat conducting piece, 128-a connecting rod, 129-a cold conducting piece, 13-a water inlet pipe, 14-a water outlet pipe and 15-a supporting leg.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The description of the directions (up, down, left, right, front, and back) is made with reference to the structure shown in fig. 1 of the drawings attached to the specification, but the practical direction of the present invention is not limited thereto.

Example (b):

referring to fig. 1-3, the present invention provides a technical solution: referring to fig. 1 and 3, a strong rapid cooling device for a mold comprises an upper mold base 1 and a lower mold base 2, the lower mold base 2 is of a cavity structure, a refrigerating device 12 is connected to the lower end surface of the lower mold base 2, a water inlet pipe 13 and a water outlet pipe 14 are respectively arranged on the side wall of the lower mold base 2, a switch valve is arranged on the water outlet pipe 14, water is injected into the lower mold base 2 through the water inlet pipe 13, the refrigerating device 12 cools the water in the lower mold base 2, a hydraulic cylinder 3 and a guide rod assembly 4 are arranged between the upper mold base 1 and the lower mold base 2, the guide rod assembly 4 is composed of a guide sleeve and a guide rod, the guide sleeve and the guide rod guide the up-and-down displacement of the upper mold base 1, a pouring gate 5 is arranged on the upper mold base 1, a pouring gate cover 6 is clamped on the upper end surface of the pouring gate 5, and a handle 7 is, the lower end of the pouring gate 5 is connected with one end of a pouring pipeline 8, the other end of the pouring pipeline 8 is provided with an injection molding device 9, a male die 10 is arranged outside the injection molding device 9, a plastic groove 11 is arranged on the lower die base 2 and at the position corresponding to the male die 10, the handle 7 is pulled by hand, the pouring port cover 6 is opened, the molten plastic material is injected into the pouring port 5, the molten plastic material enters the injection molding device 9 along the pouring pipeline 8, the injection molding device 9 extrudes the molten plastic material into the plastic groove 11 along the upper injection molding opening, then the hydraulic cylinder 3 works to drive the upper die holder 1 and the male die 10 to move downwards, the male die 10 is punched into the plastic groove 11 to complete the punch forming of the product, and the cooled water in the lower die base 2 plays a powerful rapid cooling role in the plastic groove 11.

Referring to fig. 1, specifically, the cooling device 12 includes a cooling device housing 121, a partition plate 122 is disposed on an inner side wall of the cooling device housing 121, the partition plate 122 partitions the cooling device housing 121 into an upper cooling chamber 123 and a lower heat conducting chamber 124, a semiconductor cooling plate 125 is disposed on the partition plate 122 in a penetrating manner, the semiconductor cooling plate 125 performs a cooling function and directly cools water in a cavity of the lower die holder 2, the semiconductor cooling plate 125 includes a cold end portion 1251 and a hot end portion 1252, metal conductors 1253 are respectively uniformly disposed on a lower surface of the cold end portion 1251 and an upper surface of the hot end portion 1252, N-type semiconductors and P-type semiconductors are alternately disposed between the metal conductors 1253 on upper and lower sides, a heat conducting member 127 is disposed on a lower surface of the hot end portion, two ends of the heat conducting member 127 are respectively and fixedly connected to one end of a connecting rod 128, and the other end of the connecting rod 128 is fixedly connected to the inner side, the upper surface of the cold end part is provided with a cold guide member 129, the upper surface of the cold guide member 129 is fixedly connected with the upper wall of the cooling device shell 121, the outer side wall of the cooling device housing 121 is provided with a switch, the metal conductor 1253 and an external power supply for electrical connection, the N-type semiconductor and the P-type semiconductor are common components constituting the semiconductor cooling plate 125, and in the prior art, the switch is turned on, the external power supply supplies dc power to the metal conductor 1253, electrons from the negative electrode first pass through the P-type semiconductor, absorb heat, reach the N-type semiconductor, and emit heat, and heat is transferred from the cold end 1251 to the hot end 1252 through an NP module composed of the N-type semiconductor and the P-type semiconductor, thereby generating a heat sink, and the heat conductive member 127 is used to rapidly conduct away the heat generated from the hot end portion 1252.

Referring to fig. 1, specifically, four corners of the lower end surface of the lower die base 2 are fixedly connected with support legs 15. The support legs 15 are used for supporting the lower die holder 2 and components attached to the lower die holder 2.

The working principle is as follows: through the hand power handle 7 is opened pouring gate lid 6, to 5 pouring gates pour into the melting plastic material, and the melting plastic material is followed pouring pipe 8 enters into in the ware of moulding plastics 9, the ware of moulding plastics 9 is with the melting plastic material along its mouth of moulding plastics extrusion extremely in the plastic groove 11, then pass through pneumatic cylinder 3 work drives upper die base 1 with terrace die 10 removes downwards, terrace die 10 punching press advances in the plastic groove 11, accomplish product stamping forming, by the water that is cooled in the die holder 2 is right plastic groove 11 plays powerful quick cooling effect. The cooling device 12 comprises a cooling device shell 121, a partition plate 122 is arranged on the inner side wall of the cooling device shell 121, the partition plate 122 divides the cooling device shell 121 into an upper refrigerating chamber 123 and a lower heat conducting chamber 124, a semiconductor refrigerating sheet 125 penetrates through the partition plate 122, the semiconductor refrigerating sheet 125 plays a refrigerating role and plays a direct cooling role for water in the cavity of the lower die holder 2, the semiconductor refrigerating sheet 125 comprises a cold end 1251 and a hot end 1252, metal conductors 1253 are uniformly arranged on the lower surface of the cold end 1251 and the upper surface of the hot end 1252 respectively, an N-type semiconductor and a P-type semiconductor are arranged between the metal conductors 1253 on the upper side and the lower side in a staggered mode, a heat conducting piece 127 is arranged on the lower surface of the hot end, one end of a connecting rod 128 is fixedly connected to each of two ends of the heat conducting piece 127, and the other end of the connecting rod 128 is fixedly connected to the inner, the upper surface of the cold end part is provided with a cold guide member 129, the upper surface of the cold guide member 129 is fixedly connected with the upper wall of the cooling device shell 121, the outer side wall of the cooling device housing 121 is provided with a switch, the metal conductor 1253 and an external power supply for electrical connection, the N-type semiconductor and the P-type semiconductor are common components constituting the semiconductor cooling plate 125, and in the prior art, the switch is turned on, the external power supply supplies dc power to the metal conductor 1253, electrons from the negative electrode first pass through the P-type semiconductor, absorb heat, reach the N-type semiconductor, and emit heat, and heat is transferred from the cold end 1251 to the hot end 1252 through an NP module composed of the N-type semiconductor and the P-type semiconductor, thereby generating a heat sink, and the heat conductive member 127 is used to rapidly conduct away the heat generated from the hot end portion 1252.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "fixed" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The utility model discloses the standard parts that use all can purchase from the market, and dysmorphism piece all can be customized according to the record of the description with the drawing.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a powerful quick cooling device of mould, includes upper die base (1) and die holder (2), its characterized in that: the interior of the lower die holder (2) is of a cavity structure, the lower end surface of the lower die holder (2) is connected with a refrigerating device (12), a water inlet pipe (13) and a water outlet pipe (14) are respectively arranged on the side wall of the lower die holder (2), a switch valve is arranged on the water outlet pipe (14), a hydraulic cylinder (3) and a guide rod component (4) are arranged between the upper die holder (1) and the lower die holder (2), a pouring gate (5) is arranged on the upper die base (1), the upper end surface of the pouring gate (5) is clamped with a pouring gate cover (6), a handle (7) is arranged on the pouring port cover (6), the lower end of the pouring port (5) is connected with one end of a pouring pipeline (8), the other end of the pouring pipeline (8) is provided with an injection molding device (9), a male die (10) is arranged outside the injection molding device (9), and a plastic groove (11) is formed in the lower die base (2) and is positioned at a position corresponding to the male die (10).

2. A mold strong rapid cooling device according to claim 1, characterized in that: the refrigerating device (12) comprises a cooling device shell (121), a partition plate (122) is arranged on the inner side wall of the cooling device shell (121), the partition plate (122) divides the cooling device shell (121) into an upper refrigerating chamber (123) and a lower heat conducting chamber (124), a semiconductor refrigerating sheet (125) penetrates through the partition plate (122), the semiconductor refrigerating sheet (125) comprises a cold end part (1251) and a hot end part (1252), metal conductors (1253) are uniformly arranged on the lower surface of the cold end part (1251) and the upper surface of the hot end part (1252) respectively, N-type semiconductors and P-type semiconductors are arranged between the metal conductors (1253) on the upper side and the lower side in a staggered mode, a heat conducting piece (127) is arranged on the lower surface of the hot end part (1252), one end of a connecting rod (128) is fixedly connected to each of two ends of the heat conducting piece (127), and the other end of the connecting rod (128) is fixedly connected to the inner side wall of, the upper surface of cold end portion (1251) is equipped with leads cold spare (129), the upper surface that leads cold spare (129) with the upper wall fixed connection of cooling device shell (121), the lateral wall of cooling device shell (121) is equipped with the switch, metal conductor (1253) and external power supply electricity are connected.

3. A mold strong rapid cooling device according to claim 1, characterized in that: and four corners of the lower end surface of the lower die holder (2) are fixedly connected with supporting legs (15).