CN210850037U

CN210850037U - Fingerprint module becket dismounting device

Info

Publication number: CN210850037U
Application number: CN201921250320.7U
Authority: CN
Inventors: 蒋忠春
Original assignee: Jiangxi Holitech Technology Co Ltd
Current assignee: Jiangxi Holitech Technology Co Ltd
Priority date: 2019-08-05
Filing date: 2019-08-05
Publication date: 2020-06-26
Anticipated expiration: 2029-08-05

Abstract

The utility model discloses a fingerprint module metal ring dismounting device, which comprises a bottom plate and a fingerprint module, wherein the bottom plate is provided with a supporting block and a heating platform, the upper part of the supporting block is fixed with a quick clamp, and the quick clamp comprises a driving mechanism and a front-end pressure head; a blind hole penetrates through the heating platform and the supporting block, an opening of the blind hole is formed in the lower portion of the bottom plate, a heating tube matched with the blind hole in size is arranged in the blind hole, and the heating tube is connected with an external circuit; the heating platform upper portion is provided with a boss, the size of boss with the becket looks adaptation, just the position of boss with the front end pressure head is corresponding, the fingerprint module set up in on the boss, just the becket with the boss contacts. Through the utility model discloses can comparatively high-efficient, take off the becket safely, have higher economic value and practical value.

Description

Fingerprint module becket dismounting device

Technical Field

The utility model relates to a fingerprint identification technical field especially relates to a dismounting device for dismantling fingerprint module becket.

Background

With the development of scientific technology, electronic products become necessary articles which people are difficult to leave in daily life, and smart phones are used as the most important representatives of electronic products and also used as intelligent terminals to play a great role. At present, basically all mobile phones can only have the function of fingerprint unlocking, the fingerprint unlocking has the advantages of convenience, safety and the like, and the fingerprint unlocking is also widely applied to other intelligent devices and safety devices.

The fingerprint module is as realizing the essential element of fingerprint unblock, and it mainly includes parts such as IC chip, FPC and becket, and in present industrial manufacturing, because bonding error, impedance exceed standard and reason such as customer change becket outward appearance colour, often need dismantle the becket and install again. The existing fingerprint module metal ring is disassembled, generally, the whole fingerprint module is placed on a heating platform, when the temperature reaches the melting point of a metal ring and an FPC adhesive, a nipper is used for clamping the FPC and taking down the fingerprint module, an art designing blade is used for inserting between the FPC and the metal ring, the metal ring is pried, and the metal ring is taken down; according to the method for disassembling the metal ring, the blade can easily scratch an FPC circuit and an IC chip, the whole fingerprint module product is directly scrapped, the fingerprint module product is damaged, the previous process is restarted, and great loss is caused.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a fingerprint module becket dismounting device can solve above-mentioned general dismantlement method to the solid harm problem of fingerprint module, provides one kind and realizes convenient, less to the harm of fingerprint module, and with low costs, easy operation's fingerprint module becket dismounting device.

In order to solve the problems, the invention provides a metal ring dismounting device of a fingerprint module, which comprises a bottom plate and the fingerprint module, wherein the fingerprint module consists of an IC chip, a metal ring and an FPC (flexible printed circuit), a supporting block and a heating platform are arranged on the bottom plate, a quick clamp is fixed on the upper part of the supporting block, the quick clamp comprises a driving mechanism and a front-end pressure head, and the driving mechanism can control the front-end pressure head to move up and down; a blind hole penetrates through the heating platform and the supporting block, an opening of the blind hole is formed in the lower portion of the bottom plate, a heating tube matched with the blind hole in size is arranged in the blind hole, and the heating tube is connected with an external circuit; the heating platform upper portion is provided with a boss, the size of boss with the becket looks adaptation, just the position of boss with the front end pressure head is corresponding, the fingerprint module set up in on the boss, just the becket with the boss contacts.

As preferred scheme, heating platform all make aluminium with the boss, adopt heating platform and the boss of aluminium system can heat conduction faster, heat the fingerprint module and can accelerate to take off the becket.

As a preferred scheme, the heating platform and the supporting block are both fixed on the bottom plate through threaded connection, a plurality of threaded holes are formed in the bottom plate and are matched with corresponding screws on the supporting block and the heating platform, the supporting block and the heating platform can be well fixed through threaded connection, and replacement is facilitated.

Preferably, the external circuit further comprises a thermostat, the thermostat is set at 110 ℃, the metal ring is taken down after being heated for multiple times, the melting point of the FPC adhesive is about 110 ℃, the metal ring is easy to take down, the thermostat is set at 110 ℃, the metal ring and the FPC adhesive can be well heated, and meanwhile, FPC and IC chips can be prevented from being damaged due to overhigh heating temperature.

As a preferable scheme, the diameter of the blind hole is 10-20mm, the blind hole is matched with the size of the heating tube, and the diameter of the conventional heating tube is about 10-20 cm, so that the blind hole is processed into 10-20 cm, and the blind hole can adapt to most heating tube applications.

As preferred scheme, the utility model discloses in still including a thimble device, when the FPC adhesive heats to the melting point, adopt the thimble device can take off the becket fast, and less to the damage of fingerprint module, the thimble device can be fixed in on the device, also can be with independent thimble device application to the work of this device.

The technical scheme has the following beneficial technical effects:

the utility model discloses a dismounting device of integration, the becket device on the convenient to detach fingerprint module, it is more safe to adopt the cutter to insert the method of prying open the becket between becket and the FPC after directly taking off the FPC with tweezers after the fingerprint module heating in comparison with conventional method, can not with FPC and IC chip fish tail, just the utility model discloses a simple structure, the simple operation adopts self-control aluminium system heating platform, and the heat conduction effect is outstanding and high-efficient, and the boss adopts the shape with becket looks adaptation to change in placing, and tool processing low cost has greatly reduced cost of labor and harm risk, has improved the competitiveness of product on market, has higher commercial value and practical value.

Drawings

FIG. 1 is a side view of the fingerprint module metal ring dismounting paper of the present invention;

FIG. 2 is a top view of the fingerprint module metal ring dismounting paper of the present invention;

fig. 3 is a schematic structural view of the thimble device of the present invention;

fig. 4 is a schematic structural diagram of the fingerprint module of the present invention;

description of the labeling: 1. the device comprises a base plate, 2, a supporting block, 3, a rapid clamp, 3.1, a driving mechanism, 3.2, a front-end pressure head, 4, a fingerprint module, 4.1, an IC chip, 4.2, a metal ring, 4.3, an FPC, 5, a boss, 6, a heating platform, 7, a blind hole, 8, a heating tube, 9 and an ejector pin device.

Detailed Description

The invention will be further described with reference to specific embodiments.

The following examples are not provided to limit the scope of the present invention, nor are the steps described to limit the order of execution. The present invention is not limited to the above embodiments, but may be modified in various ways.

As shown in fig. 1, fig. 1 is a schematic side structure diagram of the present invention, the present invention includes a bottom plate 1 disposed at the bottom, the bottom plate 1 is provided with a plurality of threaded holes, a heating platform 6 and the bottom plate 1 are fixed on the bottom plate 1 through threaded connection, a rapid clamp 3 is further fixed on the upper portion of the bottom plate 1, the rapid clamp 3 includes a driving mechanism 3.1 and a front end pressure head 3.2, the driving mechanism 3.1 can control the front end pressure head 3.2 to move up and down in the vertical direction; a boss 5 is arranged on the upper portion of the heating platform 6, the boss 5 and the heating platform 6 are made of aluminum, a blind hole 7 penetrates through the heating platform 6 and the bottom plate 1, the opening of the blind hole 7 is downward, the diameter of the blind hole 7 is 10-20mm, the blind hole 7 is used for installing a heating pipe, the diameter of the heating pipe is slightly smaller than the blind hole 7, the heating pipe is further connected with an external circuit, the external circuit comprises a thermostat, and the set temperature of the thermostat is 110 ℃; the position of boss 5 is corresponding with the position of front end pressure head 3.2, and front end pressure head 3.2 is located the boss 5 directly over promptly, and the becket 4.2 of fingerprint module 4 is fixed in on the boss 5. The device is also provided with a thimble device 9 which is convenient for taking down the metal ring 4.2.

The utility model discloses a theory of operation:

installation: a user fixes a heating platform 6 and a bottom plate 1 which need to be installed on the bottom plate 1 through screws, continues to fix a boss 5 and a quick clamp 3 on the heating platform 6 and the bottom plate 1 through screws respectively, adjusts the position of a front end pressure head 3.2 of the quick clamp 3 to be right above the boss 5, connects a heating tube 8 with an external circuit and a thermostat, sets the temperature of the thermostat to 110 ℃, then places the heating tube 8 into a blind hole 7 which penetrates between the heating platform 6 and the bottom plate 1, places a fingerprint module 4 on the upper part of the boss 5, and fully attaches a metal ring 4.2 to the boss 5;

the work is as follows: the circuit is switched on, the front end pressure head 3.2 of the quick clamp 3 is operated to be pressed down to cover the fingerprint module 4, meanwhile, the heating pipe at the bottom works, heat generated by the heating pipe is directly conducted to the heating platform 6 and the boss 5, then the metal ring 4.2 is heated, the FPC4.3 adhesive covered between the metal ring 4.2 and the FPC4.3 of the fingerprint module 4 begins to melt when being heated, when the temperature rises to 110 ℃, the temperature is controlled by the thermostat, the FPC4.3 adhesive reaches a melting point, the front end pressure head 3.2 is slightly moved, the ejector pin device 9 is used for slightly pushing against the left and right resistance test points of the metal ring 4.2, and the metal ring 4.2 can be separated from the FPC 4.3. After the metal ring 4.2 breaks away from completely, control front end pressure head 3.2 and keep away from boss 5, will take off fingerprint module 4 behind metal ring 4.2 and further take off, place other fingerprint module 4 that need break away from metal ring 4.2 and carry out the same processing, if complete processing, restore front end pressure head 3.2, the cutting off circuit can.

This kind of metal ring 4.2 dismounting device of fingerprint module 4: simple structure, tool processing cost is also lower, the operation is convenient to can be quick dismantle the becket 4.2 get off, through the utility model discloses carry out the processing and handle and can not harm FPC4.3 and IC chip 4.1, greatly reduced manufacturing cost, improved the competitiveness of product on market.

The above description is directed to the specific embodiments of the present invention. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention.

Claims

1. A fingerprint module metal ring dismounting device comprises a bottom plate and a fingerprint module, wherein the fingerprint module consists of an IC chip, a metal ring and an FPC (flexible printed circuit), and is characterized in that a supporting block and a heating platform are arranged on the bottom plate, a quick clamp is fixed at the upper part of the supporting block, and the quick clamp comprises a driving mechanism and a front end pressure head; a blind hole penetrates through the heating platform and the supporting block, an opening of the blind hole is formed in the lower portion of the bottom plate, a heating tube matched with the blind hole in size is arranged in the blind hole, and the heating tube is connected with an external circuit; the heating platform upper portion is provided with a boss, the size of boss with the becket looks adaptation, just the position of boss with the front end pressure head is corresponding, the fingerprint module set up in on the boss, just the becket with the boss contacts.

2. The device for detaching the metal ring of a fingerprint module as claimed in claim 1, wherein the heating platform and the boss are both made of aluminum, and the front press head is made of plastic steel.

3. The fingerprint module metal ring dismounting device according to claim 1, wherein the heating platform and the supporting block are both fixed on the bottom plate through threaded connection.

4. The device for detaching the metal ring of a fingerprint module according to claim 1, wherein the external circuit further comprises a thermostat, and the set temperature of the thermostat is 110 ℃.

5. The fingerprint module metal ring dismounting device according to claim 1, wherein the diameter of said blind hole is 10-20 mm.

6. The device for detaching the metal ring of a fingerprint module as claimed in claim 1, further comprising a pin device.