CN210837233U

CN210837233U - Ultrathin high-speed data transmission line

Info

Publication number: CN210837233U
Application number: CN201922123767.4U
Authority: CN
Inventors: 贾利宾; 胡光祥
Original assignee: Dongguan Kingsignal Electronics Co ltd
Current assignee: Shenzhen Suno Technology Co ltd
Priority date: 2019-12-02
Filing date: 2019-12-02
Publication date: 2020-06-23
Anticipated expiration: 2029-12-02

Abstract

The utility model discloses an ultra-thin high-speed data transmission line, which comprises at least two conducting wires, an upper laminating part and a lower laminating part, wherein the upper laminating part and the lower laminating part are laminated up and down, and the conducting wires are arranged in parallel at intervals and are positioned between the upper laminating part and the lower laminating part; the conductive wire is a flat conductive wire, the upper attaching portion and the lower attaching portion are flat band-shaped composite material bodies, and the upper attaching portion and the lower attaching portion sequentially comprise a shielding layer, a first adhesive layer, an insulating layer and a second adhesive layer from outside to inside. The utility model discloses the laminating is inseparable, is equipped with the required material layer of communication transmission lines such as shielding layer, and this data transmission line's thickness only is half of current data transmission line, can further helping hand electronic equipment's small-size lightweight.

Description

Ultrathin high-speed data transmission line

Technical Field

The utility model relates to a communication wire cable technical field, in particular to ultra-thin high rate data transmission line.

Background

With the advent of the information age, users have made higher demands on light weight and portability of electronic devices while demanding an increase in data transmission rate. The electronic computer can meet most of user demands from a super power tiger occupying a plurality of rooms to a small handheld mobile phone at present, and the process of small size and light weight of electronic products never stops in recent decades.

One of the keys of the small and light electronic equipment is the small and light data transmission medium-transmission line, if the size of the existing high-speed data transmission line can be reduced, the size of the matched terminal and the size of the PCB can be simultaneously reduced, and the small and light electronic equipment can be greatly stepped. Chinese patent application 201510539316.2 discloses a flat cable comprising an upper insulating layer and a lower insulating layer, a plurality of flat conductors are sandwiched between the upper insulating layer and the lower insulating layer, a gap is provided between the flat conductors, and the upper insulating layer and the lower insulating layer are bonded together by an adhesive. The flat cable disclosed in this patent can be used for wiring connection of audio, electric appliances, lighting, and the like, but the upper insulating layer and the lower insulating layer of the flat cable are not completely bonded to each other, a gap is formed between the flat conductors, and the flat cable disclosed in this patent cannot be used for high-speed data transmission, and the upper insulating layer and the lower insulating layer have no material layer required for a communication transmission line such as a shielding layer.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is not enough according to prior art, provide an ultra-thin high speed data transmission line, this data transmission line laminating is inseparable, is equipped with the required material layer of communication transmission lines such as shielding layer, and this data transmission line's thickness only is half of current data transmission line, can further assist electronic equipment's small-size lightweight.

In order to solve the technical problem, the technical scheme of the utility model is that: an ultrathin high-speed data transmission line comprises at least two conducting wires, an upper attaching part and a lower attaching part, wherein the upper attaching part and the lower attaching part are attached up and down, and the conducting wires are arranged in parallel at intervals and are positioned between the upper attaching part and the lower attaching part; the conductive wire is a flat conductive wire, the upper attaching portion and the lower attaching portion are flat band-shaped composite material bodies, and the upper attaching portion and the lower attaching portion sequentially comprise a shielding layer, a first adhesive layer, an insulating layer and a second adhesive layer from outside to inside.

Preferably, the conductive wire is any one of a silver-plated copper conductive wire, a tin-plated copper conductive wire, a bare copper conductive wire, a silver-plated copper-clad steel conductive wire, and a silver-plated copper-clad aluminum conductive wire.

Preferably, the upper attaching portion and the lower attaching portion are vertically symmetrical.

Preferably, the shielding layer is formed by combining any one or more than two of an aluminum foil layer, a copper foil layer and a silver foil layer.

Preferably, the insulating layer is any one of a polyethylene insulating layer, a foamed polyethylene insulating layer, a polypropylene insulating layer, a foamed polypropylene insulating layer, a fluorinated ethylene propylene insulating layer, a meltable polytetrafluoroethylene insulating layer, a polytetrafluoroethylene insulating layer and a foamed fluorinated ethylene propylene insulating layer.

Preferably, the first adhesive layer and the second adhesive layer are both hot-melt adhesive layers.

Preferably, the upper attaching portion and the lower attaching portion further include a skin layer, and the skin layer is disposed outside the shielding layer.

The utility model has the advantages that: one of the two, the utility model discloses a flat conducting wire structure is as the conducting wire, and laminating portion and lower laminating portion on the banding of upper and lower laminating flat can make wire rod thickness reduce to circular conductor structure less than half, can further assist electronic equipment's small-size lightweight. Two of the utility model discloses a go up laminating portion and laminating of laminating portion down inseparable, from outer to interior shielding layer, first glue film, insulating layer and the second glue film of including in proper order, can protect well, insulating conducting wire, shielding signal realizes high rate data transmission.

Drawings

Fig. 1 is a schematic diagram of the structure of the ultra-thin high-speed data transmission line.

Fig. 2 is a schematic structural view of the upper bonding portion being a lower bonding portion.

Fig. 3 is a schematic structural diagram of a preferred embodiment of the present invention.

Detailed Description

The structure and operation of the present invention will be described in detail with reference to the accompanying drawings.

As shown in fig. 1 and 2, the utility model discloses an ultrathin high-speed data transmission line, which comprises at least two transmission lines 1, an upper attaching part 2 and a lower attaching part 3, wherein the upper attaching part 2 and the lower attaching part 3 are attached up and down, and the transmission lines 1 are arranged in parallel at intervals and are positioned between the upper attaching part 2 and the lower attaching part 3; conductive wire 1 is flat conductive wire, go up laminating portion 2 and laminating portion 3 down and be the banded combined material body of flat, go up laminating portion 2 and include shielding layer 21, first glue film 22, insulating layer 23 and second glue film 24 from outer to interior in proper order, laminating portion 3 includes shielding layer 31, first glue film 32, insulating layer 33 and second glue film 34 from outer to interior in proper order down. The upper attaching part 2 and the lower attaching part 3 are symmetrical up and down.

As shown in fig. 1, the conductive wire 1 is any one of a silver-plated copper conductive wire, a tin-plated copper conductive wire, a bare copper conductive wire, a silver-plated copper-clad steel conductive wire, and a silver-plated copper-clad aluminum conductive wire.

As shown in fig. 2, the shielding layer 21/31 is one or a combination of two or more of an aluminum foil layer, a copper foil layer, and a silver foil layer. The insulating layer 23/33 is any one of a polyethylene insulating layer, a foamed polyethylene insulating layer, a polypropylene insulating layer, a foamed polypropylene insulating layer, a fluorinated ethylene propylene insulating layer, a meltable polytetrafluoroethylene insulating layer, a polytetrafluoroethylene insulating layer and a foamed fluorinated ethylene propylene insulating layer.

As shown in fig. 3, with reference to fig. 2, as a preferred structure of the ultra-thin high-speed data transmission line, the upper bonding portion 2 and the lower bonding portion 3 further include a jacket layer 25/35 disposed outside the shielding layer 21/31 to protect the shielding layer 21/31.

The utility model discloses add man-hour, once only attach the both sides on the long limit of 1 of conduction line with last laminating layer 2 and lower laminating layer 3 through rigging machine. The first adhesive layer 22/32 and the second adhesive layer 24/34 are both hot-melt adhesive layers, and the conductive wire 1, the insulating layer 23/33 and the shielding layer 21/31 can be adhered together after being heated in the attaching process.

To sum up, the embodiment of the utility model provides a compare outside traditional circular conducting wire in proper order the cladding (crowded package, around package or indulge the structure of package) insulating layer and shielding layer, the utility model discloses a laminating forming technique, wire rod processing technology is simple, and the structural design of flat conducting wire can reduce the thickness of wire rod by a wide margin to wire rod compliance and resistant bending performance are good. The utility model discloses a disposable laminating of combined material including insulation and shielding is in the conduction line both sides, and processing technology is simple, and wire rod compliance and resistant bending property are more conventional crowded package, are all promoted by a wide margin around the package or indulge a package structure moreover.

The above, only the utility model discloses preferred embodiment, all be according to the utility model discloses a technical scheme does any slight modification, the equivalent change and the modification to above embodiment, all belong to the utility model discloses technical scheme's within range.

Claims

1. An ultra-thin high-speed data transmission line, characterized by: the conductive wire bonding device comprises at least two conductive wires, an upper bonding part and a lower bonding part, wherein the upper bonding part and the lower bonding part are bonded up and down, and the conductive wires are arranged in parallel at intervals and are positioned between the upper bonding part and the lower bonding part; the conductive wire is a flat conductive wire, the upper attaching portion and the lower attaching portion are flat band-shaped composite material bodies, and the upper attaching portion and the lower attaching portion sequentially comprise a shielding layer, a first adhesive layer, an insulating layer and a second adhesive layer from outside to inside.

2. The ultra-thin high-rate data transmission line of claim 1, wherein: the conductive wire is any one of a silver-plated copper conductive wire, a tin-plated copper conductive wire, a bare copper conductive wire, a silver-plated copper-clad steel conductive wire and a silver-plated copper-clad aluminum conductive wire.

3. The ultra-thin high-rate data transmission line of claim 1, wherein: the upper attaching portion and the lower attaching portion are vertically symmetrical.

4. The ultra-thin high-rate data transmission line of claim 1, wherein: the shielding layer is formed by combining any one or more than two of an aluminum foil layer, a copper foil layer and a silver foil layer.

5. The ultra-thin high-rate data transmission line of claim 1, wherein: the insulating layer is any one of a polyethylene insulating layer, a foamed polyethylene insulating layer, a polypropylene insulating layer, a foamed polypropylene insulating layer, a fluorinated ethylene propylene insulating layer, a meltable polytetrafluoroethylene insulating layer, a polytetrafluoroethylene insulating layer and a foamed fluorinated ethylene propylene insulating layer.

6. The ultra-thin high-rate data transmission line of claim 1, wherein: the first adhesive layer and the second adhesive layer are both hot-melt adhesive layers.

7. The ultra-thin high-rate data transmission line of any one of claims 1-6, wherein: the upper bonding portion and the lower bonding portion further comprise outer layers, and the outer layers are arranged outside the shielding layers.