CN210825444U - Cooling system of polycrystalline silicon reduction furnace - Google Patents
Cooling system of polycrystalline silicon reduction furnace Download PDFInfo
- Publication number
- CN210825444U CN210825444U CN201921175361.4U CN201921175361U CN210825444U CN 210825444 U CN210825444 U CN 210825444U CN 201921175361 U CN201921175361 U CN 201921175361U CN 210825444 U CN210825444 U CN 210825444U
- Authority
- CN
- China
- Prior art keywords
- bell jar
- cooling water
- chassis
- temperature water
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Silicon Compounds (AREA)
Abstract
The utility model discloses a cooling system of polycrystalline silicon reduction furnace, this system includes: the reduction furnace comprises a bell jar and a chassis, wherein the bell jar is provided with a first cooling water inlet and a bell jar high-temperature water outlet, the chassis is provided with a second cooling water inlet and a chassis high-temperature water outlet, and the chassis high-temperature water outlet is connected with the first cooling water inlet and/or the second cooling water inlet; the heat exchange device is provided with a bell jar high-temperature water inlet and a cooling water outlet after heat exchange, the bell jar high-temperature water inlet is connected with the bell jar high-temperature water outlet, and the cooling water outlet after heat exchange is connected with the cooling water first inlet and/or the cooling water second inlet. The system not only obviously simplifies the pipeline of the cooling system of the existing polycrystalline silicon reduction furnace, but also realizes the high-efficiency and graded recycling of the heat of the bell jar high-temperature water and the chassis high-temperature water, and simultaneously obviously reduces the remote circulating use amount of the cooling water of the polycrystalline silicon reduction furnace and realizes the safe and stable operation of the polycrystalline silicon reduction furnace.
Description
Technical Field
The utility model belongs to polycrystalline silicon production field particularly, the utility model relates to a cooling system of polycrystalline silicon reduction furnace.
Background
Polycrystalline silicon is a raw material for solar photovoltaic and electronic communication products, plays a significant role in the fields of photovoltaic cell production and electronic communication, and is optimized and promoted continuously for each system in the polycrystalline silicon production process. The aim of polysilicon production workers is to reduce the production cost of polysilicon by means of energy conservation and consumption reduction. In the existing polysilicon production system, the reduction system has the highest energy consumption and most potential excavation space.
The existing polycrystalline silicon production adopts an improved Siemens process for more than 80 percent, rod-shaped polycrystalline silicon is basically produced by adopting a polycrystalline silicon deposition reduction furnace, a high-temperature deposition carrier with the temperature of 1080 ℃ is arranged in a space formed by a reduction furnace bell jar and a reduction furnace chassis to realize the vapor deposition of the polycrystalline silicon in the mixed gas atmosphere of high-purity trichlorosilane and hydrogen, and the reduction furnace bell jar and the chassis need to be cooled by adopting an external cooling medium in the high-temperature environment atmosphere to ensure the safe and stable operation of equipment. The traditional cooling medium of the reduction furnace bell jar comprises high-temperature water, heat-conducting oil and other media; the chassis mostly adopts water as a cooling medium, and different reducing furnace types adopt water with different temperature grades to implement cooling. In terms of recycling heat of the cooling medium, methods adopted by polysilicon production enterprises are very different, even many enterprises do not pay attention to recycling of the heat, so that the overall energy consumption of a polysilicon production system is high, the cost is difficult to reduce, and the enterprises are in leeward in intense market competition. In a traditional cooling system of a polycrystalline silicon reduction furnace, a reduction furnace bell jar is cooled by high-temperature water or heat conducting oil with the temperature of 150 ℃ and a reduction furnace chassis is cooled by medium-temperature water with the temperature of 60-90 ℃, so that the method has various water sources and complex cooling system, and leads the reduction workshop to have complicated piping, difficult operation and incomplete heat recovery and utilization.
Therefore, the cooling technology of the existing polysilicon reduction furnace is yet to be further improved.
SUMMERY OF THE UTILITY MODEL
The present invention aims at solving at least one of the technical problems in the related art to a certain extent. Therefore, the invention aims to provide a cooling system of a polycrystalline silicon reduction furnace. The system not only obviously simplifies the pipeline of the cooling system of the existing polycrystalline silicon reduction furnace, but also realizes the high-efficiency and graded recycling of the heat of the bell jar high-temperature water and the chassis high-temperature water, and simultaneously obviously reduces the use amount of the cooling water of the polycrystalline silicon reduction furnace and realizes the safe and stable operation of the polycrystalline silicon reduction furnace.
In one aspect of the present invention, the present invention provides a cooling system of a polysilicon reduction furnace, according to an embodiment of the present invention, the system includes:
the reduction furnace comprises a bell jar and a chassis, the bell jar is arranged above the chassis, the chassis is arranged at the bottom of the bell jar, the bell jar is provided with a first cooling water inlet and a bell jar high-temperature water outlet, the chassis is provided with a second cooling water inlet and a chassis high-temperature water outlet, and the chassis high-temperature water outlet is connected with the first cooling water inlet and/or the second cooling water inlet;
the heat exchange device is provided with a bell jar high-temperature water inlet and a cooling water outlet after heat exchange, the bell jar high-temperature water inlet is connected with the bell jar high-temperature water outlet, and the cooling water outlet after heat exchange is connected with the cooling water first inlet and/or the cooling water second inlet.
According to the cooling system of the polycrystalline silicon reduction furnace provided by the embodiment of the utility model, cooling water in the same heat range is introduced to the reduction furnace bell jar and the chassis to serve as cooling media, so that the water source variety of the cooling system of the polycrystalline silicon reduction furnace can be reduced, the complexity of the cooling system is obviously reduced, and the piping of a reduction workshop is simplified; furthermore, as the bell jar is a key heat exchange part for transferring the heat of the byproduct outwards and accounts for more than 80% of the heat of the byproduct, the temperature of the obtained high-temperature water of the bell jar is increased relative to the cooling water, and the temperature of the high-temperature water of the chassis is decreased relative to the cooling water, the high-temperature water of the chassis and the cooling water are treated separately, so that the quality of the high-temperature water of the bell jar can be prevented from being reduced by the high-temperature water of the chassis, and the quality of the high-temperature water of the bell; the high-temperature water of the chassis is treated independently and directly returned to be used as cooling water of the bell jar and/or the chassis, so that the heat of the high-temperature water of the chassis is recovered, and the amount of the cooling water of the polycrystalline silicon reduction furnace can be reduced; the obtained high-temperature water of the bell jar is directly sent to a heat exchange device for heat exchange treatment so as to recover the heat of the high-temperature water of the bell jar, the traditional complex mode process of converting hot water into steam and then exchanging heat is simplified, the heat loss of the high-temperature water of the bell jar is reduced, meanwhile, the temperature of the high-temperature water of the bell jar can be reduced after heat exchange, cooling water after heat exchange is obtained, the cooling water after heat exchange is used as cooling water and is returned to the bell jar and/or a chassis for use, the two-stage utilization of the heat of the high-temperature water of the bell jar is realized, and the water quantity of the cooling water of a cooling system of the polycrystalline. Therefore, the system not only obviously simplifies the pipeline of the cooling system of the existing polycrystalline silicon reduction furnace, but also realizes the high-efficiency and graded recycling of the heat of the bell jar high-temperature water and the chassis high-temperature water, and simultaneously obviously reduces the use amount of the cooling water of the polycrystalline silicon reduction furnace and realizes the safe and stable operation of the polycrystalline silicon reduction furnace.
In addition, the cooling system of the polycrystalline silicon reduction furnace according to the above embodiment of the present invention may further have the following additional technical features:
optionally, the cooling system of the polysilicon reduction furnace further comprises: the first pressure pump is connected with the cooling water outlet after heat exchange, and the first pressure pump is connected with the cooling water first inlet and/or the cooling water second inlet. Therefore, the utilization rate of the heat of the cooling water after heat exchange can be further improved.
Optionally, the cooling system of the polysilicon reduction furnace further comprises: the buffer tank is connected with the high-temperature water outlet of the chassis; and the second pressurizing pump is connected with the buffer tank, and the second pressurizing pump is connected with the cooling water first inlet and/or the cooling water second inlet. Therefore, the utilization rate of the heat of the high-temperature water on the chassis can be further improved.
Optionally, the heat exchange device is a plate heat exchanger. Therefore, the utilization rate of the heat of the bell jar high-temperature water can be further improved.
Optionally, the bell jar high temperature water outlet is located above the cooling water first inlet in the height direction. Therefore, the control of the temperature of the bell jar high-temperature water is facilitated.
Optionally, the distance between the bell jar high-temperature water outlet and the cooling water first inlet in the height direction accounts for 80-90% of the height of the bell jar. This further realizes the control of the bell jar high-temperature water.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic view of a cooling system of a polycrystalline silicon reduction furnace according to an embodiment of the present invention;
FIG. 2 is a schematic view showing a cooling system of a polycrystalline silicon reduction furnace according to still another embodiment of the present invention;
FIG. 3 is a schematic view showing a cooling system of a polycrystalline silicon reduction furnace according to still another embodiment of the present invention;
fig. 4 is a schematic flow chart illustrating a cooling method for implementing the polycrystalline silicon reduction furnace by using the cooling system of the polycrystalline silicon reduction furnace according to an embodiment of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In one aspect of the present invention, the present invention provides a cooling system of a polysilicon reduction furnace, which includes, according to an embodiment of the present invention, with reference to fig. 1: a reduction furnace 100 and a heat exchange device 200.
According to the embodiment of the present invention, the reduction furnace 100 includes a bell jar 110 and a chassis 120, the bell jar 110 is disposed above the chassis 120, the chassis 120 is disposed at the bottom of the bell jar 110, the bell jar 110 has a first inlet 111 of cooling water and a high-temperature outlet 112 of bell jar, the chassis 120 has a second inlet 121 of cooling water and a high-temperature outlet 122 of chassis, the high-temperature outlet 122 of chassis is connected to the first inlet 111 of cooling water and/or the second inlet 121 of cooling water, and is adapted to supply cooling water from the first inlet of cooling water and the second inlet of cooling water to the bell jar and the chassis, respectively, to cool the bell jar and the chassis, respectively, to obtain high-temperature water of bell jar and high-temperature water of chassis, and to return the high-temperature water of chassis as cooling water to the bell jar and/or the chassis. The inventor finds that cooling water in the same heat range is introduced to a bell jar and a chassis of the reduction furnace to serve as cooling media, so that the variety of water sources for cooling the polycrystalline silicon reduction furnace can be reduced, the cooling complexity is obviously reduced, and the piping of a reduction workshop is simplified; furthermore, as the bell jar is a key heat exchange part for transferring the heat of the byproduct outwards and accounts for more than 80% of the heat of the byproduct, the temperature of the obtained high-temperature water of the bell jar is increased relative to the cooling water, and the temperature of the high-temperature water of the chassis is decreased relative to the cooling water, the high-temperature water of the chassis and the cooling water are treated separately, so that the quality of the high-temperature water of the bell jar can be prevented from being reduced by the high-temperature water of the chassis, and the quality of the high-temperature water of the bell; the high-temperature water of the chassis is treated independently and directly returned to be used as cooling water of the bell jar and/or the chassis, so that the heat of the high-temperature water of the chassis is recovered, and the amount of the cooling water of the polycrystalline silicon reduction furnace can be reduced. Specifically, the polysilicon reduction furnace is common equipment in the existing polysilicon production process, gasified high-purity trichlorosilane and hydrogen are mixed according to a certain proportion and introduced into the polysilicon reduction furnace, voltage is applied to two ends of a rodlike silicon core arranged in the reduction furnace to generate high temperature, and the trichlorosilane is reduced into element silicon by the hydrogen on the surface of the high-temperature silicon core and is deposited on the surface of the silicon core to gradually generate the polysilicon rod with the required specification. The bell jar and the chassis of the reduction furnace need to adopt cooling water with the same heat range to cool under the environment atmosphere with high temperature, so as to ensure the safe and stable operation of the equipment. In the whole cooling process, because the heat quantity of the by-product of the chassis is low and the heat quantity of the by-product of the bell jar is high, the cooling water can obtain the chassis high-temperature water and the bell jar high-temperature water with obvious temperature difference after the cooling water is cooled and exchanged heat by the chassis and the bell jar. The temperature of the chassis high-temperature water and the bell jar high-temperature water output from the chassis and the bell jar can be controlled by controlling the flow of the cooling water introduced into the chassis and the bell jar, so that the recycling of the heat of the byproduct of the whole reduction furnace is controlled, the utilization rate of the heat of the byproduct of the reduction furnace is improved, and the stable operation of the system is realized.
Further, it should be noted that a specific manner of returning the chassis high-temperature water as the cooling water to the chassis and/or the bell jar is not particularly limited, and a person skilled in the art may select the cooling water according to actual needs, for example, referring to fig. 2, and the cooling system of the polysilicon reduction furnace may further include: the surge tank 300 and the second booster pump 400, i.e., the high-temperature water of the chassis can be returned to the chassis and/or the bell jar through the surge tank and the second booster pump. Specifically, the buffer tank 300 is connected with the chassis high-temperature water outlet 122; the second booster pump 400 is connected to the surge tank 300, and the second booster pump 400 is connected to the cooling water first inlet 111 and/or the cooling water second inlet 121. The inventor finds that the cooling water quantity input into the chassis and the bell jar can be adjusted according to the temperatures of the high-temperature water of the chassis and the high-temperature water of the bell jar, and the real-time adjustment and control of the cooling water quantity input into the chassis and/or the bell jar can be further realized by arranging the buffer tank before the high-temperature water of the chassis is conveyed back to the first inlet and/or the second inlet of the cooling water, so that the recycling of the heat of the by-product of the reduction furnace can be better realized, and the stable operation of the system can be promoted.
According to an embodiment of the present invention, the bell jar high temperature water outlet 112 is located above the cooling water first inlet 111 in the height direction. Specifically, in a plan view, an angle between the water flow direction of the bell jar high-temperature water outlet and the water flow direction of the cooling water first inlet is not particularly limited, and may be selected by a person skilled in the art according to actual needs, and may be, for example, 0 to 360 degrees, such as 0 degree, 45 degrees, 90 degrees, 135 degrees, 180 degrees, 225 degrees, 270 degrees, 315 degrees, 360 degrees, and preferably 180 degrees. Further, the distance between the bell jar high temperature water outlet 112 and the cooling water first inlet 111 in the height direction is 80 to 90% of the height of the bell jar, and may be, for example, 80%, 82%, 84%, 86%, 88%, 90%. The inventors have found that if this distance is too small, the bell cannot be fully cooled; if the distance is too large, the bell jar flow passage is difficult to arrange.
According to another embodiment of the present invention, the temperatures of the cooling water, the high temperature water on the chassis, and the cooling water after heat exchange can be respectively and independently 130-150 degrees centigrade, for example, 130 degrees, 135 degrees, 140 degrees, 145 degrees, 150 degrees. The inventor finds that the temperature of the cooling medium used by the existing polysilicon reduction furnace bell jar is generally 130-150 ℃, the utility model discloses still adopt the cooling medium (including cooling water, chassis high-temperature water and cooling water after heat exchange) of this temperature range to cool the chassis and the bell jar, on one hand can realize the continuous use of the existing process equipment, need not to change the existing pipeline because of the change of the process, avoid increasing the equipment cost of the system; on one hand, the water within the temperature range is used as a cooling medium, so that the direct recycling of the high-temperature water of the chassis is facilitated, and the subsequent recycling of the heat of the high-temperature water of the bell jar is facilitated; moreover, the cooling medium in the temperature range is adopted to cool the chassis and the bell jar, so that the system can operate safely and stably. Further, the temperature of the high-temperature water of the bell jar is not particularly limited, and can be selected by those skilled in the art according to actual needs, for example, 150-. The inventor finds that if the temperature of the bell jar high-temperature water is too low, the quality of the heat source is reduced, and the subsequent recovery of the heat is not facilitated; if the temperature of the bell jar high-temperature water is too high, under the condition that the subsequent heat exchange device is determined, the temperature of the obtained cooling water after heat exchange is too high, the requirement on spare parts in the reduction production process of the reduction furnace is higher, and the cost performance is greatly reduced.
According to another embodiment of the present invention, the flow ratio of the cooling water supplied to the bell jar to the cooling water supplied to the chassis is not particularly limited, and those skilled in the art can select the flow ratio according to actual needs, for example, the flow ratio can be flexibly adjusted according to the temperatures of the chassis high-temperature water and the bell jar high-temperature water. According to a specific embodiment of the present invention, the flow ratio of the cooling water supplied to the bell jar to the cooling water supplied to the base pan is 3-5: 1, for example, may be 3/3.5/4.0/4.5/5: 1. the inventor finds that in the reduction production process of the reduction furnace, the relationship of the flow rate of cooling water is determined by the heat carried by the bell jar and the chassis and the arrangement of the flow channel inside the equipment, and the cooling water in the chassis and the bell jar needs to ensure the minimum flow rate so as to ensure the smooth circulation of the cooling water.
According to the utility model discloses an embodiment, heat transfer device 200 has bell jar high temperature water entry 201 and heat transfer aftercooling water outlet 202, bell jar high temperature water entry 201 links to each other with bell jar high temperature water outlet 112, heat transfer aftercooling water outlet 202 links to each other with the first entry 111 of cooling water and/or cooling water second entry 121, and is suitable for and carries out heat recovery with bell jar high temperature water to obtain heat transfer aftercooling water, and return to bell jar and/or chassis as the cooling water with heat transfer aftercooling water. The inventor finds that the bell jar high-temperature water is directly sent to the heat exchange device for heat exchange treatment so as to recover the heat of the bell jar high-temperature water, simplifies the traditional complex mode process of converting hot water into steam and then exchanging heat, reduces the heat loss of the bell jar high-temperature water, reduces the temperature of the bell jar high-temperature water after heat exchange, obtains cooling water after heat exchange, returns the cooling water after heat exchange as cooling water to the bell jar and/or the chassis for use, realizes two-stage utilization of the heat of the bell jar high-temperature water, and further reduces the amount of the cooling water cooled by the polycrystalline silicon reduction furnace. It should be noted that the specific type of the heat exchanging device is not particularly limited, and those skilled in the art can select the heat exchanging device according to actual needs, for example, the heat exchanging device may be a plate heat exchanger. The inventor finds that the heat exchange device can better transfer and reduce byproduct heat, improves the energy utilization efficiency of a polycrystalline silicon production system, and reduces the requirement of external energy supply of the system.
Further, it should be noted that a specific manner of returning the cooling water after heat exchange as cooling water to the chassis and/or the bell jar is not particularly limited, and a person skilled in the art may select the cooling water according to actual needs, for example, referring to fig. 3, where the cooling system of the polysilicon reduction furnace may further include: the first booster pump 500 may return the cooling water after heat exchange to the chassis and/or the bell jar. Specifically, the first pressure pump 500 is connected to the heat-exchanged cooling water outlet 202, and the first pressure pump 500 is connected to the cooling water first inlet 111 and/or the cooling water second inlet 121. The inventor finds that the secondary utilization of the heat of the cooling water after heat exchange can be better realized by arranging the first pressurizing pump in the path of sending the cooling water after heat exchange to the chassis and/or the bell jar, so that the heat utilization efficiency of the whole system is improved, and meanwhile, the stable operation of the system is promoted.
According to the cooling system of the polycrystalline silicon reduction furnace provided by the embodiment of the utility model, cooling water in the same heat range is introduced to the reduction furnace bell jar and the chassis to serve as cooling media, so that the water source variety of the cooling system of the polycrystalline silicon reduction furnace can be reduced, the complexity of the cooling system is obviously reduced, and the piping of a reduction workshop is simplified; furthermore, as the bell jar is a key heat exchange part for transferring the heat of the byproduct outwards and accounts for more than 80% of the heat of the byproduct, the temperature of the obtained high-temperature water of the bell jar is increased relative to the cooling water, and the temperature of the high-temperature water of the chassis is decreased relative to the cooling water, the high-temperature water of the chassis and the cooling water are treated separately, so that the quality of the high-temperature water of the bell jar can be prevented from being reduced by the high-temperature water of the chassis, and the quality of the high-temperature water of the bell; the high-temperature water of the chassis is treated independently and directly returned to be used as cooling water of the bell jar and/or the chassis, so that the heat of the high-temperature water of the chassis is recovered, and the amount of the cooling water of the polycrystalline silicon reduction furnace can be reduced; the obtained high-temperature water of the bell jar is directly sent to a heat exchange device for heat exchange treatment so as to recover the heat of the high-temperature water of the bell jar, the traditional complex mode process of converting hot water into steam and then exchanging heat is simplified, the heat loss of the high-temperature water of the bell jar is reduced, meanwhile, the temperature of the high-temperature water of the bell jar can be reduced after heat exchange, cooling water after heat exchange is obtained, the cooling water after heat exchange is used as cooling water and is returned to the bell jar and/or a chassis for use, the two-stage utilization of the heat of the high-temperature water of the bell jar is realized, and the water quantity of the cooling water of a cooling system of the polycrystalline. Therefore, the system not only obviously simplifies the pipeline of the cooling system of the existing polycrystalline silicon reduction furnace, but also realizes the high-efficiency and graded recycling of the heat of the bell jar high-temperature water and the chassis high-temperature water, and simultaneously obviously reduces the use amount of the cooling water of the polycrystalline silicon reduction furnace and realizes the safe and stable operation of the polycrystalline silicon reduction furnace.
For convenience of understanding, a method for cooling a polycrystalline silicon reduction furnace using the cooling system of the polycrystalline silicon reduction furnace described above will be described in detail, and according to an embodiment of the present invention, with reference to fig. 4, the method includes:
s100: cooling water is supplied to a bell jar and a base plate of the reduction furnace from a cooling water first inlet and a cooling water second inlet respectively
In this step, cooling water is supplied to the bell jar and the base pan of the reduction furnace from the cooling water first inlet and the cooling water second inlet, respectively, to cool the bell jar and the base pan, respectively, to obtain high-temperature water for the bell jar and high-temperature water for the base pan, respectively, and the high-temperature water for the base pan is returned to the bell jar and/or the base pan as cooling water. The inventor finds that cooling water in the same heat range is introduced to a bell jar and a chassis of the reduction furnace to serve as cooling media, so that the variety of water sources for cooling the polycrystalline silicon reduction furnace can be reduced, the cooling complexity is obviously reduced, and the piping of a reduction workshop is simplified; furthermore, as the bell jar is a key heat exchange part for transferring the heat of the byproduct outwards and accounts for more than 80% of the heat of the byproduct, the temperature of the obtained high-temperature water of the bell jar is increased relative to the cooling water, and the temperature of the high-temperature water of the chassis is decreased relative to the cooling water, the high-temperature water of the chassis and the cooling water are treated separately, so that the quality of the high-temperature water of the bell jar can be prevented from being reduced by the high-temperature water of the chassis, and the quality of the high-temperature water of the bell; the high-temperature water of the chassis is treated independently and directly returned to be used as cooling water of the bell jar and/or the chassis, so that the heat of the high-temperature water of the chassis is recovered, and the amount of the cooling water of the polycrystalline silicon reduction furnace can be reduced. Specifically, the polysilicon reduction furnace is common equipment in the existing polysilicon production process, gasified high-purity trichlorosilane and hydrogen are mixed according to a certain proportion and introduced into the polysilicon reduction furnace, voltage is applied to two ends of a rodlike silicon core arranged in the reduction furnace to generate high temperature, and the trichlorosilane is reduced into element silicon by the hydrogen on the surface of the high-temperature silicon core and is deposited on the surface of the silicon core to gradually generate the polysilicon rod with the required specification. The bell jar and the chassis of the reduction furnace need to adopt cooling water with the same heat range to cool under the environment atmosphere with high temperature, so as to ensure the safe and stable operation of the equipment. In the whole cooling process, because the heat quantity of the by-product of the chassis is low and the heat quantity of the by-product of the bell jar is high, the cooling water can obtain the chassis high-temperature water and the bell jar high-temperature water with obvious temperature difference after the cooling water is cooled and exchanged heat by the chassis and the bell jar. The temperature of the chassis high-temperature water and the bell jar high-temperature water output from the chassis and the bell jar can be controlled by controlling the flow of the cooling water introduced into the chassis and the bell jar, so that the recycling of the heat of the byproduct of the whole reduction furnace is controlled, the utilization rate of the heat of the byproduct of the reduction furnace is improved, and the stable operation of the system is realized.
Further, it should be noted that the specific manner of returning the chassis high-temperature water as cooling water to the chassis and/or the bell jar is not particularly limited, and those skilled in the art may select the cooling water according to actual needs, for example, the cooling water may be buffered by a buffer tank, and then the chassis high-temperature water may be returned to the chassis and/or the bell jar by a second pressure pump. The inventor finds that the cooling water quantity input into the chassis and the bell jar can be adjusted according to the temperatures of the high-temperature water of the chassis and the high-temperature water of the bell jar, and the real-time adjustment and control of the cooling water quantity input into the chassis and/or the bell jar can be further realized by arranging the buffer tank before the high-temperature water of the chassis is conveyed back to the first inlet and/or the second inlet of the cooling water, so that the recycling of the heat of the by-product of the reduction furnace can be better realized, and the stable operation of the system can be promoted.
According to an embodiment of the present invention, the temperatures of the cooling water, the high temperature water on the chassis, and the cooling water after heat exchange can be respectively and independently 130-. The inventor finds that the temperature of the cooling medium used by the existing polysilicon reduction furnace bell jar is generally 130-150 ℃, the utility model discloses still adopt the cooling medium (including cooling water, chassis high-temperature water and cooling water after heat exchange) of this temperature range to cool the chassis and the bell jar, on one hand can realize the continuous use of the existing process equipment, need not to change the existing pipeline because of the change of the process, avoid increasing the equipment cost of the system; on one hand, the water within the temperature range is used as a cooling medium, so that the direct recycling of the high-temperature water of the chassis is facilitated, and the subsequent recycling of the heat of the high-temperature water of the bell jar is facilitated; moreover, the cooling medium in the temperature range is adopted to cool the chassis and the bell jar, so that the system can operate safely and stably. Further, the temperature of the high-temperature water of the bell jar is not particularly limited, and can be selected by those skilled in the art according to actual needs, for example, 150-. The inventor finds that if the temperature of the bell jar high-temperature water is too low, the quality of the heat source is reduced, and the subsequent heat recovery is not facilitated; if the temperature of the bell jar high-temperature water is too high, under the condition that the subsequent heat exchange device is determined, the temperature of the obtained cooling water after heat exchange is too high, the requirement on spare parts in the reduction production process of the reduction furnace is higher, and the cost performance is greatly reduced. According to another embodiment of the present invention, the flow ratio of the cooling water supplied to the bell jar to the cooling water supplied to the chassis is not particularly limited, and those skilled in the art can select the flow ratio according to actual needs, for example, the flow ratio can be flexibly adjusted according to the temperatures of the chassis high-temperature water and the bell jar high-temperature water. According to a specific embodiment of the present invention, the flow ratio of the cooling water supplied to the bell jar to the cooling water supplied to the base pan is 3-5: 1, for example, may be 3/3.5/4.0/4.5/5: 1. the inventor finds that in the reduction production process of the reduction furnace, the relationship of the flow rate of cooling water is determined by the heat carried by the bell jar and the chassis and the arrangement of the flow channel inside the equipment, and the cooling water in the chassis and the bell jar needs to ensure the minimum flow rate so as to ensure the smooth circulation of the cooling water.
S200: high-temperature water of the bell jar is supplied to a heat exchange device for heat recovery
In the step, high-temperature water of the bell jar is supplied to a heat exchange device for heat recovery so as to obtain cooling water after heat exchange, and the cooling water after heat exchange is used as cooling water to return to the bell jar and/or the chassis. The inventor finds that the bell jar high-temperature water is directly sent to the heat exchange device for heat exchange treatment so as to recover the heat of the bell jar high-temperature water, simplifies the traditional complex mode process of converting hot water into steam and then exchanging heat, reduces the heat loss of the bell jar high-temperature water, reduces the temperature of the bell jar high-temperature water after heat exchange, obtains cooling water after heat exchange, returns the cooling water after heat exchange as cooling water to the bell jar and/or the chassis for use, realizes two-stage utilization of the heat of the bell jar high-temperature water, and further reduces the amount of the cooling water cooled by the polycrystalline silicon reduction furnace. It should be noted that, the specific manner of heat exchange is not particularly limited, and those skilled in the art can select the heat exchange mode according to actual needs, for example, plate heat exchange mode can be used. The inventor finds that the heat exchange mode can better transfer and reduce the byproduct heat, improve the energy utilization efficiency of the polycrystalline silicon production process and reduce the requirement of external energy supply of the process.
Further, it should be noted that the specific manner of returning the cooling water after heat exchange as cooling water to the chassis and/or the bell jar is not particularly limited, and those skilled in the art may select the cooling water after heat exchange according to actual needs, for example, the cooling water after heat exchange may be returned to the chassis and/or the bell jar by the first pressure pump. The inventor finds that the secondary utilization of the heat of the cooling water after heat exchange can be better realized by arranging the first pressurizing pump in the path of sending the cooling water after heat exchange to the chassis and/or the bell jar, so that the heat utilization efficiency of the whole system is improved, and meanwhile, the stable operation of the system is promoted.
According to the cooling method of the polycrystalline silicon reduction furnace provided by the embodiment of the utility model, cooling water in the same heat range is introduced to the reduction furnace bell jar and the chassis to serve as cooling media, so that the water source variety cooled by the polycrystalline silicon reduction furnace can be reduced, the cooling complexity is obviously reduced, and the piping of a reduction workshop is simplified; furthermore, as the bell jar is a key heat exchange part for transferring the heat of the byproduct outwards and accounts for more than 80% of the heat of the byproduct, the temperature of the obtained high-temperature water of the bell jar is increased relative to the cooling water, and the temperature of the high-temperature water of the chassis is decreased relative to the cooling water, the high-temperature water of the chassis and the cooling water are treated separately, so that the quality of the high-temperature water of the bell jar can be prevented from being reduced by the high-temperature water of the chassis, and the quality of the high-temperature water of the bell; the high-temperature water of the chassis is treated independently and directly returned to be used as cooling water of the bell jar and/or the chassis, so that the heat of the high-temperature water of the chassis is recovered, and the amount of the cooling water of the polycrystalline silicon reduction furnace can be reduced; the obtained high-temperature water of the bell jar is directly sent to a heat exchange device for heat exchange treatment so as to recover the heat of the high-temperature water of the bell jar, the traditional complex mode process of converting hot water into steam and then exchanging heat is simplified, the heat loss of the high-temperature water of the bell jar is reduced, meanwhile, the temperature of the high-temperature water of the bell jar can be reduced after heat exchange, cooling water after heat exchange is obtained, the cooling water after heat exchange is used as cooling water and is returned to the bell jar and/or a chassis for use, the two-stage utilization of the heat of the high-temperature water of the bell jar is realized, and the water quantity of the cooling water cooled by the polycrystalline silicon reduction. Therefore, the method not only obviously simplifies the cooling pipeline of the existing polycrystalline silicon reduction furnace, but also realizes the high-efficiency and graded recycling of the heat of the bell jar high-temperature water and the chassis high-temperature water, and simultaneously obviously reduces the use amount of the cooling water of the polycrystalline silicon reduction furnace and realizes the safe and stable operation of the polycrystalline silicon reduction furnace.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.
Claims (6)
1. A cooling system of a polysilicon reduction furnace is characterized by comprising:
the reduction furnace comprises a bell jar and a chassis, the bell jar is arranged above the chassis, the chassis is arranged at the bottom of the bell jar, the bell jar is provided with a first cooling water inlet and a bell jar high-temperature water outlet, the chassis is provided with a second cooling water inlet and a chassis high-temperature water outlet, and the chassis high-temperature water outlet is connected with the first cooling water inlet and/or the second cooling water inlet;
the heat exchange device is provided with a bell jar high-temperature water inlet and a cooling water outlet after heat exchange, the bell jar high-temperature water inlet is connected with the bell jar high-temperature water outlet, and the cooling water outlet after heat exchange is connected with the cooling water first inlet and/or the cooling water second inlet.
2. The cooling system of a polycrystalline silicon reduction furnace according to claim 1, further comprising:
the first pressure pump is connected with the cooling water outlet after heat exchange, and the first pressure pump is connected with the cooling water first inlet and/or the cooling water second inlet.
3. The cooling system of a polycrystalline silicon reduction furnace according to claim 1 or 2, further comprising:
the buffer tank is connected with the high-temperature water outlet of the chassis;
and the second pressurizing pump is connected with the buffer tank, and the second pressurizing pump is connected with the cooling water first inlet and/or the cooling water second inlet.
4. The cooling system of a polycrystalline silicon reduction furnace according to claim 1, wherein the heat exchanging device is a plate heat exchanger.
5. The cooling system of a polycrystalline silicon reduction furnace according to claim 1, wherein the bell jar high temperature water outlet is located above the cooling water first inlet in a height direction.
6. The cooling system of a polycrystalline silicon reduction furnace according to claim 1 or 5, wherein a distance between the bell jar high-temperature water outlet and the cooling water first inlet in a height direction is 80 to 90% of a height of the bell jar.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921175361.4U CN210825444U (en) | 2019-07-24 | 2019-07-24 | Cooling system of polycrystalline silicon reduction furnace |
| PCT/CN2020/103508 WO2021013177A1 (en) | 2019-07-24 | 2020-07-22 | System and method for cooling polycrystalline silicon reduction furnace |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921175361.4U CN210825444U (en) | 2019-07-24 | 2019-07-24 | Cooling system of polycrystalline silicon reduction furnace |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210825444U true CN210825444U (en) | 2020-06-23 |
Family
ID=71257344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921175361.4U Active CN210825444U (en) | 2019-07-24 | 2019-07-24 | Cooling system of polycrystalline silicon reduction furnace |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210825444U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021013177A1 (en) * | 2019-07-24 | 2021-01-28 | 中国恩菲工程技术有限公司 | System and method for cooling polycrystalline silicon reduction furnace |
-
2019
- 2019-07-24 CN CN201921175361.4U patent/CN210825444U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021013177A1 (en) * | 2019-07-24 | 2021-01-28 | 中国恩菲工程技术有限公司 | System and method for cooling polycrystalline silicon reduction furnace |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104266381A (en) | Energy-storage solar hot water boiler adopting heat conduction oil to transfer heat and method for preparing hot water | |
| CN107246602A (en) | Cogeneration units use the optimal control method of electric boiler mode depth peak regulation | |
| CN110282627B (en) | Cooling system and method for polycrystalline silicon reduction furnace | |
| CN210825444U (en) | Cooling system of polycrystalline silicon reduction furnace | |
| CN115233256A (en) | Temperature control system for electrolytic cell for hydrogen production by water electrolysis | |
| CN202594789U (en) | High-potential energy steam generating system with chemical vapor deposition (CVD) reaction furnace | |
| CN215481312U (en) | Hydrogen production system combined with photo-thermal device | |
| CN114046615B (en) | Hydrogen fuel cell and heat pump interconnection system | |
| CN104016350A (en) | Polycrystalline silicon reduction furnace chassis and tail gas cooling system and method thereof | |
| CN115411315A (en) | Combined heat and power generation system of water electrolysis hydrogen production coupled metal solid hydrogen storage fuel cell | |
| CN101968264B (en) | Method for replacing fuel of conducting oil furnace with heat energy generated by benzene oxidization reaction | |
| CN212776797U (en) | Low-temperature waste heat recovery device of submerged combustion type gasifier of LNG receiving station | |
| WO2021013177A1 (en) | System and method for cooling polycrystalline silicon reduction furnace | |
| CN102816939A (en) | Strengthened cooling method and device for sponge titanium reaction kettle | |
| CN102020276A (en) | Method for utilizing waste heat in polycrystalline silicon production process | |
| CN111473308A (en) | Photovoltaic power generation heat storage system with steam heat exchange device | |
| CN202705439U (en) | Cooling device | |
| CN219568081U (en) | Aluminum electrolysis cell side wall waste heat recovery structure | |
| CN216845683U (en) | Reduction furnace heat recovery system and material production system | |
| CN220852298U (en) | Energy supply system without cooling requirement | |
| CN220149686U (en) | Temperature control system of alkaline water electrolysis hydrogen production device | |
| CN220793320U (en) | Energy supply system | |
| CN202675908U (en) | Flue gas heat energy recycling system | |
| CN219137000U (en) | Cooling water circulation system of Czochralski crystal growing furnace | |
| CN218274673U (en) | Fuel cell unit in water electrolysis hydrogen production system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |