CN210811035U - An electrocardiogram signal processing chip - Google Patents

An electrocardiogram signal processing chip Download PDF

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CN210811035U
CN210811035U CN201921275366.4U CN201921275366U CN210811035U CN 210811035 U CN210811035 U CN 210811035U CN 201921275366 U CN201921275366 U CN 201921275366U CN 210811035 U CN210811035 U CN 210811035U
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李烨
王俊
何青云
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Herms Technology Co ltd
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Shenzhen Institute of Advanced Technology of CAS
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Abstract

本申请属于医疗器械技术领域,主要提供了一种心电信号处理芯片,所述心电信号处理芯片包括基板、设于所述基板表面的心电信号处理电路以及用于封装所述心电信号处理电路和所述基板的封装体;其中,所述心电信号处理电路包括用于接收心电信号,并对所述心电信号进行放大处理得到心电放大信号的心电采集芯片、用于接收心电放大信号,并基于存储的心电处理程序对所述心电放大信号进行处理的处理器芯片以及用于对信号进行降噪的降噪电路。通过将心电采集芯片与处理器芯片封装集成为一软硬件一体的心电信号处理芯片,避免了多级电路导致的噪声过大、电路设计复杂等问题,解决了现阶段开发方案中存在的技术问题。

Figure 201921275366

The present application belongs to the technical field of medical devices, and mainly provides an ECG signal processing chip. The ECG signal processing chip includes a substrate, an ECG signal processing circuit disposed on the surface of the substrate, and an ECG signal processing circuit for packaging the ECG signal. A processing circuit and a package of the substrate; wherein, the ECG signal processing circuit includes an ECG acquisition chip for receiving an ECG signal and amplifying the ECG signal to obtain an ECG amplified signal; A processor chip for receiving the electrocardiographic amplification signal and processing the electrocardiographic amplification signal based on the stored electrocardiographic processing program, and a noise reduction circuit for noise reduction of the signal. By integrating the ECG acquisition chip and the processor chip into an ECG signal processing chip that integrates software and hardware, the problems of excessive noise and complex circuit design caused by multi-level circuits are avoided, and the problems existing in the current development plan are solved. technical problem.

Figure 201921275366

Description

一种心电信号处理芯片An electrocardiogram signal processing chip

技术领域technical field

本申请属于医疗器械技术领域,尤其涉及一种心电信号处理芯片。The present application belongs to the technical field of medical devices, and in particular relates to an electrocardiographic signal processing chip.

背景技术Background technique

心电图(ECG)系统是一种应用广泛的医疗检测和监控设备,其产生心电图波形。一般的ECG波形包括一系列由字母P,Q,R,S及T代表的特征点。Q,R及S部分的波形作为整体被称为QRS复合波。QRS复合波中的R波部分是一个ECG信号中每个心动周期中最显著的部分。在各种ECG应用中,对于心电图系统而言,准确地判定R波峰值的时间点是非常关键的。传统的心电图系统包括模拟前端电路,模拟数字转换器(ADC),和数字信号处理器,以执行判定R波峰值的任务。An electrocardiogram (ECG) system is a widely used medical detection and monitoring device that generates an electrocardiogram waveform. A typical ECG waveform consists of a series of characteristic points represented by the letters P, Q, R, S, and T. The waveform of the Q, R, and S parts as a whole is called a QRS complex. The R wave portion of the QRS complex is the most prominent portion of each cardiac cycle in an ECG signal. In various ECG applications, it is very critical for the ECG system to accurately determine the time point of the R wave peak. A traditional ECG system includes an analog front-end circuit, an analog-to-digital converter (ADC), and a digital signal processor to perform the task of determining the peak value of the R wave.

心电图在19世纪初被认识来,其硬件采集处理电路,软件算法识别,在近百年的发展中,已进入较为稳定的开发模式中,通过心电处理程序对心电信号进行计算处理得到对应的心电波形和心率检测结果也是现有研发过程中通常采用的方式。硬件采集电路已从多片分离IC电路,发展为一颗专用IC电路,而软件算法的滤波、容错以及特征点识别的能力也越来越强。The electrocardiogram was recognized in the early 19th century. Its hardware acquisition and processing circuit and software algorithm identification have entered a relatively stable development mode in the development of nearly a hundred years. The ECG waveform and heart rate detection results are also commonly used in the existing research and development process. The hardware acquisition circuit has been developed from a multi-chip separated IC circuit to a dedicated IC circuit, and the filtering, fault tolerance and feature point recognition capabilities of the software algorithm are also getting stronger and stronger.

然而,在现阶段的开发方案中,ECG电路模块存在噪声大、电路设计复杂等问题。However, in the current development plan, the ECG circuit module has problems such as high noise and complicated circuit design.

实用新型内容Utility model content

本申请的目的在于提供一种心电信号处理芯片,旨在解决现阶段开发方案中存在的技术问题。The purpose of this application is to provide an ECG signal processing chip, which aims to solve the technical problems existing in the current development scheme.

为了解决上述技术问题,本申请提供了一种心电信号处理芯片,所述心电信号处理芯片包括:基板、设于所述基板表面的心电信号处理电路以及用于封装所述心电信号处理电路和所述基板的封装体;所述心电信号处理电路包括:In order to solve the above technical problems, the present application provides an ECG signal processing chip, the ECG signal processing chip includes: a substrate, an ECG signal processing circuit disposed on the surface of the substrate, and an ECG signal processing circuit for packaging the ECG signal A processing circuit and a package of the substrate; the ECG signal processing circuit includes:

用于接收心电信号,并对所述心电信号进行放大处理得到心电放大信号的心电采集芯片;An ECG acquisition chip for receiving ECG signals and amplifying the ECG signals to obtain ECG amplified signals;

与所述心电采集芯片连接,用于接收心电放大信号,并基于存储的心电处理程序对所述心电放大信号进行处理的处理器芯片;A processor chip that is connected to the ECG acquisition chip and used to receive the ECG amplified signal and process the ECG amplified signal based on the stored ECG processing program;

与所述心电采集芯片连接,用于对信号进行降噪的降噪电路。A noise reduction circuit that is connected to the ECG acquisition chip and used for noise reduction of signals.

可选的,所述降噪电路包括:第一电容、第一电阻、第二电容、第三电容以及第二电阻;Optionally, the noise reduction circuit includes: a first capacitor, a first resistor, a second capacitor, a third capacitor and a second resistor;

所述第一电容的第一端与所述心电采集芯片的低通滤波信号端连接,所述第二电容的第一端与所述心电采集芯片的参考信号端连接,所述心电采集芯片的功率放大信号端、所述第二电容的第二端、所述第一电容的第一端、所述第一电阻的第一端、所述第一电阻的第二端以及所述第二电阻的第一端共接,所述心电采集芯片的高通滤波信号端与所述第三电容的第一端连接,所述心电采集芯片的功放信号前级输出端、所述第三电容的第二端以及所述第二电阻的第二端共接。The first end of the first capacitor is connected to the low-pass filter signal end of the ECG acquisition chip, and the first end of the second capacitor is connected to the reference signal end of the ECG acquisition chip. The power amplification signal end of the acquisition chip, the second end of the second capacitor, the first end of the first capacitor, the first end of the first resistor, the second end of the first resistor, and the The first end of the second resistor is connected in common, the high-pass filter signal end of the ECG acquisition chip is connected to the first end of the third capacitor, the pre-stage output end of the power amplifier signal of the ECG acquisition chip, the The second end of the three capacitors and the second end of the second resistor are connected in common.

可选的,所述心电信号处理电路还包括:Optionally, the ECG signal processing circuit further includes:

与所述处理器芯片连接,用于提供时钟信号的时钟信号振荡电路。The clock signal oscillation circuit is connected with the processor chip and used for providing the clock signal.

可选的,所述时钟信号振荡电路包括第四电容、第五电容以及晶体振荡器;Optionally, the clock signal oscillation circuit includes a fourth capacitor, a fifth capacitor and a crystal oscillator;

所述第四电容的第一端与所述晶体振荡器的第一端共接于所述处理器芯片的振荡信号输出端,所述第五电容的第一端与所述晶体振荡器的第二端共接于所述处理器芯片的振荡信号输入端,所述第四电容的第二端与所述第五电容的第二端共接于地。The first end of the fourth capacitor and the first end of the crystal oscillator are connected to the oscillating signal output end of the processor chip, and the first end of the fifth capacitor is connected to the first end of the crystal oscillator. The two terminals are connected to the oscillating signal input terminal of the processor chip in common, and the second terminal of the fourth capacitor and the second terminal of the fifth capacitor are connected to the ground in common.

可选的,所述心电采集芯片的型号为Bit2010-A6、AD8231以及ADS1191中的任意一种。Optionally, the model of the ECG acquisition chip is any one of Bit2010-A6, AD8231 and ADS1191.

可选的,所述处理器芯片的型号为GD32F403。Optionally, the model of the processor chip is GD32F403.

可选的,所述封装体上设有多个电极,多个所述电极与所述心电信号处理电路的多个信号端一一对应连接。Optionally, the package body is provided with a plurality of electrodes, and the plurality of electrodes are connected to a plurality of signal terminals of the ECG signal processing circuit in a one-to-one correspondence.

可选的,所述心电采集芯片芯片与所述处理器芯片通过焊球阵列封装。Optionally, the ECG acquisition chip and the processor chip are packaged by a solder ball array.

可选的,所述封装体的长度为5mm-20mm,所述封装体的宽度为5mm-20mm,所述封装体的厚度为1mm-5mm。Optionally, the length of the package body is 5mm-20mm, the width of the package body is 5mm-20mm, and the thickness of the package body is 1mm-5mm.

可选的,所述封装体的长度为9mm,所述封装体的宽度为9mm,所述封装体的厚度为1.2mm。Optionally, the length of the package body is 9 mm, the width of the package body is 9 mm, and the thickness of the package body is 1.2 mm.

本申请提供了一种心电信号处理芯片,所述心电信号处理芯片包括基板、设于所述基板表面的心电信号处理电路以及用于封装所述心电信号处理电路和所述基板的封装体;其中,所述心电信号处理电路包括用于接收心电信号,并对所述心电信号进行放大处理得到心电放大信号的心电采集芯片、用于接收心电放大信号,并基于存储的心电处理程序对所述心电放大信号进行处理的处理器芯片以及用于对信号进行降噪的降噪电路。通过将心电采集芯片与处理器芯片封装集成为一软硬件一体的心电信号处理芯片,避免了多级电路导致的噪声过大的问题、电路设计复杂等问题,解决了现阶段开发方案中存在的技术问题。The present application provides an ECG signal processing chip, the ECG signal processing chip includes a substrate, an ECG signal processing circuit disposed on the surface of the substrate, and an ECG signal processing circuit for packaging the ECG signal processing circuit and the substrate. A package body; wherein the ECG signal processing circuit includes an ECG acquisition chip for receiving the ECG signal, amplifying the ECG signal to obtain the ECG amplified signal, receiving the ECG amplified signal, and A processor chip for processing the ECG amplified signal based on a stored ECG processing program, and a noise reduction circuit for noise reduction of the signal. By integrating the ECG acquisition chip and the processor chip into an ECG signal processing chip that integrates software and hardware, the problems of excessive noise and complex circuit design caused by multi-stage circuits are avoided, and the problems in the current development plan are solved. existing technical problems.

附图说明Description of drawings

图1为本申请的一个实施例提供的心电信号处理电路的结构示意图。FIG. 1 is a schematic structural diagram of an ECG signal processing circuit according to an embodiment of the present application.

图2为本申请的另一个实施例提供的心电信号处理电路的结构示意图。FIG. 2 is a schematic structural diagram of an ECG signal processing circuit according to another embodiment of the present application.

图3为本申请的一个实施例提供的心电信号处理电路的结构示意图。FIG. 3 is a schematic structural diagram of an ECG signal processing circuit according to an embodiment of the present application.

具体实施方式Detailed ways

为了使本申请的目的、技术方案及优点更加清楚明白,以下结合附图及实施例,对本申请进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本申请,并不用于限定本申请。In order to make the purpose, technical solutions and advantages of the present application more clearly understood, the present application will be described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application.

图1为本申请的一个实施例提供的心电信号处理芯片的结构示意图,参见图1所示,所述心电信号处理芯片包括:基板、设于所述基板表面的心电信号处理电路以及用于封装所述心电信号处理电路和所述基板的封装体100;FIG. 1 is a schematic structural diagram of an ECG signal processing chip provided by an embodiment of the present application. Referring to FIG. 1 , the ECG signal processing chip includes: a substrate, an ECG signal processing circuit disposed on the surface of the substrate, and a package body 100 for packaging the ECG signal processing circuit and the substrate;

所述心电信号处理电路包括:The ECG signal processing circuit includes:

用于接收心电信号,并对所述心电信号进行放大处理得到心电放大信号的心电采集芯片U1;an ECG acquisition chip U1 for receiving an ECG signal and amplifying the ECG signal to obtain an ECG amplified signal;

与所述心电采集芯片连接,用于接收心电放大信号,并基于存储的心电处理程序对所述心电放大信号进行处理的处理器芯片U2;A processor chip U2 that is connected to the ECG acquisition chip and used to receive the ECG amplified signal and process the ECG amplified signal based on the stored ECG processing program;

与所述心电采集芯片连接,用于对信号进行降噪的降噪电路101。The noise reduction circuit 101 is connected to the ECG acquisition chip and used for noise reduction of the signal.

在本实施例中,心电采集芯片U1用于接收心电信号,并对所述心电信号进行放大处理得到心电放大信号,处理器芯片U2用于接收心电放大信号,并基于存储的心电处理程序对所述心电放大信号进行处理,并输出对应的处理结果,通过将心电采集芯片U1和处理器芯片U2封装集成为一软硬件一体的心电处理器芯片,通过在处理器芯片U2中预先存储心电处理程序,在心电信号处理过程中,可以直接从接收心电信号然后输出检测结果,用户可以不用具备相应的心电算法专业知识,从而极大的降低了研发难度和研发周期。In this embodiment, the ECG acquisition chip U1 is used to receive the ECG signal, amplify the ECG signal to obtain the ECG amplified signal, and the processor chip U2 is used to receive the ECG amplified signal, and based on the stored The ECG processing program processes the ECG amplified signal and outputs the corresponding processing results. The ECG processing program is pre-stored in the device chip U2. In the process of ECG signal processing, the ECG signal can be directly received and then the detection result can be output. The user does not need to have the corresponding ECG algorithm expertise, which greatly reduces the difficulty of research and development. and development cycle.

在本实施例中,通过将降噪电路101与心电采集芯片U1连接,可以降低心电信号采集以及放大过程中的噪声,减少了心电测试过程中的误差。In this embodiment, by connecting the noise reduction circuit 101 to the ECG acquisition chip U1, the noise in the process of ECG signal acquisition and amplification can be reduced, and the error in the ECG test process can be reduced.

在一个实施例中,处理器芯片U2中预先存储的心电处理程序可以基于接收的心电放大信号输出对应的对应的心电波形、心率以及心律检测结果等信息。In one embodiment, the ECG processing program pre-stored in the processor chip U2 can output corresponding information such as the corresponding ECG waveform, heart rate, and heart rhythm detection result based on the received ECG amplified signal.

在本实施例中,通过在处理器芯片U2中预先写入心电处理程序,该心电处理程序根据其内部的算法对接收的心电放大信号进行计算处理得到对应的心电波形、心率以及心律等数据,进一步的,还通过对心律数据进行处理分析,判断被检测者的心律是否正常,若其心律异常则输出对应的心律失常结果。In this embodiment, by pre-writing an ECG processing program in the processor chip U2, the ECG processing program calculates and processes the received ECG amplified signal according to its internal algorithm to obtain the corresponding ECG waveform, heart rate and For data such as heart rhythm, further, by processing and analyzing the heart rhythm data, it is judged whether the heart rhythm of the tested person is normal, and if the heart rhythm is abnormal, a corresponding arrhythmia result is output.

进一步的,在本实施例中,通过将心电采集芯片U1、处理器芯片U2外围的电阻和电容与心电采集芯片U1、处理器芯片U2均采用封装体100封装在一颗芯片内,不仅可以提升其电路的对称性,以提高心电信号的共模抑制比,还可以大大减少了产品的体积,便于可穿戴产品的开发和应用。Further, in this embodiment, by using the package body 100 to encapsulate the peripheral resistance and capacitance of the ECG acquisition chip U1 and the processor chip U2 and the ECG acquisition chip U1 and the processor chip U2 in one chip, not only the The symmetry of the circuit can be improved to improve the common mode rejection ratio of the ECG signal, and the volume of the product can be greatly reduced, which is convenient for the development and application of wearable products.

进一步的,将心电采集芯片U1、处理器芯片U2外围的电阻和电容集成在心电信号处理芯片内部还可以通过降低电源信号的干扰以提高心电信号的信号噪声比,从而提高心电信号的信号质量。Further, integrating the peripheral resistors and capacitors of the ECG acquisition chip U1 and the processor chip U2 into the ECG signal processing chip can also improve the signal-to-noise ratio of the ECG signal by reducing the interference of the power supply signal, thereby improving the signal-to-noise ratio of the ECG signal. Signal quality.

在一个实施例中,参见图1所示,所述降噪电路101包括:第一电容C1、第一电阻R1、第二电容C2、第三电容C3以及第二电阻R2;In one embodiment, as shown in FIG. 1 , the noise reduction circuit 101 includes: a first capacitor C1, a first resistor R1, a second capacitor C2, a third capacitor C3 and a second resistor R2;

所述第一电容C1的第一端与所述心电采集芯片U1的低通滤波信号端LP_OUT连接,所述第二电容C2的第一端与所述心电采集芯片U1的参考信号端VREFCM连接,所述心电采集芯片U1的功率放大信号端AMP+、所述第二电容C2的第二端、所述第一电容C1的第一端、所述第一电阻R1的第一端、所述第一电阻R1的第二端以及所述第二电阻R2的第一端共接,所述心电采集芯片U1的高通滤波信号端HP_OUT与所述第三电容C3的第一端连接,所述心电采集芯片U1的功放信号前级输出端PRE_OUT、所述第三电容C3的第二端以及所述第二电阻R2的第二端共接。The first terminal of the first capacitor C1 is connected to the low-pass filter signal terminal LP_OUT of the ECG acquisition chip U1, and the first terminal of the second capacitor C2 is connected to the reference signal terminal VREFCM of the ECG acquisition chip U1. connected, the power amplification signal terminal AMP+ of the ECG acquisition chip U1, the second terminal of the second capacitor C2, the first terminal of the first capacitor C1, the first terminal of the first resistor R1, the The second end of the first resistor R1 and the first end of the second resistor R2 are connected together, and the high-pass filter signal end HP_OUT of the ECG acquisition chip U1 is connected to the first end of the third capacitor C3, so The pre-stage output terminal PRE_OUT of the power amplifier signal of the ECG acquisition chip U1, the second terminal of the third capacitor C3 and the second terminal of the second resistor R2 are connected in common.

在一个实施例中,参见图2所示,所述心电信号处理电路还包括:与所述处理器芯片U2连接,用于提供时钟信号的时钟信号振荡电路102。In one embodiment, as shown in FIG. 2 , the ECG signal processing circuit further includes: a clock signal oscillation circuit 102 connected to the processor chip U2 and configured to provide a clock signal.

在一个实施例中,参见图2所示,所述时钟信号振荡电路102包括第四电容C4、第五电容C5以及晶体振荡器Z1;In one embodiment, as shown in FIG. 2 , the clock signal oscillation circuit 102 includes a fourth capacitor C4, a fifth capacitor C5 and a crystal oscillator Z1;

所述第四电容C4的第一端与所述晶体振荡器Z1的第一端共接于所述处理器芯片的振荡信号输出端OSC_OUT,所述第五电容C5的第一端与所述晶体振荡器Z1的第二端共接于所述处理器芯片U2的振荡信号输入端OSC_IN,所述第四电容C4的第二端与所述第五电容C5的第二端共接于地。The first end of the fourth capacitor C4 and the first end of the crystal oscillator Z1 are connected to the oscillating signal output end OSC_OUT of the processor chip, and the first end of the fifth capacitor C5 is connected to the crystal The second end of the oscillator Z1 is commonly connected to the oscillation signal input end OSC_IN of the processor chip U2 , and the second end of the fourth capacitor C4 and the second end of the fifth capacitor C5 are commonly connected to ground.

在一个实施例中,所述心电采集芯片U1的型号为Bit2010-A6、AD8231以及ADS1191中的任意一种。In one embodiment, the model of the ECG acquisition chip U1 is any one of Bit2010-A6, AD8231 and ADS1191.

在一个实施例中,所述处理器芯片U2的型号为GD32F403。In one embodiment, the model of the processor chip U2 is GD32F403.

在本实施例中,心电采集芯片U1和处理器芯片U2均为裸片,并通过飞线工艺焊接在基板上,实现电性连接。In this embodiment, the ECG acquisition chip U1 and the processor chip U2 are both bare chips, and are welded on the substrate through a flying lead process to achieve electrical connection.

在一个实施例中,所述封装体100上设有多个电极,多个所述电极与所述心电信号处理电路的多个信号端一一对应连接。In one embodiment, the package body 100 is provided with a plurality of electrodes, and the plurality of electrodes are connected to a plurality of signal terminals of the ECG signal processing circuit in a one-to-one correspondence.

在本实施例中,封装体100上设有多个电极,参见图1所示,心电采集芯片U1的信号输入端分别通过标准的心电导联线与三个心电信号采集电极RA、LA以及RL连接,其中,心电采集芯片U1的信号输入端RA通过第三电阻R3与封装体100上的电极RA电极,心电采集芯片U1的信号输入端LA通过第四电阻R4与封装体100上的电极LA电极,心电采集芯片U1的信号端RLDINV与第六电容C6的第一端连接,心电采集芯片U1的信号端RLDOUT、第六电容C6的第二端共接于第五电阻R5的第一端,第五电阻R5的第二端与电极RL连接,其中,在一个应用中,电极RA用于与人体的右胳膊连接,电极LA与人体的左胳膊连接,电极RL与人体的右腿连接。In this embodiment, the package body 100 is provided with a plurality of electrodes. Referring to FIG. 1 , the signal input end of the ECG acquisition chip U1 is connected to the three ECG signal acquisition electrodes RA and LA respectively through a standard ECG lead wire. and RL connection, wherein the signal input terminal RA of the ECG acquisition chip U1 is connected to the electrode RA on the package body 100 through the third resistor R3, and the signal input terminal LA of the ECG acquisition chip U1 is connected to the package body 100 through the fourth resistor R4. On the electrode LA electrode, the signal terminal RLDINV of the ECG acquisition chip U1 is connected to the first terminal of the sixth capacitor C6, the signal terminal RLDOUT of the ECG acquisition chip U1 and the second terminal of the sixth capacitor C6 are connected to the fifth resistor. The first end of R5 and the second end of the fifth resistor R5 are connected to the electrode RL, wherein, in one application, the electrode RA is used to connect with the right arm of the human body, the electrode LA is connected to the left arm of the human body, and the electrode RL is connected to the human body right leg connection.

在一个实施例中,参见图1所示,心电采集芯片芯片U1的接地端GND、模拟电路地以及第七电阻R7的第一端共接于封装体100的模拟电路地电极AGND,第七电阻R7的第二端与第六电阻R6的第一端共接于心电采集芯片芯片U1的参考电压信号端VREF,第六电阻的第二端、心电采集芯片芯片U1的模拟信号电源端AVDD以及处理器芯片U2的功放电源信号端ADC_VDDA共接于封装体的模拟信号电源电极AVDD;心电采集芯片芯片U1的电流增益端ICTRL与处理器芯片U2的端口GPIO0连接,心电采集芯片芯片U1的端口BL_INT与处理器芯片U2的端口GPIO1连接,心电采集芯片芯片U1的使能信号端EN与处理器芯片U2的端口GPIO2连接,心电采集芯片芯片U1的端口LD_OUT与处理器芯片U2的端口GPIO4连接,心电采集芯片芯片U1的信号输出端OUT与处理器芯片U2的信号输入端AD连接。In one embodiment, as shown in FIG. 1 , the ground terminal GND of the ECG acquisition chip U1 , the analog circuit ground, and the first terminal of the seventh resistor R7 are connected to the analog circuit ground electrode AGND of the package body 100 , and the seventh The second end of the resistor R7 and the first end of the sixth resistor R6 are connected to the reference voltage signal terminal VREF of the ECG acquisition chip U1, the second end of the sixth resistor and the analog signal power supply terminal of the ECG acquisition chip U1 AVDD and the power amplifier power signal terminal ADC_VDDA of the processor chip U2 are connected to the analog signal power supply electrode AVDD of the package; the current gain terminal ICTRL of the ECG acquisition chip U1 is connected to the port GPIO0 of the processor chip U2, and the ECG acquisition chip chip The port BL_INT of U1 is connected to the port GPIO1 of the processor chip U2, the enable signal terminal EN of the ECG acquisition chip U1 is connected to the port GPIO2 of the processor chip U2, and the port LD_OUT of the ECG acquisition chip U1 is connected to the processor chip U2 The port GPIO4 is connected, and the signal output terminal OUT of the ECG acquisition chip U1 is connected with the signal input terminal AD of the processor chip U2.

在一个实施例中,端口GPIO0、端口GPIO1、端口GPIO2以及端口GPIO4均可以为处理器芯片U2的通用IO接口。In one embodiment, the port GPIO0, the port GPIO1, the port GPIO2, and the port GPIO4 may all be general-purpose IO interfaces of the processor chip U2.

在一个实施例中,处理器芯片U2的端口AVD、端口AVDPWR、端口AVS、端口AVD1以及接地端口GND共接于封装体100上的数字接地电极DGND,处理器芯片U2的端口VDDIO1、端口VDDIO2、端口VDDPST、端口ADC_VDDIO1以及端口ADC_VDDIO2共接于封装体100上的第一数字信号电源电极DVDD,端口VDDC1、端口VDDC2、端口PLL_VDDRFE、端口PLL_VDDRHV、FLASH_VDDF、端口VDDU1以及端口VDDU2共接于封装体100上的第二数字信号电源电极DVDD1V8,处理器芯片U2的使能信号端EN与封装体100上的使能信号电极EN,处理器芯片U2的信号端SPI_RXD、信号端SPI_TXD、信号端SPI_CLK以及信号端SPI_SS分别与封装体100上的电极SPI_RXD、电极SPI_TXD、电极SPI_CLK以及电极SPI_SS一一对应连接,处理器芯片U2的下载程序端口JTAG_TMS和JTAG_TCK分别与封装体100上的电极JTAG_TMS和JTAG_TCK一一对应连接,用于从上位机获取心电处理程序,处理器芯片U2的启动端BOOT0与封装体100上的启动信号电极BOOT0连接,处理器芯片U2的复位信号端RESET与封装体100的复位信号电极RESET连接。In one embodiment, the port AVD, port AVDPWR, port AVS, port AVD1, and ground port GND of the processor chip U2 are commonly connected to the digital ground electrode DGND on the package body 100, and the ports VDDIO1, VDDIO2, The port VDDPST, the port ADC_VDDIO1 and the port ADC_VDDIO2 are commonly connected to the first digital signal power supply electrode DVDD on the package body 100 , and the port VDDC1 , the port VDDC2 , the port PLL_VDDRFE, the port PLL_VDDRHV, the FLASH_VDDF, the port VDDU1 and the port VDDU2 are commonly connected to the package body 100 The second digital signal power supply electrode DVDD1V8, the enable signal terminal EN of the processor chip U2 and the enable signal electrode EN on the package body 100, the signal terminal SPI_RXD, the signal terminal SPI_TXD, the signal terminal SPI_CLK and the signal terminal of the processor chip U2 The SPI_SS is respectively connected with the electrodes SPI_RXD, the electrode SPI_TXD, the electrode SPI_CLK and the electrode SPI_SS on the package body 100 in a one-to-one correspondence, and the download program ports JTAG_TMS and JTAG_TCK of the processor chip U2 are respectively connected with the electrodes JTAG_TMS and JTAG_TCK on the package body 100 in a one-to-one correspondence , used to obtain the ECG processing program from the host computer, the boot terminal BOOT0 of the processor chip U2 is connected to the boot signal electrode BOOT0 on the package body 100 , the reset signal terminal RESET of the processor chip U2 is connected to the reset signal electrode RESET of the package body 100 connect.

在一个实施例中,处理器芯片U2的振荡信号输出端OSC_OUT与处理器芯片U2的振荡信号输入端OSC_IN分别与封装体100上的振荡信号输出电极OSC_OUT和振荡信号输入电极OSC_IN连接。In one embodiment, the oscillating signal output terminal OSC_OUT of the processor chip U2 and the oscillating signal input terminal OSC_IN of the processor chip U2 are respectively connected to the oscillating signal output electrode OSC_OUT and the oscillating signal input electrode OSC_IN on the package body 100 .

在一个实施例中,参见图2所示,处理器芯片U2的振荡信号输出端OSC_OUT与处理器芯片U2的振荡信号输入端OSC_IN与时钟信号振荡电路102连接,时钟信号振荡电路102与封装体100上的接地信号端GND连接。In one embodiment, as shown in FIG. 2 , the oscillating signal output terminal OSC_OUT of the processor chip U2 and the oscillating signal input terminal OSC_IN of the processor chip U2 are connected to the clock signal oscillating circuit 102 , and the clock signal oscillating circuit 102 is connected to the package body 100 The ground signal terminal on the GND connection.

在一个实施例中,封装体100上设有多个电极依序排列,多个电极可以为依序排列在封装体100表面的多个焊球。In one embodiment, a plurality of electrodes are arranged on the package body 100 in sequence, and the plurality of electrodes may be a plurality of solder balls arranged in sequence on the surface of the package body 100 .

在一个实施例中,所述心电采集芯片芯片U1与所述处理器芯片U2通过焊球阵列封装。In one embodiment, the ECG acquisition chip U1 and the processor chip U2 are packaged by a solder ball array.

在一个实施例中,参见图3所示,封装体100每一边均设置多个电极,多个电极用于与外部电路连接。In one embodiment, as shown in FIG. 3 , each side of the package body 100 is provided with a plurality of electrodes, and the plurality of electrodes are used for connection with an external circuit.

图3为本申请的一个实施例提供的心电信号处理芯片整体结构示意图,在本实施例中,所述封装体100的长度为1cm-2cm,所述封装体100的宽度为1cm-2cm,所述封装体100的厚度为1mm-5mm。在一个实施例中,本实施例中的封装体100的长度为9mm,封装体100的宽度为9mm,封装体100的厚度为1.2mm。3 is a schematic diagram of the overall structure of an ECG signal processing chip provided by an embodiment of the present application. In this embodiment, the length of the package body 100 is 1cm-2cm, and the width of the package body 100 is 1cm-2cm. The thickness of the package body 100 is 1 mm-5 mm. In one embodiment, the length of the package body 100 in this embodiment is 9 mm, the width of the package body 100 is 9 mm, and the thickness of the package body 100 is 1.2 mm.

本申请提供了一种心电信号处理芯片,所述心电信号处理芯片包括基板、设于所述基板表面的心电信号处理电路以及用于封装所述心电信号处理电路和所述基板的封装体;其中,所述心电信号处理电路包括用于接收心电信号,并对所述心电信号进行放大处理得到心电放大信号的心电采集芯片、用于接收心电放大信号,并基于存储的心电处理程序对所述心电放大信号进行处理的处理器芯片以及用于对信号进行降噪的降噪电路。通过将心电采集芯片与处理器芯片封装集成为一软硬件一体的心电信号处理芯片,避免了多级电路导致的噪声过大、电路设计复杂等问题,解决了现阶段开发方案中存在的技术问题。The present application provides an ECG signal processing chip, the ECG signal processing chip includes a substrate, an ECG signal processing circuit disposed on the surface of the substrate, and an ECG signal processing circuit for packaging the ECG signal processing circuit and the substrate. A package body; wherein the ECG signal processing circuit includes an ECG acquisition chip for receiving the ECG signal, amplifying the ECG signal to obtain the ECG amplified signal, receiving the ECG amplified signal, and A processor chip for processing the ECG amplified signal based on a stored ECG processing program, and a noise reduction circuit for noise reduction of the signal. By integrating the ECG acquisition chip and the processor chip into an ECG signal processing chip that integrates software and hardware, the problems of excessive noise and complex circuit design caused by multi-level circuits are avoided, and the problems existing in the current development plan are solved. technical problem.

以上所述仅为本申请的较佳实施例而已,并不用以限制本申请,凡在本申请的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本申请的保护范围之内。The above descriptions are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application shall be included in the protection of the present application. within the range.

Claims (10)

1. An electrocardiosignal processing chip, characterized in that, electrocardiosignal processing chip includes: the electrocardiosignal processing circuit comprises a substrate, an electrocardiosignal processing circuit arranged on the surface of the substrate and a packaging body used for packaging the electrocardiosignal processing circuit and the substrate; the electrocardiosignal processing circuit comprises:
the electrocardio acquisition chip is used for receiving electrocardiosignals and amplifying the electrocardiosignals to obtain electrocardio amplified signals;
the processor chip is connected with the electrocardio acquisition chip and used for receiving the electrocardio amplification signals, processing the electrocardio amplification signals based on a stored electrocardio processing program and outputting corresponding electrocardio waveforms, heart rate and heart rhythm detection results;
and the noise reduction circuit is connected with the electrocardio acquisition chip and is used for reducing noise of signals.
2. The cardiac signal processing chip of claim 1, wherein the noise reduction circuit comprises: the circuit comprises a first capacitor, a first resistor, a second capacitor, a third capacitor and a second resistor;
the first end of the first capacitor is connected with the low-pass filtering signal end of the electrocardio acquisition chip, the first end of the second capacitor is connected with the reference signal end of the electrocardio acquisition chip, the power amplification signal end of the electrocardio acquisition chip, the second end of the second capacitor, the first end of the first resistor, the second end of the first resistor and the first end of the second resistor are connected together, the high-pass filtering signal end of the electrocardio acquisition chip is connected with the first end of the third capacitor, and the power amplification signal preceding-stage output end of the electrocardio acquisition chip, the second end of the third capacitor and the second end of the second resistor are connected together.
3. The cardiac signal processing chip of claim 1, wherein the cardiac signal processing circuit further comprises:
and the clock signal oscillating circuit is connected with the processor chip and used for providing a clock signal.
4. The cardiac signal processing chip according to claim 3, wherein the clock signal oscillating circuit comprises a fourth capacitor, a fifth capacitor, and a crystal oscillator;
the first end of the fourth capacitor and the first end of the crystal oscillator are connected to the oscillation signal output end of the processor chip in a shared mode, the first end of the fifth capacitor and the second end of the crystal oscillator are connected to the oscillation signal input end of the processor chip in a shared mode, and the second end of the fourth capacitor and the second end of the fifth capacitor are connected to the ground in a shared mode.
5. The cardiac signal processing chip according to claim 1, wherein the model of the cardiac acquisition chip is any one of Bit2010-A6, AD8231 and ADS 1191.
6. The cardiac signal processing chip as set forth in claim 1, wherein the processor chip is of type GD32F 403.
7. The ecg signal processing chip of claim 1, wherein the package has a plurality of electrodes, and the plurality of electrodes are connected to the plurality of signal terminals of the ecg signal processing circuit in a one-to-one correspondence.
8. The ecg signal processing chip of claim 1, wherein the ecg collection chip and the processor chip are packaged by a solder ball array.
9. The cardiac signal processing chip according to claim 1, wherein the package has a length of 5mm to 20mm, a width of 5mm to 20mm, and a thickness of 1mm to 5 mm.
10. The cardiac signal processing chip according to claim 9, wherein the package has a length of 9mm, a width of 9mm, and a thickness of 1.2 mm.
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