CN210807407U - Camera subassembly and vehicle that has it - Google Patents
Camera subassembly and vehicle that has it Download PDFInfo
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- CN210807407U CN210807407U CN201921648152.7U CN201921648152U CN210807407U CN 210807407 U CN210807407 U CN 210807407U CN 201921648152 U CN201921648152 U CN 201921648152U CN 210807407 U CN210807407 U CN 210807407U
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Abstract
The utility model discloses a camera subassembly and vehicle that has it, camera subassembly include camera lens subassembly, the dustcoat body and semiconductor refrigeration piece. The lens component is arranged on the outer cover body in a covering mode, the outer cover body is provided with a light-transmitting portion, the light-transmitting portion is opposite to the lens component, and an accommodating cavity is formed between the outer cover body and the lens component. The semiconductor refrigeration piece is arranged in the accommodating cavity. According to the utility model discloses a camera subassembly sets up the semiconductor refrigeration piece through the intracavity that holds between the outer cover body and lens subassembly, can utilize the semiconductor refrigeration piece to reduce the temperature of printing opacity portion or lens subassembly to make adnexed fog on the surface of printing opacity portion or lens subassembly can condense into the drop of water, and then can improve the defogging effect of camera subassembly, improve driving safety.
Description
Technical Field
The utility model belongs to the technical field of the vehicle technique and specifically relates to a camera subassembly and vehicle that has it is related to.
Background
With the development of the automobile electronic product technology, the additional requirements of users on the automobile electronic products are higher and higher. Applications such as vehicle-mounted intelligent electronic rearview mirrors are increasingly proposed, but electronic auxiliary anti-fog treatment is not available on the electronic rearview mirrors in the related art. When the vehicle runs in a rainy and foggy day, water mist is easily generated on the surface of the electronic rearview mirror at the moment of starting the vehicle, so that a user cannot receive accurate road condition information, and traffic accidents are easily caused.
SUMMERY OF THE UTILITY MODEL
The application provides a camera subassembly, camera subassembly has the efficient advantage of defogging.
The present application further provides a vehicle having the camera assembly described above.
According to the utility model discloses camera subassembly, camera subassembly includes lens subassembly, the outer cover body and semiconductor module. The lens component is arranged on the outer cover body, the outer cover body is provided with a light-transmitting part, the light-transmitting part is opposite to the lens component, and an accommodating cavity is formed between the outer cover body and the lens component; the semiconductor refrigerating sheet is arranged in the accommodating cavity.
According to the utility model discloses camera subassembly sets up the semiconductor refrigeration piece through the intracavity that holds between the dustcoat body and lens subassembly, can utilize the semiconductor refrigeration piece to reduce the temperature of printing opacity portion or lens subassembly to make adnexed fog on the surface of printing opacity portion or lens subassembly can condense into the drop of water, and then can improve camera subassembly's defogging efficiency, improve driving safety.
In some embodiments, the semiconductor refrigeration sheet is annular, and the semiconductor refrigeration sheet is sleeved outside the lens assembly.
In some embodiments, the camera assembly further comprises an electrical heating element disposed within the receiving cavity.
In some embodiments, the electrical heating element is stacked with the semiconductor chilling plate.
In some embodiments, the shape of the electric heating element is the same as the shape of the semiconductor chilling plate.
In some embodiments, the electric heating element is a PTC heater.
In some embodiments, the lens module further comprises a base, the lens module is disposed on the base, and the outer cover is connected to the base.
In some embodiments, the base has an annular groove, the edge of the outer cover is embedded in the annular groove, the annular groove surrounds the periphery of the lens assembly, and the annular groove extends along the circumferential direction of the lens assembly.
In some embodiments, the annular groove has a step therein, and the semiconductor chilling plate is disposed on the step.
According to the utility model discloses vehicle, the vehicle includes foretell camera assembly.
According to the utility model discloses vehicle crosses the intracavity that holds between the dustcoat body and lens subassembly and sets up the semiconductor refrigeration piece, can utilize the semiconductor refrigeration piece to reduce the temperature of printing opacity portion or lens subassembly to make adnexed fog on the surface of printing opacity portion or lens subassembly can condense into the drop of water, and then can improve the defogging efficiency of camera subassembly, improve driving safety.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is an exploded view of a camera assembly according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a camera assembly according to an embodiment of the present invention;
fig. 3 is a defogging flow chart of a camera assembly according to an embodiment of the present invention.
Reference numerals:
a camera assembly 100;
a lens assembly 10;
an outer cover body 20; a housing portion 21; a light-transmitting section 22; the accommodation chamber 23;
a semiconductor refrigeration plate 30; a notch 31;
an electric heating member 40;
a base 50; an annular groove 51; a step portion 511.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
A camera assembly 100 according to an embodiment of the present invention is described below with reference to fig. 1-3. It should be noted that the camera assembly 100 may be applied to a vehicle, and is used to capture an external environment around the vehicle, provide road condition information in time, and improve driving safety.
As shown in fig. 1-2, a camera assembly 100 according to an embodiment of the present invention includes a lens assembly 10, an outer cover 20, and a semiconductor cooling plate 30.
Specifically, as shown in fig. 1 and 2, the outer cover 20 may be provided to the lens assembly 10, the outer cover 20 may have a light-transmissive portion 22, the light-transmissive portion 22 may be opposite to the lens assembly 10, and an accommodating chamber 23 may be provided between the outer cover 20 and the lens assembly 10. It should be noted that the outer housing can provide a sealing protection for the lens assembly 10. In addition, the outer cover may be a structural member having a certain supporting capability, so as to reduce the probability of damage to the lens assembly 10 caused by direct contact between an external object and the lens assembly 10, thereby improving the reliability of the camera assembly 100.
As shown in fig. 1 and 2, the semiconductor chilling plate 30 may be disposed in the accommodating chamber 23. When the camera assembly 100 is exposed to a rain and fog environment, the outer surface of the light-transmitting portion 22 of the outer cover is easily covered by fog, which causes a problem that the image captured by the camera assembly 100 has insufficient definition. Accordingly, by providing the semiconductor refrigeration sheet 30 in the housing chamber 23, the temperature of the light transmitting portion 22 can be lowered by the semiconductor refrigeration sheet 30, and the mist adhering to the outer surface of the light transmitting portion 22 can be condensed into droplets. It should be noted that the water drops are more easily evaporated than the mist, so that the defogging efficiency of the camera assembly 100 can be improved, and the driving safety can be improved.
For example, as shown in fig. 1 and fig. 2, the outer cover 20 is located above the lens assembly 10, and the outer cover 20 has an opening facing downward, through which the lens assembly 10 can pass and be disposed in the inner space of the outer cover 20. The top end of the outer cover 20 has a light-transmitting portion 22, and the light-transmitting portion 22 is disposed corresponding to the lens assembly 10 in the vertical direction, so that light can be captured by the lens assembly 10 through the light-transmitting portion 22, thereby enabling imaging. A space is provided between the inner surface of the outer cover 20 and the lens assembly 10, and the space may be used as an accommodating chamber 23 for accommodating the semiconductor chilling plate 30.
In addition, it should be noted that, in the long-term use of the camera assembly, there may be a failure of the seal between the outer cover and the lens assembly, which may cause external fog to permeate into the accommodating cavity 23, and at this time, the external fog may adhere to the surface of the lens assembly 10 to blur the image formed by the lens assembly 10. Through set up semiconductor refrigeration piece 30 in holding chamber 23, can utilize semiconductor refrigeration piece 30 to reduce the temperature of lens subassembly 10 to make the attached fog of lens subassembly 10 surface can meet the condensation and become the drop of water, and then can improve camera subassembly 100's reliability.
It should be noted that the semiconductor cooling plate 30 is also called a thermoelectric cooling plate. Its advantages are limited space, high reliability and no pollution of refrigerant. By using the Peltier effect of the semiconductor materials, when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the galvanic couple respectively, and the aim of refrigeration can be fulfilled. It is a refrigeration technology generating negative thermal resistance and has higher reliability.
According to the utility model discloses camera subassembly 100 through set up semiconductor refrigeration piece 30 in the chamber 23 that holds between the outer cover body 20 and lens subassembly 10, can utilize semiconductor refrigeration piece 30 to reduce the temperature of printing opacity portion 22 or lens subassembly 10 to make adnexed fog on printing opacity portion 22 or the surface of lens subassembly 10 can condense into the drop of water, and then can improve camera subassembly 100's defogging efficiency, improve driving safety.
As shown in fig. 1, according to some embodiments of the present invention, the semiconductor cooling plate 30 may be ring-shaped, and the semiconductor cooling plate 30 is sleeved on the lens assembly 10. It should be noted that the lens assembly 10 may have a convex structure with a circular arc shape. Therefore, by arranging the semiconductor refrigerating sheet 30 to be annular and enabling the semiconductor refrigerating sheet 30 to be sleeved outside the lens assembly 10, the fitting degree of the semiconductor refrigerating sheet 30 and the lens assembly 10 can be improved, the contact area of the semiconductor refrigerating sheet 30 and the lens assembly 10 is improved, the heat conduction efficiency between the semiconductor refrigerating sheet 30 and the lens assembly 10 is improved, the defogging time of the camera assembly 100 is shortened, the forming process of the semiconductor refrigerating sheet 30 can be simplified, and the cost is saved.
As shown in fig. 1, according to some embodiments of the present invention, the camera assembly 100 may further include an electric heating element 40, and the electric heating element 40 may be disposed in the accommodating chamber 23. When the semiconductor chilling plate 30 condenses the mist around the surface of the light-transmitting portion 22 or the lens assembly 10 into droplets, the droplets may be collected on the surface of the light-transmitting portion 22 or the lens assembly 10. At this time, when the camera assembly 100 shoots an external object, there may be a refraction phenomenon (it should be noted that the "refraction phenomenon" herein may be understood as a phenomenon that when light is obliquely incident from one transparent medium to another transparent medium, a propagation direction is changed), so that image definition and accuracy of the camera assembly 100 are difficult to be ensured.
Therefore, through the arrangement of the electric heating element 40 in the accommodating cavity 23, after the semiconductor refrigerating sheet 30 condenses the fog around the surface of the light-transmitting part or the lens component 10 into water drops, the electric heating element 40 is turned on to heat the light-transmitting part 22 or the lens component 10, so that the water drops attached to the surface of the light-transmitting part 22 or the lens component 10 are evaporated into water vapor, the probability of unclear or deviated imaging of the camera component 100 caused by the refraction of the water drops to light rays is further reduced, and the reliability and the imaging effect of the camera component 100 are further improved.
It should be noted that, in the actual defogging process, the semiconductor cooling sheet 30 may first reduce the temperature of the light-transmitting portion 22 or the lens assembly 10, so that the fog attached to the outer surface of the light-transmitting portion 22 or the lens assembly 10 may be condensed into water droplets, and then the light-transmitting portion 22 or the lens assembly 10 is heated by the electric heating element 40, so that the water droplets attached to the surface of the light-transmitting portion 22 or the lens assembly 10 are evaporated into water vapor, thereby achieving the purpose of removing the fog quickly and efficiently.
As shown in fig. 3, the camera assembly 100 may further have an image analysis device, and under different external environments, the camera assembly 100 has the following control processes:
when the image analysis device confirms that the surfaces of the light transmitting part 22 or the lens assembly 10 have fog and no water drops, the semiconductor refrigerating sheet 30 is started to condense the fog into water drops;
when the image analysis device confirms that the light-transmitting part 22 or the surface of the lens assembly 10 has fog and water drops, the semiconductor refrigerating sheet 30 is removed to condense the fog into water drops;
when the image analysis device confirms that the light-transmitting part 22 or the surface of the lens component 10 has no fog and water drops, the electric heating element 40 is started to evaporate the water drops into water vapor;
when the image analysis device confirms that the light-transmitting part 22 or the surface of the lens component 10 has no fog or water drops, the operation of the electric heating element 40 or the semiconductor refrigerating sheet 30 is stopped.
It should be noted that, when the semiconductor cooling plate 30 performs the defogging operation, the image analysis device may detect the information of the accessed image again every 360 seconds to determine the defogging progress and adjust the operating state of the semiconductor cooling plate 30 or the electric heating element 40; when the electric heating element 40 removes the water droplets, the image analysis device may detect the information of the accessed image again at intervals of 120s to determine the progress of removing the water droplets and adjust the operating state of the semiconductor refrigeration sheet 30 or the electric heating element 40.
As shown in fig. 1 and 2, according to some embodiments of the present invention, the electric heating element 40 and the semiconductor cooling plate 30 may be stacked. It should be noted that the electric heating member 40 may be used as both a heating member and a heat conduction member. Accordingly, the semiconductor cooling sheet 30 may be used as both a cooling member and a heat conducting member. Therefore, by stacking the electric heating element 40 and the semiconductor refrigerating sheet 30, the distribution of the electric heating element 40 and the semiconductor refrigerating sheet 30 is relatively compact, the installation space is saved, and the contact area between the electric heating element 40 and the semiconductor refrigerating sheet 30 can be increased, so that the heat transfer efficiency between the electric heating element 40 or the semiconductor refrigerating sheet 30 and the light transmission part 22 or the lens component 10 is increased, and the water mist removing efficiency of the camera assembly 100 is improved. For example, as shown in fig. 1 and 2, the electric heating member 40 is disposed above the semiconductor chilling plate 30, and a lower surface of the electric heating member 40 is attached to an upper surface of the semiconductor chilling plate 30.
As shown in fig. 1, in some embodiments, the shape of the electric heating element 40 may be the same as the shape of the semiconductor chilling plate 30. Therefore, on one hand, the engaging degree of the laminated arrangement of the electric heating element 40 and the semiconductor refrigerating sheet 30 can be improved, and the electric heating element 40 and the semiconductor refrigerating sheet 30 can be fully contacted. On the other hand, the electric heating element 40 and the semiconductor refrigeration piece 30 can be in the same shape, and the fool-proof effect is achieved when the electric heating element 40 or the semiconductor refrigeration piece 30 is assembled.
For example, as shown in fig. 1, the semiconductor refrigeration sheet 30 and the electric heating member 40 are both annular, the semiconductor refrigeration sheet 30 has a notch 31, a notch 31 can also be formed at a position on the electric heating member 40 corresponding to the notch 31 of the semiconductor refrigeration sheet 30, both the electric heating member 40 and the semiconductor refrigeration sheet 30 are electrically connected to the lens assembly 10, when the electric heating member 40 and the semiconductor refrigeration sheet 30 are stacked and mounted in the accommodating cavity 23, the notch 31 on the electric heating member 40 can be made to correspond to the notch 31 on the semiconductor refrigeration sheet 30, so that the electrical connection end of the electric heating member 40 and the electrical connection end of the semiconductor refrigeration sheet 30 both correspond to the electrical connection end of the lens assembly 10.
According to some embodiments of the present invention, the electric heating member 40 may be a PTC heater. It should be noted that the PTC heating gas has the advantages of low thermal resistance and high heat exchange efficiency. Thus, by using the PTC heater as the electric heating member 40, the heating efficiency of the light-transmitting portion 22 or the lens assembly 10 by the electric heating member 40 can be improved, thereby shortening the time period for removing the water mist of the camera assembly 100. And cost can be saved while heating the light-transmitting portion 22 or the lens assembly 10 quickly. In addition, the PCT heater does not generate open fire in the using process and has higher safety.
And it should be noted that the PTC heater has a constant temperature heating characteristic, and its principle is that after the PTC heating sheet is powered on, it will raise its resistance value by self-heating to enter the jump zone, and the surface temperature of the PTC heating sheet will be kept at a constant value, and the temperature is only related to the curie temperature and the applied voltage of the PTC heating sheet, but not to the environment temperature. Even in the case of abnormal operation, the input power can be reduced very low due to the regulation action of the PTC element itself, and no unexpected situation occurs.
As shown in fig. 1 and 2, according to some embodiments of the present invention, the camera assembly 100 may further include a base 50, the lens assembly 10 may be disposed on the base 50, and the outer cover 20 may be connected to the base 50. Therefore, the outer cover 20 may be connected to the base 50 to form a sealing structure having a protective effect on the lens assembly 10, so as to reduce the probability that the surface of the lens assembly 10 is corroded or covered due to direct contact (e.g., moisture, dust) between the external environment and the lens assembly 10, thereby improving the reliability of the camera assembly 100. For example, as shown in fig. 1 and 2, the lens assembly 10 is disposed on the upper end surface of the base 50, and the lower edge of the outer cover 20 may be connected to the upper end surface of the base 50.
As shown in fig. 1, according to some embodiments of the present invention, the base 50 may have an annular groove 51, the edge of the outer cover 20 may be embedded in the annular groove 51, the annular groove 51 may surround the periphery of the lens assembly 10, and the annular groove 51 may extend along the circumferential direction of the lens assembly 10. It can be understood that, by embedding the edge of the outer cover 20 in the annular groove 51, the installation of the outer cover 20 can be limited in the circumferential direction of the annular groove 51, the probability of the outer cover 20 deviating in the circumferential direction of the annular groove 51 is reduced, and the installation reliability of the outer cover 20 is improved.
As shown in fig. 1 and 2, the annular groove 51 surrounds the periphery of the lens assembly 10 along the circumferential direction of the lens assembly 10, so that the lens assembly 10 can be placed in the accommodating space defined by the outer cover 20 and the annular groove 51, and it should be noted that any part of the annular groove 51 can be abutted against the edge of the outer cover 20, so that the stability of the connection between the outer cover 20 and the base 50 can be improved, and the protection capability of the outer cover 20 on the lens assembly 10 can be further improved. For example, when the edge portion of the outer cover 20 is broken, the rest of the edge of the outer cover 20 can still maintain the connection between the outer cover 20 and the base 50, thereby reducing the influence of the lens assembly 10 from the external environment.
Further, as shown in fig. 1, in some embodiments, the annular groove 51 may have a step 511 therein, and the semiconductor chilling plate 30 may be provided on the step 511. It is understood that the stepped portion 511 may form a mounting platform having a certain height in the up-down direction, thereby reducing the probability that components provided on the stepped portion 511 interfere with the rest of the components in the receiving cavity 23.
As shown in fig. 1, the housing body 20 may have a receiving portion 21 adapted to the step portion 511, the semiconductor chilling plate 30 and the electric heating element 40 may be stacked on the step portion 511, and when the housing body 20 is connected to the base 50, the step portion 511 may be adapted to the receiving portion 21 to form a receiving cavity, and the semiconductor chilling plate 30 and the electric heating element 40 are limited in the receiving cavity. Therefore, the probability of interference between the semiconductor refrigeration piece 30 or the electric heating piece 40 and other parts can be reduced, and the accommodating cavity can limit the semiconductor refrigeration piece 30 and the electric heating piece 40 in the vertical direction and the circumferential direction of the step part 511, so that the probability of shaking of the electric heating piece 40 and the semiconductor refrigeration piece 30 due to external force can be reduced, and the reliability of the camera assembly 100 is improved.
For example, as shown in fig. 1, an annular groove 51 is provided on the upper end surface of the base 50, a step 511 protruding upward is provided inside the annular groove 51, and the housing body 20 is configured with a receiving portion 21 adapted to the step 511. The semiconductor refrigeration piece 30 and the electric heating element 40 are stacked above the step portion 511, the lower surface of the semiconductor refrigeration piece 30 is attached to the upper surface of the step portion 511, and when the lower edge of the outer cover body 20 is embedded in the annular groove 51, the step portion 511 can be embedded in the accommodating portion 21 so as to press and limit the semiconductor refrigeration piece 30 and the electric heating element 40 in the accommodating cavity.
According to the embodiment of the present invention, the vehicle includes the camera assembly 100 described above.
According to the utility model discloses vehicle through the holding between the cover body 20 and lens subassembly 10 and set up semiconductor refrigeration piece 30 in the chamber 23, can utilize semiconductor refrigeration piece 30 to reduce the temperature of printing opacity portion 22 or lens subassembly 10 to make adnexed fog on printing opacity portion 22 or the surface of lens subassembly 10 can condense into the drop of water, and then can improve camera subassembly 100's defogging efficiency, improve driving safety.
A camera assembly 100 according to an embodiment of the present invention is described in detail below with reference to fig. 1-3. It is to be understood that the following description is illustrative only and is not intended as a specific limitation on the invention.
As shown in fig. 1-2, the camera assembly 100 includes a lens assembly 10, an outer housing 20, a semiconductor cooling sheet 30, an electric heating member 40, and a base 50.
As shown in fig. 1 and 2, the lens assembly 10 is disposed on the upper end surface of the base 50, the outer cover 20 has an opening facing downward, the outer cover 20 is disposed above the lens assembly 10, and a lower end edge of the outer cover 20 may be connected to the upper end surface of the base 50 and define a receiving space, and the lens assembly 10 is disposed in the receiving space. Accordingly, a sealed space having a protective effect on the lens unit 10 can be formed by the connection between the outer cover 20 and the chassis 50, and the probability of the external environment adversely affecting the lens unit 10 can be reduced.
As shown in fig. 1, the light-transmitting portion 22 is provided at the top end of the outer cover 20, and the light-transmitting portion 22 is provided in the vertical direction in correspondence with the lens module 10, so that light can be captured by the lens module 10 through the light-transmitting portion 22, thereby enabling image formation.
As shown in fig. 1 and 2, the annular semiconductor chilling plate 30 is sleeved on the periphery of the lens assembly 10, the electric heating element 40 may be disposed above the semiconductor chilling plate 30, and the electric heating element 40 and the semiconductor chilling plate 30 are stacked, so as to save the installation space and improve the heat conduction efficiency between the components. The electric heating member 40 may be a PTC.
It should be noted that, by providing the semiconductor refrigeration sheet 30 and the electric heating element 40, the temperature of the light-transmitting portion 22 or the lens assembly 10 can be lowered by the semiconductor refrigeration sheet 30, so that the mist attached to the outer surface of the light-transmitting portion 22 or the lens assembly 10 can be condensed into water droplets, and the light-transmitting portion 22 or the lens assembly 10 is heated by the electric heating element 40, so that the water droplets attached to the surface of the light-transmitting portion 22 or the lens assembly 10 are evaporated into water vapor, thereby achieving the purpose of removing the mist quickly and efficiently.
As shown in fig. 1, the electric heating element 40 is an annular structural member, the annular semiconductor chilling plate 30 has a notch 31, a notch 31 can be formed at a position on the electric heating element 40 corresponding to the notch 31 of the semiconductor chilling plate 30, the electric heating element 40 and the semiconductor chilling plate 30 are both electrically connected to the lens assembly 10, when the electric heating element 40 and the semiconductor chilling plate 30 are stacked and mounted in the accommodating cavity 23, the notch 31 on the electric heating element 40 can be made to correspond to the notch 31 on the semiconductor chilling plate 30, so that the electrical connection end of the electric heating element 40 and the electrical connection end of the semiconductor chilling plate 30 both correspond to the electrical connection end of the lens assembly 10.
As shown in fig. 1, the upper end surface of the base 50 is configured with an annular groove 51, the annular groove 51 is distributed along the circumferential direction of the lens assembly 10, and the lower end edge of the outer cover 20 can be embedded in the annular groove 51 to form a sealed space for protecting the lens assembly 10.
As shown in fig. 1, the annular groove 51 has a step 511 protruding upward therein, and the outer cover 20 is configured with a receiving portion 21 adapted to the step 511. The semiconductor refrigeration piece 30 and the electric heating element 40 are stacked above the step portion 511, the lower surface of the semiconductor refrigeration piece 30 is attached to the upper surface of the step portion 511, and when the lower edge of the outer cover body 20 is embedded in the annular groove 51, the step portion 511 can be embedded in the accommodating portion 21 so as to press and limit the semiconductor refrigeration piece 30 and the electric heating element 40 in the accommodating cavity.
As shown in fig. 3, the camera assembly 100 has an image analysis device, and under different external environments, the camera assembly 100 has the following control processes:
when the image analysis device confirms that the surfaces of the light transmitting part 22 or the lens assembly 10 have fog and no water drops, the semiconductor refrigerating sheet 30 is started to condense the fog into water drops;
when the image analysis device confirms that the light-transmitting part 22 or the surface of the lens assembly 10 has fog and water drops, the semiconductor refrigerating sheet 30 is removed to condense the fog into water drops;
when the image analysis device confirms that the external environment is fog-free and has water drops, the electric heating element 40 is started to evaporate the water drops into water vapor;
when the image analysis device confirms that the light-transmitting part 22 or the surface of the lens component 10 has no fog or water drops, the operation of the electric heating element 40 or the semiconductor refrigerating sheet 30 is stopped.
It should be noted that, when the semiconductor cooling plate 30 performs the defogging operation, the image analysis device may detect the information of the accessed image again every 360 seconds to determine the defogging progress and the external environmental characteristics, and adjust the operating state of the semiconductor cooling plate 30 or the electric heating element 40; when the electric heating element 40 removes the water globules, every 120s, the image analysis device can detect the information of the access image again to determine the progress of removing the water globules and the external environment characteristics, and adjust the working state of the semiconductor refrigeration piece 30 or the electric heating element 40.
In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "circumferential", etc. are the directions or positional relationships shown on the drawings, and are only for convenience of description and simplification of the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and thus, should not be construed as limiting the present invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A camera head assembly, comprising:
a lens assembly;
the lens component is arranged on the outer cover body, the outer cover body is covered on the lens component and is provided with a light-transmitting part, the light-transmitting part is opposite to the lens component, and an accommodating cavity is formed between the outer cover body and the lens component;
the semiconductor refrigeration piece is arranged in the containing cavity.
2. The camera assembly of claim 1, wherein the semiconductor chilling plate is annular and the semiconductor chilling plate is sleeved on the lens assembly.
3. A camera assembly according to claim 1, further comprising an electrical heating element disposed within the receiving cavity.
4. A camera assembly according to claim 3, wherein the electrical heating element is stacked with the semiconductor chilling plate.
5. A camera assembly according to claim 3, wherein the shape of the electrical heating element is the same as the shape of the semiconductor chilling plate.
6. A camera assembly according to claim 3, wherein the electrical heating element is a PTC heater.
7. The camera assembly of claim 1, further comprising a base, wherein the lens assembly is disposed on the base, and wherein the outer housing is coupled to the base.
8. The camera assembly according to claim 7, wherein the base has an annular groove, an edge of the outer cover is embedded in the annular groove, the annular groove surrounds an outer periphery of the lens assembly, and the annular groove extends in a circumferential direction of the lens assembly.
9. The camera assembly of claim 8, wherein said annular groove has a step therein, said semiconductor chilling plate being disposed on said step.
10. A vehicle comprising a camera assembly according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921648152.7U CN210807407U (en) | 2019-09-29 | 2019-09-29 | Camera subassembly and vehicle that has it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921648152.7U CN210807407U (en) | 2019-09-29 | 2019-09-29 | Camera subassembly and vehicle that has it |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210807407U true CN210807407U (en) | 2020-06-19 |
Family
ID=71231962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921648152.7U Active CN210807407U (en) | 2019-09-29 | 2019-09-29 | Camera subassembly and vehicle that has it |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210807407U (en) |
-
2019
- 2019-09-29 CN CN201921648152.7U patent/CN210807407U/en active Active
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